Elongated modular heatsink with coupled light source

Abstract

An elongated heatsink structure retaining single and/or bi-directional light sources that receive variable power input(s) through at least one endcap coupled to the elongated heatsink structure.

Claims

1. A structure comprising: an elongated heatsink that is unitarily formed and displays a solid core with a longitudinal opening extending from one end of the elongated heatsink to the other end; a plurality of heat dissipating fins unitarily coupled to the core of the elongated heatsink; a plurality of light sources coupled to at least one exterior surface of the elongated heatsink; a conductor that extends a length of the longitudinal opening of the elongated heatsink; and an endcap that is electrically coupled to at least one end of the elongated heatsink, wherein a portion of heat generated by at least one of the plurality of light sources is conveyed through the core of the elongated heatsink directly to most of the plurality of the heat dissipating fins, and the endcap includes a circuitry that conveys power and/or data to at least one of the plurality of light sources.

2. The elongated heatsink structure of claim 1, wherein intensity output of at least one of the plurality of light sources exceeds intensity output of another one of the plurality of light sources of a common elongated heatsink structure.

3. The elongated heatsink structure of claim 1, wherein at least one of the plurality of light sources can be independently controlled for at least one of on/off, dimming, and/or color operation modulation.

4. The elongated heatsink structure of claim 1, wherein at least one of: a color temperature and/or a color rendering index (CRI) of one of the plurality of light sources is different from that of another one of the plurality of light sources.

5. The elongated heatsink structure of claim 1, wherein at least one of the plurality of light sources emits photonic energy having wavelength within the ultraviolet spectrum.

6. The elongated heatsink structure of claim 5, further comprising at least one processor coupled to at least one of: a communication device, a sensing device, a power storage device, and an output device.

7. The elongated heatsink structure of claim 6, wherein the at least one processor is coupled to the communication device and at least one of: the sensing device, the power storage device, and the output device, such that the at least one of the sensing device, the power storage device, and the output device is addressable by the communication device for at least one of power, data, or a combination of both.

8. A structure comprising: an elongated heatsink that is unitarily formed and displays a solid core with a longitudinal opening extending from one end of the elongated heatsink to the other end; a plurality of heat dissipating fins unitarily coupled to the core of the elongated heatsink; a plurality of light sources coupled to at least one exterior surface of the elongated heatsink; at least one conductor that extends a length of the opening in the elongated heatsink; and an endcap that is electrically coupled to at least one end of the elongated heatsink, wherein a portion of heat generated by the at least one of the plurality of light sources is conveyed through the solid core of the elongated heatsink directly to most of the plurality of the heat dissipating fins, and the endcap provides electrical connectivity to the elongated heatsink, and conveys power and/or data to at least two of the plurality of light sources which are disposed at opposing sides of the elongated heatsink.

9. The elongated heatsink structure of claim 8, wherein at least one light source output exceeds another coupled light source of a common elongated heatsink structure.

10. The elongated heatsink structure of claim 8, wherein at least one light source can be independently controlled for at least one of on/off, dimming, and/or color operation modulation.

11. The elongated heatsink structure of claim 8, wherein at least one of: a light color temperature and/or a color rendering index (CRI) of one of the at least one light source of the plurality of light sources is different from that of another of the at least one light source of the plurality of light sources.

12. The elongated heatsink structure of claim 8, wherein at least one light source of the plurality of light sources at least one light source emits photonic energy in an the bandwidth of ultraviolet band.

13. The elongated heatsink structure of claim 8, wherein further comprising at least one processor coupled to at least one of: a communication device, a sensing device, a power storage device, and an output device, as at least one coupled device.

14. The elongated heatsink structure of claim 13, wherein the at least one coupled device is addressable by the communication device.

15. An elongated heatsink structure comprising: a heatsink that is unitarily formed and displays a solid core with a longitudinal opening extending from one end of the heatsink to the other end; a plurality of heat dissipating fins unitarily coupled to the core of the heatsink; a plurality of light sources coupled to at least one exterior surface of the heatsink; at least one conductor that extends the length of the opening in the heatsink; and an endcap that electrically is electrically coupled to at least one end of the heatsink, wherein a portion of heat generated by the at least one light source of the plurality of light sources is conveyed through the solid core of the heatsink directly to most of the plurality of the heat dissipating fins, and the endcap provides electrical connectivity to the elongated heatsink structure, and conveys power and/or data to different light sources of the plurality of light sources that are disposed on a same retaining surface of the elongated heatsink structure.

16. The elongated heatsink structure of claim 15, wherein the at least one light source can be independently controlled for at least one of on/off, dimming, and/or color operation modulation.

17. The elongated heatsink structure of claim 15, wherein at least one of: a light color temperature and/or a color rendering index (CRI) of one of the at least one light source of the plurality of light sources is different from that of another of the at least one light source of the plurality of light sources.

18. The elongated heatsink structure of claim 15, wherein at least one light source of the plurality of light sources at least one light source emits photonic energy in an the bandwidth of ultraviolet band.

19. The elongated heatsink structure of claim 15, wherein further comprising at least one processor coupled to at least one of: a communication device, a sensing device, a power storage device, and an output device, as at least one coupled device.

20. The elongated heatsink structure of claim 19, wherein the at least one coupled device is addressable by the communication device for at least one of power, data, or a combination of both.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) The detailed description particularly refers to the following figures, in which:

(2) FIGS. 1A, 1B, and 1C show typical lighting industry endcap connectors;

(3) FIG. 2 shows a power/data circuitry diagram of the elongated heatsink coupled to top and bottom light sources and disposed inside a luminaire;

(4) FIG. 3 shows a power/data circuitry diagram for a bottom mounted light source receiving power/data from a single endcap;

(5) FIG. 4 shows a power/data circuitry diagram for a bottom mounted light source having different type light sources receiving power/data from two endcaps; and

(6) FIG. 5 shows a power/data circuitry diagram with top and bottom light sources wherein the top and bottom light sources have different spacing.

DETAILED DESCRIPTION

(7) FIGS. 1A, 1B and 1C illustrate exemplary endcap electromechanical connectors 12a, 12b, 12c, respectively, used with fluorescent lighting devices. FIG. 1A shows a bi-pin connector 12a configuration, known as either G5, or G13, where G historically referred to ‘glass’ material used for the original bulbs and numeral after G refers to a pin spread, or pitch, of pins 87 in millimeters (mm). The G5 endcap connector is associated with the T5 fluorescent lamp and the G13 endcap connector is associated with the T8, T10, and T12 fluorescent lamps. The designation T stands for the lamp shape being ‘tubular’ and the numbers 5, 8, and 12 stand for the lamp's diameter divided by 8. Following this designation, the T5 lamp diameter is ⅝″, the T8 lamp diameter is 1.0″, and the T12 lamp diameter is 1.5″.

(8) Among the endcaps' electromechanical connectors 12a, 12b, and 12c, shown in FIGS. 1A, 1B and 1C, the bi-pin endcap connector 12a typically carries the lowest lamp wattage. Nonetheless, this endcap connector 12a is the most widely used endcap connector.

(9) FIG. 1B shows a single pin connector 12b configuration known as Fa8. The Fa8 endcap connector is commonly used with T8, T10 and T12 lamps. The connector 12b wattage conveyed to the lamp ranges from normal to high output, such as with luminous flux between 1 and 12000 lumen. This connector 12b is coupled to F48 and F96 lamps. The F stands for ‘fluorescent’ and the number following “F” stands for the length of the tube measured in inches.

(10) FIG. 1C shows a double recessed connector 12c configuration, known also as Recessed Direct Contact (RDC). The RDC connector 12c is typically used with lamps requiring high and very high power output. The RDC connector 12c is used with T10 and T12 lamps with length extending up to 96″ (8 feet).

(11) The light intensity output per linear foot of the present disclosure can exceed the light intensity output generated by each of the above-referenced fluorescent lamps, such as T8, T10, T12, F48, and F96, employing the G5, G13, Fa8, and the RDC endcap connectors.

(12) FIG. 2 shows a power/data circuitry diagram of an elongated heatsink structure 10 coupled to top and bottom light sources 1, 54 and disposed inside a luminaire or luminaire housing 44. House power 88 in this circuitry configuration is distributed through an enclosure/junction box 33 to two drivers 18 and at least one of: a processor/controller 51, a power management module 52, a memory storage device 53, and a communication device 57. The processor/controller 51 can be coupled to at least one sensing device 49. In an example configuration, the processor/controller 51 can be coupled to an occupancy sensor. Low voltage conductors shown between the processor/controller 51 and the sensing device 49 provide power to and carry signal from the sensing device. The low voltage conductors shown between the processor/controller 51 and the drivers 18 transmit control signal to the drivers 18. The control signal can include on/off and/or dim command. Conductors originating from each of the two drivers 18 couple to lamp holders 89 at opposite ends of the luminaire 44. The elongated heatsink structure 10 with the endcaps 12 coupled thereto at both ends, detachably couples to the lamp holders 89 engaging the endcaps' bi-pins 87 inside retaining grooves in the lamp holders 89; where element 12 illustrates an example endcap, such as, but not limited to, the endcap configurations 12a, 12b, and 12c described in reference to FIGS. 1A, 1B, and 1C. In the present configuration, the lamp holders 89 provide both mechanical and electrical connectivity. For illustration purposes, the example configuration of FIG. 2 shows one driver 18 providing power to one of the light sources 1, 54, e.g., the light source coupled to the top of the elongated heatsink structure 10, and another driver 18 providing power to a different one of the light sources 1, 54, e.g., the light source coupled to the bottom of the elongated heatsink structure 10. In other examples, one driver 18 can provide power to a plurality of light sources 1, 54 coupled to a plurality of elongated heatsink structures 10 disposed inside the luminaire 44. Further, the light sources 1, 54 can be locally controlled and/or be communicatively coupled to a remote controller and/or the neighboring devices.

(13) FIG. 3 shows a power/data circuitry diagram of the elongated heatsink structure 10 coupled to a bottom light source 1, 54 and disposed inside the luminaire 44. House power 88 in the circuitry configuration of FIG. 3 is distributed through an enclosure/junction box 33 to a single driver 18 and at least one of: a processor/controller 51, a power management module 52, a memory storage device 53, and a communication device 57. The processor/controller 51 can be coupled to at least one sensing device 49. In an example configuration the processor/controller 51 is coupled to an occupancy sensor. Low voltage conductors shown between the processor/controller 51 and the sensing device 49 provide power to and carry signal from the sensing device 49. Low voltage conductors shown between the processor/controller 51 and the driver 18 transmit control signal(s) to the driver 18. The control signal(s) can include on/off and/or dim command. Conductors originating from the driver 18 couple to lamp holders 89 at one end of the luminaire 44. This lamp holder 89 conveys power and/or data to the elongated heatsink structure 10 light source 1, also providing a mechanical connectivity for the same elongated heatsink structure 10. The lamp holder 89 disposed at the opposite end of the luminaire 44 provides mechanical connectivity for the elongated heatsink structure 10; and in some embodiments, may provide only mechanical connectivity. The pins 87 of the endcap 12 detachably couple to the lamp holders 89 by mechanically engaging retaining grooves in the lamp holders 89. For illustration purposes, the configuration of FIG. 4 shows a single driver 18 providing power and/or data to a single light source 1 coupled to the bottom surface of the elongated heatsink structure 10. Actually, the driver 18 can provide power to a plurality of light sources 1 coupled to a plurality of elongated heatsinks structures 10 disposed inside the luminaire 44. Further, the light sources 1 can be locally controlled and/or be communicatively coupled to a remote controller and/or the neighboring devices.

(14) FIG. 4 shows a power/data circuitry diagram of the elongated heatsink structure 10 coupled to the bottom light source 1, 54 and disposed inside the luminaire 44. House power 88 in the circuitry configuration of FIG. 4 is distributed through an enclosure/junction box to two drivers 18 and at least one of: a processor/controller 51, a power management module 52, a memory storage device 53 with code 56 (such as written instructions), and a communication device 57. The processor/controller 51 can be coupled to at least one sensing device 49. In an example configuration the processor/controller 51 is coupled to an occupancy sensor. Low voltage conductors shown between the processor/controller 51 and the sensing device 49 provide power to and carry signal from the sensing device 49. Low voltage conductors shown between the processor/controller 51 and the drivers 18 transmit control signal(s) to the drivers 18. The control signal(s) can include on/off and/or dim command. Conductors originating from each of the two drivers 18 couple to the lamp holders 89 at opposite ends of the luminaire 44. The elongated heatsink structure 10, with the endcaps 12 coupled thereto at both ends, detachably couples to the lamp holders 89 engaging the pins 87 of the endcap 12 inside retaining grooves in the lamp holders 89. In the present configuration, the lamp holders 89 provide both mechanical and electrical connectivity. For illustration purposes, the configuration of FIG. 4 shows a single driver 18 providing power and/or data to a distinct light source 1 coupled to the bottom surface of the elongated heatsink structure 10 and another driver 18 providing power and/or data to a different light source 1 also coupled to the bottom surface of the elongated heatsink structure 10. The at least two light sources can include different parameters of at least one of: color temperature, color rendering index (CRI) and lumen output from those of one another. In an example, a driver 18 can provide power to a plurality of light sources 1 coupled to a plurality of elongated heatsink structures 10 disposed inside the luminaire 44. For example, the first driver provides power to “white” ambient light source wherein the other driver provides power to the UV bacteria/virus disabling light source. The control of the drivers is by the local processor/controller employing sensing device/s and is communicatively coupled to remote controller/s. Further, the light sources 1 can be locally controlled at least in part by neighboring devices.

(15) FIG. 5 shows a power/data circuitry diagram of the elongated heatsink structure 10 coupled to the top and bottom light sources 1, 54 and disposed inside the luminaire 44. House power 88 in the circuitry of FIG. 5 configuration is distributed through an enclosure/junction box to a single driver 18 and at least one of: a processor/controller 51, a power management module 52, a memory storage device 53, and a communication device 57. The processor/controller 51 can be coupled to at least one sensing device 49. In an example configuration, the processor/controller 51 is coupled to an occupancy sensor. Low voltage conductors shown between the processor/controller 51 and the sensing device 49 provide power to and carry signal from the sensing device. Low voltage conductors shown between the processor/controller 51 and the driver 18 transmit signal to the driver 18. The signal can include on/off and/or dim command. Conductors originating from the driver 18 couple to the lamp holders 89 at one end of the luminaire 44. The lamp holder 89 conveys power and/or data to the elongated heatsink structure 10 light source 1 also providing a mechanical connectivity for the same elongated heatsink structure 10. The lamp holder 89 disposed at the opposite end of the luminaire 44 provides mechanical connectivity for the elongated heatsink structure 10; and in some embodiments may only provide mechanical connectivity. The pins 87 of the endcap 12 detachably couple to the lamp holders 89 by mechanically engaging retaining grooves in the lamp holders 89. For illustration purposes, the configuration of FIG. 5 shows a single driver 18 providing power and/or data to top and bottom light sources 1 coupled to the elongated heatsink structure 10. In this example, power and/or data is conveyed by the conductor from the pins 87 of the endcap 12 to the top and bottom coupled light sources 1, 54. As shown in FIG. 5, the top LED light sources 1, 54 are spaced farther apart than the bottom coupled LED light sources 1, 54. In this example of differently spaced LED units, the driver 18 provides equal power to each of the top and bottom coupled light sources 1, 54; however, the bottom coupled light source 1, 54 is configured to generate higher light output. While this example depicts a single elongated heatsink structure 10 with two coupled light sources 1, 54, the driver 18 can provide power to a plurality of light sources 1 coupled to a plurality of elongated heatsinks structures 10 disposed inside the luminaire 44. Further, the light sources 1 can be locally controlled and/or be communicatively coupled to a remote controller and/or the neighboring devices.

(16) While the concepts of the present disclosure are susceptible to various modifications and alternative forms, specific exemplary embodiments are been shown by way of example in the drawings and will be described. It should be understood, however, that there is no intent to limit the concepts of the present disclosure to the particular forms disclosed; on the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the appended claims.

(17) References in the specification to “one embodiment,” “an embodiment,” “an illustrative embodiment,” etc., indicate that the described embodiment may include a particular feature, structure, or characteristic, but every embodiment may or may not necessarily include that particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same embodiment. Further, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is submitted that it is within the knowledge of one skilled in the art to effect such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described. Additionally, it should be appreciated that items included in a list in the form of “at least one A, B, and C” can mean (A); (B); (C): (A and B); (B and C); (A and C); or (A, B, and C). Similarly, items listed in the form of “at least one of A, B, or C” can mean (A); (B); (C): (A and B); (B and C); (A and C); or (A, B, and C).

(18) The disclosed embodiments may be implemented, in some cases, in hardware, firmware, software, or any combination thereof. The disclosed embodiments may also be implemented as instructions carried by or stored on one or more transitory or non-transitory machine-readable (e.g., computer-readable) storage medium, which may be read and executed by one or more processors. A machine-readable storage medium may be embodied as any storage device, mechanism, or other physical structure for storing or transmitting information in a form readable by a machine (e.g., a volatile or non-volatile memory, a media disc, or other media device).

(19) In the drawings, some structural or method features may be shown in specific arrangements and/or orderings. However, it should be appreciated that such specific arrangements and/or orderings may not be required. Rather, in some embodiments, such features may be arranged in a different manner and/or order than shown in the illustrative figures. Additionally, the inclusion of a structural or method feature in a particular figure is not meant to imply that such feature is required in all embodiments and, in some embodiments, may not be included or may be combined with other features.

(20) While the disclosure has been illustrated and described in detail in the drawings and foregoing description, such an illustration and description is to be considered as exemplary and not restrictive in character, it being understood that only illustrative embodiments have been shown and described and that all changes and modifications that come within the spirit of the disclosure are desired to be protected.

(21) There are a plurality of advantages of the present disclosure arising from the various features of the method, apparatus, and system described herein. It will be noted that alternative embodiments of the method, apparatus, and system of the present disclosure may not include all of the features described yet still benefit from at least some of the advantages of such features. Those of ordinary skill in the art may readily devise their own implementations of the method, apparatus, and system that incorporate one or more of the features of the present invention and fall within the spirit and scope of the present disclosure as defined by the appended claims.

(22) TABLE-US-00001 Element List   1 Light source 3 Rack 4 Ceiling 5 Floor 10 Heat sink 11 Light source modules 12 Endcap receptacle 13 Fin/s 14 Mechanical key 15 Conductor(s) 16 Bore 18 Driver and/or another device/s 33 J box 34 J box cover 35 Release button/latch 36 Conduit 37 Power or power and data receptacle 39 Knockout opening 40 Cable or chain hanging opening 41 Anchoring protrusion 43 Heatsink core 44 Luminaire 47 Power or power and data entry 49 Occupancy sensor 51 Processor/controller 52 Power management module/power supply 53 Memory storage device 54 UV/GUV light source 55 Camera 56 Code 57 Communication device 58 Micro switch 59 Indicator light 60 Sound emitting/receiving device 61 Power and/or data conductor 62 Electronic device 63 Wireless device 64 Plate joiner 65 Sensing device 66 Saddle joiner 67 Hanger 68 Dip switch 70 Local power and/or power and data conductor 71 Mechanical fastener 72 Slotted bore 73 Keyed joiner opening 74 Mechanical protrusion/s 75 Device receptacle 76 Device power and data port 77 Receptacle recess 78 Saddle wall, vertical wall 79 Saddle device mounting surface 80 Joiner top surface 81 Joiner bottom surface 82 Plate top surface 83 Plate bottom surface 84 Dip switch opening 85 Through line power and/or data 86 Local power and/or data 87 Pin 88 House power 89 Lamp holder