FABRICATION METHOD OF A STACK OF ELECTRONIC DEVICES

Abstract

This method includes the following steps: a) providing a first structure successively including a substrate, an electronic device and a dielectric layer; b) providing a second structure successively including a substrate, an active layer, an intermediate layer, a first semiconducting layer and a porous second semiconducting layer; c) bonding the first and second structures by direct bonding between the dielectric layer and the porous second semiconducting layer; d) removing the substrate of the second structure so as to expose the active layer; e) adding dopants to the first semiconducting layer or to the active layer; f) irradiating the first semiconducting layer by a pulse laser so as to thermally activate the corresponding dopants.

Claims

1. Fabrication method of a stack of electronic devices, comprising the following steps: a) providing a first structure successively comprising a first substrate, a first electronic device, and a dielectric layer; b) providing a second structure successively comprising a second substrate, an active layer designed to form a second electronic device, an intermediate layer, a first semiconducting layer designed to form a ground plane, and a porous second semiconducting layer; c) bonding the first and second structures by direct bonding between the dielectric layer and the porous second semiconducting layer; d) removing the second substrate of the second structure so as to expose the active layer; e) adding dopants to the first semiconducting layer or the active layer; f) irradiating the first semiconducting layer or the active layer by a pulse laser so as to thermally activate the dopants.

2. Method according to claim 1, wherein the porous second semiconducting layer presents a free surface in step b), and wherein step b) comprises a step b.sub.1) consisting in forming a dielectric layer on said free surface, direct bonding being performed in step c) between the dielectric layer of the first structure and the dielectric layer formed in step b.sub.1).

3. Method according to claim 2, wherein the dielectric layer formed in step b.sub.1) is an oxide.

4. Method according to claim 1, wherein step b) is executed so that the porous second semiconducting layer presents a void ratio comprised between 20% and 80%.

5. Method according to claim 1, wherein the porous second semiconducting layer is made from porous silicon.

6. Method according to claim 1, wherein the porous second semiconducting layer presents a thickness comprised between 50 nm and 120 nm.

7. Method according to claim 1, wherein the second substrate of the second structure is made from semiconductor material.

8. Method according to claim 1, wherein the dielectric layer of the first structure is made from silicon dioxide.

9. Method according to claim 1, wherein the dielectric layer of the first structure presents a thickness of more than 60 nm.

10. Method according to claim 1, wherein the dopants added to the first semiconducting layer in step e) are selected from the group comprising B, In, P, and As.

11. Method according to claim 1, wherein the second structure provided in step b) comprises an etch stop layer inserted between the second substrate of the second structure and the active layer.

12. Method according to claim 11, wherein the etch stop layer is made from SiGe.

13. Method according to claim 1, wherein the intermediate layer provided in step b) is etched after step d) in selective manner relatively to the active layer and to the first semiconducting layer; and a buried oxide layer is formed instead of and in place of the etched intermediate layer.

14. Method according to claim 13, wherein the intermediate layer provided in step b) is made from SiGe.

15. Fabrication method of a stack of electronic devices, comprising the following successive steps: a) providing a first structure successively comprising a first substrate, a first electronic device, and a dielectric layer; b) providing a second structure successively comprising a second substrate, an active layer designed to form a second electronic device, an intermediate layer, a first semiconducting layer designed to form a ground plane, and a porous second semiconducting layer; c) bonding the first and second structures by direct bonding between the dielectric layer and the porous second semiconducting layer; d) removing the second substrate of the second structure so as to expose the active layer; e) adding dopants to the first semiconducting layer or the active layer; f) irradiating the first semiconducting layer or the active layer by a pulse laser so as to thermally activate the dopants.

16. Fabrication method of a stack of electronic devices, comprising the following successive steps: a) providing a first structure successively comprising a first substrate, a first electronic device, and a first dielectric layer; b) providing a second structure successively comprising a second substrate, an active layer designed to form a second electronic device, an intermediate layer, a first semiconducting layer designed to form a ground plane, and a porous second semiconducting layer presenting a free surface; b.sub.I) forming a second dielectric layer on said free surface; c) bonding the first and second structures by direct bonding between the first dielectric layer and the second dielectric layer; d) removing the second substrate of the second structure so as to expose the active layer; e) adding dopants to the first semiconducting layer or the active layer; f) irradiating the first semiconducting layer or the active layer by a pulse laser so as to thermally activate the dopants.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Other features and advantages will become apparent from the detailed description of different embodiments of the invention, the description being accompanied by examples and reference to the appended drawings.

[0037] FIG. 1 is a schematic cross-sectional view of a first structure provided for implementation of a method according to the invention.

[0038] FIGS. 2a to 2c are schematic cross-sectional views illustrating preparation of a second structure provided for implementation of a method according to the invention.

[0039] FIG. 3 is a schematic cross-sectional view illustrating bonding of the first and second structures.

[0040] FIGS. 4a to 4e are schematic cross-sectional views illustrating steps of a method according to the invention, prior to formation of a ground plane by thermal activation of the dopants.

[0041] FIG. 5 is a schematic cross-sectional view illustrating thermal activation of the dopants by a pulse laser.

[0042] FIG. 6 is a schematic cross-sectional view illustrating an electronic device of transistor type able to belong to a bottom level for a VLSI integration.

[0043] Parts that are identical or perform the same function will bear the same reference numerals for the different embodiments, for the sake of simplification.

[0044] FIGS. 7a to 7e are schematic cross-sectional views illustrating steps of a method according to the invention, with formation of a transistor and doping in the active layer.

DETAILED DESCRIPTION OF EMBODIMENTS

Definitions

[0045] What is meant by “semiconducting” is that the layer presents an electric conductivity at 300 K comprised between 10.sup.−8 S/cm and 10.sup.3S/cm. [0046] What is meant by “dielectric” is that the layer presents an electric conductivity at 300 K that is lower than 10.sup.−8 S/cm. [0047] What is meant by “direct bonding” is a spontaneous bonding resulting from two surfaces being placed in direct contact, i.e. in the absence of an additional element such as a glue, a wax or a brazing. The bonding is mainly the result of the Van der Waals forces resulting from the electronic interaction between the atoms or the molecules of the two surfaces, and of the hydrogen bonds on account of the surface preparations or of the covalent bonds established between the surfaces. Bonding by molecular adhesion is also referred to. [0048] What is meant by “void ratio” is the ratio between the volume of the pores of the layer and the total volume of the layer.

[0049] The object of the invention is to provide a fabrication method of a stack of electronic devices 11 comprising the following steps:

a) providing a first structure 1 successively comprising a substrate 10, an electronic device 11, and a dielectric layer 12;
b) providing a second structure 2 successively comprising a substrate 20, an active layer 21 designed to form an electronic device, an intermediate layer 22, a first semiconducting layer 23 designed to form a ground plane, and a porous second semiconducting layer 240;
c) bonding the first and second structures 1, 2 by direct bonding between the dielectric layer 12 and the porous second semiconducting layer 240;
d) removing the substrate 20 of the second structure 2 so as to expose the active layer 21;
e) adding dopants to the first semiconducting layer 23 or to the active layer 21;
f) irradiating the first semiconducting layer 23 or the active layer 21 by a pulse laser L so as to thermally activate the corresponding dopants.

First Structure

[0050] As illustrated in FIG. 1, the substrate 10 of the first structure 1 can comprise a support substrate 100 on which a dielectric layer 101 is formed. For non-restrictive example purposes, the support substrate 100 is made from silicon and the dielectric layer 101 is made from silicon dioxide. The dielectric layer 12 of the first structure 1 is preferentially made from silicon dioxide. The dielectric layer 12 of the first structure 1 advantageously presents a thickness of more than 60 nm, preferably more than 80 nm.

[0051] As illustrated in FIG. 6, the electronic device 11 of the first structure 1 can be a MOSFET transistor (MOSFET standing for metal-oxide-semiconductor field-effect transistor). Such an electronic device 11 can comprise: [0052] a source S, a drain D, and a gate G forming the electrodes of the transistor, [0053] contacts 114 extending from said electrodes S, D, G, [0054] a gate oxide layer 110 separating the channel C from the gate G, [0055] spacers 111 made from dielectric material (for example SiN), arranged on each side of the gate G to separate the gate G from the source S and drain D, in order to prevent short-circuiting, [0056] a nitride layer 112 and an oxide layer 113 extending above the gate G and spacers 111 so as to prevent short-circuiting of the contacts 114.

[0057] Such an electronic device 11 advantageously comprises interconnection levels (not shown) between the oxide layer 113 and dielectric layer 12.

Second Structure

[0058] As illustrated in FIGS. 2a to 2c, the substrate 20 of the second structure 2 can comprise a support substrate 200 on which an etch stop layer 201 is formed. The etch stop layer 201 is located between the support substrate 200 of the second structure 2 and the active layer 21. The etch stop layer 201 is preferentially made from SiGe, more preferentially from n-doped SiGe, with a dopant concentration preferentially lower than 10.sup.16 cm.sup.−3. The etch stop layer 201 preferentially presents a thickness comprised between 10 nm and 20 nm. The support substrate 200 of the second structure 2 is advantageously made from a semiconductor material, preferably silicon.

[0059] The active layer 21, intermediate layer 22 and first semiconducting layer 23 can be successively formed on the etch stop layer 201 by epitaxy. The active layer 21 is preferentially made from silicon.

[0060] The active layer 21 advantageously presents a thickness comprised between 5 nm and 40 nm, more preferentially comprised between 10 nm and 20 nm.

[0061] The intermediate layer 22 provided in step b) is preferentially made from SiGe, more preferentially from n-doped SiGe. The intermediate layer 22 preferentially presents a thickness comprised between 10 nm and 20 nm.

[0062] The first semiconducting layer 23 is preferentially made from silicon. The first semiconducting layer 23 preferentially presents a thickness comprised between 20 nm and 30 nm.

Porous Second Semiconducting Layer

[0063] Step b) is advantageously executed so that the porous second semiconducting layer 240 presents a void ratio comprised between 20% and 80%, preferentially comprised between 40% and 80%. The porous second semiconducting layer 240 is preferentially made from porous silicon, the porous silicon more preferentially being n-doped, with a dopant concentration preferentially higher than 5×10.sup.18 cm.sup.−3. The porous second semiconducting layer 240 preferentially presents a thickness comprised between 50 nm and 120 nm. The porous second semiconducting layer 240 presents a free surface 240a in step b) (as illustrated in FIG. 2b). As illustrated in FIG. 2c, the method advantageously comprises a step b.sub.1) consisting in forming a dielectric layer 241 on the free surface 240a of the porous second semiconducting layer 240. The dielectric layer 241 formed in step b.sub.1) is preferentially an oxide, more preferentially a thermal oxide.

[0064] As a non-restrictive example, the porous second semiconducting layer 240 can be formed from a crystalline silicon layer 24 (illustrated in FIG. 2a) epitaxied on the first semiconducting layer 23. To do this, the porous second semiconducting layer 240, made from porous silicon, can be obtained by electrochemical or photo-electrochemical means. More precisely, the second semiconducting layer 240 can be obtained by anodic dissolution of the crystalline silicon layer 24 in a solution comprising hydrofluoric acid (HF). The concentration of HF in the solution can typically vary between 1% and 50%. The current density can typically vary between a few mA/cm.sup.2 and a few A/cm.sup.2. As explained previously, the support substrate 200 of the second structure 2 is advantageously made from a semiconductor material, preferably silicon, in order to enable an electric contact allowing formation of the porous second semiconducting layer 240 by electrochemical or photo-electrochemical means. For example purposes, when the support substrate 200 of the second structure 2 is strongly p-doped or n-doped so that the resistivity of the support substrate 200 is less than or equal to a few tens of mΩ.Math.cm, it is then possible to form porous silicon directly by anodization of the crystalline silicon layer 24 without requiring illumination.

[0065] Examples of experimental conditions for formation of porous silicon are particularly described in the document H. Foll et al, “Formation and application of porous silicon”, Materials Science and Engineering, 39 (2002), 93-141.

[0066] Furthermore, the porous silicon can be divided into 3 categories according to the diameter of the pores: [0067] microporous for pore diameters of less than 2 nm, [0068] mesoporous for pore diameters comprised between 2 nm and 50 nm, [0069] macroporous for pore diameters of more than 50 nm.

[0070] The morphological characteristics of porous silicon (pore size, void ratio, thickness) depend on the experimental conditions, in particular the HF concentration, the current density, the nature of the support substrate 200 and the anodization time. In particular, it is possible to arrange suitable experimental conditions to form a porous second semiconducting layer 240 with a thickness strictly larger than 120 nm, and to then perform Chemical Mechanical Polishing (CMP) in order to achieve a thickness comprised between 50 nm and 120 nm. The use of microporous will be preferred when the porous second semiconducting layer 240 presents a thickness comprised between 50 nm and 120 nm.

Bonding

[0071] When a dielectric layer 241 is formed on the free surface 240a of the porous second semiconducting layer 240, direct bonding takes place in step c) between the dielectric layer 12 of the first structure 1 and the dielectric layer 241 formed in step b.sub.1).

[0072] Step c) can comprise a prior step consisting in planarizing the surface of the dielectric layer 12 of the first structure 1 and/or the surface of the dielectric layer 241 formed in step b.sub.1). This prior step is for example performed by means of Chemical Mechanical Polishing (CMP).

Removal of the Substrate of the Second Structure

[0073] Step d) preferentially comprises a grinding step of the support substrate 200 followed by an etching step of the remaining part of the support substrate 200, for example with a tetramethylammonium hydroxide (TMAH). Finally, the etch stop layer 201 is etched, preferentially by wet etching means.

Doping in the First Semiconducting Layer: Formation of the Ground Plane

[0074] The dopants which may be added to the first semiconducting layer 23 in step e) preferentially comprise: [0075] p-type dopants such as boron or indium, and [0076] n-type dopants such as phosphorus or arsenic.

[0077] The p-type and n-type dopants advantageously present a concentration comprised between 2×10.sup.18 cm.sup.−3 and 5×10.sup.18 cm.sup.−3.

[0078] Step e) can be executed during step b) by in situ doping when formation of the first semiconducting layer 23 takes place.

[0079] Step e) can also be executed by adding the dopants via the active layer 21 exposed in step d). Step e) is then preferentially executed by ion implantation. For example, for phosphorus, the dose is about 10.sup.13 cm.sup.−2, the energy is about 25-35 keV and the angle of attack is 15°. For boron, the dose is about 10.sup.13 cm.sup.−2, the energy is about 15 keV and the angle of attack is 15°. For indium, the dose is about 10.sup.13 cm.sup.−2, the energy is about 80 keV and the angle of attack is zero. Such parameters prevent amorphization of the active layer 21.

[0080] Advantageously, step e) previously comprises photolithography and etching steps 3 (cf. FIG. 4c) in the stack comprising the first semiconducting layer 23, intermediate layer 22, and active layer 21. The photolithography and etching steps 3 preferentially consist in forming first and second patterns within said stack. It is then possible to add p-type dopants in the first patterns, and n-type dopants in the second patterns. The ground plane, formed on completion of step f), then comprises p-doped areas and n-doped areas.

[0081] In addition, step e) advantageously previously comprises steps (illustrated in FIGS. 4d and 4e) consisting in removing the intermediate layer 22 provided in step b) and in replacing said intermediate layer 22 by a dielectric layer 4, preferentially a buried oxide layer. To do this, the intermediate layer 22 provided in step b) is etched after step d) in selective manner relatively to the active layer 21 and to the first semiconducting layer 23. Then a buried oxide layer 4 is formed instead of and in place of the intermediate layer 22 etched by means of a Silicon-On-Nothing (SON) technique.

Doping in the Active Layer

[0082] In case of doping in the active layer 21, step e) can comprise prior steps (illustrated in FIGS. 7a to 7e) consisting in forming a transistor from the active layer 21. The prior steps can thus consist in:

(i) performing shallow trench isolation STI, after step d), to form trenches in the stack comprising the first semiconducting layer 23, intermediate layer 22, and active layer 21, the STI trenches being formed at low temperature and filled with an oxide layer 40 (as illustrated in FIG. 7a);
(ii) forming gates G on the active layer 21 on each side of the shallow trench isolations (as illustrated in FIG. 7b), each gate G preferentially being formed on a gate oxide layer 110;
(iii) etching the oxide layer 40 so as to expose the intermediate layer 22 (as illustrated in FIG. 7b);
(iv) forming spacers 111 on the lateral edges of the gates G (as illustrated in FIG. 7c);
(v) removing the intermediate layer 22 provided in step b) and replacing said intermediate layer 22 by a dielectric layer 4, preferentially a buried oxide layer (as illustrated in FIG. 7d). To do this, the intermediate layer 22 provided in step b) is etched in selective manner relatively to the active layer 21 and to the first semiconducting layer 23. Then a buried oxide layer 4 is formed instead of and in place of the intermediate layer 22 etched by a Silicon-On-Nothing (SON) technique.
(vi) forming a source S and a drain D on each side of each gate G, preferably by epitaxy (as illustrated in FIG. 7e).

[0083] Then step e) consists in doping the areas of the active layer 21 formed by the sources S and drains D.

Thermal Activation of the Dopants

[0084] In case of doping in the first semiconducting layer 23, the fluence of the pulse laser L (for example from 0.1 to 1 J.Math.cm.sup.−2) and the pulse time (for example from 20 ns to 200 ns) are adjusted to the thicknesses of the active layer 21 and of the intermediate layer 22 in order to reach and thermally activate the dopants added to the first semiconducting layer 23 in step e). If the active layer 21 is covered by an oxide layer or if the thickness of the active layer 21 is increased, a possibility of adjusting the parameters is an increase of the fluence of the laser L.

[0085] In case of doping in the active layer 21, more precisely in the areas of the active layer 21 formed by the sources S and drains D, the fluence of the pulse laser L (for example from 0.1 to 1 J.Math.cm.sup.−2) and the pulse time (for example from 20 ns to 200 ns) are adjusted to the thickness of said areas of the active layer 21. If the active layer 21 is covered by an oxide layer or if the thickness of the active layer 21 is increased, a possibility of adjusting the parameters is an increase of the fluence of the laser L.

Interconnections, Stack Levels

[0086] Naturally, the first structure 1 can be provided with a set of electronic devices 11 extending on the substrate 10. The electronic devices are advantageously interconnected by metal lines.

[0087] The invention is not limited to the embodiments set out above. The person skilled in the art will be able to consider their technically operative combinations and to substitute equivalences for the latter.

[0088] The invention is thus not limited to two stack levels of electronic devices. It is quite possible to envisage at least a third stack level by reiterating the steps of the method after formation of the electronic device of the second structure from the active layer 21.

[0089] The invention is further not limited to a ground plane comprising first and second patterns respectively comprising p-type and n-type dopants The ground plane can also be uniform with a single dopant type; the photolithography and etching steps 3 will then have to be adapted accordingly.