TEST ARRANGEMENT FOR TESTING ONE OR MORE DEVICES, TEST SUPPORT MODULE FOR SUPPORTING TESTING ONE OR MORE DEVICES, AND METHOD FOR OPERATING AN AUTOMATED TEST EQUIPMENT

Abstract

The disclosure describes a test support module for supporting a test of at least one device under test (DUT). The test support module comprises a plurality of pogo pins configured to establish a connection to at least one of a load board or a probe card of an automated test equipment and at least one electronic support component configured to support a test of at least one DUT. The at least one electronic support component is electrically coupled to the pogo pins. The test support module is configured to be inserted into a pogo block frame of the automated test equipment to position the pogo pins in an alignment position to contact at least one of the load board or the probe card. The testing innovation is more efficient in view of customization, life duration of the components, high signal performance, tester channel resources, re-usability, and costs.

Claims

1. A test support module comprising: a plurality of pogo pins configured to establish a connection to at least one of a load board or a probe card of an automated test equipment; and at least one electronic support component configured to support a test of at least one device under test (DUT), wherein the at least one electronic support component is electrically coupled to the pogo pins; wherein the test support module is configured to be inserted into a pogo block frame of the automated test equipment to position the pogo pins in an alignment position to contact at least one of the load board or the probe card.

2. The test support module of claim 1, wherein the plurality of pogo pins electrically couple the test support module to an external environment.

3. The test support module of claim 1, wherein the test support module is configured to avoid a direct coupling to a channel module of the automated test equipment while coupling to the load board.

4. The test support module of claim 1, further comprising a load board side and a probe card side, wherein one of the load board side or the probe card side electrically connects the test support module to an external environment.

5. The test support module of claim 1, wherein the test support module is configured to couple to an automated test equipment channel comprising a plurality of device under test pins.

6. The test support module of claim 1, wherein the at least one electronic support component is configured to be in a signal path between an automated test equipment channel and the at least one DUT.

7. The test support module of claim 1, further comprising at least one signal path input and at least one signal path output, wherein the at least one signal path input and a corresponding one of the at least one signal path output are coupled to a corresponding one of the pogo pins.

8. The test support module of claim 1, wherein at least one of the pogo pins is configured to receive one or more control signals to control a functionality of the at least one electronic support component.

9. The test support module of claim 1, further comprising a switch, a signal path input, and a signal path output, wherein the switch is in a signal path between the signal path input and the signal path output.

10. The test support module of claim 1, further comprising a multiplexer, a signal path input, and a signal path output, wherein the multiplexer is in a signal path between the signal path input and the signal path output.

11. The test support module of claim 1, further comprising a signal distributor, a signal path input, and a plurality of signal path outputs, wherein the signal distributor is in a signal path between the signal path input and the plurality of signal path outputs, wherein the signal distributor is configured to distribute a signal received from the signal path input to the plurality of signal path outputs.

12. The test support module of claim 1, further comprising a signal conditioner, a signal path input, and a signal path output, wherein the signal conditioner is in a signal path between the signal path input and the signal path output, wherein the signal conditioner is configured to manipulate a signal received from the signal path input.

13. The test support module of claim 1, further comprising a signal protocol converter, a first signal path port, and a second signal path port, wherein the signal protocol converter is in a signal path between the first signal path port and the second signal path port, and wherein the signal protocol converter is configured to perform a signal protocol conversion.

14. The test support module of claim 1, wherein the test support module is configured to be inserted into at least one of a plurality of pogo block positions of the pogo block frame of the automated test equipment to position the pogo pins in the alignment position to contact at least one of the load board or the probe card.

15. The test support module of claim 1, further comprising at least one printed circuit board which is parallel to an axis of at least one of the pogo pins, and wherein the at least one electronic support component is positioned on the at least one printed circuit board.

16. The test support module of claim 15, further comprising a housing, wherein the housing comprises a side configured to face at least one of the load board or the probe card, wherein the side comprises a plurality of holes through which the pogo pins extend and a mounting structure for mounting in a pogo block position of the pogo block frame, and wherein the at least one printed circuit board is positioned within the housing.

17. A test arrangement for testing at least one device under test (DUT) comprising: a pogo block frame comprising a plurality of pogo block positions; at least one channel module; at least one pogo block comprising a plurality of pogo pins and a plurality of cables for establishing a connection with the at least one channel module, wherein the at least one pogo block is arranged in at least one of the pogo block positions; and at least one test support module is arranged in at least one of the pogo block positions, wherein the at least one test support module comprises a plurality of pogo pins.

18. The test arrangement of claim 17, further comprising a load board, wherein the load board comprises a plurality of pogo pads, wherein the pogo pins of the at least one pogo block contact the load board, and wherein the pogo pins of the at least one test support module contact the load board.

19. The test arrangement of claim 18, further comprising a signal path which extends from the load board to the at least one test support module and from the at least one test support module to the load board.

20. The test arrangement of claim 18, further comprising a signal path which extends via the at least one test support module.

21. The test arrangement of claim 18, further comprising at least one of a signal path which extends from the at least one channel module to the at least one pogo block via one of the cables, from the at least one pogo block to a first pogo pad of the load board via a first pogo pin of the at least one pogo block, from the first pogo pad to a second pogo pad of the load board, from the second pogo pad to an input of the at least one test support module via a pogo pin of the at least one test support module, from an output of the at least one test support module to a third pogo pad of the load board via a pogo pin of the at least one test support module, and from the third pogo pad to a device under test, or a signal path which extends from the device under test to a fourth pogo pad of the load board, from the fourth pogo pad to an input of the at least one test support module, from the output of the at least one test support module to a fifth pogo pad of the load board, from the fifth pogo pad to a sixth pogo pad of the load board, from the sixth pogo pad to the at least one pogo block via a pogo pin of the at least one pogo block, and from the at least one pogo block to the at least one channel module via one of the cables.

22. The test arrangement of claim 18, wherein the pogo block positions are arranged in a peripheral area of the pogo block frame.

23. The test arrangement of claim 18, wherein the pogo block frame comprises at least one row of openings, wherein the openings are configured for an installation of the at least one pogo block and the at least one test support module in at least one of the pogo block positions of the pogo block frame.

24. The test arrangement of claim 18, wherein the pogo block frame, the at least one pogo block, and the at least one test support module are configured to enable the at least one pogo block and the at least one test support module to be interchangeably mountable in at least one of the pogo block positions.

25. The test arrangement of claim 18, wherein the load board comprises a central area, a peripheral area, and at least one device under test socket in the central area, and wherein the pogo pads of the load board are positioned in the peripheral area.

26. The test arrangement of claim 25, wherein the at least one test support module is arranged to contact the pogo pads of the load board in the peripheral area of the load board.

27. The test arrangement of claim 18, wherein the load board comprises a first and a second side which is opposite the first side, wherein the at least one test support module is configured to contact the pogo pads on the first side of the load board, and wherein the at least one device under test socket is positioned on the second side of the load board.

28. The test arrangement of claim 17, wherein the test arrangement is configured to be mounted on a test head of an automated test equipment.

29. The test arrangement of claim 28, wherein the test arrangement is configured to selectably couple an automated test equipment channel to at least one of a plurality of device under test pins or a support equipment, wherein the at least one test support module comprises at least one of a switch or a multiplexer configured to select to which one of the device under test pins the automated test equipment channel is to be coupled to, wherein the at least one test support module is configured to process a signal provided by the at least one DUT to obtain a processed signal and to forward the processed signal to at least one of the automated test equipment channel or to the support equipment.

30. The test arrangement of claim 29, wherein the test arrangement is configured to distribute a signal provided by the automated test equipment channel to at least one of a plurality of device under test pins, wherein the at least one test support module comprises a distribution circuit operable to distribute the signal.

31. A test arrangement for testing at least one device under test (DUT) comprising: a pogo block frame comprising a plurality of pogo block positions; at least one through-connection pogo block operable to establish a connection between opposite surfaces of the pogo block frame is arranged in at least one of the pogo block positions; and at least one test support module is arranged in at least one of the pogo block positions, wherein the at least one through-connection pogo block comprises a first side and a second side opposite the first side, wherein the first side comprises a first plurality of pogo pins, and wherein the second side comprises a second plurality of pogo pins, and wherein the at least one test support module comprises a plurality of pogo pins.

32. The test arrangement of claim 31, further comprising a load board, wherein the first plurality of pogo pins contact the load board, and wherein the plurality of pogo pins of the at least one test support module contact the load board.

33. The test arrangement of claim 32, further comprising a signal path which extends from the load board to the at least one test support module and from the at least one test support module to the load board.

34. The test arrangement of claim 31, further comprising a probe card, wherein the second plurality of pogo pins contact the probe card, and wherein the plurality of pogo pins of the at least one test support module contact the probe card.

35. The test arrangement of claim 34, further comprising a signal path which extends from the probe card to the at least one test support module and from the at least one test support module to the probe card.

36. The test arrangement of claim 31, further comprising a load board, a probe card, a first signal path, and a second signal path, wherein the first signal path extends from the load board to one of the at least one test support module and from one of the at least one test support module to the probe card, and wherein the second signal path extends from the probe card to one of the at least one test support module and from one of the at least one test support module to the load board.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0060] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments, together with the description, serve to explain the principles of the disclosure.

[0061] Embodiments of the present disclosure are set out below in the figures.

[0062] FIG. 1 shows a schematic view of signal routing between a pin electronic card and a load board according to a conventional apparatus.

[0063] FIG. 2 shows a schematic view of a test support module in accordance with an embodiment.

[0064] FIG. 3A shows a schematic top view of a test support module in accordance with an embodiment.

[0065] FIG. 3B shows a schematic front view of a test support module in accordance with an embodiment.

[0066] FIG. 3C shows a front view of a test support module in accordance with an embodiment.

[0067] FIGS. 4A-4C show a test support module with a housing in accordance with an embodiment in different states of assembly.

[0068] FIG. 4D shows a front view of a double housing in accordance with an embodiment.

[0069] FIGS. 5A-5B show test support modules in accordance with embodiments.

[0070] FIG. 5C shows a front view of a test support module in accordance with an embodiment.

[0071] FIG. 5D shows a block schematic representation of a functionality of a test support module in accordance with an embodiment.

[0072] FIG. 5E shows a schematic representation of a test scenario using a support module according to an embodiment of the disclosure.

[0073] FIG. 6A shows a top view of a test support module in accordance with an embodiment.

[0074] FIG. 6B shows a front view of a test support module in accordance with an embodiment.

[0075] FIG. 6C shows a schematic of a circuitry which can be implemented on a test support module in accordance with an embodiment.

[0076] FIG. 6D shows a schematic representation of a test scenario using a test support module according to an embodiment of the disclosure.

[0077] FIG. 7A shows a top view of a test support module in accordance with an embodiment.

[0078] FIG. 7B shows a block schematic diagram of a circuit which can be implemented on a test support module in accordance with an embodiment.

[0079] FIG. 7C shows a block schematic diagram of a circuit which can be implemented on a test support module in accordance with an embodiment.

[0080] FIG. 8A shows a top view of a test support module in accordance with an embodiment.

[0081] FIG. 8B shows a block schematic diagram of a circuit which can be implemented on a test support module in accordance with an embodiment.

[0082] FIG. 9A shows a circuit diagram of a test support module in accordance with an embodiment.

[0083] FIG. 9B shows a table illustrating a pin assignment of a test support module in accordance with an embodiment.

[0084] FIG. 9C shows a schematic of circuitry which can be implemented on a test support module in accordance with an embodiment.

[0085] FIG. 10 shows a test arrangement in accordance with an embodiment.

[0086] FIG. 11 shows a pogo block frame in accordance with an embodiment.

[0087] FIG. 12 shows a support structure for a load board in accordance with an embodiment.

[0088] FIG. 13A shows a test arrangement in accordance with an embodiment.

[0089] FIG. 13B shows a test arrangement in accordance with an embodiment.

[0090] FIG. 14 shows a test arrangement in accordance with an embodiment.

[0091] FIG. 15 shows a top view of a load board in accordance with an embodiment.

DETAILED DESCRIPTION

[0092] Reference will now be made in detail to embodiments, examples of which are illustrated in the accompanying drawings. While the disclosure will be described in conjunction with these embodiments, it should be understood that they are not intended to limit the disclosure to these embodiments. On the contrary, the disclosure is intended to cover alternatives, modifications, and equivalents, which may be included within the spirit and scope of the disclosure as defined by the appended claims. Furthermore, in the following detailed description, numerous specific details are set forth in order to provide a thorough understanding. However, it will be recognized by one of ordinary skill in the art that embodiments may be practiced without these specific details.

[0093] FIG. 2 shows a schematic view of how a signal can be routed using a test support module 200 in accordance with an embodiment.

[0094] The signal is routed from the load board into a pogo block 201 of the test support module, where support components (e.g., standardized test support components or custom, e.g., applications specific, support components) 202 are placed, Thus, the signal is routed from the load board via a pogo pin of the pogo block 201 towards an input of a support component. From there, e.g., from an output of a support component or of the support component, the signal is routed back to the load board, e.g., via another pin of the pogo block 201.

[0095] For example, no direct interaction, or no direct connection, which is not routed via the load board, between the test support module and the test system electronics or any cables is present in this embodiment.

[0096] However, it should be noted that the test support module 200 may optionally be supplemented by any of the features, functionalities and details disclosed herein, both individually or taken in combination.

[0097] FIGS. 3A and 3B show a schematic view of a test support module 300 in accordance with an embodiment.

[0098] FIG. 3A shows a top view of the test support module 300.

[0099] The test support module comprises N pogo pins 301.sub.1...N and M electronic support components 302.sub.1...M, which are configured to support testing of one or more devices under test in an automated test equipment.

[0100] For example, the pogo pins 301.sub.1...N are attached (e.g., soldered) to a Printed circuit board (PCB) 303.

[0101] The electronic support components 302.sub.1...M (e.g., one or more relays or one or more multiplexers, or one or more amplifiers) are, for example, arranged on or in the PCB (e.g., soldered onto the PCB or, for example, embedded in a PCB) and electrically coupled with the pogo pins 301.sub.1...N (e.g., via conductive traces of the PCB). One of the one or more electronic support components, for example electronic support component 302.sub.1 may be electrically coupled with one or more of pogo pins 301.sub.1...N, of one or more pogo blocks, as it is shown, for example, in FIG. 2. Pogo blocks are simple units (e.g., blocks of pogo pins) to interface pogo needles to cables using a PCB.

[0102] FIG. 3B shows a front view of the test support module 300 (e.g., a view onto a side of the support module which is intended to face a load board). Tips of the pogo pins (some or all of which are coupled to signal path inputs and /or signal path outputs and/or control connections and/or supply connections of the one or more support components) can be seen in the front view of FIG. 3B. The pogo pins are, for example, arranged in a pattern which fits corresponding pads on the load board. As an example, the pogo pins may be arranged on regular grid in the top view of FIG. 3A (wherein some grid positions may be free from pogo pins). In other words, there may, for example, be a plurality of substantially parallel rows of pogo pins. However, in some embodiments, there may be one row of pogo pins.

[0103] Moreover, it should be noted that the test support module is (mechanically) adapted to be inserted into one or more pogo block positions of a pogo block frame. For example, an outer shape of the support module may be chosen to fit into one or more pogo block locations. Also, the support module may comprise appropriate fastening means to fasten the support module in one or more pogo block locations. As an example, the support module may comprise holes or threaded holes (not shown) on its front side (e.g., the side shown in FIG. 3A) to fasten the support module in one or more pogo block locations (e.g., using a plurality of screws). Alternatively or in addition, the support module may comprise one or more snap-in components to snap-fix the support module in one or more pogo block locations.

[0104] The support module may be adapted to receive one or more input “test signals” (e.g., signals which are received from a signal generator, e.g., a pin electronics module, of an automated test equipment and should be forwarded to a device under test (DUT), and/or signals provided by a DUT which should be forwarded to a measurement unit, e.g., a pin electronics module or any other signal analyzer) from the load board via one or more of its pogo pins and may be adapted to output one or more output “test signals” (e.g., signals to be forwarded to the DUT, or signals to be forwarded to a measurement unit of the automated test equipment) to the load board via one or more of its pogo pins. In addition, the support module may be adapted to receive one or more control signals which determine a functionality (e.g., a switch state) of the one or more support components, and also one or more supply signals (like a supply voltage and a reference voltage).

[0105] The test support module may, generally speaking, impact the test signals passing through the support module, for example, by switching between different test signal paths or by providing an amplification or attenuation. Thus, the test support module may support a test of a DUT, for example by providing a switching functionality or a multiplexing functionality, or a signal conditioning functionality.

[0106] However, it should be noted that the test support module 300 may optionally be supplemented by any of the features, functionalities and details disclosed herein, both individually or taken in combination.

[0107] FIG. 3C shows a front view of a test support module in accordance with an embodiment.

[0108] FIG. 3C shows a front view of a test support module in a housing (e.g., a view onto a side of the support module which is intended to face a load board). Tips of the pogo pins (some or all of which are coupled to signal path inputs and /or signal path outputs and/or control connections and/or supply connections of the one or more support components) can be seen in the front view of the test support module.

[0109] However, it should be noted that the housing shown in FIG. 3C may optionally be supplemented by any of the features, functionalities and details disclosed herein, both individually or taken in combination.

[0110] FIGS. 4A-4D show implementations of a test support module 400 with a housing in accordance with an embodiment.

[0111] A top view of components of the test support module 400 is shown in FIG. 4A. The test support module 400 comprises at least one PCB 401 carrying pogo pins 402 and a housing 403. The at least one PCB 401 is formed in the same way, as the PCB shown in FIGS. 3A and 3B, and is adapted to be arranged in the housing 403, for example a plastic housing, or for example a metal housing, which fits into one or more pogo block positions. As shown in FIG. 4A, the test support module 400 includes two PCBs 401 carrying the pogo pins 402. However, this example is not limiting and the test support module 400 can comprise one PCB or more than two PCBs, for example arranged in one housing, in embodiments.

[0112] One or more electronic support components (e.g., one or more relays or one or more multiplexers, or one or more amplifiers) can be, for example, arranged on or in the PCB 401 (e.g., soldered onto the PCB or, for example, embedded in a PCB) and electrically coupled with the pogo pins 402 (e.g., via conductive traces of the PCB). The one of the one or more electronic support components may be electrically coupled with one or more of pogo pins 402, as it is shown, for example, in FIG. 2.

[0113] The at least one PCB 401 comprises two projections (or enlargings) 404 on two sides of the PCB 401 in a plane parallel to a plane of the pogo pins 402, the projections 404 comprise holes and can be used to fix the PCB 401.

[0114] As can be seen in FIG. 4A, the housing 403 also comprises side parts 405 projecting (or widening) in the plane of the pogo pins 402, the side parts 405 comprise holes 406, axes of which are parallel to the plane of the pogo pins 402. The holes 406 can be seen in FIG. 4B, which shows a rear view of the test support module 400. The holes 406 are adapted for fixation of the housing 403 of the test support module 400 in a test equipment (e.g., in one or more pogo block positions).

[0115] The pogo pins are, for example, arranged in a pattern which fits corresponding pads on the load board. As an example, the pogo pins may be arranged on regular grid, as can be seen in the top view of FIG. 4A (wherein some grid positions may be free from pogo pins). In other words, there may, for example, be a plurality of substantially parallel rows of pogo pins. However, in some embodiments, there may be one row of pogo pins on one PCB.

[0116] FIG. 4C shows a front view of a test support module which can comprise a single housing or multiple housings, e.g., a double housing, or e.g., a triple housing in accordance with an embodiment.

[0117] The housing 403 can comprise a different amount of holes 406, e.g., four holes 406, or e.g., less than four, or e.g., more than four holes 406, in embodiments.

[0118] However, it should be noted that the test support modules 400 may optionally be supplemented by any of the features, functionalities and details disclosed herein, both individually or taken in combination.

[0119] FIG. 4D shows a double housing of a test support module in accordance with an embodiment.

[0120] FIG. 4D shows a front view of the double housing (e.g., a view onto a side of the support module which is intended to face a load board). Tips of the pogo pins (some or all of which are coupled to signal path inputs and /or signal path outputs and/or control connections and/or supply connections of the one or more support components) can be seen in the front view of the double housing.

[0121] However, it should be noted that the double housing shown in FIG. 4D may optionally be supplemented by any of the features, functionalities and details disclosed herein, both individually or taken in combination.

[0122] FIGS. 5-8 show different embodiments of a test support module, where different electronic support components are arranged in the test support module, particularly on or in a printed circuit board of the test support module.

[0123] FIGS. 5A-5E show test support modules 500A to 500B in accordance with an embodiment.

[0124] FIG. 5A shows a top view of the test support module 500A comprising at least one PCB 501 carrying pogo pins 502. The structure of at least one PCB 501 is, for example, the same as of the PCB, shown in FIGS. 4A-4D.

[0125] At least one high speed instrument switch 508 is arranged in the printed circuit board 501 of the test support module 500A. The switch 508 is, for example, an RF mechanical relay 508, as shown in FIG. 5A.

[0126] FIG. 5B shows a top view of the test support module 500B comprising at least one PCB 501 carrying pogo pins 502. The structure of at least one PCB 500B is, for example, the same as of the PCB, shown in FIGS. 4A-4D.

[0127] At least one high speed instrument switch 509 is arranged in the printed circuit board 501 of the test support module 500B. The switch 509 is, for example, mechanical MEMs relay 509, as shown in FIG. 5B.

[0128] The embodiments shown in FIGS. 5A and 5B have, as an example, four switches 508, 509 arranged on or in the PCB of the test support modules 500A and 500B.

[0129] FIG. 5C shows a front view of the test support modules 500A and 500B showing tips of the pogo pins 502 and illustrating connecting connection of the pogo pins 502 to a signal path.

[0130] FIG. 5D shows a block schematic representation of a functionality of the test support modules 500A and 500B, which may serve as switches to selectably connect an input pogo pin to different output pogo pins, or vice versa.

[0131] FIG. 5E illustrates a schematic representation of a test scenario using the support module 500A or 500B.As can be seen in FIG. 5E, two channel modules 570, 572 of the automated test equipment are coupled to the load board interface (comprising a pogo block frame having a plurality of pogo block positions) via cables. These cables (not shown) end at pogo blocks 574, 576, which comprise pogo pins for contacting the load board. The pogo blocks for establishing the connection to the channel modules are inserted in a pogo block frame. Moreover, a test support module 580, which corresponds to the test support modules described therein, is also inserted in a pogo block position of the pogo block frame. A connection between pogo pins of the pogo blocks 574, 576 and pogo pins of the test support module is established via routes 578 on the load board when the load board is attached. Moreover, a connection between pogo pins of the test support module 580 and pins of a device under test 590 is also established via routes 582 on the load board (and further via a test socket, or a pogo tower and a probe card).

[0132] The embodiment shown in FIGS. 5A-5E protects relays from high temperatures, which could be in a load board, e.g., 160° C., saves the space in the load board, for example, for high multi-site sockets, provides an independence of the relays from the load board and applications, provides a high bandwidth and signal integrity.

[0133] However, it should be noted that the test support modules 500A and 500B may optionally be supplemented by any of the features, functionalities and details disclosed herein, both individually or taken in combination.

[0134] FIGS. 6A-6D show a test support module 600 in accordance with an embodiment.

[0135] FIG. 6A shows a top view of the test support module 600 comprising at least one PCB 601 carrying pogo pins 602. The structure of at least one PCB 601 is the same as of the PCB, shown in FIGS. 4A-4D.

[0136] The test support module 600 comprises at least one amplifier 610 arranged on or in the printed circuit board 601 of the test support module 600. FIG. 6A shows a top view of the test support module 600. The embodiment shown in FIG. 6A has, for example, seven amplifiers 610 arranged on or in the PCB (e.g., soldered onto the PCB or, for example, embedded in a PCB) of the test support module 600. FIG. 6B shows a front view of the test support module 600 showing tips of the pogo pins 602 and illustrating connection of pogo pins to a signal path.

[0137] FIG. 6C shows a schematic of a circuitry which can be implemented on the test support module 600.

[0138] FIG. 6D illustrates a schematic representation of a test scenario using the test support module 600. As can be seen in FIG. 6D, pins of a device under test 670 are coupled with input pins of a test support module 680/which may correspond to the test support module 600) via a route (trace) 672 on the load board. Moreover, output pins of the test support module 680 are coupled with pins of a pogo block 690 via traces (or routes) 682 on the load board. The pogo block is, for example, coupled with one or more external handling equipment 692 of the automated test equipment via cables 694. The pogo block 690 that is connected to cables that are going to the external equipment 692, e.g., handler. Both the test support module 680 and the pogo block 690 are inserted in pogo block positions of the pogo block frame.

[0139] The embodiment shown in FIGS. 6A-6D protects an amplifier from high temperatures, which could be in a load board, e.g., 160° C., saves the space in the load board, for example, for high multi-site sockets, provides an independence from the load board and applications, provides a high bandwidth and signal integrity.

[0140] However, it should be noted that the test support module 600 may optionally be supplemented by any of the features, functionalities and details disclosed herein, both individually or taken in combination.

[0141] FIGS. 7A-7C show a test support module 700 in accordance with an embodiment.

[0142] FIG. 7A shows a top view of the test support module 700 comprising at least one PCB 701 carrying pogo pins 702. The structure of at least one PCB 701 is, for example, the same as of the PCB, shown in FIGS. 4A-4D.

[0143] The test support module 700 comprises at least one multiplexer 711 arranged in the printed circuit board 701 of the test support module 700. FIG. 7A shows a top view of the test support module 700. As shown in FIG. 7A, for example, twelve multiplexers 711 are arranged in two rows of six multiplexers on or in the PCB 701 of the test support module 700. The multiplexers 711 can be DC, for example, channel multiplexers, e.g., ADG858.

[0144] FIG. 7B shows a block schematic diagram of a circuit which can be implemented on the test support module 700. A multiplexing functionality of a 4-to-1 multiplexer is presented. Such functionality saves, for example, 3x ATE channels.

[0145] FIG. 7C shows a block schematic diagram of a circuit which can be implemented on the test support module 700. A multiplexing functionality of a 2-to-1 multiplexer is shown. Such functionality saves, for example, 1x ATE channel.

[0146] The embodiment shown in FIGS. 7A-7C saves an amount of ATE channels to be used, saves the space in the load board, for example, for high multi-site sockets, provides an independence from the load board and applications.

[0147] However, it should be noted that the test support module 700 may optionally be supplemented by any of the features, functionalities and details disclosed herein, both individually or taken in combination.

[0148] FIGS. 8A-8B show a test support module 800 in accordance with an embodiment.

[0149] FIG. 8A shows a top view of the test support module 800 comprising at least one PCB 801 carrying pogo pins 802. The structure of at least one PCB 801 is the same as of the PCB, shown in FIGS. 4A-4D.

[0150] The test support module 800 comprises at least one protocol converter 812 arranged in the printed circuit board 801 of the test support module 800. FIG. 8A shows a top view of the test support module 800. As shown in FIG. 8A, for example, seven protocol converters 812 are arranged in the PCB 801 of the test support module 800. The protocol converters 812 can be, for example, USB to RGMII converters and can be, for example, also combined with JTAG switches.

[0151] FIG. 8B shows a block schematic diagram of a circuit which can be implemented on the test support module 800.

[0152] The embodiment shown in FIGS. 8A-8B provides an adapter to expand capability and adjust to application, whereas reducing complex LBA wiring and maintaining high signal performance. A load board space saving and a protection of components from high temperatures is also provided.

[0153] However, it should be noted that the test support module 800 may optionally be supplemented by any of the features, functionalities and details disclosed herein, both individually or taken in combination.

[0154] FIGS. 9A-9C show pogo pins arrangement and connection in a test support module 900 in accordance with an embodiment.

[0155] FIG. 9A shows diagram schematic front view of the test support module 900 in accordance with an embodiment. Tips of pogo pins are shown, which are arranged in a grid of, for example, 4 rows, each row having, for example, 17 pogo pins.

[0156] FIG. 9A schematically represents a front view of the test support module in accordance with an embodiment. Tips of pogo pins are shown to illustrate the pogo pins arrangement. The pogo pins are arranged in four rows of 17 pogo pins.

[0157] FIG. 9B shows a table illustrating a pin assignment of the test support module 900. As could be seen in FIG. 9B, the pogo pins are arranged on or in two PCBs, e.g., PCB1 and PCB2.

[0158] FIG. 9C shows a schematic of a circuitry which can be implemented on the test support module 900. FIG. 9C shows about 25% of the whole test support module, i.e., a circuitry connected to one row of the pogo pins. There are, for example, three multiplexers connected with the pogo pins 1-17. These multiplexers are correspondingly arranged on or in a PCB of the test support module 900 and electrically coupled with the pogo pins, as it is shown, for example, in FIG. 9C. Input signals of the multiplexers, control signals of the multiplexers and supply voltages are all provided via the pogo pins. Outputs of the multiplexers are also coupled with pogo pins.

[0159] The test support module 900, generally speaking, supports a test of a DUT, for example by providing a multiplexing functionality.

[0160] However, it should be noted that the test support module 900 may optionally be supplemented by any of the features, functionalities and details disclosed herein, both individually or taken in combination.

[0161] FIG. 10 shows a test arrangement 1000 in accordance with an embodiment.

[0162] The test arrangement 1000 comprises a pogo block frame 1001 which comprises a plurality of pogo blocks positions, or pogo block locations (e.g., cut-outs or openings adapted to receive pogo blocks or test support modules). One or more pogo blocks 1003 comprising pogo pins and cables for establishing connection with one or more channel modules, e.g., pin electronics cards, of the test arrangement 1000 are arranged in one or more of the pogo block positions. One or more test support modules 1002 according to any of the above described embodiments, for example, shown in FIGS. 3-9, are arranged in one or more of the pogo block positions. It should be noted that the test support modules 1002 are (mechanically) adapted to be inserted into one or more pogo block positions of the pogo block frame 1001. For example, an outer shape of the test support modules 1002 may be chosen to fit into the pogo block positions. Also, the test support modules 1002 may comprise appropriate fastening means to fasten the support modules in the pogo block positions. As an example, the test support modules 1002 may comprise holes or threaded holes (not shown) on its front side (e.g., the side shown in FIG. 3A) to fasten the test support modules 1002 in the pogo block positions (e.g., using a plurality of screws). Alternatively or in addition, the test support modules may comprise one or more snap-in components to snap-fix the support module in one or more pogo block locations.

[0163] The pogo pins of the one or more pogo blocks 1003 and the pogo pins of the one or more test support modules 1002 (when inserted into the pogo block frame) are arranged to contact a load board, e.g., when the load board is attached to the test arrangement. The pogo pins of the one or more pogo blocks 1003 and the pogo pins of the one or more test support modules 1002 are, for example, arranged in a pattern which fits corresponding pads on the load board.

[0164] However, it should be noted that the test arrangement 1000 may optionally be supplemented by any of the features, functionalities and details disclosed herein, both individually or taken in combination.

[0165] FIG. 11 shows a pogo block frame 1100 in accordance with an embodiment. The pogo block frame 1100 could be used, for example, in a test arrangement 1000 shown in FIG. 10.

[0166] The pogo block frame 1100 comprises a plurality of pogo blocks positions 1110, or pogo block locations. One or more pogo blocks 1120 comprising pogo pins and cables for establishing connection with one or more channel modules, e.g., pin electronics cards, of a test arrangement, for example the test arrangement 1000 shown in FIG. 10, are arranged in one or more of the pogo block positions 1110.

[0167] Upon using the pogo block frame 1100 in a test arrangement, one or more test support modules of a corresponding test arrangement according to any of the above described embodiments, for example, shown in FIGS. 3-9, are arranged in one or more of the pogo block positions 1110.

[0168] The pogo pins of the one or more pogo blocks 1120 and the pogo pins of the one or more test support modules are arranged to contact a load board, e.g., when the load board is attached to the test arrangement.

[0169] The one or more pogo blocks 1120 are, for example, grouped in groups of 8 pogo blocks.

[0170] The one or more pogo blocks 1120 are, for example, arranged in a peripheral area of the pogo block frame 1100. The one or more pogo blocks 1120 are arranged, for example, in several rows along edges of the pogo block frame 1100. As shown in FIG. 11, the pogo blocks 1120 are, for example, arranged in 8 rows along a long side of the pogo block frame 1100. The pogo blocks 1120 are, for example, arranged in 16 columns along a short side of the pogo block frame 1100, 8 columns in a first peripheral area of the short side and 8 columns in a second peripheral are of the short side.

[0171] The pogo block frame has an application space 1130 in a central area. The application space is free from the one or more pogo blocks 1120. The application space is arranged opposite to a corresponding central area of the load board, e.g., when the load board is attached to the test arrangement.

[0172] However, it should be noted that the pogo block frame 1100 may optionally be supplemented by any of the features, functionalities and details disclosed herein, both individually or taken in combination.

[0173] FIG. 12 shows a support structure 1200, e.g., a stiffener, for a load board in accordance with an embodiment.

[0174] The support structure 1200 is implemented as a frame, for example as a metal frame, e.g., of a rectangular form, comprising longitudinal and transverse bars, or ribs, which form a closed external contour of the support structure 1200. The external contour of the support structure 1200 has a rectangular form.

[0175] The support structure 1200 is divided into the sections 1210, e.g., 8 sections, or e.g., 4 sections, or e.g., 2 section, or e.g., 1 section, any other amount of sections, to correspond to the structure of the pogo block frame in order to align the pogo pin blocks with corresponding sockets (or pads) on or in the load board. A large central section 1220 that is formed in a central part of the support structure 1200 corresponds to an application space of the pogo block frame and/or the load board.

[0176] A load board to be installed in a test arrangement is arranged on the support structure 1200. The support structure 1200 comprises handles 1260, e.g., metal handles, used to easily install or remove a load board mounted on the support structure 1200 on a test arrangement.

[0177] Test support modules, e.g., the test support modules shown in FIGS. 3-9 fit into the sections 1210 of the support structure 1200. For example, front portions of the test support modules (and also of pogo blocks) (e.g., portions equipped with pogo pins) may extent into the sections 1210 to contact the load board when the support structure 1200 approximates the pogo block frame. The test support modules are arranged movable up and down (e.g., together with a pogo block frame carrying the test support modules and further pogo blocks), e.g., movable up to connect to a load board fixed on the support structure 1200, upon arranging the support structure 1200 with the load board mounted on it on a test arrangement, e.g., a test module, e.g., as shown in FIG. 10.

[0178] However, it should be noted that the support structure 1200 may optionally be supplemented by any of the features, functionalities and details disclosed herein, both individually or taken in combination.

[0179] FIGS. 13A and 13B shows a test arrangement 1300 in accordance with an embodiment.

[0180] The test arrangement 1300 comprises a pogo block frame 1301 which comprises a plurality of pogo blocks positions 1302, or pogo block locations. The pogo block frame may, for example, be mounted on a test head of an automated test equipment (wherein the channel modules are arranged within said test head). One or more pogo blocks 1303 are arranged in one or more of the pogo block positions 1302. It should be noted that test support modules, for example the test support modules according to any of the above described embodiments, for example, shown in FIGS. 3-9, are (mechanically) adapted to be inserted into one or more pogo block positions 1302 of the pogo block frame 1301.

[0181] The pogo pins of the test support modules are arranged to contact a load board 1304, when the load board 1304 is attached to the test arrangement. The pogo pins of the test support modules are, for example, arranged in a pattern which fits corresponding pads on the load board 1304.

[0182] The load board 1304 comprises a plurality of blocks 1305 of pogo pads in a peripheral area of the load board 1304, e.g., on a second side of the load board 1304 which is opposite to the first side of the load board 1304 (wherein e.g., a central area of the load board 1304 is free from pogo pads).

[0183] The load board may have different amount of blocks 1305 of pogo pads corresponding to pogo pin blocks. For example, two, or e.g., four, or e.g., eight groups of the blocks 1305 of pogo pads could be arranged symmetrically along at least one of the longitudinal peripheral areas of the load board 1304.

[0184] A support structure 1310 having the load board 1304 mounted on it is also shown in FIG. 17B. The support structure 1310 could be, for example, as one shown in FIG. 12.

[0185] However, it should be noted that the test arrangement 1300 may optionally be supplemented by any of the features, functionalities and details disclosed herein, both individually or taken in combination.

[0186] FIG. 14 shows a test arrangement 1400 in accordance with an embodiment.

[0187] FIG. 14 shows a 3D view of a disassembled test arrangement 1400.

[0188] The test arrangement 1400 comprises a pogo block frame 1410, e.g., formed as a pogo tower, for establishing a connection between a load board 1420, e.g., a general purpose DUT Board, arranged, e.g., fixed, in a support structure 1430, e.g., a DUT Board Stiffener, and a probe card 1440. The probe card 1440 is arranged, e.g., fixed, in a probe card support structure 1450, e.g., Probe Card Stiffener, which is inserted in a Prober Head plate 1470.

[0189] The pogo block frame 1410 comprises a plurality of pogo block positions, e.g., formed as sectors of a circular ring, or as pogo tower segments. Through-connection pogo blocks for establishing a connection between opposite surfaces of the pogo block frame 1410 are arranged in one or more of the pogo block positions. Moreover, one or more test support modules are arranged in one or more of the pogo block positions.

[0190] The pogo block frame 1410 has a cylindrical form and comprises a cylindrical through cutout in a central part. The pogo block positions are arranged in a peripheral area of the pogo block frame 1410.

[0191] The pogo block frame 1410 comprises a plurality of pogo block positions 1480, e.g., formed as sectors of a circular ring, or as pogo tower segments. Through-connection pogo blocks for establishing a connection between opposite surfaces of the pogo block frame 1410 are arranged in one or more of the pogo block positions 1480. Moreover, one or more test support modules are arranged in one or more of the pogo block positions 1480.

[0192] The segment 1480 may, for example comprise the functionality of a test support module, having pogo pins on one side. However, the test support module may, in this case, have the same shape like a through connection pogo module.

[0193] Pogo pins at a first side of the one or more through-connection pogo blocks are arranged to contact the load board 1420, and pogo pins at a second side of the one or more through-connection pogo blocks are arranged to contact the probe card 1450.

[0194] However, it should be noted that the test arrangement 1400 may optionally be supplemented by any of the features, functionalities and details disclosed herein, both individually or taken in combination.

[0195] FIG. 15 shows a top view of a load board 1500 in accordance with an embodiment.

[0196] The load board 1500 is fixed in a support structure 1510. The support structure could be, for example, the same as shown in FIG. 12.

[0197] The load board 1500 comprises a plurality of blocks 1505 of pogo pads in a peripheral area of the load board (wherein e.g., a central area of the load board is free from pogo pads).

[0198] The support structure 1510 is implemented as a frame, for example as a metal frame. Pogo pins of one or more test support modules (not shown) are, for example, arranged in a pattern which fits corresponding pads on the load board 1510.

[0199] The support structure 1510 comprises fastening means 1540, e.g., screws, or alternative fastening means, used to removably attach the support structure 1510 with the load board 1500 mounted on it to the test arrangement.

[0200] The load board 1500 can be, for example, installed in a test arrangement as shown in FIGS. 10, 13, and 14.

[0201] However, it should be noted that the load board 1500 may optionally be supplemented by any of the features, functionalities and details disclosed herein, both individually or taken in combination.

[0202] Embodiments according to the disclosures may implement one or more of the following advantages. Embodiments according to the disclosures create a concept which allows application engineers to develop simple circuits in the field without relying on factory generated product, and/or saves load board space, and/or protects the electronic components from destruction due to high temperatures, and/or increases tester channel resources and signal performance. Embodiments according to the disclosures create a concept, which is more efficient in view of customization, and/or life duration of the components, and/or high signal performance and/or tester channel resources, and/or re-usability and/or the costs.

[0203] Although some aspects are described in the context of an apparatus, it is clear that these aspects also represent a description of the corresponding method, where a block or device corresponds to a method step or a feature of a method step. Analogously, aspects described in the context of a method step also represent a description of a corresponding block or item or feature of a corresponding apparatus. Some or all of the method steps may be executed by (or using) a hardware apparatus, like for example, a microprocessor, a programmable computer or an electronic circuit. In some embodiments, one or more of the most important method steps may be executed by such an apparatus.

[0204] The herein described embodiments are merely illustrative for the principles of the present disclosure. It is understood that modifications and variations of the arrangements and the details described herein will be apparent to others skilled in the art. It is the intent, therefore, to be limited by the scope of the Claims appended hereto and their equivalents and not by the specific details presented by way of description and explanation of the embodiments herein.

[0205] The foregoing descriptions of specific embodiments have been presented for purposes of illustration and description. They are not intended to be exhaustive or to limit the disclosure to the precise forms disclosed, and many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the disclosure and its practical application, to thereby enable others skilled in the art to best utilize the disclosure and various embodiments with various modifications as are suited to the particular use contemplated. It is intended that the scope of the disclosure be defined by the Claims appended hereto and their equivalents.