Terminal structure of high-frequency signal connector and manufacturing method thereof
11688990 · 2023-06-27
Assignee
Inventors
Cpc classification
H01R43/16
ELECTRICITY
H01R24/60
ELECTRICITY
H01R43/08
ELECTRICITY
International classification
Abstract
A terminal structure of a high-frequency signal connector and a manufacturing method thereof, in which multiple first terminals and multiple second terminals, multiple excavation areas and multiple trimming lines are trimmed from a tape, the first terminals and the second terminals are arranged alternately, each of the trimming lines is located between one of the first terminals and one of the second terminals that are disposed next to each other, followed by stamping the first terminals and the second terminals to form a first terminal set and a second terminal set. The first terminals and the second terminals are formed simultaneously on a single tape, and in turn, the period for fabricating dies and developing dies may be reduced, and less metal tapes is wasted after blanking of the first terminals and the second terminals, in order to decrease processes and reduce a manufacturing cost of the connector effectively.
Claims
1. A method for manufacturing a terminal structure of a high-frequency signal connector, in which multiple first terminals and multiple second terminals, multiple excavation areas and multiple trimming lines are trimmed from a tape, the first terminals and the second terminals are arranged alternately, each of the trimming lines is located between one of the first terminals and one of the second terminals that are disposed next to each other, the multiple first terminals and the multiple second terminals are divided into multiple pairs of terminals, each of the pairs of terminals includes one of the first terminals and one of the second terminals that are disposed next to each other, each of the excavation areas is only formed in a side, which is disposed toward the second terminal of the same pair of terminals, of the first terminal and a side, which is disposed toward the first terminal of the same pair of terminals, of the second terminal of one of the pairs of terminals, followed by stamping the first terminals and the second terminals to form a first terminal set and a second terminal set.
2. The method for manufacturing the terminal structure of the high-frequency signal connector as claim 1 further comprising trimming the tape to meet dimension specifications with respect to lengths for each of the first terminals and each of the second terminals.
3. The method for manufacturing the terminal structure of the high-frequency signal connector as claim 1 further comprising trimming the tape to meet the dimension specifications with respect to the lengths for each of the first terminals and each of the second terminals when each of the first terminals and each of the second terminals are trimmed from the tape.
4. The method for manufacturing the terminal structure of the high-frequency signal connector as claim 1, wherein the first terminals constitute an upper terminal set of the connector, and the second terminals constitute a lower terminal set of the connector.
5. The method for manufacturing the terminal structure of the high-frequency signal connector as claim 1, wherein each of the excavation areas is in the form of a circle, a square, a diamond, or a trapezoid.
6. A terminal structure of a high-frequency signal connector, including: multiple first terminals; multiple second terminals, the first terminals and the second terminals arranged alternately, wherein the multiple first terminals and the multiple second terminals are divided into multiple pairs of terminals, and each of the pairs of terminals includes one of the first terminals and one of the second terminals that are disposed next to each other; and multiple excavation areas, each of the excavation areas only formed in a side, which is disposed toward the second terminal of the same pair of terminals, of the first terminal and a side, which is disposed toward the first terminal of the same pair of terminals, of the second terminal of one of the pairs of terminals, for reducing an area of each of the terminals to reduce a characteristic impedance.
7. The terminal structure of the high-frequency signal connector as claim 6, wherein the first terminals constitute an upper terminal set of the connector, and the second terminals constitute a lower terminal set of the connector.
8. The terminal structure of the high-frequency signal connector as claim 6, wherein each of the excavation areas is in the form of a circle, a square, a diamond, or a trapezoid.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
(13) Referring to
(14) As shown in the figures, the first terminals 10, 11, 12, 13, 14, 15, 16, 17, 18, 19 and the second terminals 21, 22, 23, 24, 25, 26, 27, 28, 29 are arranged in a cross form on the terminal tape 3 in order, respectively, portions of the tape 3 are excavated between each of the first terminals 10˜19 and each of the second terminals 21˜29 to form multiple excavation areas 31, and multiple trimming lines 32 are provided on adjacent boundaries of the tape 3 without excavation between each of the first terminals and each of the second terminals. After the step of excavating the portions of the tape 3 for the excavation areas 31 is completed for the tape 3 and each of the terminals are resulted via trimming along each of the trimming lines 32, each of the first terminals and each of the second terminals are stamped simultaneously, such that the first terminals 10˜19 are stamped upward to form an upper terminal set, namely the first terminal set 1, and the second terminals 21˜29 are stamped downward to form a lower terminal set, namely the second terminal set 2.
(15) Referring to
(16) Therefore, two assembly lines need to be disposed for the conventional two-piece tape process in order for providing two tapes 4 and 5, and two sets of dies are required to fabricate the two sets of terminals (an upper rank of terminals and a lower rank of terminals), namely the first terminal set 4A and the second terminal set 5A. However, the method for manufacturing terminal sets with a one-piece tape according to the present invention requires only disposition of one assembly line, provision of one single tape 3 and development of one set of dies, which is able to fabricate two types of terminals (an upper rank of terminals and a lower rank of terminals), namely the first terminal set 1 and the second terminal set 2. Accordingly, compared to the process of the conventional prior art, in the invention, the expense for one set of dies may be eliminated and the cost for development of dies may be reduced, while one assembly line of terminals is eliminated to reduce the loss of materials due to blanking of two tapes, such that the cost for manufacturing HDMI electrical connectors may be reduced significantly and the invention contributes to a great economic benefit.
(17) In a first preferred embodiment according to the invention, the tape 3 may be trimmed in advance to meet dimension specifications with respect to lengths for each of the first terminals 10˜19 and each of the second terminals 21˜29. In this way, the first terminal set 1 and the second terminal set 2 may be formed on a tape 3 simultaneously, and in turn, the period or time for fabricating dies and development of dies may be reduced, and less material waste is available for metal tape conducting materials after blanking of each of the first terminals 10˜19 and each of the second terminals 21˜29, in order to achieve effective reduction of manufacturing cost for HDMI electrical connectors, such that the present invention can practically meet the requirement of industrial utilization.
(18) In the first embodiment according to the invention, the tape 3 may be trimmed to meet the dimension specifications with respect to the lengths for each of the first terminals 10˜19 and each of the second terminals 21˜29 when each of the first terminals 10˜19 and each of the second terminals 21˜29 are resulted via trimming from the tape 3. In this way, the first terminal set 1 and the second terminal set 2 may be formed on a tape 3 simultaneously, and in turn, the period or time for fabricating dies and development of dies may be reduced, and less material waste is available for metal tape conducting materials after blanking of each of the first terminals 10˜19 and each of the second terminals 21˜29, in order to achieve effective reduction of manufacturing cost for connectors, such that the invention can practically meet the requirement of industrial utilization.
(19) In the preferred embodiment according to the invention, each excavation area 31 may be formed in a shape of an extended bar (as shown in
(20) In the embodiment according to the invention, as shown in
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(22) In summary, the terminal structure of the high-frequency signal connector and the manufacturing method thereof according to the present invention indeed improve the shortages of the conventional prior arts, capable of forming the first terminal set and the second terminal set on a single tape simultaneously, and in turn, reducing disposition of one assembly line and the period for fabricating dies and development of dies, as well as contributing to less waste of metal tape materials after blanking of each of the first terminals and each of the second terminals, to reduce the manufacturing cost of electrical connectors effectively. Moreover, by excavating partial materials on a terminal tape for reducing the area of each of the terminals to achieve the effectiveness of reducing the characteristic impedance of the terminal, the invention has the advantages and effects of advancement, practicality and compliance with needs of industry.
(23) However, what described above are only preferred embodiments according to the invention, and shall not be used to limit the scope of the implementation in accordance with the invention. Therefore, any equivalent changes and modifications made with reference to the scope of the claims and the specifications in accordance with the invention shall be within the scope of the claims covered by the patent to be obtained in accordance with the invention