Component Carrier

Abstract

A component carrier with a stack including a first core layer structure and a second core layer structure, and a recess extending completely through the first core layer structure and extending at least partially into the second core layer structure. Each core layer structure has at least one electrically conductive layer structure and at least one electrically insulating layer structure. The core layer structures are stacked with one on top of the other in a stacking direction.

Claims

1. A component carrier, comprising: a stack comprising at least first and second core layer structures, each core layer structure comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure, wherein the core layer structures are stacked on top of each other in a stacking direction; and a recess extending completely through the first core layer structure and extending at least partially into the second core layer structure.

2. The component carrier according to claim 1, wherein the first and second core layer structures are connected by lamination, preferably by prepreg lamination.

3. The component carrier according to claim 1, wherein the first and second core layer structures have a thickness between 15 μm-2000 μm.

4. The component carrier according to claim 1, the stack further comprising: a third core layer structure, wherein the recess extends completely through the third core layer structure.

5. The component carrier according to claim 4, wherein the first, second and third core layer structures are connected by lamination, preferably by prepreg lamination.

6. The component carrier according to claim 1, wherein at least one of the core layer structures comprises a prepreg structure, preferably a FR-4 layer.

7. The component carrier according to claim 1, wherein the recess extends completely through the second core layer structure.

8. The component carrier according to claim 1, wherein the recess is delimited by a protrusion that extends from a surface of the recess.

9. The component carrier according to claim 1, wherein the recess extends from a first main surface of the stack into the first core layer structure, and a flexible layer is arranged above a second main surface of the stack, opposite the first main surface, wherein the flexible layer is arranged in a flexible region.

10. The component carrier according to claim 1, wherein the second core layer structure has a stepped portion comprising pre-impregnated fibers.

11. The component carrier according to claim 10, wherein at least one further stepped portion is formed on at least one sidewall of the recess.

12. The component carrier according to claim 1, wherein the recess extends from a first main surface of the stack into the first core layer structure, and a further recess extending partially from a second main surface into the stack is arranged opposite the recess, wherein the second main surface is arranged opposite the first main surface.

13. The component carrier according to claim 10, wherein the recess extends from a first main surface of the stack, and a surface of the stepped portion exposed towards the first main surface is free of indentations.

14. The component carrier according to claim 9, wherein the recess extends from a first main surface of the stack into the first core layer structure, and a rigid region comprises a first rigid region arranged adjacent to a first boundary of the flexible region and a second rigid region arranged adjacent to a second boundary of the flexible region opposite the first boundary, wherein an angle between a portion of the first main surface in the first rigid region and a further portion of the first main surface in the second rigid region is unequal to zero.

15. The component carrier according to claim 14, wherein the angle between the portion of the first main surface and the further portion of the first main surface is greater than 5 degrees or smaller than −5 degrees.

16. The component carrier according to claim 10, wherein the second core layer structure having the stepped portion comprises a protrusion, wherein the protrusion at least partially delimits the stepped portion.

17. A method of forming a component carrier, comprising: forming a stack comprising first and second core layer structures, each core layer structure comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure, wherein the core layer structures are stacked on top of each other in a stacking direction; and forming a recess extending completely through the first core layer structure and extending at least partially into the second core layer structure.

18. The method according to claim 17, wherein the recess is delimited by a protrusion that extends from a surface of the recess.

19. The method according to claim 18, wherein forming the recess comprises: forming at least one precutting hole extending partially through the stack so that the precutting hole defines the stepped portion, applying a release layer at the stepped portion, wherein the release layer contacts the precutting hole, and forming at least one cap removal hole extending from the first main surface of the stack so that the cap removal hole contacts the precutting hole.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0078] FIG. 1 illustrates a schematic cross-sectional view of a semiflexible component carrier according to an exemplary embodiment of the disclosure.

[0079] FIG. 2, FIG. 3, FIG. 4, FIG. 5, and FIG. 6 schematically illustrate structures obtained at different stages during manufacture of a semi-flexible component carrier according to an exemplary embodiment of the disclosure.

[0080] FIG. 7 illustrates a schematic cross-sectional view of a structure obtained during manufacture of a semi-flexible component carrier according to an exemplary embodiment of the disclosure.

[0081] FIG. 8 illustrates a schematic cross-sectional view of a semiflexible component carrier according to an exemplary embodiment of the disclosure, in which a flexible region is bent.

[0082] FIG. 9 illustrates a schematic cross-sectional view of a semiflexible component carrier according to an exemplary embodiment of the disclosure, in which two recesses are formed from opposite main surfaces of the component carrier.

[0083] FIG. 10 illustrates a schematic cross-sectional view of a semiflexible component carrier according to an exemplary embodiment of the disclosure.

[0084] FIG. 11, FIG. 12, FIG. 13, FIG. 14, and FIG. 15 schematically illustrate structures obtained at different stages during manufacture of a semi-flexible component carrier according to an exemplary embodiment of the disclosure.

[0085] FIG. 16, FIG. 17, FIG. 18, and FIG. 19 are photographical representations of stepped portions delimited by respective protrusions according to exemplary embodiments of the disclosure.

[0086] FIG. 20 and FIG. 21 illustrate structures obtained at different stages during the manufacture of another component carrier according to an exemplary embodiment of the disclosure.

DESCRIPTION OF EMBODIMENTS

[0087] The illustrations in the drawings are schematically presented. In different drawings, similar or identical elements are provided with the same reference signs.

[0088] Further, spatially relative terms, such as “front” and “back”, “above” and “below”, “left” and “right”, et cetera are used to describe an element's relationship to another element(s) as illustrated in the figures. Thus, the spatially relative terms may apply to orientations in use which differ from the orientation depicted in the figures. Obviously, all such spatially relative terms refer to the orientation shown in the figures only for ease of description and are not necessarily limiting as an apparatus according to an embodiment of the disclosure can assume orientations different from those illustrated in the figures when in use.

[0089] Before, referring to the drawings, exemplary embodiments will be described in further detail, and some basic considerations will be summarized based on which exemplary embodiments of the disclosure have been developed.

[0090] Embodiments of the disclosure have been developed in view of problems regarding cap removal on semi-flexible PCBs (semi-flexible component carriers) resulting from problems in depth control and consequent damage of the flexible region, in particular with the aim to provide a cap removal process without damage to the flexible region on semi-flexible PCBs. The cap removal workflow according to embodiments of the disclosure is the following: 1. Lamination of two core layers using a prepreg layer (which are all layer structures of the stack); 2. Laser precutting, e.g. by laser drilling (to form precutting holes); 3. Release ink printing (to form a release layer); 4. Prepreg (PP) and resin coated foil (RF) lamination (to form an electrically insulating layer having a stepped portion and/or a bending stress handling layer); 5. Flexible ink screen printing on the top of the flex area (to form a flexible layer); 6. Depth routing for de-cap (to form cap removal holes); 7. Cap removal. This cap removal workflow combines laser pre-cutting with a highly accurate depth control process. It introduces laser-precutting plus a depth-routing process and combines it with release layer printing technology.

[0091] An advantage may be that more tolerance in depth routing is possible and the risk of a damage to the flex area (flexible region) is eliminated. Further advantages may be that only standard materials are used, for example materials that are halogen-free. Also, with a buildup of only one or two flexible layers, very thin stackups are possible. Furthermore, a polyimide-free buildup is possible and therefore no baking process is needed in manufacture. Still further, the flexible layers (in particular the electrically insulating layer having a stepped portion and/or the bending stress handling layer) are not damaged during manufacture which increases the bending performance. Finally, the HDI (High-Density-Interconnect) design rules remain the same, also in the flexible layers.

[0092] FIG. 1 shows an embodiment of the disclosure. According to this embodiment, a semi-flexible component carrier 100 comprises a stack 101 comprising at least one electrically conductive layer structure 104 and at least one electrically insulating layer structure 105, wherein the layer structures are stacked on top of each other in a stacking direction, S. Furthermore, the semi-flexible component carrier comprises a recess 111 extending from a first main surface 102 of the stack into the stack 101 and extending only partially into one of the at least one electrically insulating layer structure. Thereby, an electrically insulating layer structure 106 having a stepped portion 107 is formed, wherein the stepped portion 107 provides a flexible region 113 of the stack 101 with respect to a rigid region 114, 115 of the stack 101.

[0093] Both the flexible region 113 and the rigid region 114, 115 extend in a plane perpendicular to the stacking direction, S. All layers present in stacking direction in a flexible region belong to the flexible region 113 and all layers present in stacking direction in a rigid region belong to the rigid region 114, 115. All layers in a flexible region 113 should to some extent be flexible, if only due to their thinness. By contrast, at least one layer in a rigid region 114, 115 should be rigid.

[0094] The recess 111 may extend through one or through a plurality of layer structures. It is delimited by the stepped portion 107 and by sidewalls which may extend substantially along the stacking direction, S. The recess 111 has edges or corners 108, where the sidewalls meet the bottom of the recess. These edges or corners coincide with edges or corners 108 of the stepped portion 107 of the electrically insulating layer 106.

[0095] In the sidewalls, at least one further stepped portion 112 may be formed, which extends from a respective step in the sidewall up to the first main surface of the stack 101. In other words, the step delimits the further stepped portion 112 in stacking direction S towards the second main surface. In particular, there may be a further stepped portion 112 for each sidewall of the recess. The extensions of these further stepped portions 112 may be the same, but they may also differ. In particular, the steps defining the respective stepped portions may have a different height, they may also be located at different positions in stacking direction. The at least one further stepped portion 112 extends in a different direction, namely along the sidewalls of the recess 111, compared with the stepped portion 107, which extends along the bottom of the recess 111.

[0096] A flexible layer 110 may be formed on top of a second main surface 103 of the stack 101, opposite the first main surface 102. This flexible layer 110 may extend over a portion of the flexible region 113, the whole flexible region 113, or the whole flexible region 113 and a portion of the rigid region 114, 115. The flexible layer 110 may comprise a flexible ink layer.

[0097] Furthermore, a bending stress handling layer 109 may be provided, which is configured to absorb or handle mechanical stress occurring for example during bending of the flexible region 113. The bending stress handling layer 109 may comprise resin coated foil (RCF), resin coated copper (RCC) and/or polyimide (PI). The bending stress handling layer 109 may extend over a portion of the flexible region 113, the whole flexible region 113, or the whole flexible region 113 and a portion of the rigid region 114, 115. Accordingly, the layer having the stepped portion 106 may be the last layer extending from the flexible region 113 into the rigid region 114, 115, if viewed in stacking direction, S, towards the second main surface 103 of the stack. The bending stress handling layer 109 may be the first insulating or dielectric layer in stacking direction, S, towards the second main surface 103 when counted from the electrically insulating layer 106 having the stepped portion 107.

[0098] Referring to FIGS. 2 to 6, these figures show structures at various stages of a method of manufacturing a semi-flexible component carrier 100 according to an exemplary embodiment of the disclosure.

[0099] In FIG. 2, a structure is illustrated in which several electrically insulating layer structures 105 and several electrically conductive layers structures 104 are provided. The layer structures may comprise two core layer structures, e.g., an electrically insulating prepreg layer structure, e.g., made from FR4, clad with copper foils on both main surfaces. These core layer structures may be rigid layer structures.

[0100] In FIG. 3, a structure is shown, in which the abovementioned core layer structures are connected by prepreg lamination, i.e., by a further electrically insulating layer structure 105. Precutting holes 302 are provided substantially along the stacking direction, S, extending up to a main surface of one of the core layer structures. They may be formed as cuts extending from one lateral edge of the core layer structure up to another lateral edge of the core layer structure. The precutting holes 302 may for example be provided by laser drilling or laser cutting. On this same main surface of one of the core layer structures, a release layer 301 is provided covering the precutting holes 302 as well as the area between the precutting holes 302. The release layer 301 may comprise a release ink layer, which may be provided by release ink printing. Also, the release layer 301 may comprise wax, Teflon® and/or tape.

[0101] In FIG. 4, a structure is shown, in which further layer structures are built upon at least one of the main surfaces of the structure shown in FIG. 3. These further layer structures may be electrically insulating layer structures 105 or they may be electrically conductive layer structures 104 (as illustrated in FIGS. 1-3). In particular, one of the further layer structures may be an electrically insulating layer structure 106 comprising a stepped portion 107, where the release layer 301 is located. Another of the further layer structures may be a bending stress handling layer 109, which is arranged on the same side as the electrically insulating layer structure 106 comprising the stepped portion 107 and therefore above the layer structure 106. The stack 101 comprises the structure of FIG. 3 combined with the above-described further layer structures. On a second main surface 103 of the stack 101, a flexible layer 110 may be provided. The flexible layer 110 may comprise a flexible ink layer.

[0102] In FIG. 5, a structure is shown, in which cap removal holes or cuts 501 are provided. These cap removal holes 501 extend from the first main surface 102 of the stack into the stack 101 to an extent that they meet the precutting holes 302. The width of the cap removal hole 501 may be sufficiently large such that considerable tolerance is allowed regarding the exact position of the cap removal hole 501 with respect to the respective precutting hole 302 that the cap removal hole 501 aims to meet. Cap removal holes 501 can be provided for example by depth-controlled routing or depth routing or by laser drilling. In the process, a cap 502 is formed by the cap removal holes 501, the precutting holes 302, the release layer 301 and possibly lateral edges of the stack 101 or component carrier.

[0103] In FIG. 6, a structure is shown, in which the cap 502 of FIG. 5 has been removed to provide a recess 111 with a stepped portion 107 in an electrically insulating layer structure 106. The stepped portion 107 is located, where the release layer 301 was located, which was removed together with the cap 502 and/or after cap removal.

[0104] In FIG. 7, yet another structure is shown of a stage during a method of manufacturing a semi-flexible component carrier 100 according to an exemplary embodiment of the disclosure showing a flexible layer 110, a release layer 301, a precutting hole 302 and a cap removal hole 501.

[0105] In FIG. 8, an exemplary embodiment of the disclosure is illustrated, in which the rigid region comprises a first rigid region 114 arranged adjacent to a first boundary of a flexible region 113 and a second rigid region 115 arranged adjacent to a second boundary of the flexible region 113 opposite the first boundary. An angle α is formed between a portion 801 of the first main surface 102 in the first rigid region 114 and a further portion 802 of the first main surface 102 in the second rigid region. The angle α is defined such that it is equal to zero, if the first and second rigid regions 114, 115 are not tilted towards each other, that it is greater than zero if the first main surfaces 102 of the rigid regions 114, 115 are tilted towards each other (as shown in the Figure) and that it is smaller than zero if the second main surfaces 103 of the rigid regions 114, 115 are tilted towards each other in a direction opposite that shown in FIG. 8.

[0106] In FIG. 9, an exemplary embodiment of the disclosure is illustrated, in which a further recess 901 is formed, which extends partially from the second main surface 103 into the stack 101 and which is arranged substantially opposite the recess 111, which extends partially from the first main surface 102 into the stack.

[0107] FIG. 10 shows an embodiment of the disclosure. A semiflexible component carrier 100 comprises a stack 101 comprising at least one electrically conductive layer structure 104 and at least one electrically insulating layer structure 105, wherein the layer structures are stacked on top of each other in a stacking direction, S. Furthermore, the semi-flexible component carrier comprises a recess 111 extending from a first main surface 102 of the stack into the stack 101 and extending only partially into one of the at least one electrically insulating layer structures. Thereby, an electrically insulating layer structure 106 having a stepped portion 107 is formed, wherein the stepped portion 107 provides a flexible region 113 of the stack with respect to a rigid region 114 of the stack.

[0108] Both the flexible region 113 and the rigid region 114 extend in a plane perpendicular to the stacking direction, S. All layers present in the stacking direction in the flexible region 113 belong to the flexible region 113 and all layers present in stacking direction in the rigid region 114 belong to the rigid region 114. All layers in a flexible region 113 may be flexible, if only due to their thinness.

[0109] The recess 111 may extend through one or through a plurality of layer structures. It is delimited by the bottom surface 1004 of the stepped portion 107 and by sidewalls which surround the recess 111 and may extend substantially along the stacking direction, S. The stepped portion 107 is at least partially delimited by a protrusion 1001 protruding from the bottom surface 1004 of the electrically insulating layer structure 106 having the stepped portion 107. The protrusion 1001 may protrude in the stacking direction, S, along one or several insulating layer structures 105 and/or conductive layer structures 104 of the stack 101.

[0110] A lateral surface 1002 of the protrusion 1001 forms at least part of a sidewall of the stepped portion 107 surrounding the recess 111 and hence delimits the stepped portion 107. The lateral surface 1002 is inclined by an angle β with respect to the bottom surface 1004 of the stepped portion 107. The angle β may be between 120° and 150°. A further lateral surface 1006 of the protrusion, opposite the lateral surface 1002 along a direction perpendicular to the stacking direction, S, may also be inclined, but in the opposite direction with respect to the bottom surface 1004 of the stepped portion 107. The angle between the further lateral surface 1006 and the bottom surface 1004 may be between 1° and 89°, in particular between 40° and 50°. The inclination of the lateral surface 1002 and of the further lateral surface 1006 may result from laser cutting.

[0111] The protrusion 1001 has a plateau surface 1003, which is substantially orthogonal to the stacking direction, S. The plateau surface 1003 is substantially orthogonal to the adjacent sidewall of the recess 111. The plateau surface 1003 delimits the protrusion 1001 in the stacking direction, S, towards the first main surface 102. However, the protrusion 1001 may also extend beyond the plateau surface 1003 in the stacking direction, S, along the sidewall of the recess 111. The plateau surface 1003 may result from a depth routing process.

[0112] Referring to FIGS. 11 to 15, structures at various stages of a method of manufacturing a semi-flexible component carrier 100 according to an exemplary embodiment of the disclosure are shown.

[0113] In FIG. 11, a stack 101 is shown having layer structures 105 and several electrically conductive layers structures 104. Precutting holes 302 are provided substantially along the stacking direction, S, extending up to a main surface of the illustrated structure. The precutting holes may be formed as cuts. The precutting holes 302 may for example be provided by laser drilling or laser cutting. Accordingly, the precutting holes 302 may have a substantially triangular profile or a substantially conical form. A covering electrically conductive layer structure 1101 may be provided on the abovementioned main surface, wherein the covering electrically conductive layer structure 1101 does not cover the region between the precutting holes 302.

[0114] In FIG. 12, a release layer 301 is shown which is applied to the above-mentioned main surface in the region between the precutting holes 302 or precutting paths. The release layer 301 may also cover at least partially the inner surfaces of the precutting holes 302. In particular, the release layer 301 may cover that inner surface of the precutting hole 302 which is adjacent to the region between the precutting holes 302, to which region the release layer 301 is applied. Thereby, a portion 1201 of the release layer 301 covering an inner surface of the precutting hole 302 is formed. This may occur, because the release layer 301 flows from the region between the precutting holes 302 at least partially into the precutting holes 302. The release layer 301 may comprise a release ink layer, which may be provided by release ink printing. Such an ink may be sufficiently liquid such that it will flow into the precutting holes. Also, the release layer 301 may comprise wax, Teflon® and/or tape.

[0115] In FIG. 13, further layer structures are built upon at least one of the main surfaces of the structure shown in FIG. 12. In particular, one of the further layer structures may be an electrically insulating layer structure 106 comprising a stepped portion 107, where the release layer 301 is located. The electrically insulating layer structure 106 may be applied with sufficient pressure and/or at sufficiently high temperatures such that resin flows into the precutting holes 302. The electrically insulating layer structure 106 may be laminated onto the release layer 301, the precutting holes 302 and the covering electrically conductive layer structure 1101 such that resin flows into the precutting holes 302, in particular into the laser cutting paths forming the precutting holes 302. The precutting holes are at least partially filled with resin, in particular they may be fully filled with resin. Thus, the electrically insulating layer structure 106 may cover the release layer 301, the covering electrically conductive structure 1101 and fill the precutting holes

[0116] In FIG. 14, further layer structures are built upon at least one of the main surfaces of the structure shown in FIG. 13. These further layer structures may be electrically insulating layer structures 105 or they may be electrically conductive layer structures 104.

[0117] Furthermore, cap removal holes or cuts 501 are provided. These cap removal holes 501 extend from the first main surface 102 of the stack into the stack 101 to an extent that they meet the portion 1201 of the release layer 301 covering inner surfaces of the precutting holes 302. The width of the cap removal hole 501 may be sufficiently large such that considerable tolerance is allowed regarding the exact position of the cap removal hole 501 with respect to the portion 1201 of the release layer 301 which the cap removal hole 501 aims to meet. Cap removal holes 501 can be provided for example by depth-controlled routing or depth routing or by laser drilling. In the process, a cap 502 is formed by the cap removal holes 501 and the release layer 301 including portions 1201 of the release layer 301 covering inner surfaces of the precutting holes 302, wherein the precutting holes 302 may be filled with material, in particular with resin.

[0118] In FIG. 15, the cap 502 of FIG. 14 has been removed to provide a recess 111 which is partially delimited by a stepped portion 107 of an electrically insulating layer structure 106. The stepped portion 107 is located, where the release layer 301 was arranged, which was removed together with the cap 502 and/or after cap removal. In particular, release layer ink may have been stripped away. Protrusions 1001 protruding from the electrically insulating layer structure 106 delimit the stepped portion 107. The protrusions are formed of the material, in particular resin, with which the precutting holes 302 were filled. Lateral surfaces 1002 of the protrusions 1001 delimit the stepped portion 107. The lateral surfaces 1002 correspond fully or at least partially to portions 1201 of the release layer 301 covering inner surfaces of the precutting holes 302, wherein these portions of the release layer have already been removed. Thus, the portions 1201 of the release layer may define predetermined breaking regions, where material of the cap can be detached in a particularly clean and controlled manner. Plateau surfaces 1003 of the protrusions 1001 correspond to portions of the bottom surfaces of the cap removal holes 501.

[0119] FIGS. 16 to 19 are representations of stepped portions delimited by respective protrusions according to exemplary embodiments of the disclosure. Various shapes are shown of protrusions 1001 comprising respective lateral surfaces 1002, plateau surfaces 1003 and further lateral surfaces 1006. Each protrusion 1001 at least partially delimits a bottom surface 1004 of a stepped portion 107 of an electrically insulating layer structure 106 having the stepped portion 107.

[0120] FIG. 20 schematically illustrates structures obtained at different stages during manufacture of a component carrier 1000 according to an exemplary embodiment of the disclosure. The component carrier 1000 comprises a stack comprising a first core layer structure 116 and a second core layer structure 126, each core layer structure 116, 126 comprising at least one electrically conductive layer structure 104 and at least one electrically insulating layer structure 105, 106, wherein the core layer structures 116, 126 are stacked on top of each other in a stacking direction. The component carrier 1000 further comprises a recess 111 completely extending through the first core layer structure 116 and at least partially extending into the second core layer structure 126.

[0121] FIG. 21 schematically illustrates structures obtained at different stages during manufacture of another component carrier 1000 according to an exemplary embodiment of the disclosure. The component carrier 1000 comprises a stack comprising a first core layer structure 116 and a second core layer structure 126, each core layer structure 116, 126 comprising at least one electrically conductive layer structure 104 and at least one electrically insulating layer structure 105, 106, wherein the core layer structures 116, 126 are stacked on top of each other in a stacking direction. The component carrier 1000 further comprises a recess 111 completely extending through the first core layer structure 116 and at least partially extending into the second core layer structure 126. The component carrier 1000 further comprises another electrically insulating layer structure 105 sandwiched between the first core layer structure 116 and the second core layer structure 126. The other electrically insulating layer structure 105 is used as a build-up layer and can be a PP-layer. The other electrically insulating layer structure 105 is not a core layer structure. The other electrically insulating layer structure 105 comprises electrically conductive layer structures 104 being embedded at both main surfaces of the other electrically insulating layer structure 105.

[0122] FIG. 21 shows the differences between the core layer structures 116, 126 and the other electrically insulating layer structure 105 which can be a build-up layer. While the core layer structures 116, 126 have a structural feature that electrically conductive layer structures 104 such as copper traces are arranged on the main surfaces of the respective electrically insulating layers 105, 106 of the core layer structures 116, 126, the other electrically insulating layers 105, which are non-core layer structures, can be build-up layers (for example made of PP), where electrically conductive layer structures 104 such as copper traces are embedded at least on one main surface of the respective other electrically insulating layer 105. The other electrically insulating layers 105 can used only for connecting the first and second (pre-manufactured) core layer structures 116, 126, wherein the electrically conductive layer structures 104 of the other electrically insulating layer 105 are flush with the main surface(s) of the other electrically insulating layers 105.

[0123] In modifications of the embodiments above, the recess 111 can also completely extend through the second core layer structure 126.

[0124] In an embodiment, the first and second core layer structures 116, 126 can be connected by lamination, preferably by prepreg lamination.

[0125] In an embodiment, the first and second core layer structures 116, 126 can have a thickness between 15 μm-2000 μm.

[0126] In an embodiment, the stack further comprises a third core layer structure being arranged between the first and second core layer structures 116, 126, wherein the recess 111 extends completely through the third core layer structure.

[0127] In an embodiment, the first, second and third core layer structures are connected by lamination, preferably by prepreg lamination.

[0128] In an embodiment, at least one of the core layer structures comprises a prepreg structure, preferably a FR-4 layer.

[0129] In an embodiment, the FR4 layer is cladded on one or both main surfaces thereof with electrically conductive layer structures, preferably copper foils.

[0130] In an embodiment, the recess 111 extends completely through the second core layer structure 126.

[0131] In an embodiment, the recess 111 extends only partially into the second core layer structure 126 so that an electrically insulating layer structure 106 having a stepped portion 107 is formed in the second core layer structure 126, and the stepped portion 107 provides a flexible region 113 of the stack with respect to a rigid region 114, 115 of the stack so that the component carrier 1000 is a semi-flexible component carrier 1000.

[0132] According to an embodiment, a semi-flexible component carrier comprises a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure, wherein the layer structures are stacked on top of each other in a stacking direction; a recess extending from a first main surface of the stack into the stack and extending only partially into one of the at least one electrically insulating layer structure so that an electrically insulating layer structure having a stepped portion is formed, wherein the stepped portion provides a flexible region of the stack with respect to a rigid region of the stack.

[0133] A flexible layer can be arranged above a second main surface of the stack, opposite the first main surface, wherein the flexible layer is arranged in the flexible region. The flexible layer can comprise a flexible ink layer.

[0134] A bending stress handling layer can extend in the flexible region of the stack. The bending-stress handling layer can comprise at least one of the group consisting of resin coated foil (RCF), resin coated copper (RCC) and polyimide (PI). The bending-stress handling layer can be electrically insulating and arranged between a second main surface of the stack opposite the first main surface and the electrically insulating layer structure having the stepped portion, wherein the region between the bending stress handling layer and the electrically insulating layer structure having the stepped portion is free of further electrically insulating layer structures.

[0135] At least one further stepped portion can be formed on at least one of the sidewalls of the recess.

[0136] The electrically insulating layer structure having the stepped portion can comprise pre-impregnated fibers.

[0137] A further recess extending partially from the second main surface into the stack can be arranged opposite the recess.

[0138] A surface of the stepped portion exposed towards the first main surface can be free of indentations.

[0139] The rigid region can comprise a first rigid region arranged adjacent to a first boundary of the flexible region and a second rigid region arranged adjacent to a second boundary of the flexible region opposite the first boundary, wherein an angle between a portion of the first main surface in the first rigid region and a further portion of the first main surface in the second rigid region is unequal to zero. The angle between the portion and the further portion can be greater than 5 degrees or smaller than −5 degrees.

[0140] The electrically insulating layer structure having the stepped portion can comprise a protrusion, wherein the protrusion at least partially delimits the stepped portion. A lateral surface of the protrusion forming at least a part of a sidewall of the stepped portion can be inclined with respect to a bottom surface of the stepped portion. The protrusion can comprise a plateau surface, wherein the stacking direction is substantially orthogonal to the plateau surface. The protrusion comprises a plateau surface, wherein the stacking direction is substantially orthogonal to the plateau surface, wherein the plateau surface has greater roughness than the lateral surface. The protrusion and a portion of the electrically insulating layer structure, from which the protrusion protrudes, are integrally formed by a resin material. The portion, from which the protrusion protrudes, can comprise reinforcement fibers.

[0141] According to an embodiment, a method of forming a semi-flexible component carrier comprises forming a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure, wherein the layer structures are stacked on top of each other in a stacking direction; forming a recess extending from a first main surface of the stack into the stack and extending only partially into one of the at least one electrically insulating layer structure so that an electrically insulating layer structure having a stepped portion is formed, wherein the stepped portion provides a flexible region of the stack with respect to a rigid region of the stack.

[0142] The forming the recess can comprise forming at least one precutting hole extending partially through the stack so that the precutting hole defines the stepped portion, applying a release layer at the stepped portion, wherein the release layer contacts the precutting hole, and forming at least one cap removal hole extending from the first main surface of the stack so that the cap removal hole contacts the precutting hole.

[0143] It should be noted that the term “comprising” does not exclude other elements or steps and the article “a” or “an” does not exclude a plurality. Also, elements described in association with different embodiments may be combined.

[0144] Implementation of the disclosure is not limited to the preferred embodiments shown in the figures and described above. Instead, a multiplicity of variants is possible which variants use the solutions shown and the principle according to the disclosure even in the case of fundamentally different embodiments.

REFERENCE NUMERALS

[0145] 100 semi-flexible component carrier [0146] 101 stack [0147] 102 first main surface [0148] 103 second main surface [0149] 104 electrically conductive layer structure [0150] 105 electrically insulating layer structure [0151] 106 electrically insulating layer structure having stepped portion [0152] 107 stepped portion [0153] 108 edge of stepped portion [0154] 109 bending stress handling layer [0155] 110 flexible layer [0156] 111 recess [0157] 112 further stepped portion [0158] 113 flexible region [0159] 114 first rigid region [0160] 115 second rigid region [0161] 301 release layer [0162] 302 precutting hole [0163] 501 cap removal hole [0164] 502 cap [0165] 801 portion of first main surface [0166] 802 further portion of first main surface [0167] 901 further recess [0168] 1001 protrusion [0169] 1002 lateral surface [0170] 1003 plateau surface [0171] 1004 bottom surface [0172] 1005 portion, from which protrusion protrudes [0173] 1006 further lateral surface [0174] 1101 covering electrically conductive layer structure [0175] 1201 portion covering inner surface of precutting hole [0176] S stacking direction [0177] α angle between portion and further portion of first main surface [0178] β angle between lateral surface and bottom surface