CIRCUIT CARRIER FOR AN ELECTRONIC CIRCUIT, AND METHOD FOR PRODUCING THE CIRCUIT CARRIER

Abstract

The invention relates to a circuit carrier (100), in particular a circuit board, for an electronic circuit, having an electric coil (10) and a core (14), which is designed to form a magnetic field (36) of the coil (10), and the coil (10) has windings (12) situated in layers on top of one another, the coil (12) being integrated into the circuit carrier (100), and the core (14) being situated outside a winding window (18) of the coil (10).

Claims

1-10. (canceled)

11. A circuit carrier for an electronic circuit, the circuit carrier comprising: an electric coil and a core configured to form a magnetic field of the coil, the coil having windings situated in layers on top of one another, the coil being integrated into the circuit carrier, and the core being situated outside a winding window of the coil, wherein a magnetic field sensor is situated within the winding window of the coil.

12. The circuit carrier as recited in claim 11, wherein the core includes two plate-type core elements, which are connected to a topside and an underside of the circuit carrier in a region of the winding window, using an integral connection.

13. The circuit carrier as recited in claim 12, wherein the plate-type core elements have metallized surfaces, which are soldered to the circuit carrier.

14. The circuit carrier as recited in claim 11, wherein the magnetic field sensor is situated in a center of the winding window and is connected to the circuit carrier by a curable material.

15. The circuit carrier as recited in claim 11, wherein the magnetic field sensor is a Hall-effect sensor.

16. The circuit carrier as recited in claim 11, wherein the windings of the coil are situated as planar, electrically conductive metal tracks in layers between insulation layers and are connected to one another in an electrically conductive manner using contact regions.

17. The circuit carrier as recited in claim 11, wherein the magnetic field formed by the coil is a homogeneous magnetic field in a region of the magnetic field sensor.

18. The circuit carrier as recited in claim 11, wherein additional electronic elements are disposed: (i) within the circuit carrier, or (ii) on a topside and/or an underside of the circuit carrier.

19. The circuit carrier as recited in claim 11, wherein the circuit carrier is configured to be connected to a single-layer, additional circuit carrier.

20. A method for producing a circuit carrier, the method comprising the following steps: integrating a coil having windings situated in layers on top of one another into the circuit carrier; positioning a magnetic field sensor within a winding window of the coil; and positioning a core so that the winding window of the coil is at least partially covered.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0017] FIG. 1A shows a perspective representation of a cross-section of the circuit carrier including windings disposed in layers on top of one another, a magnetic field sensor within the coil winding, and two plate-type core elements, according to an example embodiment of the present invention.

[0018] FIG. 1B shows a view of the cross-section of the circuit carrier according to FIG. 1A.

[0019] FIG. 1C shows a top view of the circuit carrier according to FIG. 1A.

[0020] FIG. 2A to FIG. 2C show a top view of the individual windings according to FIG. 1A including electrical contact points.

[0021] FIG. 3 shows a view of the cross-section of the circuit carrier according to FIG. 1B with arrows to mark the direction and the field strength of a magnetic field.

[0022] FIG. 4 shows a view of the circuit carrier according to FIG. 1B, which is connected to a larger additional circuit carrier.

DETAILED DESCRIPTION OF EXAMPLE EMBODIMENTS

[0023] Identical elements or elements having the same function have been provided with the same reference numbers in the figures.

[0024] FIG. 1A through FIG. 1C show a circuit carrier 100 having a coil 10 with layer-type windings 12 and a core 14, and a magnetic field sensor 16 is situated within coil 10 in a winding window 18. Core 14 is situated outside winding window 18 of coil 10. Core 14 is preferably disposed on a topside 22 and an underside 24 of circuit carrier 100. Such a preferred placement does not require any drill holes or recesses in circuit carrier 100 so that the production of circuit carrier 100 and the assembly of core 14 are particularly easy to implement.

[0025] Core 14 of coil 10 has two plate-type core elements 20, which are connected to circuit carrier 100 in the region of winding window 18, in particular with the aid of an integral joint. Core elements 20 are preferably dimensioned and disposed in such a way that winding window 18 is at least partially covered. In this way, core elements 20 are able to shield a magnetic field 36 (FIG. 3) within coil 10 from external magnetic fields, and scattering effects can be avoided. In addition, core elements 20 are dimensioned so that a magnetic flux is ensured outside winding window 18 and windings 12. Core elements 20 are preferably produced as ferrite cores or from a compressed ferrite/plastic mixture.

[0026] For the integral connection, plate-type core elements 20 are provided with metallized surfaces 26, at which plate-type core elements 20 are soldered to circuit carrier 100. The two metallized surfaces 26 are preferably implemented on at least two oppositely situated sides of plate-type core elements 20. As an alternative, core elements 20 may also be bonded to circuit carrier 100.

[0027] Magnetic field sensor 16, e.g., a Hall-effect sensor, is preferably situated in the center of winding window 18 because a particularly homogeneous magnetic field can be assumed there (FIG. 3), and it is connected to circuit carrier 100 by a curable material. The curable material may be an epoxy resin which can also form entire circuit carrier 100. For the electrical contacting, magnetic field sensor 16 is connected to preferably five electrical contacts or circuit traces (not shown) on topside 22 and/or underside 24 of circuit carrier 100.

[0028] By way of example, FIG. 2A to FIG. 2C show a detailed view of three windings 12 as planar, electrically conductive metal tracks 28a, 28b, 28c. Metal tracks 28a, 28b, 28c are mounted on an insulation layer 32 in each case, which has a bore at contact point 30a for the electrical connection to contact point 30b of the respective next metal track 28a, 28b, 28c. In addition, insulation layer 32 is cut to size in such a way that winding window 18 is exposed for the placement of magnetic field sensor 16.

[0029] For the electrical contacting, winding 12 is connected to preferably two electrical contacts or circuit traces (not shown here) on topside 22 and/or underside 24 of circuit carrier 100.

[0030] Metal tracks 28a, 28b, 28c, for example, may be produced from copper and patterned using a photolithographic process. The bores at contact points 30a can be provided with the aid of a laser drilling process.

[0031] FIG. 3 shows the direction and the field strength of magnetic field 36 in the region of coil 10 by arrows 34 by way of example. A homogeneous magnetic field 36 having the same direction and an approximately equal field strength may be developed within winding window 18, in particular. Magnetic field 36 outside winding window 18 shows partially changing amounts and directions. To ensure that measured magnetic field correlates with the coil current, magnetic field sensor 16 is preferably situated within winding window 18 in the region of homogeneous magnetic field 36.

[0032] In addition to plate-type core elements 20, further electronic elements may be mounted on topside 22 and/or underside 24 of circuit carrier 100. Moreover, additional components such as capacitive components are able to be integrated within circuit carrier 100.

[0033] As an alternative or in addition, entire circuit carrier 100 can be considered an electrical component, which is mounted, preferably with the aid of solder joints 38, as a surface mounted device (SMD) on a preferably single-layer additional circuit carrier 40. Single-layer additional circuit carrier 40 or an additional circuit carrier 40 having few layers, or an additional circuit carrier 40 without integrated components can be produced in a cost-effective manner in comparison with multilayer circuit carrier 100. For that reason, it may be advisable for larger electric circuits, e.g., for control devices, to connect entire circuit carrier 100 itself as an electrical component to the larger additional circuit carrier 40. Circuit carrier 100 has a preferred width of 15 mm to 25 mm and a preferred length of 25 mm to 35 mm.

[0034] Afore-described circuit carrier 100 may be changed or modified in a wide variety of ways without deviating from the present invention. For example, it is possible that windings 12 are formed by a helical wire. In addition, it is also possible to integrate capacitive elements in the region of coil 10.