HIGH-ENTROPY ALLOY FILM AND MANUFACTURING METHOD THEREOF
20230193435 · 2023-06-22
Inventors
- Jyh-Wei Lee (New Taipei, TW)
- Bih-Show Lou (New Taipei, TW)
- Yung-Chin Yang (New Taipei, TW)
- Hsin Chao (New Taipei, TW)
Cpc classification
C22C30/00
CHEMISTRY; METALLURGY
C23C14/16
CHEMISTRY; METALLURGY
C22C27/02
CHEMISTRY; METALLURGY
B32B15/013
PERFORMING OPERATIONS; TRANSPORTING
C23C14/35
CHEMISTRY; METALLURGY
International classification
C22C30/00
CHEMISTRY; METALLURGY
C23C14/35
CHEMISTRY; METALLURGY
C23C14/16
CHEMISTRY; METALLURGY
Abstract
A high-entropy alloy film, the composition of which includes titanium, zirconium, niobium, tantalum and iron. The high-entropy alloy film is made with a combination of elements with high biocompatibility, and its formation of non-crystalline structure is further improved by adding iron. Furthermore, as the content of titanium in the high-entropy alloy film is adjusted, the microstructure, mechanical properties, and corrosion resistance of the high-entropy alloy film is changed as well.
Claims
1. A method for manufacturing a high-entropy alloy thin film, including: providing at least one high-entropy alloy target material, wherein a composition of the high-entropy alloy target material includes titanium, zirconium, niobium, tantalum, and iron, and wherein individual contents of titanium, zirconium, niobium, tantalum, and iron are all between 5 and 35 atomic percent (at.%); and depositing the at least one high-entropy alloy target material on at least one surface of a substrate using a physical vapor deposition method so as to form a high-entropy alloy thin film on the at least one surface of the substrate.
2. The method for manufacturing a high-entropy alloy thin film according to claim 1, wherein the physical vapor deposition method is an evaporation method, a magnetron sputtering method, an ion plating method, a cathodic arc coating method, a pulse laser deposition method, or an atomic layer deposition method.
3. The method for manufacturing a high-entropy alloy thin film according to claim 1, wherein the substrate is a commercially pure titanium (cp-Ti) substrate, a Ti alloy substrate, a 316 L stainless steel substrate, or a P-type single crystal silicon substrate.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to make the above and other objects, features, advantages, and embodiments of the present invention easier to understand, the description of the accompanying drawings is as follows:
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[0032] According to the usual operating method, the various features and elements in the figures are not drawn to actual scale, and the drawing methods are used to present the specific features and elements related to the present invention in the best way. In addition, in different drawings, the same or similar element symbols are used to refer to similar elements and components.
DETAILED DESCRIPTION OF THE INVENTION
[0033] In order to make the description of the present invention more detailed and complete, the following provides an illustrative description for the implementation aspects and specific embodiments of the present invention, but this is not the only way to implement or use the specific embodiments of the present invention. In the scope of this specification and the appended patent application, unless the context indicates otherwise, “a” and “the” can also be interpreted as plurals. In addition, in the scope of this specification and the attached patent application, unless otherwise stated, “installed on something” can be regarded as directly or indirectly in contact with the surface of something by attaching or other forms. The definition of the surface should be judged based on the semantics of the preceding and following/paragraphs of the description and the general knowledge of the field to which this description belongs.
[0034] Although the numerical ranges and parameters used to define the present invention are approximate numerical values, the relevant numerical values in the specific embodiments have been presented here as accurately as possible. However, any value inherently inevitably contains standard deviations due to individual test methods. Here, “about” usually means that the actual value is within plus or minus 10%, 5%, 1%, or 0.5% of a specific value or a range. Alternatively, the term “about” means that the actual value falls within the acceptable standard error of the average value, which is determined by those who have ordinary knowledge in the field of the present invention. Therefore, unless otherwise stated to the contrary, the numerical parameters disclosed in this specification and the accompanying patent scope are approximate values and can be changed according to requirements. At least these numerical parameters should be understood as the indicated effective number of digits and the value obtained by applying the general carry method.
Embodiments
[0035] The embodiments of the present invention aim to provide a high-entropy alloy film and a manufacturing method thereof. For this embodiment, the technical spirit of the present invention can be further understood according to the flowchart shown in
[0036] In process S1, vacuum arc melting or powder metallurgy can be used to make the high-entropy alloy target using the five pure elements of titanium, zirconium, niobium, tantalum, and iron according to proportions. The alloy target is a TiZrNbTaFe high-entropy alloy target. The individual contents of titanium, zirconium, niobium, tantalum, and iron in the composition are all between 5 and 35 atomic percent (at.%). However, the preparation process of the TiZrNbTaFe high-entropy alloy target and the processing method after preparation (for example, conventional technical content such as grinding and leveling after solidification) are not limited by the present invention.
[0037] In the process S2, first, a commercially pure titanium (cp-Ti), or Ti alloy, or 316 L stainless steel, or a P-type (100) single crystal silicon substrate is selected as the substrate. Next, the TiZrNbTaFe high-entropy alloy target produced in process S1 is coated on the surface of the substrate by a physical vapor deposition method, wherein the physical vapor deposition method can be evaporation deposition, magnetron sputtering, an ion plating method, a cathodic arc coating method, a pulse laser deposition method, or an atomic layer deposition method. Preferably, the physical vapor deposition method is a magnetron sputtering method. More preferably, the magnetron sputtering method is high-power impulse magnetron sputtering (HiPIMS) or high-power pulsed magnetron sputtering (HPPMS). Accordingly, in this embodiment, the TiZrNbTaFe high-entropy alloy target and a pure titanium target are co-deposited on the substrate by a high-power impulse magnetron sputtering system. During deposition, the operating power of the TiZrNbTaFe high-entropy alloy target is fixed at 300 W, and the operating power of the titanium target is set to 0 W, 25 W, 50 W, 75 W, 100 W, 125 W, so as to obtain six kinds of high-entropy alloy films with different titanium contents. Alternatively, those with ordinary knowledge in the technical field to which this case belongs can also directly operate with six TiZrNbTaFe high-entropy alloy targets with a fixed metal content. In addition, the deposition time of this process is from 70 to 90 minutes. Preferably, it is 80 minutes. However, the detailed parameter settings are not limited by the present invention.
[0038] For the six kinds of high-entropy alloy films made by the above-mentioned manufacturing method, the composition analysis was further performed with a field emission electron probe microanalyzer (FE-EPMA). The composition after the analysis is shown in Table 1 below. The composition of the six film samples obtained includes titanium, zirconium, niobium, tantalum, iron, and oxygen. The individual contents of titanium, zirconium, niobium, tantalum, and iron are all between 5 to 35 atomic percent (at.%) The oxygen content is between 5 to 7 atomic percent (at.%), which is obtained due to the contamination from the deposition system or from the target. Furthermore, the above-mentioned samples 1 to 6 have six kinds of titanium content between approximately 16.3 to 26 atomic percent depending on the operating power of the titanium target. Alternatively, the above samples 1 to 6 all meet the definition of high-entropy alloys, that is, the change in entropy per mole (ΔS) is greater than 1.5R.
TABLE-US-00001 Sample (Ti target power) Composition (at. %) ΔS Ti Zr Nb Ta Fe O 1 (0 W) 16.9 ± 0.6 12.7 ± 0.2 22.2 ±0.4 20.2 ± 0.2 21.8 ±0.04 6.1 ± 0.3 1.59R 2 (25 W) 17.3 ± 0.5 14.5 ± 0.2 22.2 ± 0.4 18.7 ± 0.7 20.8 ±0.356 6.8 ± 0.7 1.60R 3 (50 W) 18.1 ± 1.1 13.3 ± 0.4 22.0 ± 0.5 18.9 ± 0.8 21.4 ±0.6 5.9 ± 0.1 1.60R 4 (75 W) 19.7 ± 0.4 13.7 ± 0.2 21.8 ± 0.4 18.3 ± 0.6 20.4 ±0.3 5.9 ± 0.5 1.60R 5 (100 W) 21.8 ± 0.4 12.6 ± 0.1 21.1 ± 0.2 17.9 ± 0.3 20.2 ±0.4 6.2 ± 0.6 1.59R 6 (125 W) 25.5 ± 0.5 11.8 ± 0.1 19.6 ± 0.2 17.4 ± 0.3 19.3 ±0.2 6.1 ± 0.2 1.58R
[0039] Next, the present invention further provides X-ray diffraction analysis, cross-sectional microstructure analysis, mechanical property analysis, corrosion resistance analysis, and biocompatibility analysis performed on the high-entropy alloy films of samples 1 to 6. Please refer to the tables and drawings of the present invention for a more comprehensive understanding of the technical features and effects of the present invention.
X-Ray Diffraction Analysis
[0040] X-ray diffraction analysis mainly uses accelerated electrons to hit a metal target to generate X-rays and irradiate X-rays on the surface of the material. Because different crystal structures have different crystal plane spacing, and only when the X-ray incident angle meets Bragg’s law, constructive interference can be generated, and the detector can receive a strong diffracted beam signal. Accordingly, different materials or different structures have different angles of constructive interference. Refer to
Cross-Sectional Microstructure Analysis
[0041] At this stage, the scanning electron microscope (SEM) is used to observe the cross-sectional microstructure of the above-mentioned samples 1 to 6, and the images obtained are as shown in
Mechanical Property Analysis
[0042] At this stage, a nanoindenter is used to measure the mechanical properties of the high-entropy alloy films of the above samples 1 to 6. The technique mainly measures the elastic modulus (E) and hardness (H) of the samples by nano-sized probes (both units are billion Pascals (GPa)), and obtain the plastic index (hardness/elastic modulus, H/E) by calculation, which can be regarded as an index of the wear resistance of the material. The mechanical quality test results of the above samples 1 to 6 are shown in Table 2 below. It can be further understood that as the content of titanium contained in the high-entropy alloy film increases, the hardness of the film decreases. Therefore, sample 6 (the operating power of the titanium target is 125 W) has the best wear resistance compared to other samples.
TABLE-US-00002 Sample (Ti target power) 1 (0 W) 2 (25 W) 3 (50 W) 4 (75 W) 5 (100 W) 6 (125 W) Hardness (GPa) 9.1±0.5 9.0±0.1 8.9±0.1 8.6±0.3 8.4±0.3 8.4±0.5 Elastic modulus (GPa) 135.0±4.9 134.0±2.7 128.7±3.0 128.2±2.8 128.2±4.4 127.4±1.5 H/E 0.0675 0.0673 0.0656 0.0673 0.0656 0.0702
Corrosion Resistance Analysis
[0043] In this stage, the corrosion resistance of the test piece coated with the high-entropy alloy film of the above samples 1 to 6 in Ringer solution is measured by a potentiostat, and the commercial pure titanium substrate is used as the control test piece for comparison. The potential value or current value recorded during the experiment can be used to obtain a potentiodynamic polarization curve and analyze corrosion resistance. Refer to
TABLE-US-00003 Sample # E.sub.corr(v) Icorr (A/cm.sup.2) Rp(Ωcm.sup.2) cp-Ti -324.06 1.35x10.sup.-9 1.43x10.sup.6 1 (0 W) -172.55 2.91x10.sup.-8 4.48x10.sup.5 2 (25 W) -155.10 2.70x10.sup.-8 5.04x10.sup.5 3 (50 W) -134.85 2.46x10.sup.-8 5.5x10.sup.5 4 (75 W) -160.40 1.83x10.sup.-8 8.05x10.sup.5 5 (100 W) -177.30 2.29x10.sup.-8 5.53x10.sup.5 6 (125 W) -181.40 3.68x10.sup.-8 4.42x10.sup.5
Cell Experiment
[0044] In this stage, the present invention selects sample 4 (the operating power of the titanium target is 75 W) with the best corrosion resistance in the above-mentioned corrosion resistance analysis, sample 1 (the operating power of the titanium target is 0 W), as well as commercial pure titanium substrates, and osteoblast-like cells MG-63 were used for cell viability analysis. By culturing MG-63 cells on the test piece coated with the above sample 4 and sample 1, and a commercial pure titanium substrate (as a control group), and observing the number of cells surviving after 1, 3, and 5 days of culture, and evaluate the biocompatibility of the experimental samples. Refer to
Animal Experiment
[0045] In this stage, the same sample group as the cell experiment is selected, and then the animal experiment of subcutaneous implantation in rats is further carried out. First, the diameter of the test piece used is 15 mm and the thickness is 1 mm. The test piece was coated with the above-mentioned sample 1 (operating power of titanium target is 0 W) and sample 4 (operating power of titanium target is 75 W), and experiments were carried out separately with commercial pure titanium substrates with the same geometric parameters. The test pieces were implanted under the skin of the rats and at 1, 4, and 12 weeks they were taken out and observed. Then, the muscle tissue specimens in contact with the test pieces were collected, and the tissue sections were stained with hematoxylin-eosin to observe their relative inflammatory state compared to a control group when the test piece was not implanted. Refer to
[0046] According to the content of the above-mentioned embodiments, it can be understood that through the implementation of the present invention, not only a high-entropy alloy film with good biocompatibility can be made, but also the content of the titanium component can be adjusted to obtain excellent mechanical properties and corrosion resistance. In addition, by adding iron elements, not only can the manufacturing cost be reduced, but also the ability to produce amorphous structures can be improved.
[0047] Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be based on what is defined by the attached patent application scope.