CONVERSION ELEMENT AND PRODUCTION METHOD THEREOF

Abstract

A method for the production of a conversion element (3) is disclosed, which comprises the following steps: A) provision of a first covering member (1) which has a first connecting surface (1a) and of a second covering member (2), B) insertion of at least one cavity (10) into the first covering member (1) on the first connecting surface (1a), C) filling of the at least one cavity (10) with a filling compound (30), which comprises a conversion material (31), D) applying of the second covering member (2) to the first connecting surface (1a) of the first covering member (1), E) cohesive connection of the first covering member (1) and of the second covering member (2).

Claims

1. Method for producing a conversion element, comprising the following steps: A) providing a first cover body with a first connecting surface and second cover body, B) forming at least one cavity in the first cover body on the first connecting surface, C) filling the at least one cavity with a filling material, which comprises a conversion material, D) applying the second cover body to the first connecting surface of the first cover body, E) cohesively connecting the first cover body and the second cover body.

2. Method according to claim 1, wherein the water vapor transmission rate into the cavity and/or into the filling material is no more than 1×10.sup.−3 g/m.sup.2/day, preferably no more than 3×10.sup.−4 g/m.sup.2/day.

3. Method according to claim 1, wherein the cavity has a depth which corresponds to at least 10% and no more than 90% of the thickness of the first cover body.

4. Method according to claim 1, wherein the conversion material comprises wavelength-converting quantum dots or consists of wavelength-converting quantum dots.

5. Method according to claim 1, wherein filling in step c) is effected in such a way that a cover surface of the filling material facing away from the first cover body terminates flush with the first connection surface of the first cover body, and the second cover body is in direct contact with the cover surface after the connection in step E).

6. Method according to claim 1, wherein the connection of the first cover body and the second cover body in step E) is effected by means of wringing and/or cold welding.

7. Method according to claim 6, wherein the first connecting surface of the first cover body and a second connecting surface of the second cover body facing the first cover body are treated with a solvent prior to the application in step D) and/or are heated at a temperature of at least 22° C. and no more than 24° C. after the application in step D).

8. Method according to claim 1, wherein the application of the second cover body to the first cover body in step D) is effected at an ambient pressure of at least 10.sup.−1 Pa and no more than 10.sup.3 Pa.

9. Method according to claim 1, wherein a plurality of laterally spaced cavities is formed in the first cover body, wherein at least one of the plurality of cavities remains free from the filling material.

10. Method according to claim 1, wherein the connection in step E) is effected under exclusion of a joining material, in particular an adhesive.

11. Method according to claim 1, wherein the connection in step E) is effected by laser welding with a pulsed laser beam.

12. Conversion element, comprising: a first cover body with a first connecting surface, a second cover body with a second connecting surface facing the first cover body, and a filling material, which comprises a conversion material, wherein the first cover body comprises a cavity on the first connecting surface into which the filling material is introduced, and the first cover body and the second cover body are cohesively connected to one another.

13. Conversion element according to claim 12, in which a weld seam is arranged between the first cover body and the second cover body, which encloses the filling material in the type of a frame.

14. Conversion element according to claim 12, in which the filling material has a thickness which corresponds to at least 10% and no more than 90% of the thickness of the first cover body.

15. Conversion element according to claim 12, in which a plurality of cavities is present, wherein at least a plurality of cavities is free from the filling material.

16. Conversion element according to claim 12, in which the first connecting surface and the second connecting surface are free from a joining material and are directly adjacent to one another.

17. Optoelectronic component, comprising: at least one conversion element according to claim 12, at least one light-emitting component having a light exit surface, and a light-transmissive connection layer, wherein the connection layer entirely covers the component on its side comprising the light exit surface, and an outer surface of the conversion element is directly adjacent to a joining surface of the connection layer facing away from the light-emitting component.

18. Optoelectronic component according to claim 17, in which the first cover body of the conversion element comprises at least one first cavity and at least one second cavity laterally spaced apart from the first cavity, wherein the filling material is introduced in the at least one first cavity, the at least one second cavity is filled with air and/or a gas, the filling material of the first cavity is arranged directly after the light exit surface and entirely covers the light exit surface, and the second cavity is arranged laterally spaced from the light-emitting component.

19. Method according to claim 1, wherein the first cover body and the second cover body are glass plates, respectively.

Description

[0055] Hereinafter, the method for producing a conversion element described herein, the conversion element described herein and the optoelectronic component described herein will be described in more detail on the basis of exemplary embodiments and the corresponding figures.

[0056] The FIGS. 1A to 1C show an exemplary embodiment of a method for producing a conversion element described herein as well as an exemplary embodiment of a conversion element described herein on the basis of schematic sectional illustrations.

[0057] The FIGS. 2A, 2B, 3A, 3B, 4 show exemplary embodiments of a conversion element described herein as well as of an optoelectronic component described herein on the basis of schematic sectional illustrations.

[0058] Like, similar or equivalent elements are provided with the same reference numerals throughout the figures. The figures and the dimensional relations among the elements shown are not considered to be to scale. Individual elements may rather be illustrated in an exaggerated size for a better understanding and/or better illustration.

[0059] According to the schematic sectional illustration of FIG. 1A, a first method step of a method for producing a conversion element described herein is described in more detail. In the method step shown, a first cover body 1 with a first connecting surface 1a is provided. The first cover body 1 can be, for example, a glass plate.

[0060] A cavity 10 is formed in the first cover body 1 at the first connecting surface 1a. In the present case, the cavity 10 is a recess formed in the first cover body 1. The cavity 10 is enclosed, on the side surfaces 10b thereof, by the material of the first cover body 1. For example, the cavity 10 has been formed in the first cover body 1 using a rolling and/or etching technique.

[0061] In the region of the cavity 10, the first cover body 1 has a thickness reduced by the depth of the cavity. Outside the cavity 10, the first cover body 1 has a first thickness 1d. The depth of the cavity 10 can, for example, correspond to at least 10%, preferably, at least 20% of the first thickness 1d of the first cover body 1.

[0062] According to the schematic sectional illustration of FIG. 1B, a further method step of a method described herein is described in more detail. In the method step shown, the cavity 10 is filled with a filling material 30. The filling material 30 contains a conversion material 31 which can be, for example, wavelength-converting quantum dots and/or a wavelength-converting organic conversion material. After filling the cavity 10, the filling material 30 is cured.

[0063] The filling material 30 can in particular fill the cavity 10 completely. Here, it is possible that the cover surface 30a of the filling material 30 facing away from the first cover body 1 terminates flush with the first connecting surface 1a, if applicable. In other words, the connecting surface 1a and the cover surface 30a together form a planar surface.

[0064] According to the schematic sectional illustration of FIG. 1C, a final method step of a method for producing a conversion element described herein and an exemplary embodiment of a conversion element described herein is described in greater detail. In the method step shown, a second cover body 2 is attached to a side of the first cover body 1 that comprises the first connecting surface 1a with a second connecting surface 2a facing the first cover body 1 and is cohesively connected to the first cover body 1. The second cover body 2 can also be a glass plate.

[0065] Connecting the two cover bodies 1, 2 is effected by wringing, cold welding and/or laser welding. An atomic and/or molecular connection 122 is formed between the first connecting surface 1a and the second connecting surface 2a by wringing and/or cold welding. Here, the atomic and/or molecular connection 122 represents a mixture of the materials of the two cover bodies 1, 2 and thus is part of the two cover bodies 1, 2. In particular, the two connecting surfaces 2a, 2b are directly adjacent to one another at the place of the connection 122 and form the connection 122. Additionally, a weld seam 121 can be created when using laser welding. The weld seam 121 encloses the cavity 10 and/or the filling material 30 in the type of a frame.

[0066] The last method step shown in FIG. 1C results in a conversion element 3 having the components described already. The first cover body 1, the second cover body 2, and the cavity 10 filled with the filling material 30 together form the conversion element 3 then. The cavity 10 filled with the filling material 30 of the conversion element 3 can be hermetically sealed toward the outside by the first cover body 1 and the second cover body 2. Preferably, the cover surface 30a of the filling material 30 is in direct contact with the second connecting surface 2a of the second cover body 2.

[0067] According to the schematic sectional illustration of FIG. 2A, an optoelectronic component with a conversion element 3 described herein is described in greater detail. The optoelectronic component has a light-emitting component 4 with a light-emitting semiconductor chip 40, which can, for example, be an organic or inorganic light-emitting diode chip, and a housing 41. The housing 41 is, for example, a light-reflecting component which can be formed with a plastic material. The light-emitting semiconductor chip 40 is introduced into a recess 411 of the housing 41.

[0068] A light-transmissive connection layer 5 is attached to a light-exit surface 4a of the light-emitting semiconductor chip 40 facing away from the housing 41. The connection layer 5 can be formed with a silicone or a light-transmissive adhesive. The connection layer 5 completely covers all outer surfaces of the component 4 that comprise the light-exit surface 4a.

[0069] The first bottom surface 1c of the first cover body 1 facing away from the filling material 30 is directly adjacent to a joining surface 5a facing away from the light-exit surface 4a of the connection layer 5. In other words, the conversion element 3 is glued on the light-emitting component 4 by means of the connection layer 5. In particular, the conversion element 3 is glued on the light-exit surface 4a of the component 4. Here, as an alternative, it is possible (other than shown in FIG. 2A) that the conversion element 3 is glued on the light-exit surface 4a at the second bottom surface 2c of the second cover body 2 facing away from the first bottom surface 1c. The first bottom surface 1c faces away from the light-emitting semiconductor chip 40.

[0070] According to the schematic sectional illustration of FIG. 2B, a further exemplary embodiment of an optoelectronic component described herein with a conversion element 3 described herein is described in more detail. The exemplary embodiment shown differs from the one of FIG. 2a in that the conversion element 3 is applied to the housing body 41. The connection layer 5 is attached to the recess 411 of the housing body 41. The connection layer 5 preferably completely fills the recess 411. The conversion element 3 is, in places, in direct contact with a housing cover surface 41a facing away from the light-emitting semiconductor chip 40. In particular, the conversion element 3 completely covers the recess 411.

[0071] According to the schematic sectional illustration of FIG. 3A, a further exemplary embodiment of an optoelectronic component described herein with a conversion element 3 described herein is described in more detail. The section shown is effected along a connection line A-A′. The optoelectronic component of FIG. 3A comprises a light-emitting component 4 which in the present case is configured as a so-called “semiconductor chip in a frame” component.

[0072] The optoelectronic component comprises a light-emitting component 4 with a substrate 44 and a light-emitting semiconductor chip 40 applied to the substrate 44. Furthermore, the light-emitting component 4 comprises a shaped body 42 which laterally encloses the light-emitting semiconductor chip 40 and, at least in places, is in direct contact with the light-emitting semiconductor chip 40. The shaped body 42 can, for example, be formed with an epoxy resin or a silicone resin.

[0073] Additionally, the light-emitting component 4 comprises connections 43 which serve for electrically contacting the light-emitting semiconductor chip 40. The connections 43 are at least in places in direct contact with the light-emitting semiconductor chip 40. Furthermore, the connections 43 cover the shaped body 42 and the substrate 44 at least in places. Here, it is possible that at least one connection 43 extends through the shaped body 42 in a vertical direction. As a result, a direct electrical contacting of said at least one connection 43 at a bottom surface 4c of the light-emitting component 4 facing away from the connection layer 5 is enabled.

[0074] The optoelectronic component of FIG. 3A further comprises the connection layer 5, which completely covers the light-emitting component 4 at the side thereof that comprises the light-exit surface 4a. Here, the connection layer 5 can at least in places be in direct contact with the light-exit surface 4a, the shaped body 42 and the connections 43.

[0075] The conversion element 3 is adjacent to the joining surface 5a of the connection layer 5 facing away from the component 4. The filling material 30 of the conversion element 3 preferably has at least the lateral extent of the semiconductor chip 40. In other words, the filling material 30 completely covers the semiconductor chip 40 in a plan view from a vertical direction.

[0076] According to the schematic sectional illustration of FIG. 3B, a further exemplary embodiment of an optoelectronic component described herein is described in more detail. FIG. 3B shows the component of FIG. 3A in a plan view of the conversion element 3 from above. The section illustrated in FIG. 3A is effected along the connection line A-A′.

[0077] The filling material 30 is formed in the type of a rectangle in the plan view, and comprises a cut-out 431. The cut-out 431 may already be left-out e.g. in the production method during generation of the cavity 10. For example, an electrical contacting of the light-emitting semiconductor chip 40 can be effected with a bonding wire in the cut-out 431. Furthermore, the filling material 30 is laterally completely enclosed by a weld seam 121. The two cover bodies 1, 2 have a greater lateral extent than the filling material 30.

[0078] According to the schematic sectional illustration of FIG. 4, a further exemplary embodiment of an optoelectronic component described herein is described in more detail. In the exemplary embodiment shown here, two components are connected according to FIG. 3A. The components can be singulated at the singulation line 6 shown. The conversion element 3 comprises a plurality of cavities 10, 10′. Here, the first cavities 10 are filled with the filling material 30. At least one second cavity 10′ is not filled with the filling material 30. No semiconductor chip 40 is assigned to this second cavity 10′. The second cavity 10′ is located in the periphery of the light-emitting semiconductor chip 40. In other words, no light-emitting semiconductor chip 40 is assigned to the second cavity 10′. Here, only scattering light and/or radiation with a large opening angle can enter the second cavity 10′. The second cavity 10′ may then have the function of a diffuser lens and can, for example, divert scattering light of the semiconductor chip 40 away from a main radiation direction. Thereby, the radiation characteristic of the optoelectronic component can be improved.

[0079] The invention is not limited to the exemplary embodiments by the description on the basis of the exemplary embodiments. Rather, the invention comprises each new feature as well as each combination of features, in particular including each combination of features in the patent claims, even if this feature or this combination is not per se explicitly indicated in the patent claims or exemplary embodiments.

[0080] This patent application claims priority of German patent application 10 2014 116 778.3, the disclosure content of which is incorporated herein by reference.

LIST OF REFERENCE NUMERALS

[0081] 1 first cover body [0082] 1a first connecting surface [0083] 1c first bottom surface [0084] 1d first thickness [0085] 2 second cover body [0086] 2a second connecting surface [0087] 2c second bottom surface [0088] 10, 10′ cavity [0089] 10b side surfaces of the cavity [0090] 121 weld seam [0091] 122 connection [0092] 3 conversion element [0093] 30a cover surface [0094] 30 filling material [0095] 31 conversion material [0096] 4 light-emitting component [0097] 4a light-exit surface [0098] 4c bottom surface [0099] 40 light-emitting semiconductor chip [0100] 41 housing [0101] 41a housing cover surface [0102] 411 recess [0103] 42 shaped body [0104] 43 connections [0105] 431 cut-out [0106] 44 substrate [0107] 5 connection layer [0108] 5a joining surface [0109] 6 singulation line