Electronic apparatus and method for manufacturing the same

09832880 · 2017-11-28

Assignee

Inventors

Cpc classification

International classification

Abstract

An electronic apparatus and a method for manufacturing the same are disclosed. The electronic device of the present invention comprises: a substrate with a first surface and a second surface; an electronic unit layer disposed on the first surface of the substrate; a residue layer disposed on the second surface of the substrate, wherein a material of the residue layer comprises: a compound containing at least one functional group selected from the group consisting of aryl, nitro and ketone.

Claims

1. An electronic apparatus, comprising: a substrate with a first surface and a second surface corresponding to each other; an electronic unit layer disposed on the first surface of the substrate; and a residue layer disposed on the second surface of the substrate, wherein a material of the residue layer comprises: a compound containing at least one selected from a group consisting of aryl, nitro and ketone; wherein the material of the residue layer comprises: at least one derivative of a material represented by the following formula (I) or (II) obtained after a radiation: ##STR00048## wherein Z.sub.1 is selected from a group consisting of O, S, N, C(R.sub.c).sub.2, and a bond; Z.sub.2 is selected from a group consisting of O, S, and N; Z.sub.3 is HPO.sub.3 or SO.sub.3; R.sub.a is selected from a group consisting of: ##STR00049## ##STR00050## ##STR00051## wherein * represents a bonding site; each R.sub.1 independently is selected from a group consisting of C.sub.1-6 alkyl, C.sub.1-6 haloalkyl, C.sub.1-6 alkoxy, —OH, —SH, —COOH, halogen, substituted C.sub.1-6 alkyl, substituted C.sub.1-6 alkoxy, C.sub.2-6 alkenyl, —CN, —NO.sub.2, saturated or unsaturated 5 or 6-membered heterocyclic group containing at least one hetero atom, —N(R.sub.5).sub.2, and aryl, wherein the heterocyclic group or the aryl is selectively substituted or unsubstituted with a functional group; each R.sub.2 independently is selected from a group consisting of hydrogen, C.sub.1-6 alkyl, C.sub.1-6 haloalkyl, C.sub.1-6 alkoxy, —OH, —COOH, halogen, substituted C.sub.1-6 alkyl, substituted C.sub.1-6 alkoxy, C.sub.2-6 alkenyl, —CN, —NO.sub.2, and aryl, wherein the aryl is selectively substituted or unsubstituted with a functional group; each R.sub.3 independently is selected from a group consisting of C.sub.1-6 alkyl, C.sub.1-6 haloalkyl, and aryl, wherein the aryl is selectively substituted or unsubstituted with a functional group; each R.sub.4 independently is selected from a group consisting of C.sub.1-6 alkyl, C.sub.1-6 haloalkyl, halogen and —OH; each R.sub.5 independently is hydrogen or C.sub.1-6 alkyl; X is O or S; n is an integer ranging from 0 to 5; m is an integer ranging from 0 to 4; l is an integer ranging from 0 to 3; and k is an integer ranging from 0 to 2; R.sub.b is —Si(OR.sub.d).sub.3, or ##STR00052## each R.sub.c independently is hydrogen or C.sub.1-6 alkyl; each R.sub.d independently is hydrogen or C.sub.1-6 alkyl; each R.sub.e independently is an aryl substituted or unsubstituted with a functional group; p is an integer ranging from 1 to 5; and q is an integer ranging from 50 to 500.

2. The electronic apparatus as claimed in claim 1, wherein a bending displacement of the substrate is more than 80 mm.

3. The electronic apparatus as claimed in claim 1, wherein the substrate is a thin glass substrate, a polymer substrate, a polymer-metal composite substrate, or a polymer-metal oxide composite substrate.

4. The electronic apparatus as claimed in claim 1, wherein the electronic unit layer is a display unit, a thin film transistor unit, a touch unit, or a combination thereof.

5. The electronic apparatus as claimed in claim 1, wherein the radiation is an UV light radiation.

6. The electronic apparatus as claimed in claim 5, wherein a wavelength of the radiation is in a range from 200 nm to 420 nm.

7. The electronic apparatus as claimed in claim 1, wherein the residue layer is disposed on the second surface of the substrate through a van der Waals' force, a hydrogen bond, or a π-π interaction.

8. An electronic apparatus, comprising: a substrate with a first surface and a second surface corresponding to each other; an electronic unit layer disposed on the first surface of the substrate; and a residue layer disposed on the second surface of the substrate, wherein a material of the residue layer comprises: a compound containing at least one selected from a group consisting of aryl, nitro and ketone; wherein the material of the residue layer comprises: at least one compound selected from a group consisting of: ##STR00053## wherein each R.sub.1independently is selected from a group consisting of C.sub.1-6 alkyl, C.sub.1-6 haloalkyl, C.sub.1-6 alkoxy, —OH, —SH, —COOH, halogen, substituted C.sub.1-6 alkyl, substituted C.sub.1-6 alkoxy, C.sub.2-6 alkenyl, —CN, —NO.sub.2, saturated or unsaturated 5 or 6-membered heterocyclic group containing at least one hetero atom, —N(R.sub.5).sub.2, and aryl, wherein the heterocyclic group or the aryl is selectively substituted or unsubstituted with a functional group; each R.sub.2 independently is selected from a group consisting of hydrogen, C.sub.1-6 alkyl, C.sub.1-6 haloalkyl, C.sub.1-6 alkoxy, —OH, —COOH, halogen, substituted C.sub.1-6 alkyl, substituted C.sub.1-6 alkoxy, C.sub.2-6 alkenyl, —CN, —NO.sub.2, and aryl, wherein the aryl is selectively substituted or unsubstituted with a functional group; each R.sub.5 independently is hydrogen or C.sub.1-6 alkyl; n is an integer ranging from 0 to 5; m is an integer ranging from 0 to 4; and l is an integer ranging from 0 to 3.

9. A method for manufacturing an electronic apparatus, comprising the following steps: (A) providing a carrier with a debonding layer formed thereon, wherein a material of the debonding layer comprises: a siloxane compound or a polyimide compound containing at least one selected from a group consisting of aryl, nitro and ketone; (B) disposing a substrate on the debonding layer to let the debonding layer locate between the substrate and the carrier, wherein the substrate has a first surface and a second surface corresponding to each other, and the second surface contacts the debonding layer; (C) forming an electronic unit layer on the first surface of the substrate; and (D) providing a radiation from a side of the carrier to separate the carrier from the substrate through a reaction of the material of the debonding layer to form an electronic apparatus, wherein the debonding layer is converted into a residue layer forming on the second surface of the substrate, and a material of the residue layer comprises: a compound containing at least one selected from a group consisting of aryl, nitro and ketone; and (E) wherein the material of the debonding layer comprises: at least one compound represented by the following formula (I) or (II): ##STR00054## wherein Z.sub.1 is selected from a group consisting of O, S, N, C(R.sub.c).sub.2, and a bond; Z.sub.2 is selected from a group consisting of O, S, and N; Z.sub.3 is HPO.sub.3 or SO.sub.3; R.sub.a is selected from a group consisting of: ##STR00055## ##STR00056## ##STR00057## wherein * represents a bonding site; each R.sub.1 independently is selected from a group consisting of C.sub.1-6 alkyl, C.sub.1-6 haloalkyl, C.sub.1-6 alkoxy, —OH, —SH, —COOH, halogen, substituted C.sub.1-6 alkyl, substituted C.sub.1-6 alkoxy, C.sub.2-6 alkenyl, —CN, —NO.sub.2, saturated or unsaturated 5 or 6-membered heterocyclic group containing at least one hetero atom, —N(R.sub.5).sub.2, and aryl, wherein the heterocyclic group or the aryl is selectively substituted or unsubstituted with a functional group; each R.sub.2 independently is selected from a group consisting of hydrogen, C.sub.1-6 alkyl, C.sub.1-6 haloalkyl, C.sub.1-6 alkoxy, —OH, —COOH, halogen, substituted C.sub.1-6 alkyl, substituted C.sub.1-6 alkoxy, C.sub.2-6 alkenyl, —CN, —NO.sub.2, and aryl, wherein the aryl is selectively substituted or unsubstituted with a functional group; each R.sub.3 independently is selected from a group consisting of C.sub.1-6 alkyl, C.sub.1-6 haloalkyl, and aryl, wherein the aryl is selectively substituted or unsubstituted with a functional group; each R.sub.4 independently is selected from a group consisting of C.sub.1-6 alkyl, C.sub.1-6 haloalkyl, halogen and —OH; each R.sub.5 independently is hydrogen or C.sub.1-6 alkyl; X is O or S; n is an integer ranging from 0 to 5; m is an integer ranging from 0 to 4; I is an integer ranging from 0 to 3; and k is an integer ranging from0 to 2; R.sub.b is —Si(OR.sub.d).sub.3, or ##STR00058## each R.sub.c independently is hydrogen or C.sub.1-6 alkyl; each R.sub.d independently is hydrogen or C.sub.1-6 alkyl; each R.sub.e independently is an aryl substituted or unsubstituted with a functional group; p is an integer ranging from 1 to 5; and q is an integer ranging from 50 to 500.

10. The method as claimed in claim 9, wherein the material of the residue layer comprises: at least one compound selected from a group consisting of: ##STR00059## wherein each R.sub.1 independently is selected from a group consisting of C.sub.1-6 alkyl, C.sub.1-6 haloalkyl, C.sub.1-6 alkoxy, —OH, —SH, —COON, halogen, substituted C.sub.1-6 alkyl, substituted C.sub.1-6 alkoxy C.sub.2-6 alkenyl, —CN, —NO.sub.2, saturated or unsaturated 5 or 6-membered heterocyclic group containing at least one hetero atom, —N(R.sub.5).sub.2, and aryl, wherein the heterocyclic group or the aryl is selectively substituted or unsubstituted with a functional group; each R.sub.2 independently is selected from a group consisting of hydrogen, C.sub.1-6 alkyl, C.sub.1-6 haloalkyl, C.sub.1-6 alkoxy, —OH, —COON, halogen, substituted C.sub.1-6 alkyl, substituted C.sub.1-6 alkoxy, C.sub.2-6 alkenyl, —CN, —NO.sub.2, and aryl, wherein the aryl is selectively substituted or unsubstituted with a functional group; each R.sub.5 independently is hydrogen or C.sub.1-6 alkyl; n is an integer ranging from 0 to 5; m is an integer ranging from 0 to 4; and l is an integer ranging from 0 to 3.

11. The method as claimed in claim 9, wherein R.sub.a is selected from a group consisting of: ##STR00060##

12. The method as claimed in claim 9, wherein a bending displacement of the substrate is more than 80 mm.

13. The method as claimed in claim 9, wherein the substrate is a thin glass substrate, a polymer substrate, a polymer-metal composite substrate, or a polymer-metal oxide composite substrate.

14. The method as claimed in claim 9, wherein the electronic unit layer is a display unit, a thin film transistor unit, a touch unit, or a combination thereof.

15. The method as claimed in claim 9, wherein the radiation is an UV light radiation.

16. The method as claimed in claim 9, wherein a wavelength of the radiation is in a range from 200 nm to 420 nm.

17. The method as claimed in claim 9, wherein the carrier has a light transmittance larger than 30%.

18. The method as claimed in claim 9, wherein the carrier is a glass carrier, a quartz carrier, or a plastic carrier.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1A to FIG. 1E are cross-sectional views showing a process for manufacturing an electronic apparatus according to one preferred embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

(2) The present invention has been described in an illustrative manner, and it is to be understood that the terminology used is intended to be in the nature of description rather than of limitation. Many modifications and variations of the present invention are possible in light of the above teachings. Therefore, it is to be understood that within the scope of the appended claims, the invention may be practiced otherwise than as specifically described.

(3) Hereinafter, the electronic apparatus and the method for manufacturing the same of one preferred embodiment of the present invention are illustrated in detail according to FIG. 1A to FIG. 1E.

(4) First, as shown in FIG. 1A, a carrier 11 is provided, which can be a glass carrier, a quartz carrier, or a plastic carrier known in the art, and has a light transmittance larger than 30%. In the present embodiment, a glass substrate or a plastic substrate having high light transmittance is used.

(5) Then, a debonding layer 12 is formed on the carrier 11 through dip coating, roll coating, print coating, spin coating, or deposition, wherein the material of the debonding layer 12 comprises: a siloxane compound or a polyimide compound containing at least one selected from a group consisting of aryl, nitro and ketone. The specific examples of the material of the debonding layer 12 comprise: at least one compound represented by the following formula (I) or (II):

(6) ##STR00039## wherein Z.sub.1 is selected from a group consisting of O, S, N, C(R.sub.c).sub.2, and a bond; Z.sub.2 is selected from a group consisting of O, S, and N; Z.sub.3 is HPO.sub.3 or SO.sub.3; R.sub.a is selected from a group consisting of:

(7) ##STR00040## ##STR00041## ##STR00042##

(8) wherein * represents a bonding site;

(9) each R.sub.1 independently is selected from a group consisting of C.sub.1-6 alkyl, C.sub.1-6 haloalkyl, C.sub.1-6 alkoxy, —OH, —SH, —COOH, halogen, substituted C.sub.1-6 alkyl, substituted C.sub.1-6 alkoxy, C.sub.2-6 alkenyl, —CN, —NO.sub.2, saturated or unsaturated 5 or 6-membered heterocyclic group containing at least one hetero atom, —N(R.sub.5).sub.2, and aryl, wherein the heterocyclic group or the aryl is selectively substituted or unsubstituted with a functional group;

(10) each R.sub.2 independently is selected from a group consisting of hydrogen, C.sub.1-6 alkyl, C.sub.1-6 haloalkyl, C.sub.1-6 alkoxy, —OH, —COOH, halogen, substituted C.sub.1-6 alkyl, substituted C.sub.1-6 alkoxy, C.sub.2-6 alkenyl, —CN, —NO.sub.2, and aryl, wherein the aryl is selectively substituted or unsubstituted with a functional group;

(11) each R.sub.3 independently is selected from a group consisting of C.sub.1-6 alkyl, C.sub.1-6 haloalkyl, and aryl, wherein the aryl is selectively substituted or unsubstituted with a functional group;

(12) each R.sub.4 independently is selected from a group consisting of C.sub.1-6 alkyl, C.sub.1-6 haloalkyl, halogen and —OH;

(13) each R.sub.5 independently is hydrogen or C.sub.1-6 alkyl;

(14) X is O or S;

(15) n is an integer ranging from 0 to 5;

(16) m is an integer ranging from 0 to 4;

(17) l is an integer ranging from 0 to 3; and

(18) k is an integer ranging from 0 to 2; R.sub.b is —Si(OR.sub.d).sub.3, or

(19) ##STR00043## each R.sub.c independently is hydrogen or C.sub.1-6 alkyl; each R.sub.d independently is hydrogen or C.sub.1-6 alkyl; each R.sub.e independently is an aryl substituted or unsubstituted with a functional group; p is an integer ranging from 1 to 5; and q is an integer ranging from 50 to 500.

(20) In the present embodiment, regardless of the carrier 11 being a glass carrier, a quartz carrier, or a plastic carrier, the material of the debonding layer 12 can be formed on the carrier 11 through covalent bonds. In addition, when the carrier 11 used in the present embodiment is a plastic carrier, the material of the debonding layer 12 can be bonded onto the carrier 11 through the R.sub.b of the compound represented by the formula (I) or (II) by chemical modification.

(21) In the present embodiment, the concentration of the material in the mixture for forming the debonding layer can be in a range from 0.01 wt % to 10 wt %, and the carrier 11 can be coated with the mixture through spin coating. However, in other embodiment, the material of the debonding layer 12 can be directly formed on the carrier 11 through deposition. In addition, the thickness of the debonding layer 12 is not particularly limited, and can be in a range from 100 Å to 2000 Å. However, in other embodiment, the debonding layer 12 can have other thickness beyond the aforementioned range.

(22) Furthermore, in the material of the debonding layer 12 of the present embodiment, the R.sub.a of the compound represented by the formula (I) or (II) can be selected from a group consisting of:

(23) ##STR00044##
wherein each R.sub.1 independently is selected from a group consisting of methyl, ethyl, propyl, methoxy, ethyoxy, propoxy, —CH.sub.2F, —CHF.sub.2, —CF.sub.3, —OH, —COOH, —F, —Cl, —Br, —NO.sub.2, and —N(R.sub.5).sub.2; each R.sub.2 independently is selected from a group consisting of hydrogen, methyl, ethyl, propyl, methoxy, ethyoxy, propoxy, —CH.sub.2F, —CHF.sub.2, —CF.sub.3, —OH, —F, —Cl, —Br, and —NO.sub.2; and each R.sub.5 independently is hydrogen, methyl, ethyl, or propyl.

(24) More particularly, the material of the debonding layer 12 used in the present embodiment is:

(25) ##STR00045##
but the present invention is not particularly limited to this compound in other embodiments.

(26) Next, as shown in FIG. 1A and FIG. 1B, a substrate 13 is laminated on the debonding layer 12 to make the debonding layer 12 dispose between the carrier 11 and the substrate 13, wherein the substrate 13 has a first surface 131 and a second surface 132 corresponding to each other, and the second surface 132 contacts the debonding layer 12. Herein, the substrate 13 can be laminated on the carrier 11 with the debonding layer 12 formed thereon through any manner known in the art, such as lamination or adhering process. Alternatively, the material for forming the substrate 13 can be firstly formed on the carrier 11 with the debonding layer 12 by spin coating, and then a substrate 13 can be obtained after a curing process. In the present invention, the substrate 13 is preferably laminated on the carrier 11 with the debonding layer 12 through the adhering process.

(27) Herein, the substrate 13 can be any flexible substrate generally used in the art, and featured to have a bending displacement of more than 80 mm. For example, the flexible substrate can be a thin glass substrate having a thickness in a range from 0.1 mm to 0.3 mm, a polymer substrate, a polymer-metal composite substrate, or a polymer-metal oxide composite substrate, wherein the polymer is PI, PA, PMMA, or a combination thereof.

(28) Then, as shown in FIG. 1C, an electronic unit layer 14 is formed on the substrate 13 through a known process used in the art. The electronic unit layer 14 can comprise the electronic units generally used in the art, such as a display unit, a thin film transistor unit, and a touch unit, and the aforementioned electronic units can be used alone or together to form the electronic unit layer 14. Herein, the known display unit in the art can be a liquid crystal display unit or an organic light emitting diode display unit.

(29) As shown in FIG. 1D, a radiation is performed on a side of the carrier 11 to react the material of the debonding layer 12 to separate the substrate 13 from the carrier. Thus, an electronic apparatus is obtained, as shown in FIG. 1E.

(30) More specifically, as shown in FIG. 1D, the radiation is provided from the backside of the carrier 11. In the present embodiment, the radiation is provided from the carrier 11 without the debonding layer 12 formed thereon, and the light penetrates through the carrier 11 and achieves the debonding layer 12 to perform a photo-reaction (or, photo-cleavage) on the material thereof. Thus, the substrate 13 can be separated from the carrier, as shown in FIG. 1E.

(31) In the present embodiment, when an UV light source is used as the radiation, the light absorbing group (R.sub.a) of the material of the debonding layer 12 is excited to perform the cleavage reaction, and the generated derivative after the cleavage reaction is remained on the second surface 132 of the substrate 13 to form a residue layer 121, wherein the residue layer 121 is disposed on the second surface 132 of the substrate 13 through a van der Waals' force, a hydrogen bond, or a π-π interaction. Herein, the wavelength, the light intensity, and the radiation time can be selected according to the material of the debonding layer 12. Preferably, the wavelength of the UV light can be in a range from 200 nm to 420 nm, and the accumulated amount of the light can be in a range from 1 J to 60 J. However, the radiation conditions used in the other embodiments of the present invention are not limited to the aforementioned ranges. Therefore, the material of the obtained residue layer comprises: a compound containing at least one selected from a group consisting of aryl, nitro and ketone; and comprises: at least one derivative of a material represented by the aforementioned formula (I) or (II) obtained after a radiation.

(32) Preferably, the material of the residue layer 121 of the present embodiment comprises: at least one compound selected from a group consisting of:

(33) ##STR00046##
wherein each R.sub.1 independently is selected from a group consisting of methyl, ethyl, propyl, methoxy, ethyoxy, propoxy, —CH.sub.2F, —CHF.sub.2, —CF.sub.3, —OH, —COOH, —F, —Cl, —Br, —NO.sub.2, and —N(R.sub.5).sub.2; each R.sub.2 independently is selected from a group consisting of hydrogen, methyl, ethyl, propyl, methoxy, ethyoxy, propoxy, —CH.sub.2F, —CHF.sub.2, —CF.sub.3, —OH, —F, —Cl, —Br, and —NO.sub.2; and each R.sub.5 independently is hydrogen, methyl, ethyl, or propyl.

(34) More specifically, the material of the residue layer 121 obtained in the present embodiment is:

(35) ##STR00047##
but the present invention is not particularly limited to this compound in other embodiments.

(36) After the aforementioned process, the electronic apparatus of the present embodiment can be obtained, as shown in FIG. 1E. The electronic apparatus of the present embodiment comprises: a substrate 13 with a first surface 131 and a second surface 132 corresponding to each other; an electronic unit layer 14 disposed on the first surface 131 of the substrate 13; and a residue layer 121 disposed on the second surface 132 of the substrate 13, wherein a material of the residue layer 121 comprises: at least one derivative of a material represented by the aforementioned formula (I) or (II) obtained after a radiation.

(37) In addition, the electronic apparatus obtained in the present embodiment can also be applied to various display panels, such as liquid crystal display (LED) panel or organic light emitting diode display (OLED) panel. Furthermore, the obtained display panel can further be applied to various electronic devices, such as cell phones, notebooks, video cameras, cameras, music players, navigation devices, and televisions.

(38) Although the present invention has been explained in relation to its preferred embodiment, it is to be understood that many other possible modifications and variations can be made without departing from the spirit and scope of the invention as hereinafter claimed.