ELECTRONIC APPARATUS AND HEAT DISSIPATION AND EMI SHIELDING STRUCTURE THEREOF

Abstract

An electronic apparatus and heat dissipation and EMI shielding structure thereof are provided. The electronic apparatus includes a substrate, at least one chip disposed on the substrate, and the heat dissipation and EMI shielding structure. The heat dissipation and EMI shielding structure covers the chip and includes a shielding frame and a heat dissipation element. The shielding frame has an opening to expose the chip, and the heat dissipation element is disposed on the shielding frame and covers the opening. The conjunction of the shielding frame and the heat dissipation element can protect the chip from being interfered with electromagnetic waves, and the heat generated by the chip can be dissipated by the heat dissipation element.

Claims

1. A heat dissipation and EMI shielding structure for at least one chip disposed on a substrate and comprising: a shielding frame having at least one opening to expose the chip; and a heat dissipation element disposed on the shielding frame to cover the opening, wherein the shielding frame is in conjunction with the heat dissipation element to protect the chip from electromagnetic interference, and the heat dissipation element dissipates heat generated from the chip.

2. The heat dissipation and EMI shielding structure according to claim 1, wherein the heat dissipation element includes a heat dissipation layer and an adhesive layer, the heat dissipation layer is fixed on the shielding frame and the chip through the adhesive layer, and heat generated from the chip is conducted to the heat dissipation layer through the adhesive layer.

3. The heat dissipation and EMI shielding structure according to claim 2, wherein the heat dissipation layer is a conductive heat dissipation layer so as to protect the chip from the electromagnetic interference in conjunction with the shielding frame.

4. The heat dissipation and EMI shielding structure according to claim 3, wherein the conductive heat dissipation layer is made of copper, aluminum, or graphene.

5. The heat dissipation and EMI shielding structure according to claim 2, wherein the heat dissipation layer is an electrical insulating heat dissipation layer, the adhesive layer is a curable conductive adhesive layer so as to protect the chip from electromagnetic interference in conjunction with the shielding frame.

6. The heat dissipation and EMI shielding structure according to claim 1, wherein the heat dissipation element includes a heat sink and a cured thermally conductive adhesive, and the heat sink is attached to the shielding frame through the cured thermally conductive adhesive so as to protect the chip from electromagnetic interference in conjunction with the shielding frame.

7. The heat dissipation and EMI shielding structure according to claim 1, wherein the shielding frame comprises a top plate and an enclosing sidewall extending downward from an outer periphery of a surface of the top plate toward the substrate.

8. The heat dissipation and EMI shielding structure according to claim 7, wherein the shielding frame is disposed on the substrate with the enclosing sidewall in contact with the substrate, and a height of a top surface of the top plate relative to a substrate surface is larger, equal to, or less than that of an upper surface of the chip relative to the substrate surface.

9. The heat dissipation and EMI shielding structure according to claim 8, wherein the heat dissipation element is attached to the top surface of the top plate and the upper surface of the chip.

10. An electronic apparatus comprising: a substrate; at least one chip disposed on the substrate; and a heat dissipation and EMI shielding structure disposed on the substrate, wherein the heat dissipation and EMI shielding structure comprises: a shielding frame having at least one opening to expose the chip; and a heat dissipation element disposed on the shielding frame to cover the opening, wherein the shielding frame is in conjunction with the heat dissipation element to protect the chip from electromagnetic interference, and the heat dissipation element dissipates heat generated from the chip.

11. The electronic apparatus according to claim 10, wherein the heat dissipation element includes a heat dissipation layer and an adhesive layer, the heat dissipation layer is fixed on the shielding frame and the chip through the adhesive layer, and heat generated from the chip is conducted to the heat dissipation layer through the adhesive layer.

12. The electronic apparatus according to claim 11, wherein the heat dissipation layer is a conductive heat dissipation layer so as to protect the chip from the electromagnetic interference in conjunction with the shielding frame.

13. The electronic apparatus according to claim 12, wherein the conductive heat dissipation layer is made of copper, aluminum, or graphene.

14. The electronic apparatus according to claim 11, wherein the heat dissipation layer is an electrical insulating heat dissipation layer, the adhesive layer is a curable conductive adhesive layer so as to protect the chip from electromagnetic interference in conjunction with the shielding frame.

15. The electronic apparatus according to claim 10, wherein the heat dissipation element includes a heat sink and a cured thermally conductive adhesive, and the heat sink is attached to the shielding frame through the cured thermally conductive adhesive so as to protect the chip from electromagnetic interference in conjunction with the shielding frame.

16. The electronic apparatus according to claim 10, wherein the shielding frame comprises a top plate and an enclosing sidewall extending downward from an outer periphery of a surface of the top plate toward the substrate.

17. The electronic apparatus according to claim 16, wherein the shielding frame is disposed on the substrate with the enclosing sidewall in contact with the substrate, and a height of a top surface of the top plate relative to the substrate surface is larger, equal to, or less than that of an upper surface of the chip relative to the substrate surface.

18. The electronic apparatus according to claim 16, wherein the heat dissipation element is attached to the top surface of the top plate and the upper surface of the chip.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0011] FIG. 1A shows an exploded perspective view of an electronic apparatus according to an embodiment of the instant disclosure;

[0012] FIG. 1B shows another exploded perspective view of an electronic apparatus shown in FIG. 1A;

[0013] FIG. 1C shows a perspective view of the electronic apparatus shown in FIG. 1A;

[0014] FIG. 2 shows a cross-sectional view of the electronic apparatus taken on line II-II shown in FIG. 1C;

[0015] FIG. 3 shows a cross-sectional view of an electronic apparatus according to another embodiment of the instant disclosure;

[0016] FIG. 4 shows a cross-sectional view of an electronic apparatus according to another embodiment of the instant disclosure; and

[0017] FIG. 5 shows a cross-sectional view of an electronic apparatus according to another embodiment of the instant disclosure.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] Please refer to FIG. 1A, FIG. 1B and FIG. 1C. The electronic apparatus 1 includes a substrate 10, at least one chip 11 and a heat dissipation and electromagnetic interference (EMI) shielding structure 12. The electronic apparatus 1 can be a portable electronic apparatus, such as a notebook, a tablet, a smartphone, and so on.

[0019] The substrate 10 can be a printed circuit board including a plurality of traces (not shown in FIG. 1A) and a plurality of components with different functions. The components may include a control chip, a memory chip, a plurality of connecting ports, and so on. The chip 11 is disposed on the substrate 10 and electrically connected to the other components through the traces configured in the substrate 10.

[0020] The heat dissipation and EMI shielding structure 12 is adapted to dissipate heat generated by at least one chip 11 disposed on the substrate 10, protect the chip 11 from being interfered with by electromagnetic waves, and prevent the other components from being affected by the radiation generated from the chip 11. As shown in FIG. 1A, the heat dissipation and EMI shielding structure 12 includes a shielding frame 120 and a heat dissipation element 121. As shown in FIG. 1A and FIG. 1B, the shielding frame 120 is disposed on the substrate 10 and has at least one opening 120h to expose the chip 11. Specifically, the shielding frame 120 includes a top plate 120a and an enclosing sidewall 120b extending downward from an outer periphery of a surface of the top plate 120a toward the substrate 10. The opening 120h positioned at the top plate 120a extends from a top surface 120s to a lower surface (not labeled) of the top plate 120a. The size of the opening 120h corresponds to the size of the chip 11. As shown in FIG. 1B, when the shielding frame 120 is disposed on the substrate 10, the chip 11 is arranged in the opening 120h, and the enclosing sidewall 120b is in contact with the substrate 10.

[0021] In addition, the height of the top surface 120s of the top plate 120a relative to the substrate 10 is similar to the height of an upper surface 11s of the chip 11 relative to the substrate 10. That is, it is different from the conventional structures in that the shielding frame 120 has a height similar to, or even thinner than, a thickness of the chip 11.

[0022] Please refer to FIG. 1C. The heat dissipation element 121 is disposed on the shielding frame 120 to cover the opening 120h. Furthermore, the shielding frame 120 protects the chip 11 from being interfered with by electromagnetic waves in conjunction with the heat dissipation element 121, and the heat from the chip 11 can be directly dissipated by the heat dissipation element 121. In the instant embodiment, the heat dissipation element 121 completely covers the opening 120h. However, in another embodiment, the heat dissipation element 121 can partially cover the opening 120h as long as a good EMI shield can be obtained.

[0023] Please refer to FIG. 2, which illustrates a cross-sectional view of the electronic apparatus taken on line II-II shown in FIG. 1C. In one embodiment, the heat dissipation element 121 includes a heat dissipation layer 121a and an adhesive layer 121b, and the heat dissipation layer 121a is fixed on the shielding frame 120 and the chip 11 through the adhesive layer 121b. The heat from the chip 11 can be conducted to the heat dissipation layer 121a through the adhesive layer 121b.

[0024] In one embodiment, the heat dissipation layer 121a is a conductive heat dissipation layer and can be made of copper, aluminum, or graphene. The adhesive layer 121b can be conductive or electrically insulative. As long as at least one of the heat dissipation layer 121a and the adhesive layer 121b is conductive, the heat dissipation element 121 can provide EMI shielding to the chip 11. In the instant embodiment, the heat dissipation layer 121a is made of graphene, and the adhesive layer 121b is electrically insulated. The heat dissipation layer 121a has a thickness of about 20 μm to about 25 μm, and the adhesive layer 12 lb has a thickness of about 10 μm.

[0025] In another embodiment, the heat dissipation layer 121a is an electrical insulating heat dissipation layer, such as a ceramic heat dissipation sheet, and the adhesive layer 121b is a curable conductive adhesive layer. In the embodiment of the instant disclosure, the thickness of the heat dissipation element 121 is thinner, ranging from about 20 μm to about 35 μm. In one embodiment, the heat dissipation element 121 is made of material in sheet form and having flexibility and ductility so that the heat dissipation element 121 can be attached to and conforming to the shape of the upper surface 11s of the chip 11.

[0026] Accordingly, even if the chip 11 may deform during the fabrication processes thereof and the deformation results in an uneven upper surface 11s, the heat dissipation element 121 can be conformingly attached to the upper surface 11s of the chip 11 through the opening 120h so that the heat generated from the center region of the chip 11 can be transferred to the outside atmosphere through the heat dissipation element 121. Compared to the conventional heat dissipation member and EMI shield, the heat dissipation and EMI shielding structure provided in the instant disclosure has higher heat dissipation efficiency.

[0027] In one experiment, the heat dissipation and EMI shielding structure 12 provided in the instant disclosure was applied to dissipate heat generated from a chip whose length and width were both 15 mm, and the heat dissipation element 121 had a length of about 62 mm and a width of about 36 mm. In the experiment, a conventional heat dissipation member and EMI shield was applied to dissipate the heat generated from the same chip. During the same time period, the experiment results showed the temperature of the chip can be lowered by 30 degrees C. through the heat dissipation and EMI shielding structure 12 provided in the instant disclosure, and the temperature of the chip was lowered by 15 degrees C. through the conventional ways. The experiment results prove the heat dissipation and EMI shielding structure 12 provided in the instant disclosure indeed has higher heat dissipation efficiency compared to the conventional structure.

[0028] Please refer to FIG. 3. FIG. 3 shows a cross-sectional view of an electronic apparatus according to another embodiment of the instant disclosure. In the embodiment shown in FIG. 3, the heat dissipation element 121′ includes a heat sink 121a′ and an adhesive layer 121b′. That is, after the adhesive layer 121b′ is directly coated on the upper surface 11s of the chip 11 and the shielding frame 120, the heat sink 121a′ is fixedly attached to the shielding frame 120 to improve the heat dissipation efficiency. The heat sink 121a′ can be made by aluminum extrusion molding and the adhesive layer 121b′ can be a cured with thermally conductive adhesive. In another embodiment, the heat sink 121a′ also can be omitted, and the heat generated from the chip 11 only dissipated by the cured thermally conductive adhesive.

[0029] Please refer to FIG. 4 and FIG. 5, which respectively show cross-sectional views of two different electronic apparatus according to other embodiments of the instant disclosure. Notably, in the embodiments shown in FIG. 2 and FIG. 3, the height hl of the top surface 120s of the top plate 120a of the shielding frame 120 relative to the substrate 10 is substantially the same as the height h2 of the upper surface 11s of the chip 11 relative to the substrate 10. That is, the top surface 120s of the top plate 120a is coplanar with the upper surface 11s of the chip 11.

[0030] However, in the embodiment shown in FIG. 4, the height hl of the top surface 120s of the top plate 120a of the shielding frame 120 relative to the substrate 10 is less than the height h2 of the upper surface 11s of the chip 11 relative to the substrate 10. Additionally, in the embodiment shown in FIG. 5, the height hl of the top surface 120s of the top plate 120a of the shielding frame 120 relative to the substrate 10 is larger than the height h2 of the upper surface 11s of the chip 11 relative to the substrate 10. In the embodiments respectively shown in FIG. 4 and FIG. 5, it is preferred that the difference between the top surface 120s of the top plate 120a of the shielding frame 120 and the upper surface 11s of the chip 11 is less than 0.2 mm, which can be determined according to the ductility of the heat dissipation element 121a and the adhesive capacity of the adhesive layer 121b to ensure the heat dissipation element 121 can be smoothly adhered to the upper surface 11s of the chip 11.

[0031] To sum up, in the heat dissipation and EMI shielding structure according to the embodiment of the instant disclosure, the shielding frame has an opening formed thereon so that the heat dissipation element can be directly attached to the chip through the opening to directly dissipate the heat generated from the chip. As such, the thermally conductive silicone pad can be omitted in the heat dissipation and EMI shielding structure of the instant disclosure, and the cost of the heat dissipation and EMI shielding structure can be reduced. Additionally, because the shielding frame can have substantially the same height as that of the chip, the overall thickness of the heat dissipation and EMI shielding structure provided herein is thinner than that of the conventional structure, which provides a benefit for minimizing the size of the portable electronic product.

[0032] Furthermore, the soft and flexible adhesive layer is applied so that the heat dissipation element of the instant disclosure is fixed on the upper surface of the chip. Accordingly, even if the chip is deformed during the fabrication processes thereof, the heat dissipation element can be smoothly adhered to the center region of the chip where the heat is generated. Compared to the conventional structure, the heat dissipation and EMI shielding structure has better heat dissipation efficiency.

[0033] The descriptions illustrated supra set forth simply the preferred embodiments of the instant disclosure; however, the characteristics of the instant disclosure are by no means restricted thereto. All changes, alterations, or modifications conveniently considered by those skilled in the art are deemed to be encompassed within the scope of the instant disclosure delineated by the following claims.