MULTI-INPUT, MULTI-OUTPUT MANIFOLD FOR THERMOCONTROLLED SURFACES

20230182361 · 2023-06-15

Assignee

Inventors

Cpc classification

International classification

Abstract

A forming tool with forced thermal fluid-based spatio-temporal temperature control of a surface of the tool has a subsurface manifold underlying at least a part of a forming surface of the tool and a number P of at least 6 ports, each port fluid coupled respectively to the manifold via respective channels, where the ports exit the tool at disparate points, with each pair of ports in fluid communication via the manifold. This structure allows manifold path diversity for varying thermal fluid supply and drainage. The manifold may be reinforced.

Claims

1. A forming tool with thermal fluid-based spatio-temporal temperature control, the tool comprising: a subsurface manifold underlying at least a part of a thermocontrolled surface of the tool, the manifold bounded between a face-adjacent wall and a back-adjacent wall of the tool, and at least substantially surrounded by a peripheral wall; and a number P of at least 6 ports, each port fluid coupled respectively to the manifold via respective channels, the ports at disparate points, with each pair of ports in fluid communication via the manifold.

2. The forming tool according to claim 1 wherein ports occupy at most 70% of the back-adjacent wall.

3. The forming tool according to claim 1 wherein each of one or more channels extend through: the peripheral wall; or the back-adjacent wall.

4. The forming tool according to claim 1 wherein there are at least 8, 9, 10, 12, 15, 20, or 50 ports.

5. The forming tool according to claim 1 wherein the ports are regularly arrayed with uniform spacing on the back-adjacent wall.

6. The forming tool according to claim 1 wherein the manifold is reinforced with an open supporting structure that permits fluid circulation.

7. The forming tool according to claim 6 wherein the open supporting structure comprises a number of members arrayed across the manifold, the members configured as pillars, I-beams, spacers, or Kagome-shaped structures.

8. The forming tool according to claim 7 wherein each of the members are: joined to a common sheet, or to one or more strips; or adhered to the face- or back-adjacent wall by welding, adhesive, mechanical fastener, or by additive manufacturing.

9. The forming tool according to claim 1 wherein the tool comprises a mold of one of the following types: injection mold, powder injection mold, metal injection mold, casting mold, or a stamping die.

10. The forming tool according to claim 1 further comprising: at least one thermal fluid supply; a drain; and a respective flow control element mounted to each one of the P ports, to couple the respective port to at least one conduit, be it one of the at least one thermal fluid supply, or the drain, with: at least a minimum number M of the ports coupled via respective control elements to the drain, and at least M of the ports coupled via respective control elements to the first supply, where M=2+floor (15(P−6)/4P); where each flow control element is adapted to switch between at least two of the following states for a first of the at least one conduit to which it is coupled: a closed state where flow through the port is closed; a first open state where flow between the port and the first conduit has a first hydrodynamic resistance; and a second open state where flow between the port and first conduit has a second hydrodynamic resistance different by at least 10% than the first hydrodynamic resistance.

11. The forming tool according to claim 10 wherein: a set of the ports that selectively couple the manifold to the drain in dependence on a state of the flow control element defines a drain set, just as a set of ports selectively coupling to a first of the at least one thermal fluid supply defines a first supply set; both the drain set and the first supply set are substantially dispersed in that for each port in the first supply set: at least 2 of the 5 nearest ports are in the drain set; a mean distance to the 3 nearest ports of the first supply set is 15% greater than a mean distance to the 3 nearest ports of the drain set; or among the 5 nearest ports, a mean distance to the ports of the drain set is 15% less than the mean separation to the ports of the first supply set; and the drain set and first supply set: are disjoint subsets of the set of all ports; partition the set of all ports; have a non-trivial set intersection; or are mutually inclusive.

12. The forming tool according to claim 10 wherein at least one of the flow control elements couple the port to both the drain and the first thermal fluid supply, and is adapted to switch between open states of exclusively one of the drain and first thermal fluid supply.

13. The forming tool according to claim 10 wherein each flow control element is adapted to switch to the closed state.

14. The forming tool according to claim 1 further comprising: at least one thermal fluid supply; a drain; and a respective flow control element mounted at at least two of the ports, adapted to switch between these three states: a first state that couples a first thermal fluid supply to the manifold; a second state that couples the manifold to a drain: and a third state wherein the port is closed.

15. The forming tool according to claim 10 wherein at least two of the flow control elements further selectively couples a second thermal fluid supply to the manifold alternatively to coupling to the first thermal fluid supply, and to coupling to the drain.

16. The forming tool according to claim 10 wherein at least one of the flow control elements has a number of states for opening to drain or supply, each state corresponding to a respective opening hydrodynamic diameter.

17. The forming tool according to claim 10 wherein each flow control element is a mechanical valve or switch electronically controlled by a common processor.

18. The forming tool according to claim 10 further comprising: a thermal treatment centre adapted to receive fluid from the drain, change a temperature thereof, and pump the product to the first thermal fluid supply; or a common processor for controlling each of the flow control elements.

19. The forming tool according to claim 14 wherein the manifold is: closed, constraining the fluid to exit only via one of the ports; or is coupled by one or more channels to one or more other manifolds, and the manifold, channels and one or more other manifolds are collectively closed.

20. A kit for transforming a forming apparatus with thermal control channels into a multi-input, multi-output temperature controlled forming surface, the kit comprising at least 6 electromechanical flow controllers each flow controller adapted to couple the manifold to at least one of a first thermal fluid supply and a drain, for switching between at least two of the following states: a closed state where flow through the port is obstructed; a first open to source state where a first supplied thermal fluid may enter through the port at a first rate from the first thermal fluid supply; a second open to source state where a first supplied thermal fluid may enter through the port from the first thermal fluid supply at a second rate other than the first rate; a first open to drain state where thermal fluid may exit the manifold through the port at a third rate through the drain; and a second open to drain state where thermal fluid may exit the manifold through the port at a fourth rate other than the third rate.

21. The kit according to claim 20 further comprising a micromachining device adapted to be used alone or with other bits or materials, for at least partial insertion into a thermal control channel of the forming apparatus to join two or more separated thermal control channels to form a single manifold interconnecting at least 6 ports, the insertion provided by entry via existing ports of the separated channels of the forming apparatus, or by boring one or more new ports.

22. A method for controlling a spatio-temporal thermal distribution on a mold face of a forming apparatus, the method comprising: providing a forming tool according to claim 10 with respective flow control elements coupled to respective conduits; and applying a signal to control each of the flow control elements while thermal fluid supplies and drain are operating, to control a temperature at the mold face.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order that the invention may be more clearly understood, embodiments thereof will now be described in detail by way of example, with reference to the accompanying drawings, in which:

[0037] FIG. 1A is a top plan view of a mold half, provisioned with a multi-input, multi-output manifold for thermocontrol of a mold face in accordance with a first embodiment of the present invention;

[0038] FIG. 1B is a cross-section of the mold half of FIG. 1A through FIG. 1A along line BB;

[0039] FIG. 10 is back plan view of the mold half of FIGS. 1A,B featuring an array of ports and showing mold face features in ghost view;

[0040] FIG. 1D is the back plan view of FIG. 10 with a plurality of 1-way flow control elements sealed and mounted to respective ports showing fluidic network connections in accordance with an embodiment of the present invention;

[0041] FIG. 1D′ is the back plan view of FIG. 10 with a plurality of 2-way flow control elements sealed and mounted to respective ports, featuring path redundency in accordance with an embodiment of the present invention;

[0042] FIG. 1E is a backing tray for sealed coupling to the back side of the mold half of FIG. 1C, to effectively displace to ports to side edge at an interface between the mold half and tray, and showing 90° bends for each channel at the interface;

[0043] FIG. 1E′ is a backing tray for protecting the 2-way flow control elements of FIG. 1D′ and improving stiffness of the forming tool for bottom and edge-based clamping;

[0044] FIG. 1F is a cross-section through FIG. 1A along line BB assembled with the backing tray of FIG. 1E featuring two 1-way flow control elements;

[0045] FIG. 1F′ is a cross-section through FIG. 1A along line BB assembled with the network of 2-way valves shown in FIG. 1D′ and the backing tray of FIG. 1E′;

[0046] FIG. 1G is an enlarged cut out view of the forming tool of FIG. 1F′ with a different reinforcement in the manifold, and an enlarged view of a 2-way valve, showing principal chambers thereof in ghost view, and a sensor mounted thereon;

[0047] FIG. 2 is an apparatus comprising the forming tool of FIG. 1F′ with one bundle removed, coupled to a thermal treatment centre with a pump and controller;

[0048] FIG. 3 is a schematic view of fluid, and electrical connections to ports of a manifold in accordance with an embodiment of the present invention, the system has both hot and cold thermal fluid supplies and drain; and

[0049] FIG. 4 is a panel of three images A,B,C showing thermal and fluid-dynamic simulated results for respective system states, the thermal modelling provided by a gray-scale marking provided by a same scale to the right of panel A, and the fluid-dynamic simulation illustrated by vectors, with larger flows identified by larger weight arrows.

DESCRIPTION OF PREFERRED EMBODIMENTS

[0050] Herein a forming tool, and kit for transforming a forming tool with thermal control channels into a forming tool with a multi-input, multi-output temperature controlled forming surface is described, as well as a method for controlling a thermal distribution of a forming tool or apparatus, such as a mold.

[0051] FIGS. 1A,B,C are schematic top plan, cross-sectional side, and bottom plan views respectively of a first embodiment of a mold half 10 of the present invention. The mold half 10 has a mold face on a top surface 10a that consists of numerous curved recessed and protruding surfaces, and edges designed to define some part of a piece, the collection of which are referred to herein as features.

[0052] The specific shape shown is not designed to resemble any known part, and any similarity is unintentional, however the mold half can have substantial depth and variability in depth and can have abrupt edges and easier and more difficult regions for demolding. As shown, the mold face has a flat-bottomed cup area 12a joined by neck 12b to a base 12c having intrusions 13 that (as seen in FIG. 1B) protrude above a nominal height of the top surface 10a, though such intrusions are by no means common amongst mold halves. Furthermore the deep recesses between intrusions 13 may be infeasible for demolding certain metal parts, but may be acceptable e.g. for some resin-based plastic molding.

[0053] Surrounding the mold face, shown in ghost line, is a thermally controlled area 15 of the mold half 10. While the thermally controlled area encompasses the whole mold face in this embodiment, it need not cover the whole mold face as some parts of a mold face may be in greater need of enhanced temperature control, and not others. Furthermore, as shown, it is usual for thermal control to extend beyond the limits of the mold feature areas.

[0054] As seen in FIG. 1B, substantially underlying the thermally controlled area 15 is a single, connected manifold 20 to which numerous channels 22 are coupled. While only 5 channels 22 are in view along the section line BB, as can be seen in FIG. 10, which schematically illustrates a back surface of the mold half 10, there are 20 such channels in the illustrated embodiment, that are arranged on 6 equally spaced lines. The manifold 20 provides a plenum for thermal fluid that is shown somewhat as a conformal cooling manifold in that a mean distance from a floor of the mold face (where defined) to the manifold 20 (i.e. a nominal minimal thickness of the mold face above the manifold 20) varies across the mold face by less than twice a mean depth of the manifold 20. The depth of the manifold 20 is substantially uniform. Although this is expedient, it is by no means necessary. Each channel 22 communicates between the manifold 20 and a respective port 25.

[0055] As is well known in the art of conformal thermal control of molds, there is a trade-off between the closest approach between the channels and floor of mold (the nominal minimal thickness of the mold face above the manifold), as too thin a separation results in inferior strength of the mold, and too thick a separation reduces efficiency of the cooling. This trade-off is exacerbated by the enlargement and increased interconnection of channels to form the single connected manifold 20, and peaks with the unstructured, whole of area open plenum shown. Furthermore, the tradeoff becomes acute as the closer the thermal fluid gets to the formed material, the more effective the thermal control becomes. However, the fluid-based thermal control is of no use if the mold fails prematurely or the mold face deforms under thermal or mechanical loading during forming processes. As will be appreciated by those of skill in the art, mold halves are typically composed of particular materials chosen for longevity of the mold, costs, and stiffness used for forming molds for different processes and materials, and while the inclusion of a manifold may provide an impetus to use higher stiffness materials, to increase a plenum volume, it is expected to more often be cost efficient to reinforce the manifold with a scaffold, bridging structure, packing of high stiffness balls or cylinders, strip of joined supports or Kagome structures, space frame truss, or any sufficiently open (low hydrodynamic resistance) support structure.

[0056] FIG. 10 shows a full set of 20 ports 25 (of which only 5 are identified to avoid complicating further the image). The mold face features are shown in ghost view for context, and the outline of the thermal control region 15 is shown in dashed line. Thus the mold half 10 is shown with a novel manifold 20 that is believed to be unique in that it interconnects 6 or more ports permitting a large number of spatio-temporal thermal distributions to be applied at the mold face.

[0057] FIG. 1D schematically illustrates the back side of the mold half 10 with one flow control element 30 (of which only 5 are identified to avoid complicating further the image) in each port 25. Each port is sealed for a rated pressure in any one of a variety of manners known in the art. Half of the flow control elements 30 selectively couple a thermal fluid supply 26 with the respective port, in that the flow control element can either block the port, or couple it to the supply; and the other half selectively couple to the drain in like manner.

[0058] Each flow control element 30 may be a simple open/close valve, or may have a plurality of degrees of open states, each state corresponding with a respective pressure loss in flow across the valve (for example by varying hydrodynamic resistance), and further some of the flow control elements 30 may be of either kind. Once the hydrodynamic resistance is less than that of the fluid through the conduits 26/28, the flow control element is fully open (no further opening has any effect on flow rate). A small number, less than 20, more preferably less than 10, and most preferably 3-8 states of respective hydrodynamic resistance may be identified with distinct, open states of these flow control elements. The number of states of each valve greatly affects a number of thermal distributions applicable to the thermal control region by the system as a whole, at the expense of slightly more cumbersome control and costs of the system.

[0059] Each flow control element 30 shown couples two tube sections of the conduit to which it couples: i.e. either the supply 26 or the drain 28. This allows for a single serial conduit to sequentially feed each port 25, in dependence upon state of the flow control element. As such, each flow control element 30 illustrated has two tube coupling ends in communication with a first internal channel of the flow control element 30, a second internal channel coupled to the channel 22, and a sealed mechanical device for selectively interconnecting the two internal channels. Some flow control elements known in the art have only one opening to each internal channel, and it is trivial to provide T-couplers in the conduit 26,28 for each flow control element to provide an equivalent network.

[0060] The supply 26, as shown (just like the drain 28), happens to have 2 ends. Both ends of the supply 26 will come from a pump section of thermally treated fluid. While most often these fluids are high thermal transfer rate liquids, that are inert and have stable reliable rheology across the temperature range, they can also be gasses. Preferably the thermal fluid and manifold (with any reinforcement) and pump rates are selected to ensure that a flow regime through the manifold has a Reynolds number 1 to 1000 to avoid full turbulence. The two ends are not necessary as the second end can alternatively be a termination: the fluid can be fed from only one end. The first internal channels of all of the connected flow control elements 30 of the same conduit are in open fluid communication, regardless of the states of the other connected flow control elements. Thus the sealed mechanical devices are in parallel with the conduit 26,28. Likewise there could be any number of ends desired. In general, the more ends, the shorter the path between the supply/drain and the open flow control elements 30, which is advantageous for reducing thermal loss (particularly important for the supply 26), and fastest response time. The use of two ends is convenient as every flow control element 30 has a same number of couplers, and there is one redundant path to every port 25: if one tube section were to be blocked or constricted between two ports 25, the flow to no ports would be appreciably impaired, and there is very little penalty in tubing connections or complexity introduced by this redundancy. This is because flow through conduit 26,28 is not inherently directed flow (it can flow in either direction). Once one or several of the ports are open, unless there is some constriction, flow is balanced between both ends to meet the flow requirements.

[0061] As shown, the ports selectively coupled to drain (herein “drain-coupled”) and those coupled to supply (“supply-coupled”) partition the set of ports, and are equi-numerous. The drain-coupled set is reasonably uniformly distributed amongst the supply-coupled set and vice versa. In the illustrated embodiment, the nearest neighboring port of each port happens to not be a member of the same partition, although this is a stronger requirement than necessary. It would be expected that for each port: at most 3 of the 5 nearest ports are members of the same partition; a mean separation between the 5 nearest ports of the same partition is 15% greater than a mean separation between the 5 nearest ports of the opposite partition; or among the 5 nearest ports, a mean separation to the ports of the opposite partition is 15% less than the mean separation to the ports of the same partition. Such a distribution is preferred to facilitate a broadest range of thermal fluid distribution patterns, as will allow the system to apply varied response. However, it will be appreciated that a forming tool may have a larger number of ports than are usable, and an engineered solution to address a particular problem may be called for that does not require uniform distributions of drain- and supply-coupled sets. If a reconnection of ports to source and drain conduits is required, the system is as reconfigurable as the availability of ports.

[0062] FIG. 1E schematically illustrates a backing tray 35 with surface relief patterns defining one channel segment 22 extending from edge ports 25 to elbows 36 that align with previously identified ports 25 in FIG. 10. This backing tray 35 effectively elongates channel segments 22 that extend in the mold half's relief direction (mold depth) by coupling them at the elbows 36, to channel segments 22 running towards edges of the mold half 10. This advantageously translates the ports from back-side features to side edge features that are more accessible during forming operations, and minimizes a volume to be bridged by the tray 35 (increasing a load that may be passed through the tray).

[0063] FIG. 1F is a cross-section showing the tray 35 mounted to the mold half 10, and the extension of two of the channels 22, that are coupled to respective source 26 and drain 28 conduits by respective 1-way valves. For this embodiment, the channel segments 22 are well separated, except for crevice flow between the mold half 10 and tray 35. While this can be substantially reduced with a suitable pancake flange or seal, the above comments about sealing apply here again: it may not be necessary to preclude flow along this crevice, as long as flow resistance is sufficiently higher than flow through the manifold, as long as the inconvenience of leaking out of the system is prevented by a seal surrounding the interface at an outside periphery of the mold half 10 where it meets the tray 35. This seal may also conveniently provide a seal for flow control elements 30.

[0064] FIG. 1F further shows a support structure 40 for rigidifying the manifold 20. The illustrated structure is that of an expanded, corrugated sheet. The corrugation, in this case, is a map-fold providing tent structures of triangular cross-section running an extent of the manifold. It will be appreciated that further rigidification can be provided by providing a set of base and peak separating structures to isolate each tent structure from transverse movement, or with any transverse wiring or rod that extends through some of the expansion slots of the folded sheet structure to limit motion. The addition of reinforcing structures into the manifold will typically increase fluid resistance between arbitrary ports. It is naturally disadvantageous to system responsiveness to increase resistance too much, and doing so increases the mechanical work of pumping the thermal fluid. Nonetheless, some resistance may be advantageous to improve resolution, in that flow can be more tightly focused between the source and drain ports.

[0065] Finally, FIG. 1F shows mounting flange ears 42 that can be used in some mold half structures to increase a localization of load to the mold above the manifold 20, which is another way of reducing a load applied through tray 35. Tray 35 is shown to have the channels 22 of low depth relative to the thickness of the part, which also increases a force that can be communicated through this part.

[0066] FIGS. 1D′,E′,F′, schematically illustrate a variant of the embodiments of FIGS. E,F, but with a common mold half 10. In this embodiment, the tray 35 does not provide any type of seal, but merely provides a supported enclosure for tubing that defines conduits 26,28. If the thermal insulation value of the tubing is appreciably higher than that of channels 22 (which is preferable for the conduction to the thermo-controlled surface), this embodiment may be of higher thermal efficiency than the embodiment of FIGS. E,F, as the thermal fluid is provided more directly to the manifold 20.

[0067] That said, direct thermal contact between the supply tubing 26 and drain 28 is a short-circuit thermal bridge that extends over a large surface area with this embodiment. Thus while the network connections of the 2-way valve system shown in FIG. 1D′ are substantially reduced compared with FIG. 1D, it may require higher quality insulation of the tubing.

[0068] FIG. 1D′ has a network of side-by-side source and drain conduits 26,28 that may flow in the same or opposite directions at any instant, and not necessarily at the same rates. It has three ends for each conduit, and further has 3 minimal closed loop cycles, provided by adding connections above what is necessary to connect to each port 25. These 3 cycles provide path redundancy, and expedite delivery.

[0069] FIG. 1E′ shows a tray 35 with enlarged passages 38 to accommodate the thermal fluid ingress and egress network, and FIG. 1F′ shows the mold half 10, coupled with the thermal fluid ingress and egress network of FIG. 1D′, assembled within the tray of FIG. 1E′. Each flow control element 30 is schematically illustrated coupled to a pair of source and drain conduits 26,28, although minutiae of directions of these coupling segments are not represented. As can be seen from FIG. 1D′, one of the ports is shown coupled to 4 other ports, whereas others only to one.

[0070] In FIG. 1F, an arrangement of Kagome structures 40 is used to rigidify the manifold 20. Each Kagome structure 40 may be retained in place at either top or bottom end by a weld. Alternatively the Kagome structures, which would be difficult to tip or roll, may be allowed to slide. Further alternatively, the Kagome structures may be welded to a top or bottom sheets or strips, as long as the sheets or strips don't occlude openings to the channels 22. For this reason it may be preferred to have sheets or strips only on one side, nearer the thermocontrolled surface. Kagome structures offer excellent mechanical support with minimal fluid dynamic resistance. If the Kagome structures are multiplied to the point where the base and top structures meet, the structure may be more akin to a space-plane truss, which also is an excellent support structure that can be employed.

[0071] FIG. 1G is an enlarged view of a small part of a manifold with a tray 35 (unsealed) that encloses a 2-way flow control element 30 particularly useful for the present invention. The 2-way flow control element 30 has two couplers for supply 26, and two for drain 28. The two for each conduit are open connected to respective first and second internal channels within the body of the 2-way flow control element 30. A device selectively couples a third internal channel, open to the manifold 20 via channel 22, to at most one of the conduits 26,28. Thus the 2-way flow control element 30 is adapted to either block its port, or couple to either the drain 28 or the supply 26. While not shown, a thermal insulation barrier is preferably provided between the drain and supply conduits.

[0072] Applicant further notes that an embodiment intermediate those of FIG. 1F and FIG. 1F′ is equally envisaged. Instead of sealing the tray 35 and mold half 10, as was done in FIG. 1F, or providing of the flow control element 30 in the passage 38 of the tray, a pipe with right angle fitting is provided in the passages 38 (which can also be reduced in diameter accordingly to provide greater stiffness). The pipe is therefore sealed and open to the manifold at one end, and controlled by the flow control element at the other that is provided at a more accessible location, such as around the periphery of the mold half.

[0073] FIG. 1G shows an array of pillars 40′ used to reinforce. These pillars may be additively manufactured, built up from either part of the mold half 10 (mold-adjacent or back-adjacent), and advantageously the whole mold can be additively manufactured to avoid assembly and leakage problems. While the pillars are illustrated as simple structures, it will be appreciated that additive manufacturing, with a variety of techniques such as cold spray, and various powder bed forming techniques, permit much more intricate structures to be fabricated quickly and easily. For example, it is possibly easier to form thickened roots of these pillars at both ends, and narrowing of the structures in the middle, as this general strategy improves buckling resistance and off-axis stiffness, with much less flow resistance than simply thickening the pillars. A wide variety of reinforcements can be built into the manifold if it is additively manufactured.

[0074] FIG. 1G also show an electrical bus 32 which allows for communication of signaling between a thermal regulation controller (which may be integrated with a mold process controller, and/or a controller of a thermal control station, or may be a standalone controller). The bus communicates between a flow control circuit (not in view), which may be as simple as a switch circuit or as complicated as a processor. Power for the processor may be supplied via the bus 32. It is highly preferable that the flow control element 30 of the present invention be electronically controlled. A fully autonomous thermal regulation system is achievable for well characterized processes.

[0075] The flow control circuit, or bus 32 is preferably coupled to a sensor 47, which is shown extending toward the manifold 20. The sensor 47 may be a flow rate sensor, such as a mass, velocity, or volume flow sensor, and/or a thermocouple or a resistance-based thermometer (for fast temperature change detection). Direct thermal measurement can be particularly advantageous if read by the flow control circuit, as this allows the local control over locally sensed parameters, as well as those of some neighbouring flow control circuits, can provide a robust processing architecture that can handle multiple faults and exceptions, although any variety of processing architectures are equally practicable. For example, if sampling of the sensors and instructions to respective flow control circuits can be time divided via the bus, all the thermal control can be provided by a single processor, conveniently located at the thermal processing system, which can also control pump rates and communicate with, comprise, or be comprised by, a process controller.

[0076] FIG. 2 is a schematic top plan illustration of the mold half 10 with flange 42 resting on a base 43, with two paired conduit ends extending from a common side. The supply conduits 26 are separated from a main supply 26′ at the mold half 10 to minimize thermal losses, just where the drain conduits 28 are joined to drain main 28′. Drain main 28′ is coupled to a drain inlet of a thermal treatment system 50, that comprises an insulated chamber for heating or cooling (including compressing or expanding the fluid, particularly if a gaseous medium is used) the thermal fluid until it has the right temperature for exiting to the main supply 26′. A pump 52 is used to control pump rate, energy supplied, or work done to maintain the thermal fluid within an established pressure supply and temperature range, that may depend on current demand by the process. A controller 55 receives the electrical leads 32 that are bundled with the drain main 28′, which allows the controller 55 to regulate temperature, pump rate, as well as the states of each of the flow control elements 30.

[0077] FIG. 3 is a schematic illustration showing an array of n ports (P) in a line coupled to a manifold 20. There may by m many such lines for m×n ports. Schematic switches show the allowed states of the 4-way 4 position switches 30, which include only coupling to the manifold, or no coupling. Specifically there are two thermal supplies (A and B), which may be hot and cold, respectively, or may be normal hot/cold and exceptionally hot/cold. Electrical control lines are shown dashed, and the controller 55 is separate from the two-station thermal treatment system (50a,b). Each has a relief valve.

[0078] The 4-way 4 position switches 30 are shown only with switching capability, but a variable flow resistance is coupled to the switch 30 at each port P, to further allow the controller 55 to throttle the flow through each port independently.

[0079] Control exerted by the controller may be assisted by the usual PID control algorithms, or by artificial intelligence driven by inputs and output response, where the inputs are control states of the flow control elements, temperature and pump rates of the thermal treatment system, and state of process in a process model, and the outputs may be quality of parts, demolding issues, or particular flaws.

EXAMPLES

[0080] To demonstrate the present invention, simulation results were produced with a multi-physics finite element simulator that modelled transient thermodynamics and fluid dynamics of a simple 25 port thermal control manifold having a regular array of ports to a square manifold. The dimensions were 250×250 mm, virtually filled with a fluid with physical properties (density, viscosity, specific heat and conductivity) of water. The boundary conditions set for the manifold were isothermal. In the examples the manifold was initially set at a maximum and uniform temperature, and the image shows flow rates after 6 s. The thermal fluid supplied was a low temperature fluid source. The simulated switch operation was Boolean, each port fully opened or closed states were predefined. Injected fluid effectively cooled down specific region according to the selected configuration.

[0081] FIG. 4A is a simulation output showing the simulated structure in plan view. The whole structure is shown in a transient state with the centre opening acting as the inlet connected to the thermal fluid supply, and all the other ports are connected to the drain. The resulting profile is close to a Gaussian distribution concentric to the manifold centre. The arrow glyphs shows flow patterns with a length proportional to the velocity magnitude of the fluid. In this configuration the flow rate is strongest around the centre opening, and the 4 nearest neighbours are the dominant drains. The gray-scale image illustrates temperature as a function of position within the virtual manifold. A radius curvature of the opening of the channels to the manifold can be seen in the drawings.

[0082] FIG. 4B is a simulation output showing a bottom part of the simulated structure in plan view, with some magnification according to a second thermal distribution pattern. The second thermal distribution pattern produces a vertical thermal gradient is achieved with the bottom corner ports being respectively in the open to thermal fluid and open to drain states while the 23 other ports are closed.

[0083] FIG. 4C is a simulation output showing thermal and fluid-dynamic simulated results for a third thermal distribution pattern produced by using two central neighbouring ports respectively as source and drain, with all other ports closed. In this configuration, the thermally affected zone surrounds the two openings for a more localized, non-uniform, tailored heat transfer.

[0084] The described invention has been shown with the forming tool bearing a manifold with multiple input ports and multiple output ports. It will be appreciated by those of skill in the art that a wide variety of molds and other forming apparata can benefit from the present invention: including extremely high temperature, high pressure molds, such as those used in powder metallurgy; high temperature low pressure molds such as semisolid injection molding; to moderately high temperature low or higher pressure plastic injection molding apparata. Forming processes with a cycle time of seconds to hours or longer can all benefit, but particularly forming processes with cycle times on the order of one minute are particularly advantageous for temporal response of feedback that allows for a change in the thermal fluid distribution within a single cycle.

[0085] Other advantages that are inherent to the structure are obvious to one skilled in the art. The embodiments are described herein illustratively and are not meant to limit the scope of the invention as claimed. Variations of the foregoing embodiments will be evident to a person of ordinary skill and are intended by the inventor to be encompassed by the following claims.