Heating tile

Abstract

A heating tile designed to be easily installed using standard construction methods and materials while providing a radiant heating method that is compatible with both computer controlled systems as well as simple thermostat controls, can be repaired without major floor rework, does not produce a significant magnetic field, is protected against overheating due to excessive exposed surface insulation, and is water and contaminant resistant even if there is minor cracking of the tile.

Claims

1. A heating tile comprising: an inflammable tile of rigid design with a melting point in excess of 200 C and an electrical conductivity value greater than or equal to 1×10.sup.6 Ωm.

2. The heating tile of claim 1, wherein recessed channels have been designed into the tile to hold the heating elements, over temperature sensor and cold leads. The channels being laid out such that the two cold leads, and separately the heating elements, run side by side and no more than 5 mm ( 13/64 in) between channels with the channels routed to have the currents in the side by side channels running in opposite directions. The close spacing helps cancel out any magnetic fields which may be generated.

3. A resistive heating element of the appropriate wattage within a flexible water resistant covering.

4. The heating tile of claim 2, wherein the resistive heating element of claim 3 is placed such that it has the ability to slide within the channels of claim 2. This allows the tile to crack under normal usage without exposing the resistive heating element of claim 3 to contact with liquids or the encroachment of fine contaminants.

5. A heating tile of claim 4, wherein a heat sensing element is wired in series with the heating element of claim 4 to shut current flow off if the temperature of the tile exceeds a preset value, generally 40° C. (104° F.) for a human occupancy, other applications may require higher or lower temperatures depending on their application.

6. The heating tile of claim 2, wherein two electrically insulated cold leads are placed in their appropriate channels and adhered loosely to the tile.

7. The heating tile of claim 6, wherein the electrically resistive heating elements of claim 4 are attached to the cold leads of claim 6.

8. The heating tile of claim 6, wherein the cold leads are terminated with those on one end being of exposed electrically conductive material. The other end being of either a hard and fast connector or a slide connector, both of which shall have a water seal against exposing the bare electrically conductive material to liquids after installation.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Many aspects of the embodiment's can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the embodiment's. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.

[0029] FIG. 1 is a schematic view of one embodiment of a heated tiled floor. Although this embodiment shows squares, the invention applies to any shape or arrangement of tiles.

[0030] FIG. 2 is a schematic of a heating tile used in the heating floor in FIG. 1. The layout of one embodiment is shown. The exact placement of the components is dependent on the design of the tile but all components that are required are presented.

DETAILED DESCRIPTION OF THE INVENTION

[0031] The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.

[0032] Referring to FIG. 1, a heating floor according to one embodiment is shown. The heating floor includes a plurality of heating tiles (1) disposed side by side and may be of any shape the design requires. The plurality of heating tiles (1) are arranged to form a plurality of lines and rows between which there may be a gap filled with some form of grout or equivalent (9) or the heating tiles (1) may be placed next to each other with no deliberate gap (9). The plurality of heating tiles (1) can be fixed with the floor using the standard tile securing material methods and materials.

[0033] The plurality of heating tiles can be electrically interconnected in any fashion as appropriate for the installation. They may be connected by number of tiles, or they may be grouped according to the designers plans, or the control system limitations, but in no case to exceed the current rating of the cold leads (6) of the tiles.

[0034] Referring to FIG. 2, each heating tile (1) includes channels (2) inlaid with the heating elements (3) and the flexible covering (4) to allow minor cracking of the tile and shifting caused by normal floor deformations. In line with the heating element (3) there is an automatic reset over temperature cutout (5) to prevent the tile from getting to hot. This cutout would be activated by such things as storing large flat objects on the tile while the heat is on, or being covered by items placed on the floor such as pillows, blankets, throw rugs, etc.

[0035] The over temperature sensor may be located in different spots based on design criteria and tile shape and characteristics.

[0036] The cold leads (6,6a & 6b) are shown going straight through the tile, but can be designed to enter/leave any side, or even multiple sides if the design requires it. This allows the tiles to be designed so some may act as corner pieces or straight through pieces, or even multiple branch pieces as would best fit the application.

[0037] First end cold lead (6a) is the end which mates up to the second end (6b) cold lead and consists of enough bare electrically conductive material to make up with the connector on the second end (6b). The cold lead second end (6b) can be either a slip in connector or a mechanical connector using mechanical compression or soldering as the attachment method. The method used will depend on Electrical codes in the areas the tile is designed to be used in.

[0038] The slack take up chamber (8) will only be required when either types mechanical connections or solder sleeve connectors are used. This allows the connection to be made up and then any slack pushed back into the tile. On very thin tiles, this chamber may not be used and the leads may be countersunk into the flooring as determined by the installer. The exact size and shape of the take up chamber (8) will depend on the characteristics of the cold lead and the illustration is generic and not to scale.

[0039] Cold lead to heating element connection (7) is done at some point along the cold lead. The chamber may actually be the channel the cold leads (6) are running in or may accommodate both cold leads (6) within one chamber depending on the tile material and construction. It's exact placement will depend on the layout of the heating element (3) and were the most economical attachment point is.

[0040] Heating tile (1) provides a method of installation which requires minimum expertise outside of the normal expertise which would be required to install the tile without heat. It allows an installation in existing houses with little more effort than what would be required for a new floor overlay.

[0041] It is to be understood that the above-described embodiment's are intended to illustrate rather than limit the present disclosure. Variations may be made to the embodiment's without departing from the spirit of the disclosure as claimed. It is understood that any element of any one embodiment is considered to be disclosed to be incorporated with any other embodiment. The above-described embodiment's illustrate the scope of the disclosure but do not restrict the scope of the disclosure.