Debondable Reactive Hot Melt Adhesives

Abstract

The present invention relates to a reactive hot melt adhesive composition, which at least partially loses its adhesiveness upon application of an electric voltage and thus allows debonding of substrates that have been bonded using said adhesive. Furthermore, the present invention relates to a method for its production and a method for forming a bonded substrate using such a reactive hot melt adhesive composition.

Claims

1. An electrically debondable reactive hot melt adhesive composition, comprising: a) at least one isocyanate-functional polyurethane polymer; and b) at least one organic or inorganic salt.

2. The electrically debondable reactive hot melt adhesive composition according to claim 1, wherein the at least one isocyanate-functional polyurethane polymer is present in an amount of 20% to 90% by weight of the adhesive composition.

3. The electrically debondable reactive hot melt adhesive composition according to claim 1, wherein the at least one organic or inorganic salt is present in an amount of 1% to 30% by weight of the adhesive composition.

4. The electrically debondable reactive hot melt adhesive composition according to claim 1, wherein the composition comprises at least one polar compound c), which polar compound c) is different from compounds a) and b).

5. The electrically debondable reactive hot melt adhesive composition according to claim 4, wherein the at least one polar compound c) is selected from the group consisting of propylene carbonate and poly(ethylene glycol)bis(2-ethylhexanoate).

6. The electrically debondable reactive hot melt adhesive composition according to claim 1, wherein compound b) is a trifluoromethanesulfonate salt, preferably lithium trifluoromethanesulfonate.

7. The electrically debondable reactive hot melt adhesive composition according to claim 1, wherein the free NCO content in the isocyanate-functional polyurethane polymer ranges from 0.1% to 5%.

8. The electrically debondable reactive hot melt adhesive composition according to claim 1, further comprising one or more additives selected from the group consisting of plasticizer, adhesion promoter, pigment, corrosion inhibitor, leveling agent, gloss promoter, stability enhancer, anti-foaming agent, antioxidant and filler, which are different from compounds a) and b).

9. A method for producing an electrically debondable reactive hot melt adhesive composition according to claim 1, the method comprising: providing an isocyanate-functional polyurethane hot melt composition optionally comprising one or more additives; providing at least one organic or inorganic salt; and blending the reactive polyurethane hot melt composition in a molten state with the at least one organic or inorganic salt, wherein the blending step is performed at temperatures such as to keep the hot melt in the molten state.

10. A method for forming a debondable adhesive bond between a first and a second substrate, the method comprising the steps of: i) applying the electrically debondable reactive hot melt adhesive composition according to claim 1 to the surface of the first substrate and optionally the surface of the second substrate; ii) contacting the first and the second substrates such that the electrically debondable reactive hot melt adhesive composition is disposed between the two substrates; iii) allowing formation of an adhesive bond between the two substrates to provide bonded substrates; and iv) optionally applying a voltage to the bonded substrates whereby adhesion at least one interface between the electrically debondable reactive hot melt adhesive composition and a substrate surface is substantially weakened.

11. The method according to claim 10, wherein (1) the voltage applied ranges from 9 to 100 V; (2) the voltage is applied for an interval of 1 second to 20 minutes; and/or (3) the first and/or the second substrate are electrically conductive.

12. The method according to claim 10, wherein in step iv) in addition to the voltage heating at a temperature up to 80° C. is applied to the bonded substrates.

13. A bonded substrate obtained according to the methods of claim 10, wherein the bonded substrate can be debonded upon application of an electric voltage and, optionally, heat.

Description

EXAMPLES

Preparation of the Electrically Debondable Reactive Hot Melt Adhesive Compositions

[0099] Reactive polyurethane hot melts were heated to 70° C. Subsequently an electrolyte composition was added in appropriate amounts, followed by mechanical agitation (70 rpm) for approximately 10 minutes. The heat applied has to be sufficient enough to maintain the composition in a molten state, whilst the mechanical agitation is required to disperse the ionic material thoroughly to achieve visual homogeneity.

Example 1

[0100] An electrically debondable reactive polyurethane hot melt composition, comprising an isocyanate-functional polyurethane polymer with a free NCO content of ca. 1.8% and containing 15 wt % electrolyte composition 1 was applied between two aluminum substrates to form a composite.

Electrolyte composition 1=30 wt. % lithium trifluoromethanesulfonate (CF.sub.3SO.sub.3Li) 70 wt % 4-Methyl-1,3-dioxolan-2-one (propylene carbonate) (C.sub.4H.sub.6O.sub.3)

[0101] Upon introduction of 48 V current at 25 ° C. and 1 atm, adhesive failure observed at cathode attached substrate with bond strengths of 0.06 MPa (control=1.15 MPa). Upon introduction of 48 V current at 45° C. and 1 atm, adhesive failure observed at cathode attached substrate with bond strengths of 0.63 MPa (control=1.10 MPa). Upon introduction of 48 V current at 65° C. and 1 atm, adhesive failure is observed at cathode attached substrate with bond strengths of 0.30 MPA (control=0.58 MPA).

Example 2

[0102] The electrically debondable reactive polyurethane hot melt composition from Example 1 was applied between one aluminum substrate and one stainless steel substrate to form composite.

[0103] Upon introduction of 48 V current at 25° C. and 1 atm, adhesive failure was observed at the cathode attached substrate with bond strengths of 0.05 MPa.

Example 3

[0104] The electrically debondable reactive polyurethane hot melt composition from Example 1 was applied between two aluminum substrates to form a composite.

[0105] Upon introduction of 9 V current at 25° C. and 1 atm, adhesive failure observed at cathode attached substrate with bond strengths of 0.04 MPa (control=1.15 MPa).

Example 4

[0106] An electrically debondable reactive polyurethane hot melt composition comprising the isocyanate-functional polyurethane polymer with a free NCO content of ca. 1.8% and containing 15 wt % electrolyte composition 2, as defined below, was applied between two aluminum substrates to form a composite.

Electrolyte composition 2=30 wt. % lithium trifluoromethanesulfonate (CF.sub.3SO.sub.3Li) 70 wt. % poly(ethylene glycol)bis(2-ethylhexanoate) (PEG-bis-2EH) average M.sub.N˜650

[0107] Upon introduction of 48 V current at 25° C. and 1 atm, adhesive failure is observed at anode attached substrate with bond strengths of 0.16 MPa (control=1.20 MPa).

Example 5

[0108] The electrically debondable reactive polyurethane hot melt composition from Example 4 was applied between two aluminum substrates to form a composite.

[0109] Upon introduction of 48 V current at 35° C. and 1 atm, adhesive failure is observed at anode attached substrate with bond strengths of 0.12 MPa (control=1.14 MPa).