Flexible display and method of manufacturing the same
09847250 · 2017-12-19
Assignee
Inventors
- TAE AN SEO (HWASEONG-SI, KR)
- Tae Woong Kim (Yongin-si, KR)
- Seong Min WANG (Yongin-si, KR)
- JIN HWAN CHOI (SEOUL, KR)
Cpc classification
H01L2924/0002
ELECTRICITY
H01L2924/0002
ELECTRICITY
H01L2924/00
ELECTRICITY
H01L21/76838
ELECTRICITY
H01L27/1218
ELECTRICITY
H01L27/124
ELECTRICITY
H01L2924/00
ELECTRICITY
International classification
H01L21/768
ELECTRICITY
H01L23/498
ELECTRICITY
Abstract
A flexible display and method of manufacturing the same are disclosed. In one aspect, the display includes a flexible substrate having a bending area and a non-bending area and a plurality of metal wirings formed over the flexible substrate in the bending area and the non-bending area. Each of the metal wirings which are formed in the bending area includes a pair of first hard wirings formed over the flexible substrate and a first soft wiring electrically connected to ends of the pair of first hard wirings.
Claims
1. A flexible display, comprising: a flexible substrate having a bending area and a non-bending area; and a plurality of metal wirings formed over the flexible substrate in the bending area and the non-bending area, wherein each of the metal wirings which are formed in the bending area includes: a pair of first inflexible wirings formed over the flexible substrate and a first flexible wiring electrically connected to ends of the pair of first inflexible wirings.
2. The flexible display of claim 1, wherein the first flexible wirings are formed of one or more of the following: silver nanowire (AgNW), aluminum (Al), silver (Ag), magnesium (Mg), copper (Cu), titanium (Ti), bronze, and carbon nanotube (CNT).
3. The flexible display of claim 1, further comprising: a data driver; and a plurality of pixels formed over the flexible substrate, wherein the metal wirings comprise a plurality of data lines which are connected to the data driver, and wherein the data driver is configured to apply a plurality of driving voltages to the pixels via the data lines.
4. The flexible display of claim 1, further comprising: a scan driver; and a plurality of pixels formed over the flexible substrate, wherein the metal wirings comprise a plurality of scan lines which are connected to the gate driver, and wherein the gate driver is configured to apply a plurality of scan signals to the pixels via the scan lines.
5. The flexible display of claim 1, wherein ends of the first flexible wiring are respectively electrically connected to the ends of the first inflexible wirings by a female and male connection.
6. The flexible display of claim 1, wherein each of the metal wirings further comprises a pair of second inflexible wirings electrically connected to ends of the first flexible wirings.
7. A flexible display, comprising: a flexible substrate including a bending area and a non-bending area; and a plurality of metal wirings formed over the flexible substrate in the bending area and the non-bending area, wherein each of the metal wirings which are formed in the bending area includes: a first flexible wiring formed over the flexible substrate and a pair of first inflexible and wirings electrically connected to ends of the first flexible wiring.
8. The flexible display of claim 7, wherein each of the metal wirings further comprises a second flexible wiring electrically connected to ends of the first inflexible wirings.
9. The flexible display of claim 8, wherein each of the metal wirings further comprises a pair of second inflexible wirings electrically connected to ends of the second flexible wiring.
10. A method of manufacturing a flexible display, comprising: preparing a flexible substrate including a bending area and a non-bending area; coating an insulating layer over the flexible substrate; forming a plurality of metal wirings over the insulating layer in the bending area and the non-bending area; forming a plurality of bridge wirings so as to respectively electrically connect pairs of the metal wirings formed in the bending area; and forming a passivation layer over the insulating layer so as to cover the metal wirings and the bridge wirings.
11. The method of claim 10, wherein the bridge wirings are formed so as to be electrically connected to ends of the metal wirings via an inkjet method.
12. The method of claim 10, wherein the bridge wirings are formed so as to be electrically connected to ends of the metal wirings via a laser transfer method.
13. The method of claim 10, wherein the bridge wirings are formed so as to be electrically connected to ends of the metal wirings via a gravure printing method.
14. The method of claim 10, wherein the bridge wirings are formed so as to be electrically connected to ends of the metal wirings via a deposition method.
15. The method of claim 10, further comprising forming a plurality of inflexible metal wirings so as to be electrically connected to ends of the bridge wirings after the forming of the bridge wirings.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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DETAILED DESCRIPTION OF CERTAIN INVENTIVE EMBODIMENTS
(13) Hereinafter, the described technology will be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments are shown. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the described technology.
(14) Further, in exemplary embodiments, since like reference numerals designate like elements having the same or a similar configuration, an exemplary embodiment is representatively described, and in other exemplary embodiments, only those configurations differing from the previously described exemplary embodiment will be described.
(15) It is to be noted that the accompanying drawings is schematically illustrated and may not be illustrated to a scale. The relative dimensions and ratios of components illustrated may be exaggerated or reduced in the drawings for the sake of clarity and convenience in the drawings and any dimensions are only exemplary and therefore the described technology is not limited thereto. Further, the same structures, elements, or parts which are illustrated in at least two drawings are denoted by the same reference numerals, which are used to indicate similar features. When any first portion is described as being “over” or “on” another second portion, this means that the first portion may be directly formed on the second portion or a third portion may be interposed between the first portion and the second portion.
(16) An exemplary embodiment will be described in detail. As a result, numerous variations of exemplary embodiments are expected. Therefore, the exemplary embodiments are not limited to the specific form of the illustrated region(s) and, for example, also include form(s) that may be produced by manufacturing.
(17) Hereinafter, a flexible display according to an exemplary embodiment will be described with reference to
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(19) Referring to
(20) Additionally, a printed circuit board (PCB) 30 having a driving circuit unit other than the driver IC is connected to the flexible substrate 10 by using a flexible printed circuit (FPC) 20.
(21)
(22) Referring to
(23) The insulating layer 15 formed of an organic layer or an inorganic layer is formed on the flexible substrate 10 and the first hard wirings 82 are formed on the insulating layer 15. The first hard wiring 82 can be formed of chromium (Cr), molybdenum (Mo), aluminum (Al), titanium (Ti), or an alloy thereof. The first soft wiring 84 is connected to the ends of the first hard wirings 82 so as to form a bridge. The first soft wirings 84 can be formed of any one of silver nanowire (AgNW), aluminum (Al), silver (Ag), magnesium (Mg), copper (Cu), titanium (Ti), copper (Bronze), and carbon nanotube (CNT) or an alloy material thereof.
(24) When the flexible substrate 10 is bent, the first soft wiring 84 can be bent up and/or down based on the orientation of the drawings due to the connection structure of the first soft wiring 84 of
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(27) The metal wirings 81 and 82 which are formed in the bending region B includes the first soft wirings 84 contacting the flexible substrate 10 and the first hard wirings 82 connected to ends of the first soft wirings 84 so as to be connected to the first soft wirings 84.
(28) In contrast to the exemplary embodiment of
(29)
(30) Referring to
(31) In addition to the structure in which two soft wirings 84 and 86 and two hard wirings 82 and 83 which are illustrated in
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(33) Referring to
(34) Next, the metal wirings 82 and 84 are formed on the insulating layer 15 (S803). The metal wirings can be the hard wiring 82 which can be formed of chromium (Cr), molybdenum (Mo), aluminum (Al), titanium (Ti), or an alloy thereof as described above. Further, the metal wirings can be the soft wiring 84 which can be formed of any one of silver nanowire (AgNW), aluminum (Al), silver (Ag), magnesium (Mg), copper (Cu), titanium (Ti), copper (Bronze), and carbon nanotube (CNT) or an alloy material thereof.
(35) Next, the bridge wirings are formed on the metal wiring which is formed in the bending area B to connect the metal wirings (S804). When the metal wirings are the hard wiring 82, the bridge wirings are the soft wiring 84 and when the metal wirings are the soft wiring 84, the bridge wirings are the hard wiring 82. The stacked structure of the hard wiring and the soft wiring can be variously formed similar to the structures described with reference to
(36) Next, a passivation layer is formed on the insulating layer 15 to cover the metal wirings and the bridge wirings (S805). The passivation layer 25 is a protective layer to protect the metal wirings and the bridge wirings from the environment and can be formed of a single layer which is formed of one or more material such as a silicone oxide layer and a silicone nitride layer or a multilayer thereof but is not limited thereto, and therefore the passivation layer 25 can be formed of various materials.
(37) Further, as illustrated in
(38) Further, as illustrated in
(39) Further, as illustrated in
(40) Further, as illustrated in
(41) Additionally, the method can further include forming hard metal wirings which are connected to the ends of the bridge wirings so as to be connected to the bridge wirings after the forming of the bridge wirings. The method of manufacturing a flexible display according to the exemplary embodiment can be variously altered, corresponding to the structures described above with reference to
(42) As described above, the flexible display and the method of manufacturing the same in accordance with at least one exemplary embodiment, it is possible to prevent the disconnection of the wirings by using the soft wiring formed of a flexible material to electrically connect the existing hard metal wirings in the bending area of the flexible display. Therefore, it is possible to manufacture a flexible display that can be repeatedly bent.
(43) Further, it is possible to minimize the modification from existing processes by using the flexible metal wiring only in the bending area.
(44) Further, it is possible to save the manufacturing costs and improve the supply network management (SNM) by effectively using an expensive soft wiring (e.g., silver nanowire (AgNW)).
(45) While this disclosure has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.