ENVIRONMENT SENSOR SYSTEM
20170343502 · 2017-11-30
Inventors
Cpc classification
G01N27/16
PHYSICS
G01N27/18
PHYSICS
International classification
Abstract
We disclose herein an environmental sensor system comprising an environmental sensor comprising a first heater and a second heater in which the first heater is configured to consume a lower power compared to the second heater. The system also comprises a controller coupled with the environmental sensor. The controller is configured to detect if a measured value of a targeted environmental parameter is present. The controller is configured to switch on at least one of the first and second heaters based on the presence and/or result of the measured value of the targeted environmental parameter.
Claims
1. An environmental sensor system comprising: an environmental sensor comprising at least a first heater and a second heater, wherein the first heater is configured to consume a lower power compared to the second heater; a controller coupled with the environmental sensor, wherein the controller is configured to switch on at least one of the first and second heaters based on a predetermined technique.
2. A sensor system according to claim 1, wherein the controller is configured to apply the predetermined technique to detect if a measured value of a targeted environmental parameter is present, and wherein the controller is configured to switch on at least one of the first and second heaters based on the presence and/or result of the measured value of the targeted environmental parameter.
3. A sensor system according to claim 1, wherein the controller is configured to apply the predetermined technique to switch on at least one of the first and second heaters based on a time based event or based on a power change detection in the sensor system.
4. A sensor system according to claim 1, wherein the first heater has a smaller size compared to the second heater.
5. A sensor system according to claim 1, wherein the controller is configured to detect if there is no measured value of the targeted environmental parameter.
6. A sensor system according to claim 5, wherein the controller is configured to switch on the first heater.
7. A sensor system according to claim 1, wherein the controller is configured to analyse the measured value and if the measured value exceeds a predetermined threshold limit the controller is configured to switch on the second heater.
8. A sensor system according to claim 7, wherein the controller is configured to switch on both the first and second heaters if the measured value exceeds the predetermined threshold limit.
9. A sensor system according to claim 1, wherein the controller is configured to: store a set of measured values; analyse a predetermined number of recent measured values from the set of measured values; and determine which of the first and second heaters to be switched on based on the analysed results of the predetermined number of recent measured values.
10. A sensor system according to claim 9, wherein the controller is configured to switch on the first heater if the controller determines from the analysed results that there are no measured values or the measured values are less than a pre-determined threshold limit.
11. A sensor system according to claim 9, wherein the controller is configured to switch on the second heater or both the first and second heaters if the controller determines from the analysed results that the measured values are more than a pre-determined threshold limit.
12. A sensor system according to claim 1, wherein the environmental sensor comprises: a substrate comprising an etched portion; a dielectric region on the substrate, the dielectric region being formed such that a dielectric membrane is formed adjacent the etched portion; wherein the first and second heaters are formed in or on the dielectric membrane.
13. A sensor system according to claim 1, wherein the environmental sensor comprises: a substrate comprising a first etched portion and a second etched portion; a dielectric region on the substrate, the dielectric region being formed such that a first dielectric membrane is formed adjacent the first etched portion and a second dielectric membrane is formed adjacent the second etched portion; wherein the first heater is formed in or on the first dielectric membrane, and the second heater is formed in or on the second dielectric membrane.
14. A sensor system according to claim 12, wherein the dielectric membrane is formed by any one of: back-etching using Deep Reactive Ion Etching (DRIE) of the substrate, and using anisotropic etching such as Potassium Hydroxide (KOH) or TetraMethyl Ammonium Hydroxide (TMAH).
15. A sensor system according to claim 12, wherein the dielectric membrane comprises: one or more dielectric layers comprising silicon dioxide and/or silicon nitride; one or more layers of spin on glass, and a passivation layer over the one or more dielectric layers.
16. A sensor system according to claim 12, wherein the sensor further comprises: a sensing material in one side of the dielectric membrane; and an electrode between the sensing material and the dielectric membrane.
17. A sensor system according to claim 16, wherein the sensor is a resistive gas sensor.
18. A sensor system according to claim 12, wherein the sensor is a calorimetric gas sensor, wherein a catalyst material is provided which is configured to increase a heater temperature when a targeted gas is present.
19. A sensor system according to claim 1, wherein the sensor is a Non-Dispersive Infrared (NDIR) sensor, wherein the first and second heaters are configured to operate as Infrared (IR) sources.
20. A sensor system according to claim 1, wherein the environmental sensor is a humidity sensor.
21. A sensor system according to claim 1, wherein the first and second heaters are configured to operate in one or more of the following modes: direct current (DC) mode; pulsed mode comprising pulse width modulation (PWM) mode.
22. A sensor system according to claim 21, wherein the heaters are configured to operate using a series of pulses at a different temperature.
23. A sensor system according to claim 21, wherein the controller is configured to: vary pulse frequency, vary duty cycle or the amplitude of the voltage applied to the heaters; and vary the temperature of the heaters.
24. A sensor system according to claim 1, wherein the first and second heaters are configured to operate in an alternative current (AC) mode or a dynamic mode.
25. A sensor system according to claim 24, wherein the controller is configured to detect different species of gases which have different chemical reaction rates.
26. A sensor system according to claim 25, wherein the controller is configured to operate the heaters such that two different gases are distinguished by analysing the chemical reaction rates.
27. A sensor system according to claim 12, wherein the first and second heaters are formed in one or more of the following configurations: concentrically to one another; on top of one another; and laterally spaced to one another.
28. A method for controlling an environmental sensor, the sensor comprising at least a first heater and a second heater, wherein the first heater consumes a lower power compared to the second heater; the method comprising: switching on at least one of the first and second heaters based on a predetermined technique.
29. A method according to claim 28, further comprising: detecting if a measured value of a targeted environmental parameter is present, and switching on at least one of the first and second heaters based on the presence and/or result of the measured value of the targeted environmental parameter.
30. A method according to claim 29, further comprising detecting if there is no measured value of the targeted environmental parameter; and switching on the first heater.
31. A method according to claim 29, further comprising analysing the measured value and if the measured value exceeds a predetermined threshold limit switching on the second heater.
32. A method according to claim 31, further comprising switching on both the first and second heaters.
33. A method according to claim 29, further comprising: storing a set of measured values; analysing a predetermined number of recent measured values from the set of measured values; and determining which of the first and second heaters to be switched on based on the analysed results of the recent measured values.
34. A method according to claim 33, further comprising switching on the first heater if it is determined from the analysed results that there are no measured values or the measured values are less than a pre-determined threshold limit.
35. A method according to claim 33, further comprising switch on the second heater or both the first and second heaters if it is determined from the analysed results that the measured values are more than a pre-determined threshold limit.
Description
BRIEF DESCRIPTION OF THE PREFERRED EMBODIMENTS
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DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
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[0072] When gas is not present, then the small heater 4 will be powered, and the resistance of the sensing material 10 will be measured. If the measured resistance of the material 10 indicates a presence of gas, then heater 2 will be powered instead and the resistance of sensing material 9 measured.
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[0080] It should be noted that during operation when the larger heaters are operated, the smaller heaters may also be operated to improve the temperature uniformity within the heater region. Alternately the larger heaters can be on a different layer than the smaller heater allowing a more complicated design than just a ring to be made. Besides this many number and combination of heaters and heater designs are possible.
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[0090] The skilled person will understand that in the preceding description and appended claims, positional terms such as ‘above’, ‘below’, ‘front’, ‘back’, ‘vertical’, ‘underneath’ etc. are made with reference to conceptual illustrations of a semiconductor device, such as those showing standard cross-sectional perspectives and those shown in the appended drawings. These terms are used for ease of reference but are not intended to be of limiting nature. These terms are therefore to be understood as referring to a semiconductor device when in an orientation as shown in the accompanying drawings.
[0091] Although the invention has been described in terms of preferred embodiments as set forth above, it should be understood that these embodiments are illustrative only and that the claims are not limited to those embodiments. Those skilled in the art will be able to make modifications and alternatives in view of the disclosure which are contemplated as falling within the scope of the appended claims. Each feature disclosed or illustrated in the present specification may be incorporated in the invention, whether alone or in any appropriate combination with any other feature disclosed or illustrated herein.