LIGHT GUIDING DEVICE FOR APPLYING TO SILICON PHOTONICS STRUCTURE
20230185036 · 2023-06-15
Inventors
Cpc classification
H04B10/801
ELECTRICITY
H04B10/43
ELECTRICITY
International classification
Abstract
A light guiding device for applying to silicon photonics structure is provided. The light guiding device includes an optical transceiver and a reflective structure. The reflective structure is disposed on the optical transceiver. The reflective structure has a reflective surface facing the optical transceiver, and the reflective surface is used for reflecting at least one light transmitted between the optical transceiver and a waveguide structure of the silicon photonics structure.
Claims
1. A light guide device for applying to a silicon photonics structure, comprising: an optical transceiver; and a reflective structure disposed on the optical transceiver, wherein the reflective structure has a reflective surface facing the optical transceiver, and the reflective surface is configured to reflect at least one light transmitted between the optical transceiver and a waveguide structure of the silicon photonics structure.
2. The light guide device according to claim 1, further comprising a positioning platform; wherein the optical transceiver is connected to the positioning platform, and the optical transceiver is configured to move in three dimensions through the positioning platform.
3. The light guide device according to claim 1, wherein the silicon photonics structure further includes a silicon substrate; wherein the waveguide structure is disposed in the silicon substrate, and a slot is formed on an upper surface of the silicon substrate; wherein the reflective structure is configured to extend into the slot, so that the reflective surface faces the waveguide structure.
4. The light guide device according to claim 3, wherein, when the reflective structure is configured to extend into the slot, a distance between a bottom surface of the reflective structure and a bottom of the slot is smaller than a distance between the waveguide structure and the bottom of the slot.
5. The light guide device according to claim 1, wherein the reflective surface is a curved surface in a concave shape.
6. The light guide device according to claim 5, wherein the curved surface is a spherical surface.
7. A light guide device for applying to a silicon photonics structure, comprising: an optical transceiver; a reflective structure having a reflective surface facing the optical transceiver, wherein the reflective surface is configured to reflect at least one light transmitted between the optical transceiver and a waveguide structure of the silicon photonics structure; and a positioning platform configured to connect to the optical transceiver and the reflective structure, wherein the optical transceiver and the reflective structure are configured to move in three dimensions and adjust a relative position of each other through the positioning platform.
8. The light guide device according to claim 7, wherein the silicon photonics structure further includes a silicon substrate; wherein the waveguide structure is disposed in the silicon substrate, and a slot is formed on an upper surface of the silicon substrate; wherein the reflective structure is configured to extend into the slot, so that the reflective surface faces the waveguide structure.
9. The light guide device according to claim 8, wherein, when the reflective structure is configured to extend into the slot, a distance between a bottom surface of the reflective structure and a bottom of the slot is smaller than a distance between the waveguide structure and the bottom of the slot.
10. The light guide device according to claim 7, wherein the reflective surface is a curved surface in a concave shape.
11. The light guide device according to claim 10, wherein the curved surface is a spherical surface.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0022] The described embodiments may be better understood by reference to the following description and the accompanying drawings, in which:
[0023]
[0024]
[0025]
DETAILED DESCRIPTION OF THE EXEMPLARY EMBODIMENTS
[0026] The present disclosure is more particularly described in the following examples that are intended as illustrative only since numerous modifications and variations therein will be apparent to those skilled in the art. Like numbers in the drawings indicate like components throughout the views. As used in the description herein and throughout the claims that follow, unless the context clearly dictates otherwise, the meaning of “a”, “an”, and “the” includes plural reference, and the meaning of “in” includes “in” and “on”. Titles or subtitles can be used herein for the convenience of a reader, which shall have no influence on the scope of the present disclosure.
[0027] The terms used herein generally have their ordinary meanings in the art. In the case of conflict, the present document, including any definitions given herein, will prevail. The same thing can be expressed in more than one way. Alternative language and synonyms can be used for any term(s) discussed herein, and no special significance is to be placed upon whether a term is elaborated or discussed herein. A recital of one or more synonyms does not exclude the use of other synonyms. The use of examples anywhere in this specification including examples of any terms is illustrative only, and in no way limits the scope and meaning of the present disclosure or of any exemplified term. Likewise, the present disclosure is not limited to various embodiments given herein. Numbering terms such as “first”, “second” or “third” can be used to describe various components, signals or the like, which are for distinguishing one component/signal from another one only, and are not intended to, nor should be construed to impose any substantive limitations on the components, signals or the like.
First Embodiment
[0028] Referring to
[0029] As stated above, in addition to the waveguide structure A1, the silicon photonics structure A0 also includes a silicon substrate A2, a first cover layer A3, and a second cover layer A4. The waveguide structure A1 is disposed in the silicon substrate A2, and a slot A21 is formed on an upper surface A20 of the silicon substrate A2. For example, the silicon substrate A2 can be a silicon wafer, and the slot A21 can be a scribe line on the silicon wafer. In addition, during a process for forming the slot A21, a surface A22 with a lower height (compared to the upper surface A20) will be formed on one of two side surfaces of the slot A21, so that the surface heights of the silicon substrate A2 on two sides of the slot A21 are different. The first cover layer A3 and the second cover layer A4 cover the surface A22 of the silicon substrate A2 on a lower side of the slot A21. The waveguide structure A1 is disposed between the first cover layer A3 and the second cover layer A4 (the first cover layer A3 and the second cover layer A4 are located above and below the waveguide structure A1 respectively), the waveguide structure A1, the first cover layer A3 and the second cover layer A4 jointly constitute one side A5 adjacent to slot A21, and a port A10 of the waveguide structure A1 for receiving and emitting light is approximately aligned with the side A5.
[0030] Continuing to refer to
[0031] For example, the material of the waveguide structure A1 may include lithium niobate (LiNbO.sub.3), silicon-on-insulator (SOI), or silicon compounds, etc., and the composition material of each of the first cover layer A3 and the second cover layer A4 may include silicon dioxide (SiO.sub.2), but the present disclosure is not limited thereto. In other embodiments, the composition materials of the second cover layer A4 and the first cover layer A3 may also be different. The slot A21 can be formed by a semiconductor process or laser engraving, but the present disclosure is not limited thereto. In addition, an outline of the slot A21 is roughly U-shaped or V-shaped, and an average width thereof is less than 60 μm. In other words, compared with a width and a depth of the slot formed on the conventional silicon substrate are 300 μm and 100 μm, respectively, the light guide structure of the present disclosure does not need to form another light guide element in the slot A21. Therefore, the size of the slot A21 can be minimized as much as possible, so as to reserve more usable area of the silicon wafer (i.e., the silicon substrate A2).
[0032] For example, the optical transceiver 1 can be an optical fiber transceiver for converting short-distance electrical signals and long-distance optical signals. The optical transceiver 1 includes a transmitting end and a receiving end. A signal is sent from the transmitting end, and is transmitted over a long distance through an optical fiber. In addition, for example, the reflective surface 21 is a curved surface in a concave shape. Preferably, the curved surface is a spherical surface. Therefore, a curvature of the reflective surface 21 is equal to a curvature of the spherical surface. It should be noted that, since
[0033] In addition, the light guide device M further includes a positioning platform 3, and the optical transceiver 1 is disposed on the positioning platform 3. For example, the positioning platform 3 is a three-dimensional mobile platform designed according to a rectangular coordinate system or a three-dimensional mobile platform designed according to a circular coordinate system or a cylindrical coordinate system, but the present disclosure is not limited to a form of the positioning platform 3. Further, the positioning platform 3 can be electrically connected to a control device D, so that a user can control the positioning platform 3 to move the optical transceiver 1 by operating the control device D. In other words, the optical transceiver 1 can move in three dimensions through the positioning platform 3.
Second Embodiment
[0034] Referring to
Beneficial Effects of the Embodiments
[0035] In conclusion, by virtue of “the reflective structure 2 being disposed on the optical transceiver 1, or the optical transceiver 1 and the reflective structure 2 being connected through the positioning platform 3, so that the reflective surface 21 of the reflective structure 2 can reflect at least one light L transmitted between the optical transceiver 1 and a waveguide structure A1 of the silicon photonics structure A0” the light guide device M provided by the present disclosure improves the misalignment of the side light guide in the conventional technology, and eliminates the complicated process that requires additional coating, deposition and chemical etching in the slot A21 to form an independent light guide element, so as to achieve the effect of cost saving and optimization of light guide efficiency.
[0036] The foregoing description of the exemplary embodiments of the disclosure has been presented only for the purposes of illustration and description and is not intended to be exhaustive or to limit the disclosure to the precise forms disclosed. Many modifications and variations are possible in light of the above teaching.
[0037] The embodiments were chosen and described in order to explain the principles of the disclosure and their practical application so as to enable others skilled in the art to utilize the disclosure and various embodiments and with various modifications as are suited to the particular use contemplated. Alternative embodiments will become apparent to those skilled in the art to which the present disclosure pertains without departing from its spirit and scope.