METHOD FOR MANUFACTURING A POWER SEMICONDUCTOR MODULE AND POWER SEMICONDUCTOR MODULE

Abstract

A method for manufacturing a power semiconductor module and a power semiconductor module having, in each case, a housing, a switchgear arranged in this housing and having a plurality of connection elements, has the following method steps: A) forming a housing with pre-fixed connection elements; B) arranging the switchgear in the housing and connecting the connection elements to connection surfaces of a substrate of the switchgear; C) arranging a positioning device for fixing the position of the connection elements with respect to one another; D) fixing the connection elements relative to one another and to the housing.

Claims

1. A method, for manufacturing a power semiconductor module, said power semiconductor module having a housing (2), a switchgear (3) arranged in the housing (2), and a plurality of connection elements (4), comprising the steps of: A) forming said housing (2) with a plurality of pre-fixed said connection elements (4); B) arranging said switchgear (3) in the housing (2) and connecting the connection elements (4) to respective connection surfaces of a substrate of the switchgear (3); C) arranging a positioning device (5) for fixing the position of the connection elements (4) with respect to one another relative to the position of respective connection elements (4); and D) fixing the connection elements (4) relative to one another and to the housing (2).

2. The method, according to claim 1, wherein: the connection elements (4) each have a foot portion (4) and a contact portion (42); and wherein, in method step B), the respective foot portion (40) is mechanically connected to an associated connection surface (30) in an electrically conductive manner.

3. The method, according to claim 2, wherein: the respective contact portions (42) are arranged to be movable with respect to one another, in at least one of (i) perpendicularly to their longitudinal direction and (ii) orthogonal spatial directions.

4. The method, according to claim 3, wherein: the housing (2) is formed as a plastic housing and the connection elements (4) are pre-fixed therein formed as an integrated injection molding

5. The method, according to claim 4, wherein: the positioning device (5) is removed after method step D).

6. The method, according to claim 4, wherein: the positioning device (5) is not removed (5) after method step D) and, in particular, forms part of the housing (2).

7. The method, according to claim 6, wherein: the connection elements (4) are fixed in position by at least one circumferential second positioning surface (58); and each circumferential second positioning surface (58) is arranged in or at the respective opening (52) of the positioning device (5).

8. The method, according to claim 4, wherein: the housing (2) has openings (20) receiving the connection elements (4); and the connection elements (4) are fixed in position by an adhesive compound (6) filled in openings (20) in the housing (2).

9. The method, according to claim 4, wherein: the positioning device (5) has openings (50) receiving the connection elements (4); and the connection elements are fixed in position by an adhesive compound (6) filled in openings (50).

10. The method, according to claim 4, wherein: the connection elements (4) are fixed in position by a step of deformation of a deformation portion (22) of the housing (2) or of the positioning device (5).

11. The method, according to claim 4, wherein: the respective connection element (4) is fixed in one spatial direction by at least one first positioning surface (56) of the positioning element (5) lying flush against the connection element (4) during method step C).

12. A power semiconductor module, manufactured by the method according to claim 1, having said housing (2), said switchgear (3) arranged in said housing (2) and having said plurality of connection elements (4), wherein: the respective connection elements (4) each have a first connecting portion (44) arranged in the housing (2) in a form-fitting connection manner, and a second connecting portion (46) is arranged in the housing (2) in one of a materially-bonded connection manner or a force-fitting connection manner.

13. The power semiconductor module, according to claim 12, wherein: the form-fitting connection is formed as an injection-molded connection.

14. The power semiconductor module, according to claim 12, wherein: the materially-bonded connection is formed as an adhesive connection in which the adhesive compound (6) is arranged in an opening (20) in the housing (2).

15. The power semiconductor module, according to claim 12 wherein: the force-fitting connection is formed as a thermal deformation of a deformation portion (22) of the housing (2).

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0024] FIGS. 1 to 3 show a first configuration of an inventive method.

[0025] FIG. 4 shows a step of a second configuration of an inventive method.

[0026] FIGS. 5 and 6 show a third configuration of an inventive method.

[0027] FIG. 7 shows a step of a fourth configuration of an inventive method.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0028] Reference will now be made in detail to embodiments of the invention. Wherever possible, same or similar reference numerals are used in the drawings and the description to refer to the same or like parts or steps. The drawings are in simplified form and are not to precise scale. The word ‘couple’ and similar terms do not necessarily denote direct and immediate connections, but also include connections through intermediate elements or devices. For purposes of convenience and clarity only, directional (up/down etc.) or motional (forward/back, etc.) terms may be used with respect to the drawings. These and similar directional terms should not be construed to limit the scope in any manner. It will also be understood that other embodiments may be utilized without departing from the scope of the present invention, and that the detailed description is not to be taken in a limiting sense, and that elements may be differently positioned, or otherwise noted as in the appended claims without requirements of the written description being required thereto.

[0029] FIGS. 1 to 3 show a first configuration of an inventive method. In this regard, a power semiconductor module according to method step B) is illustrated in FIG. 1. In this power semiconductor module having a housing 2, having a switchgear 3 arranged in this housing 2 and having a plurality of connection elements 4, the housing 2 has been formed in such a way that the connection elements 4 are pre-fixed therein. To this end, the connection elements 4 are already arranged in the housing 2, which is formed as a frame-like plastic housing, during the plastic injection moulding procedure of the manufacturing process. However, this arrangement is flexible in that the connection elements 4, more specifically a respective first connection portion 44, are merely pre-fixed in the housing 2 using an injection moulding technique, i.e., by means of a form-fitting connection. This means that, in particular, the contact portions 42 of the connection elements 4 which project out of the housing 2 may move perpendicularly to their longitudinal direction, which is the same as the normal direction N of the switchgear 3 substrate shown here, as indicated by arrows.

[0030] Following the formation of the frame-like plastic housing 2 with the pre-fixed connection elements 4, the switchgear 3 is arranged in or on the housing 2 and the connection elements 4, more specifically the respective foot portion 40 thereof, are mechanically connected to connection surfaces 40 of a substrate 32 of the switchgear 3 in an electrically conductive manner.

[0031] FIG. 1 shows the start of method step C), wherein the arrangement of a positioning device 5 takes place. The positioning device 5 has a continuous opening 52 for each connection element 4. The respective opening 52 has a conical portion 54 on its side facing the housing 2. The openings 52 themselves have a first positioning surface 56, or a plurality of first positioning partial-surfaces 56, against which the contact portion 42 of the connection element 4 is intended to lie, and which, together with the opening 52 as such, define the position of the contact portions 42 of the connection elements 4 with respect to one another and, in this case, also with respect to the housing 2. To this end, the reusable positioning device 5, and in particular the position of the openings 52, is produced with the necessary precision.

[0032] FIG. 1 shows the start of the arrangement of the positioning device 5 with respect to the housing 2 in method step C). In this case, to fix their position by means of the conical portion 52, the contact portions 42 are slotted into the openings 52 associated with the respective connection element 4. The result is shown in FIG. 2.

[0033] After the arrangement of the positioning device 5 in method step C), as illustrated in FIG. 2, the contact portions 42 lie against the first positioning surface 56 in such a way that their previously possible movement capability perpendicular to the longitudinal extent is restricted to the permissible maximum.

[0034] FIG. 2 shows the state prior to method step D) for a connection element 4 which is shown on the right. In this case, a second connecting portion 46, which connects the first connecting portion 44 to the contact portion 42 of the connection element 4, is arranged in an opening 20 in the housing 2. Below this opening 20, the connection element 4 having the first connecting portion 44, as described above, is injection-moulded into the housing 2 so that the contact portion 42 and also, to a lesser extent, the second connecting portion 46 are arranged to be movable in two orthogonal spatial directions perpendicular to the longitudinal extent until the arrangement of the positioning device 5 has taken place.

[0035] FIG. 2 furthermore shows the completed method step D) for a connection element 4 shown on the left. In this case, in method step D), the connection element 4 is already fixed relative to the housing 2 and to the connection element 4 on the right as a result of filling the opening 20 in the housing 2 with an adhesive compound 6. This adhesive compound 6 may be formed, for example, as a highly-filled plastic adhesive material.

[0036] Following method step D), the positioning device 5 is removed again. FIG. 3 finally shows an inventive power semiconductor module having a housing 2, a switchgear 3 arranged in this housing 2 and having a plurality of connection elements 4, wherein the respective connection elements 4 have a first connecting portion 44, which is arranged in the housing 2 in a form-fitting manner, and a second connecting portion 46, which is arranged in the housing 2 in a materially-bonded manner. The contact portions 42 of the respective connection elements 4 are now adequately fixed in position with respect to one another and with respect to the housing 2.

[0037] FIG. 4 shows a step of a second configuration of an inventive method. The substrate 3, the connection elements 4 and the positioning device 5, and also the respective interaction thereof, are the same as described for FIG. 2.

[0038] The arrangement of the connection elements 4 in the housing 2, and also their movement capability, are likewise the same. However, the housing 2 has a deformation portion 22 at the upper edge region of the opening 20, in which the second connecting portion 46 is arranged. This deformation portion 46 does not restrict, or at least does not substantially restrict, the movement capability of the second connecting portion 46 and the contact portion 42 of the connection element 4 after method step B).

[0039] Within the context of method step D), this deformation portion 22, which may also be formed as a plurality of individual partial deformation portions, is deformed thermally here by means of a heatable die in such a way that the deformation portion 22 lies against the second connecting portion 46 and fixes this, and also the contact portion 42, in the position determined by the positioning device 5.

[0040] FIGS. 5 to 6 show a third configuration of an inventive method. The substrate 3, the housing 2 and the connection elements 4, and also the respective interaction thereof, are the same as described for FIG. 1.

[0041] The arrangement of the connection elements 4 in the housing 2, and also their movement capability, are likewise the same. However, the positioning device 5 has, at the upper edge region, the opening 50 in which the second connecting portion 46 is arranged. In contrast to the first configuration of the inventive method, the positioning device 5 here remains directly on the housing 2 here and is therefore not removed after method step C). The positioning device 5 therefore even forms part of the housing 2 here.

[0042] During method step D), it is not, or not only, the opening in the housing 2 which is filled with an adhesive compound 6 (already described), but in particular the opening 50 of the positioning device 5, whereby the connection element 4, and in particular its second connecting portion 46 and also its contact portion 42, is therefore fixed in position.

[0043] FIG. 7 shows a step of a fourth configuration of an inventive method. The substrate 3, the housing 2 and the connection elements 4, and also the respective interaction thereof, are the same as described for FIG. 1.

[0044] The arrangement of the connection elements 4 in the housing 2, and also their movement capability, are likewise the same. However, the positioning device 5 has, at the upper edge region, a second positioning surface 58, which is arranged on the inside of a positioning partial-body 580. By way of example, it is also possible to form more, preferably three, second positioning partial-surfaces of this positioning surface 58, which are preferably arranged in a star shape. In this configuration of the inventive method, the positioning device 5 also remains on the housing 2, in this case directly, and is therefore not removed after method step C). The positioning device 5 in turn forms part of the housing 2 here. Moreover, purely for technical reasons, method step C) and method step D) coincide in a simplifying manner.

[0045] Also, the inventors intend that only those claims which use the specific and exact phrase “means for” are intended to be interpreted under 35 USC 112. The structure herein is noted and well supported in the entire disclosure. Moreover, no limitations from the specification are intended to be read into any claims, unless those limitations are expressly included in the claims.

[0046] Having described at least one of the preferred embodiments of the present invention with reference to the accompanying drawings, it will be apparent to those skills that the invention is not limited to those precise embodiments, and that various modifications and variations can be made in the presently disclosed system without departing from the scope or spirit of the invention. Thus, it is intended that the present disclosure cover modifications and variations of this disclosure provided they come within the scope of the appended claims and their equivalents.