Abstract
A surgical instrument having: a wall; an electrically insulating substrate; an electrical connection, wherein at least a portion of the electrical connection is applied on an exterior surface of the electrically insulating substrate; an insulating layer applied on the portion of the electrical connection; and a hermetic connection layer applied to the insulating layer, wherein the hermetic connection layer is hermetically connected to the wall to separate a hermetic chamber from an outer area.
Claims
1. A surgical instrument comprising: a wall that extends radially inward from a tube; an electrically insulating substrate arranged within the tube; an electrical connection, wherein at least a portion of the electrical connection is applied on an exterior surface of the electrically insulating substrate; an insulating layer applied on an exterior surface of the portion of the electrical connection, wherein the insulating layer extends radially outward from the exterior surface of the portion of the electrical connection towards the wall, and wherein the insulating layer is comprised of a different material than the portion of the electrical connection applied on the exterior surface of the electrically insulating substrate; and a hermetic connection layer applied on the insulating layer, wherein the hermetic connection layer extends radially outward towards the wall and is hermetically connected to the wall to hermetically separate a chamber within the tube from an outer area, wherein the wall comprises: a first shell; and a second shell joined together hermetically with the first shell to define an opening in which the electrically insulating substrate, the portion of the electrical connection, the insulating layer, and the hermetic connection layer are arranged, wherein the wall extends radially inward between the tube and the opening by a radial distance, and the wall extends along a longitudinal axis of the tube by an axial distance that is less than the radial distance, and wherein an outer edge of the first shell and an outer edge of the second shell are connected to a portion of an inner surface of the tube between a first end of the tube and a second end of the tube along the longitudinal axis of the tube.
2. The surgical instrument according to claim 1, wherein the hermetic connection layer is a soldering.
3. The surgical instrument according to claim 1, wherein the electrically insulating substrate has a thermal conductivity of more than 1 W/mK.
4. The surgical instrument according to claim 3, wherein the thermal conductivity is greater than 200 W/mK.
5. The surgical instrument according to claim 1, further comprising: a flexible conductor plate configured to electrically contact the electrical connection.
6. The surgical instrument according to claim 1, wherein the electrical connection is completely arranged around the exterior surface of the electrically insulating substrate.
7. The surgical instrument according to claim 6, further comprising a plurality of the electrical connection, wherein the plurality of the electrical connection are provided symmetrically around the electrically insulating substrate.
8. The surgical instrument according to claim 1, wherein the at least a portion of the electrical connection is applied on the exterior surface of the electrically insulating substrate by metallization.
9. The surgical instrument according to claim 1, wherein the electrically insulating substrate defines a groove extending longitudinally axially, and wherein the at least a portion of the electrical connection is arranged in the groove.
10. The surgical instrument according to claim 9, wherein the groove has a rectangular cross-section.
11. The surgical instrument according to claim 9, wherein a portion of the electrical connection is provided outside the groove.
12. The surgical instrument according to claim 9, wherein the groove has a V-shaped cross-section.
13. The surgical instrument according to claim 10, wherein a portion of the exterior surface of the electrically insulating substrate forms a flank of the groove having the V-shaped cross-section, and wherein the electrical connection is applied to the flank of the groove having the V-shaped cross-section.
14. The surgical instrument according to claim 1, further comprising the tube, wherein the tube is an endoscope.
15. The surgical instrument according to claim 14, wherein the endoscope is a laparoscope.
Description
(1) The invention is described below without restricting the general inventive idea based on exemplary embodiments with reference to the drawings, wherein the drawings are expressly referenced with respect to all details according to the invention not described in greater detail in the text. The drawings show in:
(2) FIG. 1 a schematic longitudinal cut through a system tube of a video endoscope in accordance with the state of the art,
(3) FIG. 2 a schematic section of a longitudinal cut through a surgical instrument according to the invention,
(4) FIG. 3 a schematic radial sectional view of the embodiment in accordance with FIG. 2,
(5) FIG. 4 a schematic axial sectional view of a portion of FIG. 2,
(6) FIG. 5 a schematic radial sectional view of another embodiment according to the invention of a corresponding electrically insulating substrate with additional layers,
(7) FIG. 6 a schematic radial sectional view of a portion of an embodiment according to the invention,
(8) FIG. 7 a schematic sectional representation along A-A in accordance with FIG. 6,
(9) FIG. 8 a schematic radial sectional representation through the inner area of a surgical instrument,
(10) FIG. 9 a schematic axial sectional representation along BB from FIG. 8,
(11) FIG. 10 a schematic portion of a longitudinal cut through a surgical instrument according to the invention,
(12) FIG. 11 a schematic three-dimensional representation of a portion of FIG. 10 in an alternative embodiment,
(13) FIG. 12 a schematic lateral view of a portion of the body from FIG. 11 in another embodiment and
(14) FIG. 13 a schematic lateral view of a portion of another embodiment according to the invention.
(15) In the following figures, the same or similar elements or respectively corresponding parts have the same reference numbers so that a corresponding reintroduction is omitted.
(16) FIG. 1 shows schematically a longitudinal cut through a system tube of a video endoscope according to the state of the art from DE 10 2006 015 176 B3.
(17) FIG. 1 shows a rigid medical video endoscope 1 with a system tube 2 made of metal, which is closed on the distal end with a soldered in window 3, behind which a schematically shown objective 4 and a video camera 5 are arranged in the distal end area of the system tube 2, which is connected to the outside via the lines. In the simplified example in FIG. 1, these are two electrical lines 6.
(18) The electrical lines 6 run through the proximal opening 7 of the system tube 2, the proximal opening being closed with a potting material 8. The electrical lines 6 are designed in this area as non-insulating feed-through conductors 9. According to the usual state of the art, glass, which is melted in liquid form into the system tube 2 and around the feed-through conductors 9, is provided for sufficient hermetic sealing of the interior of the system tube 2 as potting material 8. A simple design of the potting material 8 made of plastic can lead to insufficient gas permeability.
(19) FIG. 2 shows schematically a part of a surgical instrument 1 according to the invention, for example a video endoscope, a laparoscope, an endoscope or a similar instrument in a first embodiment according to the invention, wherein the part is shown, which is represented for a hermetic sealing of a hermetic chamber 19 from an outer area 20.
(20) In this exemplary embodiment, the system tube 2 is designed cylindrically. It can however also have other shapes. For the hermetic through connection or respectively for the hermetic electrical connection, a conductor path structure in the form of feed-through conductors 9, 9.sup.I and other feed-through conductors, which are then shown in FIG. 3, are applied to the exterior of a cylindrical substrate 21, which preferably has a non-electrically conductive but thermally conductive material.
(21) The application of the conductor path structure can occur by means of printing, CVD, magnetic sputtering, laser ablation and the like.
(22) An insulating layer 14 is then applied and on the insulating layer a metal layer 15. Adjacent to the metal layer 15 is the wall 16, which leads to the system tube 2. The wall is hermetically soldered with the system tube 2 and the metal layer 15. A hermetical sealing of the hermetic chamber 19 is hereby enabled.
(23) For the through contacting or respectively for the connection with the corresponding lines, flexible conductor plates 10, 11, 12, 13 are provided, which are electrically connected with a corresponding solder 18 also with the respective conductor path 9, 9.sup.I and also the other conductor paths from FIG. 3. It can be seen that on the end surfaces of the substrate the conductor paths or respectively the feed-through conductors 9, 9.sup.I and also the other feed-through conductors 9.sup.II-9.sup.VIII, which are shown in FIG. 3, are exposed. The insulating layer 14 and the metal layer 15 are arranged completely around the substrate 21. The substrate can be a ceramic, which is named above.
(24) For stabilization of the flexible conductor plates 10, 11 on the proximal end of the surgical instrument or respectively video endoscope 1, they can be potted for example with plastic. The soldering points 18 or respectively the flexible conductor plates 10, 11 can hereby be protected from tensile loading.
(25) FIG. 3 shows schematically a cross-section through the feed-through device with the substrate 21 as per FIG. 2. The feed-through conductors 9-9.sup.VIII can be vapor-deposited and structured. Accordingly, the insulating layer 14 and the metal layer 15 can also be vapor-deposited. It can be seen that the substrate 21 is round in cross-section. The corresponding feed-through conductors 9-9.sup.VIII are arranged symmetrically around the substrate 21. The insulating layer 14 is arranged around them and around it the metal layer 15. The insulating layer 14 can be a silicon dioxide or a silicon nitride or another ceramic. The feed-through conductors 9-9.sup.VIII can be made of gold, copper or silver. The outer metal layer, which can also be called a solder layer, can for example be made of gold.
(26) FIG. 4 shows another section representation of a portion of the embodiment as per FIG. 3, without the wall 16 for better illustration.
(27) FIG. 2 through 4 show an embodiment without shielding. Whereas FIG. 5 shows a schematic sectional representation of an embodiment with shielding, it can be seen that an intermediate layer 22, which can be a metal layer and serves for shielding together with the solder and shielding layer 23, is first provided around the substrate 21. The conductor paths or respectively feed-through conductors 9-9.sup.VIII are arranged on an insulating layer 24. A second insulating layer 25 is arranged around the feed-through conductor 9-9.sup.IV. The corresponding layer and the feed-through conductors can also be vapor-deposited accordingly. The insulating layers 24 and 25 can be made of silicon nitride, silicon dioxide or another ceramic.
(28) FIG. 6 shows a schematic representation of a feed-through device according to the invention in a longitudinal, axial sectional representation. A rectangular flexible conductor plate 100 is provided as the substrate, which can also be made of a plastic.
(29) FIG. 7 shows a schematic sectional representation along A-A of FIG. 6. Five feed-through conductors 9-9.sup.IV are applied around the flexible conductor plate 100, of which three are applied above the conductor plate 100 and two below the conductor plate 100. The feed-through conductors 9-9.sup.IV can also be an integral component of the conductor plate 100. Feed-through conductors can also be applied to the sides or a different number of feed-through conductors can be applied.
(30) An insulating layer 14 is provided around the feed-through conductor and the flexible conductor plate 100. A metal layer 15 is provided around the insulating layer 14. In the sectional view, the insulating layer 14 and the metal layer 15 completely surround the substrate with the feed-through conductors 9-9.sup.IV here.
(31) On the edges, i.e, indicated left and right in FIG. 6, two other insulating layers 26 and 27 are applied around the metal layer 25 or respectively on the metal layer 25. These layers are, as shown in FIG. 6, not applied in the middle area and are not applied to the end areas either, which is not shown in FIG. 6, in order to enable a corresponding connection of the feed-through conductors 9 through 9.sup.IV.
(32) A connection with a corresponding first half shell 28 and the corresponding second half shell 29 to the system tube 2 (not shown) is represented in FIG. 9. A hermetic solder 32 is also represented there.
(33) FIG. 8 shows a structure, which is inserted into a system tube 2 (not shown), provided around a hermetic sealing. A first half shell 28 and a second half shell 29, which are hermetically joined at the joints 30 and 31, are provided. The solder, which enables a connection with the system tube 2 (not shown) is then applied on the outer edge of the half shells 28 and 29. This also concerns a hermetic connection. The hermetic connection with the feed-through device comprising the flexible conductor plate 100, the feed-through lines not shown in FIG. 8 for better illustration, the insulating layer 14 and the metal layer 15, on which the solder 32 is applied, are also shown in FIG. 8. The insulating layer 26 is also shown schematically. It protrudes over the opening for the feed-through device resulting from the half shells 28, 29.
(34) Through the embodiments according to FIGS. 6 through 9, a particularly simple feed-through of conductors is possible since a flexible conductor plate, which is connected in the hermetic chamber with corresponding electrical components, is led through directly. The corresponding layers are also applied, e.g. vapor-deposited, on the flexible conductor plate 100. A potential creep distance between the applied layers of the flexible conductor plate 100 can be extended by the applied insulating layer 26 and 27. An electrical plating-through can hereby take place directly and without further soldering points or plug connections. A hermetic soldering is nonetheless present. The dimensions that can be used in the feed-through device according to the invention are considerably smaller than for conventional solutions with hermetic plugs. Considerably thinner tubes can hereby be used.
(35) FIG. 10 shows a schematic portion of a longitudinal cut through a surgical instrument according to the invention in another embodiment. A hermetically sealed area 19 and a non-hermetic chamber 20 are also provided here. For the connection of these two areas and for the feed-through of electrical lines, an insulating body 40 is provided, to which electrical lines in the form of electrically conductive layers are applied, for example printed. The insulating body 40 is connected with the tube 52 via a glass-potted connector 42. A hermetic connection is hereby created. The tube 52 can be the outer tube of the surgical instrument 1, but can also be connected with the outer tube of the surgical instrument, in particular hermetically. The conductor paths or respectively electrical connections 9-9.sup.VIII can, as indicated for example in FIG. 10, be printed or vapor-deposited on the surface of the insulating body 40. These can hereby be metal layers that are arranged in the longitudinal extension of the insulating body.
(36) FIG. 11 shows a schematic three-dimensional representation of another embodiment of the insulating body 40. Corresponding grooves 41 are made in the surface of the insulating body 40. Corresponding electrical connections each in the form of a feed-through conductor 39-39.sup.VIII provided on the floor of the grooves 40. A fit groove 43 is provided for a clear assignment of the corresponding electrical connections with a connection plug. Alternatively, an eccentric blind hole can also be provided, which can be connected with a correspondingly fitting pin of a plug attachable to the insulating body 40.
(37) FIG. 12 shows a section of a lateral view of the insulating body 40, in a further embodiment, wherein rectangular grooves are provided along the longitudinal axis of the insulating body 40. The grooves are labeled with reference number 41. Corresponding feed-through conductors 39 through 39.sup.IV are provided in the grooves. Further feed-through conductors 9-9.sup.V are arranged on another level, namely on the outer surface of the insulating body 40. In the case of a circumference of for example 31.4 mm, which corresponds to a diameter of 10 mm of the insulating body 40, more than 400 conductor paths with a width of 75 μm can hereby be accommodated. A second level of conductor paths is created through the use of small rectangular longitudinal grooves distributed over the circumference.
(38) FIG. 13 shows another embodiment of the insulating body 40 in a schematic lateral view. V-shaped grooves are made longitudinally axially in the insulating body 40. The feed-through conductors 39 through 39.sup.VIII are applied on the respective left flank of the respective groove 41′. It is provided that a feed-through conductor is arranged in each groove. The fit groove 43 is also provided here. Through this embodiment, in which corresponding V grooves are provided along the cylinder surface of the insulating body 40, for example of a ceramic pin, and a corresponding metallization of a flank of the V groove, it is possible, for example in the case of a height of the flank of 45 μm at a diameter of the insulating body of 10 mm, to provide approximately 300 conductor paths in a corresponding pin or respectively insulating body 40.
(39) Moreover, it is shown in FIG. 13 that the groove 43 also has a conducting layer 44, by means of which a contacting can also be performed. For example, the mass can be conducted from the hermetically sealed area towards outside the hermetically sealed area or respectively vice versa.
(40) All named characteristics, also those taken solely from the drawings as well as individual characteristics disclosed in combination with other characteristics, are considered important for the invention both alone and in combination. Embodiments according to the invention can be fulfilled by individual characteristics or a combination of several characteristics.
LIST OF REFERENCE NUMBERS
(41) 1 Video endoscope 2 System tube 3 Soldered in window 4 Objective 5 Video camera 6 Electrical line 7 Proximal opening 8 Potting material 9 Feed-through conductor 9.sup.I Feed-through conductor 9.sup.II, 9.sup.III, 9.sup.IV, 9.sup.V, 9.sup.VI, Feed-through conductor 9.sup.VI, 9.sup.VII, 9.sup.VIII Feed-through conductor 10 Flexible conductor plate 11 Flexible conductor plate 12 Flexible conductor plate 13 Flexible conductor plate 14 Insulating layer 15 Metal layer 16 Wall 17 Hermetic solder 18 Solder 19 Hermetic chamber 20 Non hermetic chamber 21 Substrate 22 Intermediate layer 23 Solder and shielding layer 24 Insulating layer 25 Insulating layer 26 Insulating layer 27 Insulating layer 28 First half shell 29 Second half shell 30 Joint 31 Joint 32 Hermetic groove 39, 39.sup.I, 39.sup.II, 39.sup.III, 39.sup.IV, 39.sup.V, 39.sup.VI, 39.sup.VII, 39.sup.VIII Feed-through conductor 40 Insulating body 41, 41′ Groove 42 Glass-potted connector 43 Fit groove 44 Conducting layer 52 Tube 100 Flexible conductor plate
