TOOL ASSEMBLY FOR MANUFACTURING PARTS AND A METHOD OF PRODUCING A TOOL ASSEMBLY
20230182348 ยท 2023-06-15
Inventors
- Nirup Nagabandi (Pflugerville, TX, US)
- Luke Johnson (Austin, TX, US)
- Kevin Holder (Pflugerville, TX, US)
- Elisa Teipel (Pflugerville, TX, US)
- Thomas Colin Mulholland (Austin, TX, US)
Cpc classification
B29C35/02
PERFORMING OPERATIONS; TRANSPORTING
B33Y80/00
PERFORMING OPERATIONS; TRANSPORTING
B29C2049/4879
PERFORMING OPERATIONS; TRANSPORTING
B29C33/3842
PERFORMING OPERATIONS; TRANSPORTING
B29C49/4823
PERFORMING OPERATIONS; TRANSPORTING
B29C49/48185
PERFORMING OPERATIONS; TRANSPORTING
International classification
B29C33/38
PERFORMING OPERATIONS; TRANSPORTING
Abstract
A tool assembly and a method for manufacturing and sealing a tool assembly for manufacturing an article includes building a tool assembly using additive manufacturing or 3D printing processes.
Claims
1. A method comprising: receiving a tool assembly including a plurality of layers defining at least one part-cavity and plurality of cooling channels; pouring sealant into the plurality of cooling channels; pressurizing the sealant to a pressure for a pressurization period; and applying a centrifugal force to the tool assembly to remove excess sealant from the tool assembly, wherein the sealant extends between the plurality of layers.
2. The method as recited in claim 1, further comprising: heating the tool assembly in an oven at approximately seventy degrees Celsius for approximately four hours.
3. The method as recited in claim 2, further comprising: pouring the sealant into the tool assembly while the tool assembly is at or near seventy degrees Celsius.
4. The method as recited in claim 3, wherein the sealant is pressurized to a pressure ranging from approximately sixty pounds per square inch to approximately one hundred pounds per square inch.
5. The method as recited in claim 4, wherein the pressurization period comprises at least thirty seconds.
6. The method as recited in claim 4, wherein the pressurization period comprises at least sixty seconds.
7. The method as recited in claim 3, wherein the sealant is pressurized to at least one hundred and fifty pounds per square inch for a pressurization period of at least sixty seconds.
8. The method as recited in claim 7, wherein the tool assembly is rotated at a rotational velocity between approximately seventy-five revolutions per minute up to approximately one hundred and twenty-five revolutions per minute for at least three minutes.
9. The method as recited in claim 1, wherein the sealant comprises a two-part epoxy and flowable ceramic material.
10. A method comprising: receiving a tool assembly including a plurality of layers defining at least one part-cavity and plurality of cooling channels; pouring sealant into the plurality of cooling channels; pressurizing the sealant to a pressure for a pressurization period; and applying a centrifugal force to the tool assembly to remove excess sealant from the tool assembly at a rotational velocity between approximately seventy-five revolutions per minute up to approximately one hundred and twenty-five revolutions per minute for at least three minutes, wherein the sealant extends between the plurality of layers.
11. The method as recited in claim 10, further comprising: heating the tool assembly in an oven at approximately seventy degrees Celsius for approximately four hours.
12. The method as recited in claim 11, further comprising: pouring the sealant into the tool assembly while the tool assembly is at or near seventy degrees Celsius.
13. The method as recited in claim 12, wherein the sealant is pressurized to a pressure ranging from approximately sixty pounds per square inch to approximately one hundred pounds per square inch.
14. The method as recited in claim 13, wherein the pressurization period comprises at least thirty seconds.
15. The method as recited in claim 13, wherein the pressurization period comprises at least sixty seconds.
16. The method as recited in claim 12, wherein the sealant is pressurized to at least one hundred and fifty pounds per square inch for a pressurization period of at least sixty seconds.
17. The method as recited in claim 10, wherein the sealant comprises a two-part epoxy and flowable ceramic material.
18. A tool assembly, comprising: an upper half defining at least one part cavity and a plurality of cooling channels; and a lower half defining at least one part cavity and a plurality of cooling channels, wherein each cooling channel of the plurality of cooling channels defines a surface that includes a pressurized and cured sealant extending between one or more layers and that coats the surface.
19. The tool assembly of claim 18, wherein the sealant comprises a two-part high temperature cured epoxy.
20. The tool assembly of claim 18, wherein the plurality of cooling channels are configured to connect to a temperature control system.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0021] The drawings described herein are for illustration purposes only and are not intended to limit the scope of the present disclosure in any way.
[0022]
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DETAILED DESCRIPTION
[0031] The following description is merely exemplary in nature and is not intended to limit the present disclosure, application, or uses.
[0032] Referring now to
[0033] Referring now to
[0034] Referring now to
[0035] Referring to
[0036] Referring to
[0037] Referring to
[0038] The method 100 includes a first step 102 of making a CAD model of surfaces of a tool assembly such as the tool assembly 34. The CAD model may be created by using a surface scanning tool that uses a laser measuring device to convert the surface of a solid master part model into digital surface data. The CAD model may also be created partially from a CAD model of a desired part. Once the CAD model of the surface or surfaces of the tool assembly is created, a second step 104 adds features to the surface data including but not limited to tool design features such as parting surfaces, cooling channels, ejection pin holes, vent holes, and injection passages, thereby creating a CAD model of the tool assembly.
[0039] Next, a third step 106 uses a conversion or slicing software and generates a printing path of the CAD model of the tool assembly and transfers the printing path to a 3D printer. In a fourth step 108 a solid model of the tool assembly is printed using a 3D printer. In some applications, the 3D printing process includes using a high temperature, high performance thermoplastic filament that produces a high strength printed part capable of sustaining high stresses and high temperature manufacturing processes. Other 3D printing materials and processes intended to increase the strength and durability of the solid model of the tool assembly may also be used without departing from the scope of the present disclosure.
[0040] Following generation of a G-Code, in a fifth step 110 a G-Code is optimized using a programming script such as but not limited to, a python script, to optimize multiple items, for example a minimum or a least amount of travel moves is developed. In a sixth step 112 a single seam line of the tool assembly is identified and optimized. In a seventh step 114 a plurality of varying temperatures of the tool assembly are optimized based on infill of printed parts versus outlines of the printed parts. The above optimizations are performed to obtain a best finish of the 3D printed part made using the tool assembly and to obtain a highest strength of the 3D printed part.
[0041] In an eighth step 116 the tool assembly is heated in an oven at approximately 70 degrees C. for approximately 4 hours, which allows the tool assembly to rid thermally induced mechanical stresses and to prevent formation of further voids, gaps and pores. The tool assembly is then taken out of the oven.
[0042] In a ninth step 118 while the tool assembly is still at or near oven temperature a sealant is poured into any cooling channels such as the cooling channels 20, 38 with the elevated temperature of the tool assembly 34 allowing the sealant to begin curing as quickly as the sealant comes into contact with surfaces inside the tool cooling channels 38. Rapid curing also allows the sealant proximate to the tool cooling channel surfaces such as surfaces described in reference to
[0043] In a tenth step 120 the sealant is pressurized to force the sealant into gaps or crevices defining voids of the cooling channel walls. In particular, the cooling channels 38 are filled with the sealant which is pressurized to a pressure ranging between approximately 60 psi up to approximately 100 psi for a pressurization period of 30 seconds or more and preferably at least 60 seconds. According to several aspects, the pressure applied to the cooling channels 38 may be approximately 150 psi for approximately 60 seconds to force the sealant to flow into the gaps within the cooling channels 38 to fill the gaps and the cooling channels 38 more completely.
[0044] After the pressurization period is completed and the pressure on the sealant is released, in an eleventh step 122 a centrifugal force is applied to the tool assembly to remove excess sealant from the tool assembly. According to several aspects the tool is placed proximate to a center of the spin table 60 described in reference to
[0045] The residual heat maintained in the tool assembly 34 during the spinning step following removal from the oven helps to retain the sealant captured in the gaps and on the cooling channel surfaces of the cooling channels 38 due to increased viscosity of the sealant at the elevated tool assembly temperature. The increased viscosity sealant is thereby allowed to better bind to the tool assembly 34.
[0046] Referring to
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[0048] The processor 202 provides processing functionality for the computing device 200 and may include any number of processors, micro-controllers, or other processing systems, and resident or external memory for storing data and other information accessed or generated by the computing device 200. The processor 202 may execute one or more software programs which implement techniques described herein. The processor 202 is not limited by the materials from which it is formed or the processing mechanisms employed therein and, as such, may be implemented via semiconductor(s) and/or transistors (e.g., electronic integrated circuits (ICs)), and so forth.
[0049] The memory 204 is an example of tangible computer-readable media that provides storage functionality to store various data associated with the operation of the computing device 200, such as the software program and code segments mentioned above, or other data to instruct the processor 202 and other elements of the computing device 200 to perform the steps described herein. Although a single memory 204 is shown, a wide variety of types and combinations of memory may be employed. The memory 204 may be integral with the processor 202, stand-alone memory, or a combination of both. The memory may include, for example, removable and non-removable memory elements such as RAM, ROM, Flash (e.g., SD Card, mini-SD card, micro-SD Card), magnetic, optical, USB memory devices, and so forth.
[0050] The communication module 206 provides functionality to enable the computing device 200 to communicate with one or more communication networks. In various implementations, the communication module 206 may be representative of a variety of communication components and functionality including, but not limited to: one or more antennas; a browser; a transmitter and/or receiver (e.g., radio frequency circuitry); a wireless radio; data ports; software interfaces and drivers; networking interfaces; data processing components; and so forth.
[0051] The computing device 200 can be communicatively connected to a surface scanning tool 208 and a 3D printer 210. In some example implementations, the computing device 200 can receive data representing a CAD model from another computing device via the one or more communication networks.
[0052] The description of the present disclosure is merely exemplary in nature and variations that do not depart from the gist of the present disclosure are intended to be within the scope of the present disclosure. Such variations are not to be regarded as a departure from the spirit and scope of the present disclosure.