BOARD TERMINAL
20170346203 · 2017-11-30
Assignee
Inventors
Cpc classification
H01R12/585
ELECTRICITY
International classification
Abstract
A board terminal includes a metal wire material with a first end and a second end, the metal wire material including: a middle part that is between the first end and the second end, a connecting part that is at the first end and that is configured to be connected to a mating member, and a conductive part that is at the second end and that is configured to be inserted through a through-hole of a printed circuit board and is made to be conductive with an electrically conductive path, wherein: a first side edge of the connecting part is cut away from the first end toward the middle part for a specified length between the first end and the second end, and a width of the connecting part is narrower than the middle part, and a pressing part is formed by a step surface that is between the connecting part and the middle part.
Claims
1. A board terminal comprising: a metal wire material with a first end and a second end, the metal wire material including: a middle part that is between the first end and the second end, a connecting part that is at the first end and that is configured to be connected to a mating member, and a conductive part that is at the second end and that is configured to be inserted through a through-hole of a printed circuit board and is made to be conductive with an electrically conductive path, wherein: a first side edge of the connecting part is cut away from the first end toward the middle part for a specified length between the first end and the second end, and a width of the connecting part is narrower than the middle part, and a pressing part is formed by a step surface that is between the connecting part and the middle part.
2. The board terminal as set forth in claim 1, further comprising: a plating layer formed of conductive metal that is provided on a surface of the metal wire material, wherein: the metal wire material is provided with the first side edge and a second side edge that are opposite to each other in a direction perpendicular to a length direction; the second side edge is cut away from the conductive part from the second end toward the middle part for a specified length, and the conductive part is provided with a soldering part having a width narrower than that of the middle part, and a board abutment part is formed by a step surface formed between the conductive part and the middle part.
3. The board terminal as set forth in claim 1, wherein: the conductive part is provided with a pressure contact part that is configured to be press-fitted into the through-hole of the printed circuit board and connected by pressure contact to the electrically conductive path of the printed circuit board.
4. The board terminal as set forth in claim 1, wherein: the metal wire material has a rectangular cross section.
5. The board terminal as set forth in claim 2, wherein: the metal wire material has a rectangular cross section.
6. The board terminal as set forth in claim 3, wherein: the metal wire material has a rectangular cross section.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Various exemplary aspects of the disclosure will be described with reference to the drawings, wherein:
[0022]
[0023]
[0024]
[0025]
[0026]
[0027]
DETAILED DESCRIPTION OF EMBODIMENTS
[0028] Hereafter, exemplary aspects of the disclosure are explained with reference to the drawings.
[0029] First,
[0030] A rectangular metal wire material that forms the hoard terminal 10 is a wire material that is formed of copper alloy or the like and extends in a substantially constant rectangular cross-sectional shape. Furthermore, an undepicted plating layer is provided over the entire surface on a circumference of the rectangular metal wire material. Such a plating layer is formed such that tin or the like is layered and plated on an underlayer plating such as copper, nickel, or the like. In addition, the rectangular metal wire material is provided with a first side edge 18 and a second side edge 20 that are opposite to each other in a direction perpendicular to the axial direction, that is, in a plate width direction (right/left direction in
[0031] As shown in
[0032] As shown in
[0033] According to the thus-constituted board terminal 10, by cutting away the first side edge 18 of the connecting part 14 by a substantially constant width from the tip end toward the middle part 12 for a specified length, the width of the connecting part 14 is formed to be narrower than that of the middle part 12, and the pressing part 22 is constituted by a step surface that extends between the connecting part 14 and the middle part 12 in a direction perpendicular to the axial direction. Thus, while reducing the width dimension of the connecting part 14, the pressing part 22 can be pressed, and the conductive part 16 can be stably insertingly arranged through the through-hole 32 of the printed circuit board 30. Thus, compared to a case in which the tip end of the connecting part 14 is pressed and the board terminal is insertingly arranged through the through-hole 32, as with a conventional board terminal formed of a metal wire material, a pressing force is not applied to the connecting part 14. Therefore, even when the width dimension of each of the connecting parts 14 is thin, and the size is small, the problem of deformation of the connecting parts 14 can be alleviated or eliminated, and the board terminals 10 can be stably insertingly arranged through the through-holes 32 of the printed circuit board 30. Furthermore, only the first side edges 18 of the connecting parts 14 are cut away, so compared to a conventional case in which both side edges are cut away and the pressing parts 22 are arranged to protrude at both sides of the connecting parts 14, the board terminals 10 can be formed with a good yield, and the board terminals 10 can be aligned at a more narrow interval on the printed circuit board 30. Because of this, this can also advantageously handle demands for miniaturization of mating connectors connected to the connecting parts 14, and for mating connectors with increased density. Additionally, by changing the cutting widths at which the first side edges 18 of the connecting parts 14 are cut, the board terminals 10 can also be formed with connecting parts 14 with various sizes and in which a mold is commonly used for metal wire materials using the same specifications. Thus, component maintenance and operation efficiency can also be advantageously improved.
[0034] Additionally, at the connecting parts 14 and the conductive parts 16 of the board terminals 10, the first side edges 18 and the second side edges 20 facing each other in a direction perpendicular to the axial direction are respectively cut away. Thus, the connecting parts 14 and the conductive parts 16 are protrudingly arranged respectively on both sides, in the length direction, of the terminals 10, with the middle parts 12 sandwiched therebetween, at positions that are opposite each other in a direction perpendicular to the axial direction, and the pressing parts 22 and the board abutment parts 26 are also provided. Thus, the soldering parts 24 of the conductive parts 16 that are inserted through the through-holes 32 of the printed circuit board 30 and soldered can be arranged directly under the pressing parts 22, and the board terminals 10 can be effectively pressed and insertingly arranged through the through-holes 32 of the printed circuit board 30. Furthermore, the metal wire material has a rectangular cross section, so the pressing parts 22 and the board abutment parts 26 can also be made to have a rectangular cross section and can be constituted with cross-sectional areas of sufficient width. Thus, when the pressing parts 22 are pressed, workability can be made suitable, and strength of the board abutment parts 26 can be advantageously maintained. In addition, a plating layer formed of conductive metal is provided on the surface of the metal wire material. Thus, even if the soldering parts 24 are arranged by cutting away the second side edges 20 of the conductive parts 16 that are inserted through the through-holes 32 and soldered, the plating layers still remain on other surfaces of the conductive parts 16. Thus, plating is not needed later, and soldering can be suitably realized. Furthermore, the soldering parts 24 are formed by cutting away the second side edges 20 of the conductive parts 16 so as to make the widths narrower. Thus, this can also advantageously handle mounting of the board terminals 10 on the printed circuit board 30 via the through-holes 32, and printed wiring with increased density. Additionally, uprightness of the board terminals 10 on the printed circuit board 30 is stably maintained.
[0035] Exemplary aspects of the disclosure are described in detail above, but this disclosure is not limited to these specific descriptions. For example, the cross-sectional shape of the metal wire material is not limited to a rectangular cross section. Upon considering rigidity of the board terminals 10, board space, and the like that are demanded, an arbitrary shape, such as a round shape or an elliptical shape, can be adopted. Even in that case, at the connecting parts 14 and the conductive parts 16 of the board terminals 10, the first side edges 18 and the second side edges 20 that face each other in a direction perpendicular to the axial direction are respectively cut away; thus, the connecting parts 14 and the conductive parts 16 are protrudingly arranged at respective positions that are opposite to each other in a direction perpendicular to the axial direction, and the pressing parts 22 and the board abutment parts 26 are arranged. Therefore, it is clear that operation effects of this disclosure can be seen in the same manner.
[0036] Additionally, in the above-mentioned first exemplary aspect, the soldering parts 24 of the conductive parts 16 are inserted through the through-holes 32 arranged in the printed circuit board 30 and soldered; thus, they are electrically connected to undepicted printed wiring or the like that is an electrically conductive path formed on the printed circuit board 30. However, for example, as shown by board terminals 42 of the second exemplary aspect of
[0037] Additionally, in the above-mentioned exemplary aspect, plating layers formed of conductive metal are provided on the surfaces of the metal wire material, but this is not needed. For example, a plating layer can be arranged by post plating.