Method for configuring a laser machining machine

09839975 · 2017-12-12

Assignee

Inventors

Cpc classification

International classification

Abstract

Methods for configuring laser machining machines (1) include control (2), whereby different types laser machining processes (A, B, C, D) can be executed using the laser machine (1), these processes being respectively controlled by the control apparatus (2) using process parameters. The processes of different types are categorized in a classification (20), in which a respective set of process parameters (21A-24A; 21B-24B; 21C-24C; 22D-24D), that are used during the execution of the respective process (A, B, C, D), is assigned to each process. During a determination and/or changing of a first process parameter (21A-24A) of a first process (A), a process parameter (S1-S6; 21B-24B; 21C-24C; 22D-24D) of a different process (B, C, D) that is contained within classification (20), is automatically determined and/or changed according to a stored rule, as a function of the first process parameter.

Claims

1. A method of operating a laser machining machine comprising the steps of: providing a classification with a plurality of different classes of laser machining processes, with each of the plurality of different classes including at least one defined laser machining process; providing a respective set of process parameters as respective characteristics for each respective one of the plurality of different classes of laser machining processes; establishing at least one first process parameter of a first respective class of laser machining process; and, automatically establishing at least one respective process parameter of at least a second respective class of laser machining process based on at least one stored rule as a function of said at least one first process parameter of the first respective class of laser machining process.

2. The method of operating a laser machining machine as claimed in claim 1, further comprising the steps of: providing a respective set of process primary parameters as respective characteristics for each respective one of the plurality of different classes of laser machining processes; and, providing a respective set of process secondary parameters as respective characteristics for at least one of the plurality of different classes of laser machining processes, in accordance with stored rules as a function of at least one primary parameter.

3. The method of operating a laser machining machine as claimed in claim 2, further comprising the step of: changing at least one primary parameter based on sensor data.

4. The method of operating a laser machining machine as claimed in claim 1, further comprising the step of: providing a classification with a plurality of different classes of laser machining processes and including at least one laser machining process employing continuous laser radiation and at least one laser machining process employing laser radiation.

5. The method of operating a laser machining machine as claimed in claim 1, further comprising the step of: providing a classification with a plurality of different classes of laser machining processes and including at least one laser machining process selected from the group consisting of cutting, engraving, scanning, vaporization, and continuous cutting of small contours.

6. The method of operating a laser machining machine as claimed in claim 1, further comprising the step of: providing a respective set of process primary parameters as respective characteristics for each respective one of the plurality of different classes of laser machining processes and providing for at least one of the plurality of different classes at least one process parameter selected from the group consisting of focus position, feed rate, laser power, and nozzle distance from workpiece.

7. The method of operating a laser machining machine as claimed in claim 1, further comprising the step of: changing the at least one stored rule.

8. The method of operating a laser machining machine as claimed in claim 1, further comprising the steps of: displaying a plurality of respective workpiece images on an output interface; assigning each of said plurality of respective workpiece images to at least one respective certain value of at least one respective process parameter; and, providing an actual process parameter value by selecting at least one of said plurality of workpiece images.

9. A laser machining process comprising the steps of: providing a classification with a plurality of different classes of laser machining processes, with each of the plurality of different classes including at least one defined laser machining process; providing a respective set of process parameters as respective characteristics for each respective one of the plurality of different classes of laser machining processes; establishing at least one first process parameter of a first respective class of laser machining process; automatically establishing at least one respective process parameter of at least a second respective class of laser machining process based on at least one stored rule as a function of said at least one first process parameter of the first respective class of laser machining process; and, controlling laser machining with a controller employing the process parameters.

10. The laser machining process as claimed in claim 9 further comprising the steps of: monitoring laser machining with at least one sensor; creating at least one suggestion, based on sensor data from the at least one sensor, for the changing of a process parameter: and, providing the at least one suggestion to an output interface.

11. The laser machining process as claimed in claim 9 further comprising the steps of: monitoring laser machining with at least one sensor; comparing with reference data, values that are based on sensor data; and, creating at least one suggestion, based on sensor data from the at least one sensor, for the changing of a process parameter, as a function of a deviation derived from said step of comparing with reference data values based on sensor data.

12. The laser machining process as claimed in claim 9 further comprising the steps of: monitoring laser machining with at least one sensor; creating at least one suggestion for the changing of a process parameter by employing an empirically determined data set; and, in the empirically determined data set linking possible values of sensor-based data with respective values for associated process parameter.

13. The laser machining process as claimed in claim 9 further comprising the step of: creating at least one suggestion for a machine care measure when at least one process parameter exceeds a predetermined limit.

14. The laser machining process as claimed in claim 9 further comprising the step of: creating at least one suggestion for a machine care measure when at least one machining-related analytical parameter exceeds a predetermined limit.

15. The laser machining process as claimed in claim 9 further comprising the steps of: monitoring laser machining with at least one sensor; creating at least one suggestion, based on sensor data from the at least one sensor, for the changing of a process parameter; employing an instruction program contained in the controller to provide the at least one suggestion to an output interface.

16. The laser machining process as claimed in claim 9 further comprising the steps of: providing a respective set of process primary parameters as respective characteristics for each respective one of the plurality of different classes of laser machining processes; and, providing a respective set of process secondary parameters as respective characteristics for at least one of the plurality of different classes of laser machining processes, in accordance with stored rules as a function of at least one primary parameter.

17. A laser machining machine comprising: a laser beam generator in said laser machining machine; a controller operatively connected to control said laser machining machine; said laser machining machine including a classification apparatus containing a classification with a plurality of different classes of laser machining processes with each of the plurality of different classes including at least one defined laser machining process, and also containing a respective set of process parameters as respective characteristics for each respective one of the plurality of different classes of laser machining processes; and, electronic structure configured to automatically establish at least one first process parameter of at least a first respective class of laser machining process electronic structure being further configured to automatically establish at least one respective process parameter of at least a second respective class of laser machining process based on at least one stored rule as a function of said at least one first process parameter of the first respective class of laser machining process; said electronics structure being operatively associated with said classification apparatus.

18. The laser machining machine as claimed in claim 17, further comprising: an input interface operatively connected to said controller; an output interface operatively connected to said controller; at least one sensor configured to monitor machining; and, said controller including a set of stored program instructions that generate at said output interface at least one suggestion for process parameter change based on operative communication of said at least one sensor.

19. The laser machining machine as claimed in claim 17, wherein: said classification apparatus contains a respective set of process primary parameters as respective characteristics for each respective one of the of different classes of machining processes, and also contains a respective set of process secondary parameters as respective characteristics for at least one of the plurality of different classes of machining processes in accordance with stored rules as a function of at least one primary parameter.

20. The laser machining machine as claimed in claim 19, wherein: said electronic structure has structure configured to automatically change a value of at least one process secondary parameter as a function of a change in value of at least one primary process parameter.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) In the Figures:

(2) FIG. 1 depicts a laser machining machine according to the invention in schematic illustration,

(3) FIG. 2 depicts a laser machining method according to the invention in schematic illustration,

(4) FIG. 3 depicts a laser machining head in section,

(5) FIG. 4 depicts a classification apparatus with classification system, and

(6) FIG. 5 depicts a rule for generating process parameters converted to a graphical illustration.

DETAILED DESCRIPTION

(7) Reference in this specification to “one version,” “a version,” “a variant,” “one variant,” “one embodiment,” and “an embodiment,” should be understood to mean that a particular feature, structure, or characteristic described in connection with the version, variant, or embodiment is included in at least one such version, variant, or embodiment of the disclosure. The appearances of phrases “in one embodiment”, “in one version,” “in one variant,” and the like in various places in the specification are not necessarily all referring to the same variant, version, or embodiment, nor are separate or alternative versions, variants or embodiments necessarily mutually exclusive of other versions, variants, or embodiments. Moreover, various features are described which may be exhibited by some versions, variants, or embodiments and not by others. Similarly, various requirements are described which may be requirements for some versions, variants, or embodiments but not others. Furthermore, if the specification states a component or feature “may”, “can”, “could”, or “might” be included or have a characteristic, it should be understood that that particular component or feature is not always necessarily required to be included or have the characteristic. Additionally, as used throughout this specification, the terms ‘a’, ‘an’, ‘at least’ do not denote a limitation of quantity, but rather denote the presence of at least one of the referenced item, and the term ‘a plurality’ denotes the presence of more than one referenced items.

(8) FIG. 1 shows a laser machining machine 1 for machining a workpiece 11 using a laser beam 10 in the form of a laser cutting machine. This includes a control apparatus 2, via which a laser machining process may be controlled by using process parameters. Included are an input interface 8 and an output interface 7 for the operating personnel. The interfaces, respectively are connected to the control apparatus 2, and sensor apparatuses 4, 5, 6 for monitoring the laser machining process.

(9) FIG. 4 depicts an exemplary classification apparatus 19, in which the laser machining processes of different types are categorised in a classification 20. The classification apparatus 19 may be a constituent 2 of an internal or external data memory or a specific configuration module. A set of process parameters 21A-24A, 21B-24B, etc. is assigned to each laser machining process A, B, C, D (first row of the table) by the classification 20, which process parameters are used during the execution of the relevant laser machining process.

(10) The first column of the table from FIG. 4 describes the process parameter types: 21 describes the process parameter type: focus position; 22 describes the process parameter type: feed rate; 23 describes the process parameter type: laser power; and 24 describes the process parameter type: nozzle distance.

(11) Thus, 21A, 21B, 21C, 21D are the actual process parameters for the focus position; 22A, 22B, 22C, 22D are the feed rate process parameters; 23A, 23B, 23C, 23D are the laser power process parameters; and, 24A, 24B, 24C, 24D are the nozzle distance process parameters for the respective laser machining types A, B, C, D.

(12) In the illustrated version, A designates a laser machining process with a continuous laser beam, B designates a laser machining process with a pulsed laser beam, C designates a laser machining process “engraving,” and D designates a laser machining process “cutting”. Further machining types are, of course, conceivable and may comprise: ‘continuous wave’ mode (CW) for small contours, scanning, vaporization, and much more.

(13) The classification apparatus 19 is constructed in such a manner that in the event of a determination and/or change, at least one first process parameter (e.g., 21A) of a laser machining process (e.g., A), at least one process parameter (e.g., 21B) of a different laser machining process (e.g., B) contained in the classification may be determined and/or changed in accordance with at least one stored rule as a function of the first process parameter. The first, or primary, process parameters are illustrated in FIG. 4 in ‘bold’ and ‘italics’, while the secondary parameters are shown in normal text.

(14) Thus, the determination or changing of the at least one process parameter takes place in a class-overarching manner, as the first process parameter belongs to a different class (the classification) from the process parameter determined or changed as a function of the first process parameter. The laser machining processes of different types respectively form classes A, B, C, D (illustrated respectively as columns in FIG. 4). One laser process of a first type forms a first class of the classification; a laser process of a second type forms a second class of the classification. In this case, the first type differs from the second type in terms of quality (e.g., CW operation vs. pulsed operation). Further laser processes of different types may form further classes in each case.

(15) In principle, primary process parameters and secondary process parameters can be defined, the secondary process parameters automatically being derived from the primary parameters, while the primary parameters are determined and/or changed by the operator or as a function of sensor data (and are therefore independent of the secondary parameters to a certain extent). In FIG. 4, the primary or first process parameters are additionally illustrated in a highlighted manner (‘bold’ and ‘italics’). The actual selection or assignment of the primary parameters can basically also be different, depending on the requirement. A change of this definition is, of course, possible.

(16) In the case of a determination and/or change at least of a first (primary) process parameter of a laser machining process, at least one (secondary) process parameter of a different laser machining process contained in the classification is then automatically determined and/or changed in accordance with at least one stored rule as a function of the first process parameter. As already mentioned, the set of process parameters assigned to each laser machining process A, B, C, D may comprise the process parameters focus position and/or feed rate and/or laser power and/or nozzle distance from the workpiece 11.

(17) FIG. 5 depicts the dependence relationships (according to the stored rules) of secondary process parameters S1 . . . S6 on a primary process parameter P. Multiple dependencies are likewise conceivable, for example the process parameter 21B focus position could depend on the primary parameters 21A and 22A.

(18) The at least one stored rule can preferably be changed via an input interface 8.

(19) Preferably, the determination and/or changing of at least one first (primary) process parameter P takes place by means of an input at an input interface 8 of the laser machining machine 1 by an operator.

(20) In this context, a plurality of images of workpieces of different machining quality could be displayed on an output interface 7 of the laser machining machine 1, wherein each image is assigned to a certain value of at least one first process parameter. The determination and/or changing of the at least one first process parameter then takes place by operator selection of one of the images. The system thereby achieves knowledge of the effects of a certain process parameter, and can change the same in order to improve the machining quality.

(21) The determination and/or changing at least of one first process parameter may also take place as a function of sensor data of a sensor apparatus 4, 5, 6, as is described in more detail below.

(22) The assessment of the machining or cutting quality can also take place without a sensor, specifically only via the optical assessment of the cut face by the operator. This way, a part is cut and is compared as to the quality with various, illustrated qualities on the screen display. Then the operator may press on the closest image. The control could then make at least one suggestion for a change from this information. This process may, however, also be supported further by at least one sensor apparatus.

(23) Such an optimization process initially only relates to the (important) primary process parameters. If these are determined, the values for the secondary parameters are automatically calculated using the stored rules on the control apparatus or a memory location (this could also be outside the machine), and the entire data set is stored. The production then starts using this complete data set. With this step, expenditure of operator's effort is saved and operators do not have to have deep technical understanding.

(24) The fully automatic determination of the primary process parameters using at least one sensor without interaction of an operator is likewise conceivable. In this case, the sensors also asses only the primary parameters or the effects thereof on the machining quality, and the secondary parameters are calculated according to the stored rules.

(25) A sensor apparatus (e.g., camera) does not necessarily have to be used during the laser process, but rather could also be used only subsequently. However, such a sensor is also connected to the control and forwards the information directly.

Example

(26) The sectioned sample is removed from the machine and the cut face is held before a camera. This assesses the roughness and the burr formation, and transmits this information to the control. These properties are then compared with stored values, and an adjustment of the process parameters is suggested on the basis of the deviation.

Further Example

(27) A cut-out bore is recorded by the camera (after the cutting process, within or outside the cutting installation) and the diameter is determined (using appropriate image processing software). The determined diameter is compared with the programmed (i.e., ideal) diameter, and the deviation is suggested as a suggestion for the adjustment of the process parameters. This process could, however, also run fully automatically, e.g. in that the camera independently measures the first bore and then already uses the necessary parameter adjustment from the second hole on.

(28) The sensor apparatus, with the sensor data of which a determination or changing of the primary parameters is to take place, could also be provided outside the laser machining machine. Thus, an investigation of a machined workpiece may also take place outside of the laser machining machine.

(29) If a specified deviation of the operator or a sensor is too large (compared to the stored data), the system suggests a check or warning. Example: The operator cuts a part, that has a burr on the underside of the metal sheet. They press the corresponding image, and the installation suggests that they place the focus position 1 mm deeper. They confirm this, and cut the next part, which in turn has a burr (possibly somewhat less). They repeat this five times without significant improvement. After the fifth time, the installation suggests that they clean the lens, as this is presumably the reason for the large deviation. Thus, in addition to the control-supported determination of process parameters, the plausibility is also checked, and a possible cause to be overcome is suggested. This process also tends to relieve the operator of the burden of expert knowledge and contexts.

(30) An actual example is described in following.

(31) The control apparatus 2 includes an instruction program 3 for instructing the operating personnel, which is designed in order to create at least one suggestion for the change of a process parameter as a function of the sensor data recorded by the at least one sensor apparatus 4, 5, 6, and to provide the same at the output interface 7 for the operating personnel.

(32) The sensor apparatuses 4, 5, 6 are constructed in order to monitor the effects of the laser beam 10 on the workpiece 11, particularly the cutting quality, during the laser machining process. The sensor apparatus 6 may preferably be a camera.

(33) At least one sensor apparatus 4 is constructed in order to monitor parameters relating to the laser tool during the laser machining process, this sensor apparatus 4 preferably being a pressure sensor or optical sensor arranged in, or on, the laser machining head 9.

(34) A sensor apparatus 4 of the illustrated embodiment, for example an optical sensor, is arranged in the laser machining head 9 and monitored, for example as to the cutting quality and/or the laser cross section. A sensor apparatus of this type is illustrated in detail in FIG. 3. A drive unit 12 (only illustrated schematically) is used for the method of the laser machining head 9 in all spatial directions. Further sensor apparatuses 5, 6 may be provided in order to monitor the cutting quality from outside the laser head 9, for example above and below the workpiece 11.

(35) FIG. 3 shows an optical sensor 4 within the laser machining head 9, which measures the cut gap width. To this end, a light of a diode is directed via a diverting mirror in the direction of the nozzle opening. The cutting region illuminated by the diode is recorded by an opposite optical sensor, that detects the reflected light likewise diverted via a diverting mirror.

(36) The control apparatus 2 includes reference data 13, and the instruction program 3 is set up in order to compare the sensor data recorded by the at least one sensor apparatus 4, 5, 6, and/or data derived therefrom, with the reference data 13. The creation of at least one suggestion for the change of a process parameter takes place as a function of the deviation of the sensor data and/or data derived therefrom from the reference data 13.

(37) The control apparatus 2 also comprises a preferably empirically determined data set 14, in which possible values of the sensor data and/or data derived therefrom with values for the associated process parameter. The instruction program 3 is set up in order to carry out at least one suggestion for the changing of a process parameter by means of the data set 14.

(38) The laser machining process for machining a workpiece 11 using a laser beam 10 in a laser machining machine 1 is now described in detail on the basis of FIG. 2.

(39) Method step 15 includes the control of a laser machining process with the control apparatus 2 using process parameters.

(40) Parallel to this, in method step 16, a monitoring of the laser machining process takes place using at least one sensor apparatus 4, 5, 6.

(41) In method step 17, there is a creation/generation of at least one suggestion for the changing of a process parameter as a function of the sensor data recorded by the at least one sensor apparatus 4, 5, 6.

(42) The suggestion for the changing of the process parameter is provided at an output interface 7 for the operating personnel, for example displayed at a screen display.

(43) The input interface 8 then receives the input of the operator. Preferably, a changing of the process parameter (method step 18), to which the suggestion relates, preferably takes place only if the operating personnel carries out an input corresponding to the suggestion or an input deviating from the suggestion for the process parameter on the input interface 8 of the laser machining machine 1.

(44) In a preferred version, the sensor data recorded by the at least one sensor apparatus 4, 5, 6 and/or data derived therefrom are compared with reference data 13. The creation of at least one suggestion for the change of a process parameter takes place as a function of the deviation of the sensor data and/or data derived therefrom from the reference data 13.

(45) In this case, it can be provided that the creation at least of one suggestion for the changing of a process parameter only takes place if the deviation exceeds a predetermined limit value.

(46) The creation at least of one suggestion for the changing of a process parameter takes place preferably by means of a preferably empirically determined data set 14, in which possible values of the sensor data, and/or data derived therefrom, are linked with data for the associated process parameter.

(47) An optional enhancement involves changing the data set 14 if an input deviating from the suggestion for changing the process parameter, or a series of deviating inputs, take(s) place by the operating personnel. The changing of the data set takes place as a function of the deviating input(s). This can take place automatically or after confirmation or setting by the operator.

(48) At least two parameters can also be monitored by sensor apparatuses 4, 5, 6 during the laser machining process (for example, cutting gap width and piercing duration). The process parameter, to which the suggestion suggested by the system relates, is in this case a process parameter (for example, the laser power or the feed rate) different from the at least two parameters monitored by the sensor apparatuses 4, 5, 6.

(49) As already mentioned, the method takes place utilizes an instruction program 3, which is contained in the control apparatus 2 of the laser machining machine 1. The instruction program is used for creating a human/machine interface, by which the operator can interactively influence the machining/cutting process.

(50) The scope of the present disclosure should be understood as not merely limited to the described embodiments and the aspects highlighted therein. Rather, within the scope of the present disclosure, a multiplicity of modifications, which lie in the context of an experienced reader's trade, is possible. Likewise, it is possible by combining the features mentioned, to realize further design variants without leaving the context of the present disclosure and the scope of protection. Finally, it may be mentioned that the invention relates to all possible machining types, particularly piercing, cutting, engraving, vaporization, welding, and many more.

(51) In closing, it should be noted that the above description is intended to illustrate rather than limit the invention, and that those skilled in the art shall be capable of designing many alternative embodiments without departing from the scope of protection of invention as defined by the appended claims. As equivalent elements can be substituted for elements employed in claimed invention so as to obtain substantially the same results in substantially the same way, the scope of the present invention is defined by the appended claims, including known equivalents and unforeseeable equivalents at the time of filing of this application. Furthermore, in the claims, the verb ‘comprise’ and its conjugations do not exclude the presence of elements or steps other than those listed in any claim or the specification as a whole. The singular reference of an element does not exclude the plural reference of such elements and vice-versa. The mere fact that certain measures are recited in mutually different dependent claims does not necessarily indicate that a combination of these measures cannot be used to advantage.

LIST OF REFERENCE LABELS

(52) 1 Laser machining machine 2 Control apparatus 3 Instruction program 4 Sensor apparatus 5 Sensor apparatus 6 Sensor apparatus 7 Output interface 8 Input interface 9 Laser machining head 10 Laser beam 11 Workpiece 12 Drive unit 13 Reference data 14 Data set 15 Method step: Controlling a laser machining process 16 Method step: Monitoring the laser machining process 17 Method step: Creation of a suggestion 18 Method step: Changing of the process parameter 19 Classification apparatus 20 Classification 21 Process parameter type: Focus position 22 Process parameter type: Feed rate 23 Process parameter type: Laser power 24 Process parameter type: Nozzle distance 21A, 21B, 21C, 21D Focus position process parameter 22A, 22B, 22C, 22D Feed rate process parameter 23A, 23B, 23C, 23D Laser power process parameter 24A, 24B, 24C, 24D Nozzle distance process parameter A Laser machining process with a continuous laser beam B Laser machining process with a pulsed laser C Engraving laser machining process D Cutting laser machining process P Primary process parameter S1-S6 Secondary process parameter