Chip card assembling structure and method thereof

Abstract

Disclosed are a chip card assembling structure and a method thereof, including at least one base plate, at least one fixing element having a side forming a fixing trough corresponding to the base plate, at least one adhesive film disposed on one side of the fixing element to cover the fixing trough, and at least one thin-film chip received in the fixing trough and bonded to the adhesive film. To use the present invention, the adhesive film, together with the thin-film chip, is lifted and the base plate is placed into the fixing trough, following setting the adhesive film and the thin-film chip back to have the thin-film chip coupled to the base plate. Then, the adhesive film is lifted to remove the coupled thin-film chip and base plate, so that the relative position between the thin-film chip and the base plate is precise and correct.

Claims

1. An e chip card assembling structure, comprising: at least one base plate; at least one fixing element, the fixing element having at least one side in which at least one fixing trough is formed to correspond to the base plate; at least one adhesive film, the adhesive film being disposed on a side of the fixing element to cover the fixing trough; and at least one thin-film chip, the thin-film chip being received in the fixing trough and bonded to the adhesive film, wherein the thin-film chip has a side that is adjacent to the adhesive film and comprises a contact interface assembly and an opposite side that comprises at least one coupling section for coupling with the base plate, the coupling section comprising at least one separator sheet; and wherein the thin-film chip comprises at least one dividable section that corresponds to the base plate and is detachable so that the at least one dividable section is selectively removable from the thin-film chip.

2. The e chip card assembling structure according to claim 1, wherein the fixing trough is divided into a first fixing trough, a second fixing trough, and a third fixing trough, the first fixing trough, the second fixing trough, and the third fixing trough having trough bottoms that are at different distances from a side of the base plate.

3. The e chip card assembling structure according to claim 1, wherein the adhesive film has a side that is adjacent to the fixing element and comprises at least one sticky portion, the sticky portion being repeatedly attachable.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is a perspective view illustrating a preferred embodiment of the present invention.

(2) FIG. 2 is an exploded view of the preferred embodiment of the present invention.

(3) FIG. 3 is a perspective view showing a thin-film chip according to the preferred embodiment of the present invention.

(4) FIG. 4 is a schematic view showing a fixing element according to the preferred embodiment of the present invention.

(5) FIG. 5 is a schematic view illustrating assembling of the preferred embodiment of the present invention.

(6) FIG. 6 is another schematic view illustrating assembling of the preferred embodiment of the present invention.

(7) FIG. 7 is a further schematic view illustrating assembling of the preferred embodiment of the present invention.

(8) FIG. 8 is a schematic view illustrating disassembling of the preferred embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

(9) The following descriptions are exemplary embodiments only, and are not intended to limit the scope, applicability or configuration of the invention in any way. Rather, the following description provides a convenient illustration for implementing exemplary embodiments of the invention. Various changes to the described embodiments may be made in the function and arrangement of the elements described without departing from the scope of the invention as set forth in the appended claims.

(10) Referring to FIGS. 1-4, which are respectively a perspective view and an exploded view of a preferred embodiment of the present invention, a schematic view of a thin-film chip of the preferred embodiment of the present invention, a schematic view of a fixing element of the preferred embodiment of the present invention, the drawings clearly show that the present invention comprises at least one base plate 1, at least one fixing element 3, at least one adhesive film 4, and at least one thin-film chip 2. In the instant embodiment, explanation will be given with reference to three different sizes specified for a regular SIM card, a micro SIM card, and a nano SIM card. The fixing element 3 comprises, formed in at least one side thereof, at least one fixing trough 31 corresponding to the base plate 1. The fixing trough 31 is divided into a first fixing trough 311 (of which the size corresponds to that of a regular SIM card), a second fixing trough 312 (of which the size corresponds to that of a micro SIM), and a third fixing trough 313 (of which the size corresponds to that of a nano SIM card). Further, trough bottoms of the first fixing trough 311, the second fixing trough 312, and the third fixing trough 313 are arranged to have different distances from a side wall of the base plate 1. The adhesive film 4 is set on one side of the fixing element 3 to cover the fixing trough 31. The adhesive film 4 has a side that is adjacent to the fixing element 3 and forms at least one sticky portion 41. The sticky portion 41 is repeatedly attachable. The thin-film chip 2 is set in the fixing trough 31 and is bonded to the adhesive film 4. The thin-film chip 2 has a side that is adjacent to the adhesive film 4 and comprises a contact interface assembly 21 and an opposite side forming at least one coupling section 22 for coupling to the base plate 1. The coupling section 22 comprises at least one separator sheet 221 mounted thereto. The thin-film chip 2 comprises at least one dividable section 23 that corresponds to the base plate 1 and is detachable. The dividable section 23 has an outer perimeter having a size corresponding to the micro SIM. The dividable section 23 has an inner perimeter having a size corresponding to the nano SIM card. Further, the above description is given to only one possible configuration of the present invention, and other configurations are also available.

(11) Referring to FIGS. 1-8, which are respectively a perspective view and an exploded view of a preferred embodiment of the present invention, a schematic view of a thin-film chip of the preferred embodiment of the present invention, a schematic view of a fixing element of the preferred embodiment of the present invention, three schematic view illustrating assembling of the preferred embodiment of the present invention, and a schematic view illustrating disassembling of the preferred embodiment of the present invention, these drawings clearly show that to use the present invention, the adhesive film 4 is first partially peeled off to expose the fixing trough 31. The adhesive film 4 uses the sticky portion 41 to lift the thin-film chip 2 so as to remove the thin-film chip 2 out of the fixing trough 31. The separator sheet 221 is then peeled off to expose the coupling section 22 and the base plate 1 is placed and fixed in one of the first fixing trough 311, the second fixing trough 312, and the third fixing trough 313 according to the size thereof. The adhesive film 4 is bonded back to have the coupling section 22 of the thin-film chip 2 coupled to the base plate 1. The adhesive film 4 is partially peeled off again to remove the coupled thin-film chip 2 and base plate 1. When the size of the base plate 1 is that of a regular SIM card or a micro SIM card, the assembling of the chip card is completed according to the present invention.

(12) Further, when the base plate 1 has a size that is the size of a nano SIM card, the dividable section 23 is detached and removed from the thin-film chip 2 to complete the assembling of the chip card according to the present invention (as shown in FIG. 8).

(13) Thus, the chip card assembling structure and the method thereof according to the present invention provide the following features that improve the known techniques:

(14) (1) The collaborative arrangement of the base plate 1 and the adhesive film 4 and that of the thin-film chip 2 and the base plate 1 provide the availability for manufacture of different sizes, specifications, and individuals so that the present invention may achieve a practical advantage of unconstrained application and reduction of manufacture cost.

(15) (2) The detachability of the dividable section 23 from the thin-film chip 2 provides the availability for manufacture of different sizes, specifications, and individuals so that the present invention may achieve a practical advantage of unconstrained application and reduction of manufacture cost.

(16) It will be understood that each of the elements described above, or two or more together may also find a useful application in other types of methods differing from the type described above.

(17) While certain novel features of this invention have been shown and described and are pointed out in the annexed claim, it is not intended to be limited to the details above, since it will be understood that various omissions, modifications, substitutions and changes in the forms and details of the device illustrated and in its operation can be made by those skilled in the art without departing in any way from the spirit of the present invention.