Composition for Preparation of Plating Base and Plating Base Thereof

Abstract

Provided is a composition for forming a plating base on which plating is applied without a pretreatment, especially any activation process for the plating base, conventionally believed to be necessary, as well as a thus-formed plating base and a method of forming a plating coat over the plating base. The plating base is a coating film formed by applying and drying a metal nanoparticle dispersion liquid or a metal nanoparticle dispersion ink in which metal nanoparticles are protected with a small amount of protecting agent. Thus, a metal film can be formed by plating without operations such as substrate cleaning or catalyst imparting and activating. Since it is not necessary to wash the substrate with acid or base solution or to heat-treat it at a high temperature, many variations of materials become available for the substrate.

Claims

1. A composition for forming a plating base, comprising: (A) inorganic nanoparticles that are made of at least one or two or more kinds of substances selected from a group consisting of metal, semiconductor substance, and metal oxide; (B) at least one or two or more kinds of organic pi conjugated ligands which include phthalocyanine and/or naphthalocyanine wherein the organic pi conjugated ligands include a polar substituent group; and (C) an aqueous or water-soluble solvent and/or dispersing medium wherein a residue of the composition exhibits electronic conductivity due to substantial loss of the aqueous or water-soluble solvent and/or dispersing medium from the composition.

2. The composition for forming the plating base according to claim 1 wherein the organic pi conjugated ligands comprise at least one selected from a group consisting of TCAP, TCAN, OCAP, and OCAN.

3. The composition for forming the plating base according to claim 1 further comprising: (D) a binder resin.

4. The composition for forming the plating base according to claim 1 wherein the inorganic nanoparticles comprise at least one kind of element or metal alloy or a compound formed of at least one kind of element and/or metal alloy selected from a group consisting of Li, Be, B, Na, Mg, Al, Si, P, K, Ca, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, As, Se, Rb, Sr, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, In, Sn, Sb, Te, Cs, Ba, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Hf, Ta, W, Re, Os, Ir, Pt, Au, Hg, Tl, Pb, Bi, Po, and At.

5. The composition for forming the plating base according to claim 1 wherein the inorganic nanoparticles have an average particle diameter of 1 nm to 500 nm.

6. The composition for forming the plating base according to claim 1 wherein the aqueous or water-soluble solvent and/or dispersing medium comprises at least one selected from a group consisting of water, an organic solvent that is miscible in water, and a mixture of water.

7. The composition for forming the plating base according to claim 3 wherein the binder resin comprises at least one or two or more kinds selected from a group consisting of acrylic resin, polyester, polyurethane polyethylene resin, polypropylene, polystyrene, polyvinylpyrrolidone, polyethylene glycol, polyamide, polyepoxy, polyvinyl alcohol, polysaccharides, and protein.

8. A thin film for a plating base which is attached to a predetermined substrate wherein the film comprises (A) inorganic nanoparticles that are made of at least one or two or more kinds of substances selected from a group consisting of metal, semiconductor substance, and metal oxide; and (B) at least one or two or more kinds of organic pi conjugated ligands which may include phthalocyanine and/or naphthalocyanine wherein the organic pi conjugated ligands may include a polar substituent group, and wherein the inorganic nanoparticles and the organic pi conjugated ligands are substantially in a homogeneously mixed state in the film.

9. The thin film for the plating base according to claim 8 further comprising: (C) an aqueous or water-soluble solvent and/or dispersing medium at most to an extent such that the thin film is recognized as a solid body and exhibits electric conductivity.

10. The thin film for the plating base according to claim 8 further comprising: (D) a binder resin.

11. The thin film for the plating base according to claim 8 wherein the inorganic nanoparticles comprises at least one kind of element or a metal alloy or a compound formed of at least one kind of element and/or metal alloy selected from a group consisting of Li, Be, B, Na, Mg, Al, Si, P, K, Ca, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, As, Se, Rb, Sr, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, In, Sn, Sb, Te, Cs, Ba, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Hf, Ta, W, Re, Os, Ir, Pt, Au, Hg, Tl, Pb, Bi, Po, and At.

12. The thin film for the plating base according to claim 9 wherein the aqueous or water-soluble solvent and/or dispersing medium comprises at least one selected from a group consisting of water, an organic solvent that is miscible in water, and a mixture of water.

13. The thin film for the plating base according to claim 10 wherein the binder resin may include at least one or two or more kinds selected from a group consisting of acrylic resin, polyester, polyurethane polyethylene resin, polypropylene, polystyrene, polyvinylpyrrolidone, polyethylene glycol, polyamide, polyepoxy, polyvinyl alcohol, polysaccharides, and protein.

14. The thin film for the plating base according to claim 8 wherein surfaces of the inorganic nanoparticles are at least partially exposed from the outermost surface of the thin film.

15. A method of forming a metal coating film over the thin film recited in claim 8 comprising the step of: applying electrolytic plating or electroless plating onto the thin film wherein the above-mentioned metal coating film may include at least one or two or more kinds of elements or a metal alloy and/or a compound including at least one or two or more kinds of elements, which are selected from a group consisting of copper, nickel, tin, chrome, zinc, gold, silver, platinum, rhodium, and palladium.

Description

BRIEF DESCRIPTIONS OF THE DRAWINGS

[0036] FIG. 1 shows an electroless copper plating (a light-colored part on the right side) formed on a plating base formed by applying an Ag nanoparticle dispersion ink to a glass-epoxy substrate (A dark part occupying a major area is an Ag coating film.).

[0037] FIG. 2 shows a UV-vis absorption spectrum of an Ag nanoparticle dispersion liquid.

[0038] FIG. 3 shows a UV-vis absorption spectrum of an Au nanoparticle dispersion liquid.

[0039] FIG. 4A shows TG-DTA measurement results (Ag nanoparticle dispersion liquid).

[0040] FIG. 4B shows TG-DTA measurement results (Au nanoparticle dispersion liquid).

[0041] FIG. 4C shows TG-DTA measurement results (Ag nanoparticle dispersion liquid with addition of resin).

[0042] FIG. 4D shows TG-DTA measurement results (Au nanoparticle dispersion liquid with addition of resin).

[0043] FIG. 5A shows a result of a laser Raman spectroscopy measured on a coating film surface of Example 1 (prior to plating treatment).

[0044] FIG. 5B shows a result of a laser Raman spectroscopy measured for Synthesized example 1.

[0045] FIG. 6A shows an optical photomicrograph of surface of plating base of manufactured examples 1-3.

[0046] FIG. 6B shows an optical photomicrograph of surface of plating base of manufactured examples 4-5.

[0047] FIG. 6C shows an optical photomicrograph of surface of plating base of manufactured examples 6-7.

[0048] FIG. 7A shows an optical photomicrograph of surface of plating base of manufactured examples 8.

[0049] FIG. 7B shows an optical photomicrograph of surface of plating base of manufactured examples 9.

[0050] FIG. 7C shows an optical photomicrograph of surface of plating base of manufactured examples 10.

[0051] FIG. 8A shows an optical photomicrograph of surface of plating base of manufactured examples 11-12.

[0052] FIG. 8B shows an optical photomicrograph of surface of plating base of manufactured examples 13-14.

[0053] FIG. 8C shows an optical photomicrograph of surface of plating base of manufactured examples 15-16.

[0054] FIG. 9A shows an optical photomicrograph of surface of plating base of manufactured examples 17-18.

[0055] FIG. 9B shows an optical photomicrograph of surface of plating base of manufactured examples 19-20.

[0056] FIG. 9C shows an optical photomicrograph of surface of plating base of manufactured examples 21-22.

[0057] FIG. 10A shows an optical photomicrograph of surface of plating base of manufactured examples 23-24.

[0058] FIG. 10B shows an optical photomicrograph of surface of plating base of manufactured examples 25-26.

[0059] FIG. 10C shows an optical photomicrograph of surface of plating base of manufactured examples 27-28.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

[0060] In the following, a so-called best mode for carrying the present invention will be explained. Here, the present invention is not limited to these examples, but it goes without saying that various kinds of modifications may be made within the scope of the present invention without departing from the spirit and scope of the present invention. In the following embodiments, the following terms are used.

(Plating)

[0061] Plating has been known for a long time as a method for obtaining a metal coating film. The method of obtaining a coating metal by utilizing electric reduction may be called electrolytic plating and the method utilizing chemical reduction may be called electroless plating. Further, many kinds of plating liquids and plating methods are known to be selected depending on constituents of the metal coating film. The plating base according to the present invention can be used in any of the above-mentioned methods.

(Pretreatment Prior to Plating)

[0062] It is preferable to conduct an activation treatment on the place where a plating coating film is formed as a normal pretreatment along with the electroless plating. The activation treatment is aimed to remove an oxide film with acid if the surface to which coating film is attached is metal and to impart and activate catalyst for plating that mainly includes noble metal if the surface to which coating film is attached is non-metal.

[0063] The above-mentioned activation treatment may be conducted in order to cause metal ions to be easily reduced chemically or electrochemically on a surface where plating is conducted and enhance the adhesiveness and the coatability of metal attached thereto by plating. For example, in the case where the catalyst is utilized, it is to remove contaminants and the like from a catalyst surface which is covered with organic substance contamination so as to activate the catalyst surface such that metal ions may be easily reduced by reduction reaction. Further, in the case where reduction is conducted electrically, it is to remove an oxide film, organic substance contamination, and the like on the surface which metal ions contact such that electric conductivity on the surface may be enhance. For example, with respect to catalyst such as platinum and palladium placed on the plating base, it may be covered with a protecting agent including polymer and the like in order to keep stability thereof.

[0064] However, there may be a condition where metal ions to be plated chemically or electrochemically are easily reduced on the surface where such plating is made even if the above-mentioned pretreatment is not conducted. In such a case, it is not necessary to conduct the pretreatment. For example, the above-mentioned pretreatment is not necessary in the case where the plating base is formed by applying and drying the following composition. Hence, it is not necessary to be subject to a high temperature treatment as one of the typical pretreatments such that the productivity is increased as well as deterioration of the substrate may be prevented. And, the plating base formed by applying and drying the following composition as mentioned later has electric conductivity so as to be utilized as the plating base for electrolytic plating.

(Nanoparticle Metal Kind)

[0065] The metal kind to constitute nanoparticles according to the present invention is not in particular limited thereto, but it may be selected as appropriate depending on the kind and the purpose of plating to be applied thereon. For example, the element to constitute the metal nanoparticles may be at least one element as a simple substance or an alloy, or a compound thereof selected from a group consisting of Li, Be, B, Na, Mg, Al, Si, P, K, Ca, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, As, Se, Rb, Sr, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, In, Sn, Sb, Te, Cs, Ba, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Hf, Ta, W, Re, Os, Ir, Pt, Au, Hg, Tl, Pb, Bi, Po, and At. It is preferable that the nanoparticles includes a noble metal such gold, silver, and platinum; a transition metal such as nickel; or an amphoteric metal such as tin in consideration of activity at the time of plating. Here, the noble metal may include gold, silver, copper, platinum, palladium, iridium, rhodium, osmium, and ruthenium and the nanoparticles may comprise at least one or two or more kinds of metals or alloys selected from these.

(Particle Diameter)

[0066] In the present invention, the shapes of metal nanoparticles are not limited thereto in particular, and a particle diameter after spherical approximation need not be particularly limited as far as the nanoparticles disperse or dissolve properly in the composition. When stable dispersibility in a solvent or the like is taken into consideration, an average particle diameter of 500 nm or less is preferable. Further, the average particle diameter of 250 nm or less is also preferable. Moreover, the average particle diameter is also preferably 200 nm or less, and more preferably 50 nm or less. On the other hand, when ease of a manufacturing method or the like is considered, the average particle diameter is preferably 1 nm or more. In terms of average particle diameter range, an average particle diameter range of 1 nm to 500 nm is preferable, 1 nm to 100 nm is more preferable, and 1 nm to 50 nm is still more preferable. This is because, for example, when the average particle diameter is more than 500 nm, the ratio of the surface area of the particles to the weight thereof is lowered, resulting in decreased dispersibility in a solvent or the like. It is noted that the average particle diameter may be an arithmetic mean diameter, mode diameter, median diameter, geometric mean diameter, mean surface diameter, mean volume diameter, length mean diameter, surface mean diameter, and the like, which can be determined on number basis or mass basis. The average particle diameter on number basis is employed herein (for example, JIS H 7804: 2005 and JIS Z 8827-1: 2008).

[0067] Further, it is widely known that, metal nanoparticles of each metal species show a specific absorption spectrum corresponding to the particle diameter. This is because a frequency of irradiated light and surface charges of the metal nanoparticles interact strongly with each other. For example, it is widely known that a dispersion liquid of fine gold particles with a diameter of 20 nm has an absorption peak at about 520 nm and thus looks red, while a dispersion liquid of fine silver particles with a diameter of 30 nm has an absorption peak at about 420 nm and thus looks brown. As such, it is possible to estimate a kind and a diameter of metal nanoparticles based on the light absorption spectrum, and on the other hand, it is also possible to define a diameter of metal nanoparticles based on the light absorption spectrum and the kind of the metal contained.

(Preferred Dispersing Medium)

[0068] In the present invention, a dispersing medium or the like composing a metal nanoparticle solution or dispersion liquid is preferably a polar solvent including water. For example, water alone or a mixture liquid of water and a water-miscible polar organic solvent is preferable. Polar solvents are preferable, because it is believed that the dispersibility is further secured by electrostatic repulsion between nanoparticles. Exemplary water-miscible polar solvents may include a polar solvent having SP value, which is known as a solubility parameter, of 9.5 or more. More specifically, the polar solvent includes at least one selected from methanol, ethanol, propanol, acetone, acetonitrile, dimethylacetamide, dimethylformamide, dimethylsulfoxide, dioxane, phenol, cresol, ethylene glycol, propylene glycol, butylene glycol, diethylene glycol, triethylene glycol and glycerol, or a mixture of two or more thereof.

(Organic Dispersing Agent for Metal Nanoparticle)

[0069] Examples of dispersing agents for the metal nanoparticles composing a metal nanoparticle dispersion liquid of the present invention may include organic pi conjugated ligands including aromatic compounds having any one of phthalocyanine, naphthalocyanine and porphyrin skeleton (WO2011/114713). The organic pi conjugated ligand may have any one or more substituent groups selected from amino, mercapto, hydroxyl, carboxyl, phosphine, phosphonic acid, halogen, selenol, sulfide and selenoether. Further, the organic pi conjugated ligand may have any one or more substituent groups selected from hydroxyl, carboxyl, amino, alkylamino, amide, imide, phosphonic acid, sulfonic acid, cyano, nitro and salts thereof. In particular, the organic pi conjugated ligand may include any one or more of TCAP, TCAN, OCAP and OCAN. Here, TCAP denotes 2,11,20,29-tetrakiscarboxyphthalocyanine. TCAN denotes 2,11,20,29-tetrakiscarboxynaphthalocyanine. OCAP denotes 2,3,11,12,20,21,29,30-octakiscarboxyphthalocyanine. OCAN denotes 2,3,11,12,20,21,29,30-octakiscarboxynaphthalocyanine.

(Binder Resin Additive)

[0070] Binder resins, when added to a composition, can enhance the adhesiveness of the coating film formed by applying the composition to a substrate. Further, binder resins can also enhance the strength of the coating film itself after dried. Moreover, the binder resin which does not separate in a solvent or the like included in the composition (for example, does not form a precipitate) is preferable. This is because the separation from the solvent or the like results in insufficient homogeneity of the composition, which possibly leads to impaired homogeneity of the coating film.

[0071] Examples of the binder resins of the present invention may include any one of acrylic resins, polyester, polyurethane polyethylene resins, polypropylene, polystyrene, polyvinylpyrrolidone, polyethylene glycol, polyamide, polyepoxy, polyvinyl alcohols, polysaccharides and proteins, and mixtures of two or more thereof.

[0072] In addition to the above-noted binder resins, the binder resin may include binder resins with a modified chemical structure or physical shape to improve solubility. Exemplary resins having a modified chemical structure may include polyethyleneimine, polystyrene sulfonic acids, aromatic polyamide, carboxymethylcellulose, and the like. Further, exemplary resins having a modified physical shape to improve solubility may include cellulose nanofibers, chitin nanofibers, and the like.

(Application Style)

[0073] In the present invention, it is possible to obtain a coating film by applying and drying a composition in which metal nanoparticles are dissolved or dispersed, however, the method of applying is not particularly limited. In the present invention, the composition including suitable metal nanoparticles in a dissolved or dispersed state may include an aqueous solvent or the like. The content of organic components is relatively small, and typical viscosity of the composition is approximately 1 to 50 mPa.Math.s. Accordingly, a variety of methods such as spray application, ink-jet printing and flexographic printing can be employed. It is noted that the plating base may be formed by applying the composition by using an applicator, a bar coater or a blade, or a writing tool such as a pen filled with said solution, though they may be slightly unsuitable for large scale manufacture.

(Spray Application)

[0074] Here, “spray application” refers to a method to apply a solution or the like to be applied onto a substrate by generating mist of the solution and spraying the mist by using compressed air. Masking with an adhesive tape or the like enables selective application to form a particular shape.

(Blade Coating)

[0075] Here, “blade coating” refers to a method to spread, on a substrate, a solution or the like to be applied by using a blade made of rubber, metal or the like. Masking with an adhesive tape or the like enables selective application to form a particular shape.

(Ink-Jet Printing)

[0076] Here, “ink-jet printing” refers to a method in which fine droplets generated by driving computer-controlled nozzles are applied onto a substrate. Several types of nozzles employing different driving methods, such as piezo system, thermal system and XAAR system are currently known widely. Drawing by using computer software or the like enables to apply the ink into an arbitrary planar shape.

(Flexographic Printing) Here, “flexographic printing” refers to a kind of relief printing technique wherein printing is achieved by transferring ink applied on a relief printing plate onto a substrate.

(Drying Method)

[0077] In the present invention, a coating film obtained by applying and drying ink having a composition in which metal nanoparticles are dissolved or dispersed can be utilized as plating base. Drying condition is not particularly limited. For example, any of dried coating films obtained by removing a solvent or the like at an ordinary or heated temperature either under atmospheric air, inert gas atmosphere, reducing atmosphere or reduced pressure can be used as plating base. Heating the ink to 40° C. to 150° C. under atmospheric air is preferable in terms of economic rationality, because the solvent or the like to be removed is water or an aqueous liquid. The ink may also be heated to 50° C. to 95° C. under atmospheric air.

(Coating Film Thickness)

[0078] In the present invention, plating base comprising a coating film obtained by applying and drying metal-dispersed ink having a composition in which a metal nanoparticles are dissolved or dispersed can be provided. A film thickness of the coating film is not limited as far as it does not cause adverse effect on the plating formed thereon. For example, the coating film thickness may be 10 μm or less. The coating film thickness may also be 5 μm or less. Further, as far as the function as plating base is sufficient, the coating film thickness is not limited and the coating film thickness may be 50 nm or more. The coating film thickness may also be 100 nm or more. In particular, when the plating base is used for electrolytic plating, the coating film thickness may be small as far as sufficient electric current is secured. The coating film thickness may be 100 nm or more. The coating film thickness may also be 200 nm or more.

(Metal Content Amount in Coating Film)

[0079] In the present invention, the metal content in the coating film that serves as plating base is not particularly limited as far as the metal component contained in the coating film has activity which is sufficient both in quantity and quality as a whole. This is because when a large amount of inactive metal is contained, the function as plating base cannot necessarily be expected. Generally, when the metal content is low and the activation ratio of the contained metal is almost the same, the amount of active metal of the coating film decreases as a whole, and as a result, the subsequent plating may not be achieved sufficiently. For example, the metal content in the coating film may be 50 wt % or more. Further, since components other than metal are included in the coating film, the metal content is less than 100 wt %. It is noted that the metal content amount in the coating film mentioned herein refers to a weight value of the contained metal per unit coating film weight (wt/wt %).

[0080] The metal content amount in the above-mentioned coating film may be measured, for example, by TG-DTA analysis as one kind of the thermogravimetric analyses. It may be considered that the weight loss is caused by evaporation, sublimation, or thermal decomposition of the organic substances when the temperature is raised within the temperature range where the metal may not be substantially released out of the system by evaporation, sublimation, or thermal decomposition. And it goes without saying that it is also considered that the weight loss of the solvent and the like left in a sample collected from the coating film should be counted. In the present invention, with respect to the TG-DTA analysis, the weight of the sample at the temperature of 150° C. was considered to be the coating film weight in the case where the temperature was raised from the room temperature, and the residual weight of the sample at the temperature of 600° C. was considered to be a metal nanoparticle weight (or metal solid content weight) in the case where the temperature was further raised. As a concrete measurement method thereof, a measurement sample is prepared by being stripped off from the coating film formed on a glass substrate, changes in the weight and the differential heat are measured as the temperature is raised from the room temperature to 600° C. at the rate of 3.5° C./min or 10.0° C./min. Thus, the measurement data can be obtained.

(Dispersing Agent in Coating Film)

[0081] As described in WO2011/114713, which is herein incorporated by reference in its entirety, in the case where dye molecules such as porphyrin, phthalocyanine, and naphthalocyanine are used as a dispersing agent of the metal nanoparticles, a strong mutual interaction may be caused among these dye molecules and the metal nanoparticles such that a peak of Q band that is a characteristic absorption spectrum of the dye molecules substantially disappears. In such a condition, other highly sensitive methods of measurement may be employed to confirm that the dye molecule such as porphyrin, phthalocyanine, and naphthalocyanine can be confirmed to exist on the metal nanoparticle surface by, for example, a laser Raman spectroscopy measurement. The laser Raman spectroscopy measurement can be conducted with a sample in a wet condition or in a dry condition and, in the case of dry condition, a coating film dried on a glass substrate can be utilized as a measurement sample.

(Activity of Surface of Coating Film (Especially, of Metal))

[0082] If the surface of the coating film serving as a plating base is active in the subsequent plating treatment, the so-called pretreatment is not necessary. If the subsequent plating treatment cannot be carried out completely or substantially, the pretreatment is necessary since the surface of the coating film is not active. For example, in the case where metal in the coating film is exposed on the outside surface of the coating film, the surface of the coating film may be active. This is because it is difficult for the metal to participate in the reaction process of the plating treatment if the metal is not exposed on the outside surface of the coating film. The method of measuring degree of exposure on the surface of the metal coating film may include, for example, a method of detecting a metal ion dissolved in dilute nitric acid that washes the surface of the coating film and an analyzing method with a spatial analyzer (for example, STEM-EELS, Aberration Corrected STEM-EDS, and so on).

(Substrate)

[0083] In the present invention, a plating base can be obtained by applying and drying an ink comprising a composition in which metal nanoparticles are dissolved or dispersed. The substrate having a surface on which such a coating film is formed is not in particular limited thereto. For example, a substrate comprising a composite material such as a glass-epoxy; a substrate comprising one or two or more kinds of organic materials selected from a group consisting of PET resin, PEN resin, PP resin, PI resin, epoxy resin, cellulose nanofiber film, chitin nanofiber film and so on; and a substrate comprising one or two or more kinds of inorganic materials selected from a group consisting of alkali glass (soda glass), alkali-free glass (borosilicate glass), ITO, alumina and so on are named as examples of the substrate.

Embodiment

(Reagent)

[0084] In embodiments of the present invention, the following reagents were used. Copper(II) sulfate pentahydrate; Nacalai Tesque, Inc. (Product code: 09604-85), ethylenediaminetetraacetic acid tetrasodium salt tetrahydrate; Nacalai Tesque, Inc. (Product code: 15114-15),

2,2′-bipyridyl; Nacalai Tesque, Inc. (Product code: 14020-52),
formaldehyde solution (37%); Nacalai Tesque, Inc. (Product code: 16222-65),
silver nitrate; Ohura Precious Metal Industry Co., ltd (Lot No. 270728),
chlorauric acid; Tanaka Kikinzoku Kogyo K.K. (Lot No. L3000162314342),
sodium hydroxide; Nacalai Tesque, Inc. (Model No.: 31511-34),
hexaammonium heptamolybdate tetrahydrate; Wako Pure Chemical Industries, Ltd. (Model No.: 016-06902), 4-sufophthalic Acid (ca. 50% in water); Tokyo Chemical Industry Co., Ltd. (Model No.: S0136), urea; Nacalai Tesque, Inc. (Model No.: 35905-93), monoethanolamine; Nacalai Tesque, Inc. (Model No.: 23405-55), methanol; KISHIDA CHEMICAL Co., Ltd. (Model No.: 520-48665), isopropanol (IPA); Nacalai Tesque, Inc. (Model No.: 29113-24), hexanol; Nacalai Tesque, Inc. (Model No.: 18013-45), ethylene glycol; Nacalai Tesque, Inc. (Model No.: 15209-85), triethylene glycol dimethyl ether (triglyme); Nacalai Tesque, Inc. (Model No.: 34832-15), acetone; KISHIDA CHEMICAL Co., Ltd. (Model No.: 170-00305), and OLFINE PD002 W: Nissin Chemical Industry Co., Ltd (Model No.: PD-002 W). Here, as for the ion-exchanged water, pure water having the electric resistivity of 15 MΩ.Math.cm or more, having been purified by Ultrapure Water System, Pure Water System (Model No.: KE0129) of KOMATSU ELECTRONICS CO., Ltd. was used.

(Devices)

[0085] The used devices are as follows. In order to measure absorption spectra of examples, UV-Visible Spectrophotometer (Hitachi High-Technologies Corporation, Model No.: U-4100) was employed, and, in order to investigate thickness of coating films, a fine structure measuring device (Kosaka Laboratory Ltd. (Model No.: ET200)) was employed, and, in order to investigate metal contents in coating films, TG/DTA Simultaneous Measuring Instrument (SHIMADZU CORPORATION (Model No.: DTG-60H)) was employed, and, in order to investigate existence of phthalocyanine and derivatives thereof, a laser Raman spectrophotometer (Nanophoton Corporation (Model No.: RAMAN touch)) was employed. Further, in order to measure viscosity of solutions, a viscometer (Toki Sangyo Co., Ltd (TV-22)) was employed. Here, surface tension of solutions was measured with a capillary-rise method surface tensiometer (Surfgauge Instruments (DG-1)) was employed. Further, in order to observe particle shapes of nanoparticles, a transmission electron microscope (Hitachi High-Technologies Corporation, Model No.: H-7500) was employed.

[0086] And, in order to conduct ejection test of inkjet inks, an inkjet printer for household use of SEIKO EPSON CORPORATION (Model No. PX-K150 and S-160T) was employed and the original ink was replaced with the metal nanoparticle dispersion liquid, which was loaded thereinto.

(Substrate)

[0087] Substrates on which coating films of plating base were formed were used as shown below.

Glass substrate: made by Matsunami Glass Ind., Ltd. (Model No.: S9115),
Glass epoxy substrate: MISUMI Corporation (Model No.: EPXA-60-24-2),
PET film (1): (Teijin® Tetoron® Film): Teijin DuPont Films Japan Limited (Model No. G2P2), and PET film (2): (TORAY® Lumirror®): Toray Industries, Inc. (Model No. T-60).

Synthesized Example 1

(Synthesis of Phthalocyaninetetracarboxylic Acid)

[0088] ##STR00001##

[0089] The synthesis of phthalocyanine-4,4′,4″,4′″tetracarboxylic acid (hereinafter referred to as TCAP) was conducted with reference to the method for the synthesis by Fukada et al. (The Journal of the Society of Chemical Industry, Japan Vol. 64 (1961) No. 10, pp. 1817-1819 and U.S. Pat. No. 4,522,755, both of which are herein incorporated by reference in their entirety). Here, it is necessary to pay sufficient attention such that the container pressure might not be increased too much since the present reaction is accompanied by generation of carbon dioxide gas and ammonium carbonate.

[0090] That is, 41.8 g (217.5 mmol) of trimellitic anhydride, 145 g of urea, 11.5 g of ammonium molybdate were input into one-litter of reaction container in which a magnetic stirrer was placed and then 220 ml of tryglyme was further added thereto and the ambient gas was replaced with nitrogen gas. The above-mentioned suspension liquid was heated to 140° C. while the liquid was stirred, and then, solid content therein started to become more viscous. After the liquid was continued to be stirred for one hour at this temperature, the reaction temperature was raised to 210° C. and green solid substance started to be generated while bubbles were also generated. After the liquid was continued to be heated at 210° C. for two hours, the heating was stopped and the reaction system was cooled down to the room temperature.

[0091] After a small amount of formic acid was added to ammonium carbonate left in the container such that the ammonium carbonate was dissolved, green solid bodies were crushed into small pieces for the purpose of wash. The green solid bodies were suspended in methanol and centrifugal separation was conducted and supernatant was removed. The process was repeated twice such that tryglyme was removed as much as possible.

[0092] Then, the thus-obtained solid bodies were stirred in 300 ml of 3 wt % sodium hydroxide solution and were refluxed for one hour such that amido was hydrolyzed to become carboxylic acid. Here, 650 ml of IPA was added thereto so as to make precipitation therein such that green solid bodies were obtained by centrifugal separation. After the green solid bodies were centrifuge refined with acetone, methanol, and acetone in this order, respectively, the solid bodies were dried with a vacuum pump overnight such that 32.08 g of TCAP (77.5% of gross yield as tetrasodium salt) was obtained. Similarly for the compounds to be described later, it was considered that β position substitution products derived from impurities of the raw materials should be included, but the present compounds were used as a dispersing agent for metal nanoparticles without any additional refinement.

Example 1

(Preparation of Ag Nanoparticle Dispersion Liquid)

[0093] One hundred liter (100 L) of Ag nanoparticle dispersion liquid (concentration of silver solid content: 0.02 wt %) was obtained with citric acid with reference to the method described in J. Phys. Chem., 1982, 86(17), pp 3391-3395 (DOI: 10.1021/j100214a025). Five liter (5 L) of 4 mM TCAP aqueous solution was added thereto and it was well stirred. Then, by conducting centrifugal filter refinement, Ag nanoparticle dispersion liquid in which the Ag nanoparticles were protected by a small amount of aromatic compound (hereinafter referred to as Ag dispersion liquid) was obtained.

[0094] Here, deionized water was used for the refinement. The metal solid content weight of this Ag dispersion liquid was 52 wt %. A UV-Vis absorption spectrum of this Ag dispersion liquid was measured such that an obtained result is shown in FIG. 2. The particles were observed with a transmission electron microscope to find the average particle size was 20 nm. Here, the present dispersion liquid was stored in a refrigerator (5° C.) and it was confirmed that a stable dispersion state was maintained after one half-year by the visual test.

Example 2

(Preparation of Au Nanoparticle Dispersion Liquid)

[0095] Au nanoparticle dispersion liquid (hereinafter referred to as Au dispersion liquid) was prepared with reference to the method described in Discuss. Faraday Soc., 1951, 11, 55-75 (DOI: 10.1039/DF9511100055) and Example 1. The metal solid content weight of this Au dispersion liquid was 44 wt %. A UV-vis absorption spectrum of this Au dispersion liquid was measured such that an obtained result is shown in FIG. 3. The particles were observed with a transmission electron microscope to find the average particle size was 15 nm. Here, the present dispersion liquid was stored in a refrigerator (5° C.) and it was confirmed that a stable dispersion state was maintained after one half-year by the visual test.

Example 3

(Preparation of Ink for Ink-Jet Application)

[0096] Ink for ink-jet having a solid content weight of 10 wt %, a viscosity of 4 cps, and a surface tension of 29 mN (hereinafter referred to as Ag dispersion ink or Au dispersion ink) was obtained by adding ethylene glycol, hexanol, and PD002 W to the metal nanoparticle dispersion liquid having been obtained for Examples 1 and 2.

Example 4

[0097] (Preparation of Ink for Ink-Jet Application with Addition of Binder Resin)

[0098] With respect to the metal solid content weight, 5 wt % of binder resin was added to the metal nanoparticle dispersion liquid having been obtained for Examples 1 and 2. As the binder resin, AQ Nylon A-90 of water-soluble nylon (modified polyamide resin) manufactured by Toray Industries, Inc. was used as the binder resin. Then, ethylene glycol, hexanol, and PD002 W were added such that an ink for ink-jet application having a solid content weight of 10 wt %, a viscosity of 4 cps, and a surface tension of 29 mN (hereinafter referred to as Ag dispersion ink with addition of binder resin or Au dispersion ink with addition of binder resin) was prepared.

(Preparation of Plating Base)

[0099] A plating base was obtained by forming a coating film with an application method to described later and by heating and drying the coating film in the atmosphere at the temperature of 60° C. for 2-5 minutes.

(Coating Film Forming Method)

(Spray Application)

[0100] The metal dispersion liquid or metal dispersion ink having been obtained by the above-mentioned method was loaded in an airbrush (manufactured by Tamiya, Inc, product name; airbrush system No. 010 HG trigger-type airbrush) such that a coating film was formed by spraying the liquid or ink onto a substrate.

(Blade Coating)

[0101] The metal dispersion liquid or metal dispersion ink having been obtained by the above-mentioned methods was dripped on the substrate and a glass blade was used to spread the drop over the surface to form a coating film.

(Ink-Jet Printing)

[0102] An ink-jet printer for black-and-white printing for a small office of PX-K100 (manufactured by SEIKO EPSON CORPORATION) was employed such that ink in an ink cartridge thereof was replaced with the metal dispersion ink for ink-jet application having been obtained for Examples 3 and 4. This printer was connected to a computer in which an ordinary computer software was used to operate the printer to form a coating film of the metal dispersion ink.

(Metal Content Weight in Coating Film)

[0103] With respect to the coating films obtained by applying the metal nanoparticle dispersion liquid and the metal nanoparticle dispersion ink, which were obtained for Examples 1 to 4, the metal content amount in the coating film was measured by the TG-DTA analysis. The results are shown in FIGS. 4A to 4D. The results are summarized in Table 1.

TABLE-US-00001 TABLE 1 Metal content Example 1 99.7 wt % Example 2 99.2 wt % Example 3 — (same as Examples 1 and 2) Example 4 (Ag) 93.9 wt % Example 4 (Au) 93.5 wt %

(Preparation of Plating Bath)

(Preparation of Electroless Copper Plating Bath (1))

[0104] An electroless copper plating bath (1) was built with reference to the method described in the reference (Journal of the Surface Finishing Society of Japan, Vol. 42, No. 4, 1991, pp 425-430). Thus, 674 mg of copper (II) sulfate pentahydrate, 1.58 g of ethylene diamine tetra acetic acid, tetra sodium salt tetra hydrate, and 2.5 mg of 2,2′-bipyridyl were dissolved in 90 ml of deionized water. After the pH value of this solution was adjusted to be 12.0 by using 25 wt % of sodium hydroxide solution, 565 μl of 37 wt % formaldehyde solution was added thereto and diluted in measuring cylinder to 100 ml total. Hereinafter this solution is referred to as Cu plating bath (1). This plating bath was used at the temperature of 70° C.

(Preparation of Electroless Copper Plating Bath (2))

[0105] An electroless copper plating liquid (ARG copper) manufactured by Okuno Chemical Industries Co., Ltd. was built with reference to the procedures and ratios described in the instruction manual. Thus, 3 ml of ARG copper (1) was diluted with 74 ml of deionized water and 20 ml of ARG copper (3) was added thereto and the mixture was stirred. Finally, 3 ml of ARG copper (2) was gradually added thereto and mixed them well. Hereinafter this solution is referred to as Cu plating bath (2). This plating bath was used at the temperature of 45° C.

(Preparation of Electroless Nickel-Boron Plating Bath)

[0106] An electroless nickel-boron plating liquid (topchemialloy 66-LF) manufactured by Okuno Chemical Industries Co., Ltd. was built with reference to the procedures and ratios described in the instruction manual. Thus, 9 ml of topchemialloy 66-ML was diluted with 65 ml of deionized water and 3 ml of topchemialloy 66-1ML was added thereto and the mixture was stirred. Then, 6 ml of topchemialloy 66-2ML was gradually added thereto and finally the mixture was diluted in measuring cylinder to 100 ml total by adding deionized water. Hereinafter this solution is referred to as Ni plating bath. This plating bath was used at the temperature of 70° C.

Embodiment 1

(Plating Treatment to Coating Film of Metal Dispersion Liquid-Dispersion Ink)

[0107] With respect to each dispersion liquid and dispersion ink as prepared by the above-mentioned methods, a coating film was formed on a glass substrate by the spray coating method and dried at the temperature of 60° C. for two minutes so as to make a plating base. An electroless plating treatment was carried out by immersing each plating base in each plating bath. The results are summarized in Table 2. From the results below, it should be understood that any of the dispersion liquid and dispersion ink can be utilized as the plating base only by applying and drying them.

TABLE-US-00002 TABLE 2 Results of plating treatment onto plating base obtained by applying a composition on a glass substrate. Dispersion liquid-ink used for Used plating Evaluation of No. forming coating film bath plating* Manufactured Ag dispersion liquid Cu plating ∘ example 1 bath 1 Manufactured Ag dispersion liquid Cu plating ∘ example 2 bath 2 Manufactured Ag dispersion liquid Ni plating ∘ example 3 bath Manufactured Ag dispersion ink Cu plating ∘ example 4 bath 2 Manufactured Ag dispersion ink Ni plating ∘ example 5 bath Manufactured Ag dispersion ink Cu plating ∘ example 6 with addition of bath 2 binder resin Manufactured Ag dispersion ink Ni plating ∘ example 7 with addition of bath binder resin Manufactured Au dispersion liquid Cu plating ∘ example 8 bath 2 Manufactured Au dispersion ink Cu plating ∘ example 9 bath 2 Manufactured Au dispersion ink Cu plating ∘ example 10 with addition of bath 2 binder resin *∘: Reduction reaction occurred on metal coating film and metal plating precipitation was confirmed by visual inspection. *x: Metal plating precipitation was not confirmed by visual inspection.

Embodiment 2

(Selection of Substrate)

[0108] The Ag dispersion liquid of Example 1 and the Ag dispersion ink (with addition of binder resin) of Example 4 were sprayed and coated onto the substrates as shown in the following Table 3. From Tables 2 and 3, it should be understood that the present coating film formed on any of an inorganic substrate, an organic substrate, or a composite substrate should serve well as the plating base.

TABLE-US-00003 TABLE 3 Results of plating treatment onto plating base formed on various kinds of substrates. Dispersion liquid-ink used for Used plating Evaluation of No. forming coating film Use substrate bath plating* Manufactured Ag dispersion Glass-epoxy Cu plating ∘ example 11 liquid bath 2 Manufactured Ag dispersion Glass-epoxy Ni plating ∘ example 12 liquid bath Manufactured Ag dispersion PET film 1 Cu plating ∘ example 13 liquid bath 2 Manufactured Ag dispersion PET film 1 Ni plating ∘ example 14 liquid bath Manufactured Ag dispersion PET film 2 Cu plating ∘ example 15 liquid bath 2 Manufactured Ag dispersion PET film 2 Ni plating ∘ example 16 liquid bath Manufactured Ag dispersion ink Glass-epoxy Cu plating ∘ example 17 with addition of bath 2 binder resin Manufactured Ag dispersion ink Glass-epoxy Ni plating ∘ example 18 with addition of bath binder resin Manufactured Ag dispersion ink PET film 1 Cu plating ∘ example 19 with addition of bath 2 binder resin Manufactured Ag dispersion ink PET film 1 Ni plating ∘ example 20 with addition of bath binder resin Manufactured Ag dispersion ink PET film 2 Cu plating ∘ example 21 with addition of bath 2 binder resin Manufactured Ag dispersion ink PET film 2 Ni plating ∘ example 22 with addition of bath binder resin *∘: Reduction reaction occurred on metal coating film and metal plating precipitation was confirmed by visual inspection. *x: Metal plating precipitation was not confirmed by visual inspection.

Embodiment 3

(Selection of Coating Method)

[0109] The Ag dispersion ink with addition of binder resin of Example 4 was applied to a PET film (1) by the blade coating or the ink-jet printing and heated and dried at the temperature of 60° C. for 5 minutes so as to form a plating base, and then, the plating treatment was carried out thereon. The results are shown in Table 4. From the results below, it should be understood that the present coating film serves effectively as the plating base notwithstanding the applying methods.

TABLE-US-00004 TABLE 4 Coating film formation Used plating Evaluation of method bath plating* Manufactured Doctor blade method Cu plating ∘ example 23 bath 2 Manufactured Doctor blade method Ni plating ∘ example 24 bath Manufactured Ink-jet method Cu plating ∘ example 25 bath 2 Manufactured Ink-jet method Ni plating ∘ example 26 bath *∘: Reduction reaction occurred on metal coating film and metal plating precipitation was confirmed by visual inspection. *x: Metal plating precipitation was not confirmed by visual inspection.

(Supplemental 1)

(Strong Heat Treatment)

[0110] The coating film of the Ag dispersion ink with addition of binder of Example 4 was heated in the atmosphere at the temperature of 150° C. for 10 minutes so as to form a coating film, on which a plating treatment was conducted. The results are summarized in Table 5 below. From the results, it should be understood that the coating film according to the present invention, even when a high temperature treatment of 150° C. was conducted, it should be understood that it did not lose the forming ability of plating.

TABLE-US-00005 TABLE 5 Results of plating treatment onto 150° C.-heat-treated coating film with Ag dispersion ink with addition of binder resin. Used plating Evaluation of No. bath plating* Manufactured Cu plating ∘ example 27 bath 2 Manufactured Ni plating ∘ example 28 bath *∘: Reduction reaction occurred on metal coating film and metal plating precipitation was confirmed by visual inspection. *x: Metal plating precipitation was not confirmed by visual inspection.

(Supplemental 2)

(Laser Raman Spectroscopy Measurement)

[0111] Laser Raman spectra of the dried Ag coating film (before plating treatment) having been used for Example 1 and TCAP as the dispersing agent were measured and the spectra as shown in FIGS. 5A and 5B were obtained. From the present results, it can be confirmed that TCAP still existed in the dried Ag coating film, and thus, on surfaces of Ag nanoparticles. Here, the wavelength of laser light used for the measurement was 532 nm. And a measurement sample of TCAP was obtained by spraying and drying TCAP saturated solution onto a glass plate.

(Supplemental 3)

[0112] (Number of Holes Per 1 cm.sup.2)

[0113] Photomicrographs of surfaces of plating base of the above-mentioned manufactured examples 1 to 30 are shown in FIGS. 6A to 10C. The measurement results of numbers and sizes of holes from these pictures are summarized in Table 6 below.

TABLE-US-00006 TABLE 6 Number of holes per 1 cm.sup.2 and size of holes * Number of holes per 1 cm.sup.2 Size of holes Manufactured 3.5 × 10.sup.3 0.5-2 μm examples 1-3 Manufactured 1.9 × 10.sup.3 0.5-3 μm examples 4-5 Manufactured 1.6 × 10.sup.3 0.5-3 μm examples 6-7 Manufactured 1.9 × 10.sup.3 0.5-2 μm example 8 Manufactured 3.3 × 10.sup.3 0.5-2 μm example 9 Manufactured 1.7 × 10.sup.3 1-3 μm example 10 Manufactured 1.2 × 10.sup.3 1-5 μm examples 11-12 Manufactured 1.5 × 10.sup.3 0.5-4 μm examples 13-14 Manufactured 1.0 × 10.sup.3 0.5-0.6 μm examples 15-16 Manufactured 1.2 × 10.sup.3 0.5-3 μm examples 17-18 Manufactured 3.1 × 10.sup.3 0.5-4 μm examples 19-20 Manufactured 1.0 × 10.sup.3 3-5 μm examples 21-22 Manufactured 4.0 × 10.sup.3 0.3-3 μm examples 23-24 Manufactured 3.5 × 10.sup.2 0.3-0.6 μm examples 25-26 Manufactured 2.9 × 10.sup.3 0.5-3 μm examples 27-28 * Measured by observing surface of plating base with microscope.

[0114] As mentioned above, it is preferable that the thin film serving as the plating base has high adhesiveness with the substrate. In general, it is possible to try to enhance the adhesiveness by adding the binder resin. On the other hand, it is preferable that the nanoparticles in the thin film are held strongly inside the film. For example, at least part of the surface of the inorganic nanoparticle is strongly covered with the organic pi (π) conjugated ligand via pi (π) junction caused by the organic pi (π) conjugated ligand. The pi (π) junction may be strong mutual interaction between the organic pi (π) orbital and the inorganic nanoparticle orbital, which may be caused by bringing the organic pi (π) orbital close to the surface of the inorganic nanoparticle. Such effect is expected in the case where, for example, porphyrin, phthalocyanine, naphthalocyanine, and the like are used as the organic pi (π) conjugated ligand. The strength of the pi (π) junction can be quantitatively evaluated by the ultraviolet-visible light spectral measurement. Porphyrin and phthalocyanine have characteristic absorbance as referred to as soret band or Q band in the visible light range. When the strong pi (π) junction is expressed, the organic pi (π) orbital is metalized by the strong mutual interaction between the organic and the inorganic such that the above characteristic absorbance becomes significantly broadened. Therefore, in porphyrin, phthalocyanine, and naphthalocyanine protecting metal nanoparticles, Q bands around 650 nm and around 700 nm observed in respective ligands by themselves substantially disappear. This indicates existence of a strong pi junction. In fact, when UV-vis spectral measurement of OTAP protecting pi (π) junction palladium-core-gold-shell nanoparticles (OTAP is a phthalocyanine compound) was conducted, the soret band around 420 nm was broadened and so much broadening was recognized such that the Q band from 500 to 700 nm could not be observed (WO2011/114713), thereby expecting there was a strong pi junction.

[0115] Here, that a metal nanoparticle solution is stably dispersed may mean that, in one atmosphere of air at 25° C., (1) after the composition in a test tube is sufficiently stirred, the test tube stands still for 60 minutes and substantially no precipitation is recognized in the test tube, or (2) even if precipitation is recognized in the test tube after still standing for 120 minutes or longer from when the composition in the test tube is stirred sufficiently, substantially no precipitation is recognized after still standing for 10 minutes from when the composition is stirred again. And a coating film having electric conductivity can correspond to a case where a thin film of 1 μm thickness has a resistance value of 1.0×10.sup.3Ω or less between two points apart by distance of 1 cm wherein the thin film is formed by applying the composition onto a glass substrate and letting the applied composition dry such that the dispersing medium or solvent is substantially lost from a surface thereof such that the thin film is in a solid state or a solid body. Here, the applying and drying can be conducted at the so-called room temperature (for example, at around 25° C. and at one atmosphere of air, printing or the like as application is made and the applied composition is left for at least 5 minutes (or until it is recognized that no dispersing medium or solvent is observed in a visual test)). It is not necessary to press the applied film with a press or the like or apply a pressure thereon and it is not necessary to heat it. It may be held at the temperature of 100° C. or less. Judgement whether precipitation exists or not can be sufficiently made by a visual test. An accelerated test, for example, by centrifugal separation may be utilized. As the observation is continuously made and recorded as a series of results until precipitation is clearly recognized while conditions are changed to enhance more precipitation effect, a standard for judgment of existence or nonexistence of precipitation can be determined.

[0116] Therefore, the composition to form a plating base according to the present invention may comprise (A) at least one or two or more kinds of inorganic nanoparticles selected from a group consisting of metal, semiconductor substance, and metal oxide; (B) an organic pi conjugated ligand including a polar substituent group, the ligand including phthalocyanine and/or naphthalocyanine; and (C) a water-soluble solvent and/or dispersing medium. Further, the composition may have dispersing ability such that precipitation cannot be recognized after still standing for 60 minutes from when the composition is made in a homogeneous dispersion state. Further, the composition may have dispersing ability to maintain a dispersion state for at least 10 minutes from when the composition is stirred so as to be in a re-dispersed state even if it is the case where precipitation is recognized after still standing for 120 minutes from when the composition is initially made in a homogeneous dispersed state. And since the water-soluble solvent and/or dispersing medium is substantially lost from the composition, the composition may have an aggregating property to exhibit electric conductivity when the rest of the composition becomes in a solid state or a solid body.

[0117] Here, as mentioned above, although the peak (around 750 nm) derived from the Q band substantially disappeared due to the broadening in the UV-vis measurement, it is possible to confirm that phthalocyanine existed on the inorganic nanoparticles because the peak derived from phthalocyanine existed in the laser Raman spectroscopy measurement in FIGS. 5A and 5B.

[0118] Here, to exhibit electric conductivity may mean that the electric resistance is lowered. For example, the volume resistivity may be 1.0×10.sup.−3 Ω/cm or less. And the electric conductivity of the composition may be evaluated by measuring an electric resistance between two points 1 cm apart from each other on an applied and dried composition at an ambient temperature which is formed on a non-electric conductive substrate. For example, in the case where the thickness of this coating film is 1 μm, it can be said that it has electric conductivity if the value of resistance is 1.0×10.sup.3Ω or less. And the electrical conductivity of this thin film was evaluated by the four-terminal method (IEC60093, JISK6911). For example, if it is 1.0×10.sup.3 S/cm, it can be said that it has electric conductivity.

[0119] When a UV-vis spectrum measurement is conducted with respect to porphyrin, phthalocyanine, naphthalocyanine, and the like, the soret band around 420 nm and the Q band from 500 to 800 nm are observed as characteristic absorbance. In the case where the pi junction does not exist, only when the solvent or the like is removed by evaporation and the like, this soret band and the Q band can be observed such that existence of porphyrin, phthalocyanine, naphthalocyanine, and the like can be detected in a non-destructive way. On the other hand, in the case where this strong pi junction exists, this soret band and the Q band are significantly broadened. However, in the case where an excess amount thereof is added, it may be OK that the soret band and the Q band are observed and the quantification of the spectra may enable quantitative measurement of the excess amount of porphyrin, phthalocyanine, naphthalocyanine, and the like. Or it is considered that the characteristic absorbance of such soret band and Q band would be reduced if the excess amount of porphyrin, phthalocyanine, naphthalocyanine, and the like are extracted from the coating film including them. Thus, it is possible to detect the existence of porphyrin, phthalocyanine, naphthalocyanine, and the like and the existence of strong pi junction. On the other hand, even if the Q band substantially disappears in the UV-vis measurement, it is possible to confirm whether porphyrin, phthalocyanine, naphthalocyanine, and the like exist or not by utilizing another measurement of a laser Raman spectroscopy and the like. Thus, existence of the strong pi junction can be detected by employing a plurality of measurement methods.

[0120] In FIG. 5A, a laser Raman spectroscopic measurement result of the coating film used for Embodiment 1 is shown. Since a characteristic Raman spectrum for phthalocyanine can be confirmed, it can be confirmed whether phthalocyanine exists on the surface of this coating film, thus, surface of the metal nanoparticles dispersed therein. On the other hand, the thin film formed as the plating base may have electric conductivity. That is, it is considered that this is because there are contacts between the electric conductive inorganic nanoparticles in a direct manner such that such contacts spread at least portion of the thin film. For example, in the case where a general polymer dispersing agent is used, it is difficult to cause the electric conductive inorganic nanoparticles to contact with each other in a direct manner and, even if such contacts are achieved partially, it would be difficult to make such contacts spread in a macroscopic part of the thin film. To the contrary, in the present invention, with respect to the coating film formed from the composition and the thin film for the plating base, contacts between the electric conductive inorganic nanoparticles in a direct manner are easily spread as the network spreads such that the coating film is constituted of them in a skeleton manner. Also, in order to form such a structure, it is preferable to make the content amount of the electric conductive nanoparticles in the coating film at least 70 wt/wt % or more. And it is also preferable to make the amount 80 wt/wt % or more. Further, it is also preferable to make the amount 90 wt/wt % or more. Since another constituent other than the nanoparticles is included in the coating film, the content amount of the nanoparticles is less than 100%. As long as the composition to form the coating film can be maintained in a dissolved or dispersed state, the content amount could be extremely close to 100% and, if it would be technically OK, as close to 100% as possible.

[0121] On the other hand, the electric conductivity could be detected optically. For example, if the coating film formed from the composition according to the present invention is viewed, transmitted light through the film appears to be seen through a transparent film in the case that the film does not have electric conductivity. However, once the electric conductivity may be imparted partially on the film, the transmitted light would be colored in brown and then further would become colored in black. In the case where the electric conductivity is significantly high, the coating film might show metal luster. If the transmitted light would appear substantially black, it can be said that the film has electric conductivity. Such optical standard may be measured by utilizing an instrument that is commercially available in accordance with the method described in, for example, JIS8741 (specular gloss-measuring method) and JIS8722 (measuring method of color-reflectance and reflected and transmitted body colors).

INDUSTRIAL APPLICABILITY

[0122] With respect to a substrate (and a part thereof) having more complicated shape or a substrate comprising a kind of material being difficult for plating by the conventional plating method, a plating film could be obtained by a simpler method if the present invention is utilized. It would be expected to perform an excellent effect in the art where, more specifically, wiring and electrode formation on the electronic substrate, RFID antenna, electromagnetic shield, decorative application, and the like are concerned.