PRESSURE REDUCING DEVICE FOR COOLING SYSTEM AND COOLING SYSTEM
20170350631 ยท 2017-12-07
Assignee
- Mitsubishi Heavy Industries, Ltd. (Tokyo, JP)
- MITSUBISHI HEAVY INDUSTRIES COMPRESSOR CORPORATION (Tokyo, JP)
Inventors
- Kazutoshi Yokoo (Tokyo, JP)
- Takeshi KANEKO (Tokyo, JP)
- Hideki Nagao (Hiroshima-shi, JP)
- Koichi MIZUSHITA (Hiroshima-shi, JP)
Cpc classification
F25B2500/01
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F16K17/28
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F25B2500/09
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F25B41/31
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F25B2500/05
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F25B41/34
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
Y02B30/70
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
International classification
F16K51/00
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
Abstract
The pressure reducing device (4) for a cooling system according to the present invention is equipped with: a pressure reducing valve (5) that is disposed in a stage subsequent to a condenser for a refrigerant (40); and a microscopic bubble formation unit (20) that is disposed within the flow path for the refrigerant from the condenser to a heat exchanger so as to form the vapor phase (41) of the refrigerant (40) into microscopic bubbles (41a) and disperse the microscopic bubbles into the liquid phase (42) of the refrigerant.
Claims
1.-7. (canceled)
8. A pressure reducing device for a cooling system comprising: a pressure reducing valve disposed in a stage subsequent to a condenser for a refrigerant; and a microscopic bubble formation unit which is disposed inside a flow path for the refrigerant from the condenser to a heat exchanger and which includes an opening member in which a plurality of through hole portions which constitute a plurality of microscopic flow paths having a flow path cross-sectional area smaller than a cross-sectional area of the flow path are formed, and which is configured to form a vapor phase of the refrigerant into microscopic bubbles to be dispersed into a liquid phase of the refrigerant, wherein an opening diameter at least on a discharge side of each through hole in the plurality of through hole portions is 1 mm or less.
9. The pressure reducing device for a cooling system according to claim 8, wherein each through hole in the plurality of through hole portions has an elongated opening having a width of 1 mm or less.
10. The pressure reducing device for a cooling system according to claim 8, wherein the microscopic bubble formation unit is disposed inside the pressure reducing valve.
11. The pressure reducing device for a cooling system according to claim 8, further comprising a horizontal pipe having a refrigerant flow path which connects the microscopic bubble formation unit and the heat exchanger horizontally and in a straight line.
12. A cooling system comprising: a compressor which compresses a refrigerant; a condenser disposed in a stage subsequent to the compressor and configured to liquefy at least a portion of the refrigerant; a heat exchanger disposed in a stage subsequent to the condenser and having a flow path through which the refrigerant flows; and a pressure reducing device for a cooling system according to claim 8.
13. A cooling system comprising: a compressor which compresses a refrigerant; a condenser disposed in a stage subsequent to the compressor and configured to liquefy at least a portion of the refrigerant; a heat exchanger disposed in a stage subsequent to the condenser and having a flow path through which the refrigerant flows; and a pressure reducing device for a cooling system according to claim 9.
14. A cooling system comprising: a compressor which compresses a refrigerant; a condenser disposed in a stage subsequent to the compressor and configured to liquefy at least a portion of the refrigerant; a heat exchanger disposed in a stage subsequent to the condenser and having a flow path through which the refrigerant flows; and a pressure reducing device for a cooling system according to claim 10.
15. A cooling system comprising: a compressor which compresses a refrigerant; a condenser disposed in a stage subsequent to the compressor and configured to liquefy at least a portion of the refrigerant; a heat exchanger disposed in a stage subsequent to the condenser and having a flow path through which the refrigerant flows; and a pressure reducing device for a cooling system according to claim 11.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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DESCRIPTION OF THE EMBODIMENTS
First Embodiment
[0031] A first embodiment of the present invention will be described.
[0032] As illustrated in
[0033] The compressor 2 compresses a refrigerant 40 (see
[0034] The condenser 3 liquefies the refrigerant 40 that has been compressed by the compressor 2 and sends it to the pressure reducing device 4. A configuration of the condenser 3 is not particularly limited.
[0035] The pressure reducing device 4 illustrated in
[0036] The pressure reducing valve 5 includes an inlet 6 connected to a pipe 31 connected to the condenser 3, an outlet 7 connected to a refrigerant pipe 32 connected to the heat exchanger 14, and a throttle portion 8.
[0037] The throttle portion 8 includes a cylinder 9, a piston 12, and an operating unit 13.
[0038] The cylinder 9 includes the microscopic bubble formation unit 20 for introducing the refrigerant 40 from the inlet 6 into the cylinder 9 and an outlet opening 11 through which the refrigerant 40 flows out from the cylinder 9 to the outlet 7.
[0039] As illustrated in
[0040] The through hole portions 22 have a flow path cross-sectional area smaller than a cross-sectional area of the inlet 6 of the pressure reducing valve 5 (see
[0041] The refrigerant 40 passing through the through hole portions 22 becomes a flow of a vapor-liquid mixed phase during the pressure reducing process due to a pressure difference in the refrigerant 40 between the outside of the cylinder 9 and the inside of the cylinder 9 illustrated in
[0042] In the present embodiment, when carbon dioxide is employed as the refrigerant 40, for example, when a supercritical liquid of carbon dioxide which is in a supercritical state in a state in which a difference of 20 atmospheres or more is generated between the inside and outside of the cylinder 9 passes through the through hole portions 22 of the microscopic bubble formation unit 20, it is possible to generate a bubble flow including bubbles having an average bubble diameter of 0.2 mm.
[0043] The piston 12 illustrated in
[0044] The operating unit 13 adjusts a position of the piston 12 in the cylinder 9 so that the refrigerant 40 flowing out from the outlet 7 to the outside of the pressure reducing valve 5 has a constant flow rate set in advance.
[0045] As illustrated in
[0046] The heat exchanger 14 of the present embodiment includes a first plate 15 having a plurality of first conduits 16 and a second plate 17 having a plurality of second conduits 18. The first plate 15 and the second plate 17 are alternately stacked. In the present embodiment, heat exchange is performed between the first plate 15 and the second plate 17.
[0047] An operation of the cooling system 1 of the present embodiment will be described.
[0048] In the operation of the cooling system 1 of the present embodiment illustrated in
[0049] As illustrated in
[0050] The refrigerant 40 after passing through the microscopic bubble formation unit 20 is in a state in which the microscopic bubbles 41a are dispersed into the liquid phase 42 of the refrigerant 40. The refrigerant 40 in which the microscopic bubbles 41a are dispersed is sent to the heat exchanger 14 illustrated in
[0051] Inside the heat exchanger 14 illustrated in
[0052] In the refrigerant 40 introduced into the second conduit 18, the vapor phase of the refrigerant 40 has become the microscopic bubbles 41a. Therefore, in the second conduit 18, the microscopic bubbles 41a are substantially evenly dispersed throughout the entire second conduit 18. As a result, since the vaporization of the refrigerant 40 occurs in all regions of the second conduit 18, a heat exchange efficiency becomes higher compared to a case in which only the vapor phase of the refrigerant 40 is introduced into a portion of the second conduit 18.
[0053] As described above, in the cooling system 1 and the pressure reducing device 4 of the present embodiment, the microscopic bubble formation unit 20 can disperse the vapor phase 41 of the refrigerant 40 into the liquid phase 42 as the microscopic bubbles 41a and send it to the heat exchanger 14 instead of separating the vapor phase 41 from the flow of a two-phase mixed phase of the refrigerant 40. Thus, it is possible to obtain the same heat exchange efficiency as that in the case of introducing only the liquid phase 42 of the refrigerant 40 into the heat exchanger 14, without needing to retrieve only the liquid phase 42 by providing a separator in a container shape having a certain volume for separating the refrigerant 40 into the vapor phase 41 and the liquid phase 42.
[0054] In the present embodiment, since the microscopic bubble formation unit 20 is disposed inside the flow path for the refrigerant 40 from the condenser 3 to the heat exchanger 14, particularly in the present embodiment, inside the pressure reducing valve 5, it is possible to reduce a size of the pressure reducing device 4 compared with the case in which the separator is provided. Therefore, it is also possible to reduce the overall size of the cooling system 1.
Second Embodiment
[0055] A second embodiment of the present invention will be described. Further, in the embodiment described below, components the same as the components disclosed in the first embodiment are designated by the same reference signs as in the first embodiment, and duplicated description and illustration thereof will be omitted.
[0056]
[0057] A cooling system 1A of the present embodiment illustrated in
[0058] The pressure reducing device 4A of the present embodiment includes a pressure reducing valve 5A and a microscopic bubble formation unit 20A.
[0059] In the present embodiment, a known configuration can be appropriately selected and employed for the pressure reducing valve 5A.
[0060] The microscopic bubble formation unit 20A of the present embodiment is disposed in a refrigerant pipe 32 connecting the pressure reducing valve 5A and a heat exchanger 14.
[0061] As illustrated in
[0062] The through hole portions 22A have an inner diameter of 1 mm or less as in the first embodiment. The through hole portions 22A serve as flow paths connecting an upstream side and a downstream side of the microscopic bubble formation unit 20A in the refrigerant pipe 32 in a state in which the microscopic bubble formation unit 20A is attached to the refrigerant pipe 32.
[0063] Also, a shape of an opening of the through hole portions 22A in the microscopic bubble formation unit 20A of the present embodiment may not be a circular opening. As another configuration example, as illustrated in
[0064] An operation of the cooling system 1A of the present embodiment will be described.
[0065] The microscopic bubble formation unit 20A of the pressure reducing device 4A of the cooling system 1A illustrated in
[0066] The refrigerant 40 passing through the pressure reducing valve 5A illustrated in
[0067] As described above, in this embodiment, as in the first embodiment, it is possible to obtain the same heat exchange efficiency as that in the case of introducing only the liquid phase 42 of the refrigerant 40 into the heat exchanger 14, without needing to retrieve only the liquid phase 42 by providing a separator.
[0068] Also, since a known pressure reducing valve 5 can be appropriately selected and employed in the present embodiment, production of the cooling system 1A is facilitated and a degree of freedom in designing the cooling system 1A is high.
Third Embodiment
[0069] A third embodiment of the present invention will be described.
[0070] A cooling system 1B of the present embodiment illustrated in
[0071] That is, in the present embodiment, regarding refrigerants pipes 32 on opposite sides of the microscopic bubble formation unit 20A, a pipe on the downstream side of the microscopic bubble formation unit 20A is straight.
[0072] The cooling system 1B of the present embodiment is installed so that a center line of the horizontal pipe 32A is horizontal when the cooling system 1B is installed. The inside of the horizontal pipe 32A which is a straight pipe extending horizontally serves as a refrigerant flow path through which a refrigerant 40 flows with microscopic bubbles 41a. Since stagnation of the refrigerant 40 cannot easily occur in the horizontal pipe 32A, growth of the microscopic bubbles 41a due to the stagnation of the refrigerant 40 is prevented. Thus, uneven flow of the refrigerant 40 in each flow path of the heat exchanger 14 due to a diameter of bubbles growing large can be prevented.
[0073] Also, in the present embodiment, a refrigerant pipe 32-1 upstream with respect to the microscopic bubble formation unit 20A may not be a straight pipe extending horizontally. When the refrigerant pipe 32-1 upstream with respect to the microscopic bubble formation unit 20A is not a straight pipe, the refrigerant 40 easily stagnates in a bent portion of the refrigerant pipe 32-1. When a vapor phase 41 of the refrigerant 40 stagnates in the portion in which the refrigerant 40 stagnates, a portion of the vapor phase 41 that has stagnated grows to a large bubble and may move toward the horizontal pipe 32A. In the present embodiment, since this bubble becomes the microscopic bubbles 41a due to the microscopic bubble formation unit 20A, large bubbles are prevented from being directly introduced into the heat exchanger 14. As a result, in the present embodiment, a degree of freedom in handling the refrigerant pipe 32-1 is high.
Examples
[0074] Examples of the present invention will be described.
[0075] In the present example, when an inner diameter of through hole portions of the microscopic bubble formation unit is 0.2 mm, 0.4 mm, 1.0 mm, and 1.8 mm (see
[0076] As illustrated in
INDUSTRIAL APPLICABILITY
[0077] The present invention can be applied to a cooling system or a gas pressure booster system using a refrigeration cycle.
BRIEF DESCRIPTION OF THE REFERENCE SYMBOLS
[0078] 1, 1A, 1B: Cooling system [0079] 2: Compressor [0080] 3: Condenser [0081] 4, 4A: Pressure reducing device [0082] 5, 5A: Pressure reducing valve [0083] 6: Inlet [0084] 7: Outlet [0085] 8: Throttle portion [0086] 9: Cylinder [0087] 11: Outlet opening [0088] 12: Piston [0089] 13: Operating unit [0090] 14: Heat exchanger [0091] 15: First plate [0092] 16: First conduit [0093] 17: Second plate [0094] 18: Second conduit [0095] 20, 20A: Microscopic bubble formation unit [0096] 21A: Frame body portion [0097] 22, 22A: Through hole portion [0098] 22B: Slit (Through hole portion, Elongated opening) [0099] 31: Pipe [0100] 32: Refrigerant pipe [0101] 32-1: Upstream portion of refrigerant pipe [0102] 32-2: Downstream portion of refrigerant pipe [0103] 32A: Horizontal pipe [0104] 33: Pipe [0105] 40: Refrigerant [0106] 41: Vapor phase of refrigerant [0107] 41a: Microscopic bubble of refrigerant [0108] 42: Liquid phase of refrigerant