Soft underlayer for heat assisted magnetic recording media

Abstract

A soft underlayer (SUL) and methods for making an SUL are provided, the SUL having characteristics that make it compatible with the high temperature requirements associated with heat-assisted magnetic recording (HAMR) media growth and writing, e.g., temperatures greater than 500° C. The SUL may have a high crystallization temperature of greater than 450° C. and a high Curie temperature greater than 300° C., for example. Additionally, the SUL can maintain a saturation magnetization value greater than, e.g., 9 kGauss, at such high temperatures, thereby having the ability to remain amorphous at temperatures up to, e.g., 650° C., and exhibiting a relatively flat integrated noise profile from approximately 300° C. to 650° C. Further still, a spacer layer material is chosen such that inter-diffusion does not occur at these high temperatures.

Claims

1. A recording medium, comprising: a magnetic recording layer; a soft underlayer disposed under the magnetic recording layer, the soft underlayer comprising: a first soft underlayer portion formed of a first soft underlayer material comprising a Cobalt-Iron (CoFe) material having a set of additives, the set of additives comprising W; and a second soft underlayer portion formed of a second soft underlayer material wherein the second underlayer material is different from the first underlayer material, wherein the first and second soft underlayer materials have Curie temperatures exceeding 300° C. and saturation magnetization values greater than 9 kGauss, and wherein the second soft underlayer material maintains an amorphous microstructure at a temperature greater than 450° C., wherein material composition ranges of the first and second soft underlayer materials comprise 20 to 90% Cobalt (Co), at most 60% Iron (Fe), at most 20% Nickel (Ni), at most 20% Zirconium (Zr), at most 15% Boron (B), at most 20% Tantalum (Ta), at most 10% Tungsten (W), and at most 10%_Molybdenum (Mo); and a spacer layer disposed between the first and second soft undeclayer portions, the spacer layer comprising material having inter-diffusion-resistant properties at temperatures greater than 1800° C., wherein the spacer layer is composed of one of Niobium (Nb), Vanadium (V), Mo, Osmium (Os), Carbon (C), Magnesium-Oxide (MgO), W, Rhenium (Re), Titanium Nitride (TiN), TiC, VN, MoC, TaN, TaC, Zr0.sub.2, Yttrium Oxide (Y.sub.20.sub.3), Silicon Dioxide (Si0.sub.2), or Ta; an adhesion layer; and a heatsink layer configured to facilitate heat transfer for the recording medium, wherein the soft underlayer and heatsink layer are disposed over the adhesion layer and under the magnetic recording layer.

2. The recording medium of claim 1, further comprising an interlayer disposed over the soft underlayer, an overcoat disposed over the magnetic recording layer, a lubricant disposed over the overcoat, and a substrate disposed under the adhesion layer, wherein the heatsink layer is disposed between the interlayer and soft underlayer.

3. The recording medium of claim 2, wherein the substrate comprises one of a glass substrate, a metal substrate, a metal alloy substrate, a polymer substrate, or a ceramic substrate.

4. The recording medium of claim 1, further comprising an interlayer disposed under the magnetic recording layer and over the soft underlayer, an overcoat disposed over the magnetic recording layer, a lubricant disposed over the overcoat, and a substrate disposed under the adhesion layer, wherein the heatsink layer is disposed between the soft underlayer and adhesion layer.

5. The recording medium of claim 4, wherein the substrate comprises one of a glass substrate, a metal substrate, a metal alloy substrate, a polymer substrate, or a ceramic sub.

6. The recording medium of claim 1 further comprising at least one additional soft underlayer, the at least one additional soft underlayer comprising additional first and second soft underlayer materials between which an additional spacer layer is disposed.

7. The recording medium of claim 1, wherein the spacer layer has a melting temperature greater than 1800° C.

8. The recording medium of claim 1, wherein the set of additives further comprises B and Ta.

9. The recording medium of claim 1, wherein the set of additives further comprises B and Zr.

10. The recording medium of claim 9, wherein the set of additives further comprises Ta.

11. The recording medium of claim 10, wherein the second soft underlayer material comprises Co and Fe.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) Various embodiments are illustrated by way of example, and not limitation, in the figures of the accompanying drawings in which:

(2) FIG. 1 illustrates an example conventional PMR disk drive system;

(3) FIG. 2A is a representation of a cross-sectional transmission electron microscopy image (TEM) of an as sputtered disk including conventional SULs;

(4) FIG. 2B is a representation of a cross-sectional TEM image of a disk including conventional SULs annealed at 500° C.;

(5) FIG. 3A illustrates a cross-sectional view of an example media structure utilized in evaluating SUL materials in accordance with one embodiment;

(6) FIG. 3B illustrates a cross sectional view of an example media structure utilized in evaluating SUL materials in accordance with another embodiment;

(7) FIG. 3C illustrates a cross sectional view of an example full stack HAMR media structure into which an SUL in accordance with various embodiments is integrated;

(8) FIG. 4A illustrates X-ray diffraction (XRD) spectra as a function of annealing temperature for an SUL material in accordance with one embodiment;

(9) FIG. 4B illustrates a representation of a TEM micrograph of the SUL material of FIG. 4A annealed at 650° C.;

(10) FIG. 5A illustrates XRD spectra as a function of annealing temperature for an SUL material in accordance with another embodiment;

(11) FIG. 5B illustrates a representation of a TEM micrograph of the SUL material of FIG. 5A annealed at 650° C.;

(12) FIG. 6A is a table of melting point temperatures of various spacer layers utilized in an SUL material in accordance with various embodiments;

(13) FIGS. 6B-6D illustrate representations of TEM micrographs for media structures utilizing various spacer layers in SULs configured in accordance with various embodiments;

(14) FIG. 7 illustrates an example noise spectra comparison between a conventional SUL and a HAMR SUL configured in accordance with one embodiment;

(15) FIG. 8 is a flow chart of example processes performed for manufacturing a HAMR disk utilizing an SUL in accordance with various embodiments; and

(16) FIG. 9 illustrates an example disk drive in which a HAMR disk utilizing an SUL configured in accordance with various embodiments can be implemented.

DETAILED DESCRIPTION

(17) In the following description, numerous specific details are set forth to provide a thorough understanding of various embodiment of the present disclosure. It will be apparent to one skilled in the art, however, that these specific details need not be employed to practice various embodiments of the present disclosure. In other instances, well known components or methods have not been described in detail to avoid unnecessarily obscuring various embodiments of the present disclosure.

(18) The high deposition temperatures relied upon to obtain high K.sub.u media and elevated temperatures during the writing process (as described above) can pose challenges when developing a SUL structure for HAMR media. Conventional PMR media design may include an amorphous antiparallel coupled SUL (through a thin spacer layer), which provides a closure path for conducting magnetic flux from the write pole to the opposing pole of the recording head.

(19) From a materials perspective alone, once this conventional SUL structure is heated above 500° C., there is a loss in antiparallel coupling due to inter-diffusion of the spacer layer. Additionally, at such higher temperatures, a conventional SUL (which is typically an alloy of Co, Fe, and Tantalum (Ta)) begins to crystallize, resulting in higher roughness for the HAMR media. Both the inter-diffusion and crystallization characteristics of conventional SULs can be detrimental, and play contributing factors to higher noise arising from the conventional SUL, thereby limiting media signal-to-noise ratio (SNR). FIGS. 2A and 2B illustrate an example of this issue of interlayer diffusion and crystallization when a PMR-like SUL stack is annealed at 500° C.

(20) In particular, FIGS. 2A and 2B illustrate representations of cross-sectional TEM images for an as sputtered disk 200a and another similar/identical disk 200b annealed at 500° C., respectively. FIG. 2A illustrates that the as sputtered disk 200a comprises a substrate layer 202, in this instance, a glass substrate, a Nickel-Tantalum (NiTa) adhesion layer 204, a first SUL 206-1 and a second SUL 206-2 with a Ruthenium (Ru) spacer layer 208 therebetween, and a carbon overcoat COC 210. Comparing FIGS. 2A and 2B, it can be seen that Ru spacer layer 208 inter-diffuses after annealing in disk 200b, and essentially disappears into the other layers. Moreover, the presence of crystalline grains is also evident in the annealed structure of disk 200b.

(21) Accordingly, various embodiments are directed to an SUL having certain characteristics that make it compatible with the high temperature requirement (which in the context of HAMR media, may be considered to be temperatures greater than 400° C.) of HAMR media growth, as well as the HAMR writing process. Unlike conventional SULs used in present generation PMR, an SUL in accordance with various embodiments has a high crystallization temperature T.sub.x (in this context, greater than 450° C.), and a high Curie temperature T.sub.c (in this context, greater than 300° C.,). Additionally, an SUL developed in accordance with various embodiments can maintain a saturation magnetization value B.sub.s greater than 9 kGauss at high temperatures. Thus, such an SUL can remain amorphous at temperatures up to, e.g., 650° C., and exhibit a relatively flat integrated noise profile from approximately 300° C. to 650° C. Further still, a spacer layer material is chosen such that inter-diffusion does not occur at these high temperatures.

(22) To arrive at an SUL that meets the aforementioned criteria, various SUL materials can be evaluated. FIG. 3A illustrates a cross-sectional view of an example media structure 300a utilized in evaluating various SUL materials to determine their suitability for use in HAMR media. Media structure 300a may include a substrate 302, an adhesion layer 304 (30-80 nm thick), a prospective SUL 306 (10-100 nm thick), an overcoat layer 310 (2-4 nm thick), and a lubricant layer 312. Media structure 300a may be post deposition annealed at temperatures ranging from approximately 300-650° C. It should be noted that annealing is described herein as being performed at various temperatures to mimic actual HAMR media deposition conditions.

(23) FIG. 3B illustrates a cross-sectional view of another example media structure 300b that may also be utilized in evaluating various SUL materials to determine their suitability for use in HAMR media. Media structure 300b, similar to media structure 300a, may include a substrate 302, an adhesion layer 304 (30-80 nm thick), an overcoat layer 310 (2-4 nm thick), and lubricant layer 312. In contrast to media structure 300a, however, media structure 300b may include two SULs 306-1 and 306-2 (each 10-50 nm thick), separated by a spacer layer 308 (0-5 nm thick).

(24) FIG. 3C illustrates a full stack HAMR media structure 300c, into which a SUL in accordance with various embodiments can be integrated. HAMR media structure 300c may include a substrate 302. Substrate 302 may be, e.g., a high temperature glass, metal, and/or metal alloy material. In one embodiment, substrate 302 can be disk-shaped or annular. Glass substrates that may be used include, for example, a silica-containing glass such as borosilicate glass and aluminosilicate glass. Metal and metal alloy substrates that may be used include, for example, aluminum (Al), tantalum (Ta), and aluminum magnesium (AlMg) substrates. In an alternative embodiment, other substrate materials such as polymers and ceramics may be used.

(25) HAMR media structure 300c may also include an adhesion layer 304 (30-80 nm thick), which can be, e.g., NiTa, disposed over substrate 302, as well as SUL 306 which in turn may be disposed over adhesion layer 304, and can be made up of first and second SULs 306-1 and 306-2 (each 10-50 nm thick), with a spacer layer 308 (0-5 nm thick) (as previously described with respect to FIG. 3B). The material(s) that make up SUL 306 and spacer layer 308 will be described in greater detail below. It should be noted that SUL 306-1 may be deposited over spacer layer 308, and SUL 306-2 may be deposited over adhesion layer 304 in an alternative embodiment.

(26) Disposed over SUL 306, is a heatsink layer 314 (60-90 nm thick) and an interlayer 316 (5-6 nm thick). Heatsink layer 314 can be configured to specifically facilitate heat transfer for the HAMR media. It should be noted that although the illustrated example embodiment depicts heatsink layer 314 as being disposed between SUL 306 and interlayer 316, it should be appreciated that heatsink layer 314 may alternatively be disposed between the SUL 306 and adhesion layer 304. Generally, regardless of the position within HAMR media structure 300c, heatsink layer 314 is typically a metal or other heat-conductive material. For example, metals or other heat-conductive materials with thermal conductivity greater than 100 W.Math.m.sup.−1.Math.K.sup.−1 may be utilized.

(27) Disposed over interlayer 316, is a recording layer 318 (8-12 nm thick). Recording layer 318 may be, as previously alluded to, an L1.sub.0 FePt, FePd, CoPt, or MnAl magnetic recording layer, or a Cobalt Platinum (CoPt) or Cobalt Palladium (CoPd) multilayer alloy having a predetermined/preferred thickness, granular structure, small grain size, desired uniformity, high coercivity, high magnetic flux, and good atomic ordering, as would be appropriate for HAMR media. Other additive elements may be added to the aforementioned alloy recording layer 318 including, e.g., Silver (Ag), Gold (Au), Cu, or Nickel (Ni), or Co. Recording layer 318 may be characterized, for example, in part by a magnetocrystalline anisotropy greater than 1×10.sup.7 erg/cm.sup.3.

(28) Deposition of the various layers described herein may be accomplished via, e.g., sputter deposition techniques, e.g., electroless plating, sputtering (e.g., static or in-line), chemical vapor deposition (CVD), ion-beam deposition (IBD), etc. For example, static sputter systems may be utilized. With in-line sputtering systems, disk substrates are loaded on a pallet that passes through a series of deposition chambers the deposit films successively being deposited on substrates.

(29) Further still, an overcoat layer 310 may be formed on top of recording layer 318 to, e.g., meet tribological requirements, such as contact-start-stop (CSS) performance and corrosion protection. Materials than can be utilized for overcoat layer 310 may be, e.g., carbon-based materials, such as hydrogenated or nitrogenated carbon. A lubricant layer 312 may be placed on top of overcoat layer 310 to further improve tribological performance. Some examples of lubricant that can be used in lubricant layer 312 include, but are not limited to perfluoropolyether, phosphazene lubricant, or a composite thereof.

(30) FIGS. 4A and 4B illustrate XRD spectra as a function of annealing temperature and a representation of a bright field TEM micrograph for an SUL material annealed at 650° C., respectively. The SUL material in this example embodiment, and others which will be discussed below may have a Bs of 11.3 kGauss, for example, and may be one of a Co or CoFe alloy having at least one additive, the at least one additive comprising Ni, Zirconium (Zr), Boron (B), Ta, Tungsten (W), or Molybdenum (Mo). Such Co or CoFe materials may have also varying compositions due to the amounts of each material(s) included therein, e.g., 20 to 90% Co, 0 to 60% Fe, 0- to 20% Ni, 0 to 20% Zr, 0 to 15% B, 0 to 20% Ta, 0 to 10% W, and 0 to 10% Mo.

(31) FIG. 4A illustrates XRD spectra for a substrate (e.g., substrate 302) only, and a media 400 (illustrated in part in FIG. 4B), with a structure similar to that illustrated in FIG. 3A, having a substrate 402, an NiTa adhesion layer 404, a CoFe-based SUL 406 including additives of Zr and B, an overcoat layer (not shown), and a lubricant layer (not shown), annealed at 300° C., 500° C., and 650° C. As can be appreciated, the XRD spectra of the substrate alone, and media 400 at the three temperatures remain substantially similar/graph on top of each other. This indicates a desired lack of crystallization (which would otherwise appear as peaks), therefore, suggesting that SUL 406 is amorphous at the aforementioned temperatures, including the deposition temperatures utilized in conjunction with HAMR media.

(32) FIG. 4B illustrates a representation of a bright field TEM micrograph for media 400, where it can be seen that SUL 406 remains in an amorphous state when media 400 is annealed at 650° C. FIG. 4B further illustrates this amorphous state of SUL 406 given the lack of appearance of lattice fringes and diffraction contrast (which would otherwise suggest crystalline structure(s)). Inset 420 of FIG. 4B also confirms the amorphous microstructure of SUL 406 given that the fast Fourier transform image (FFT) of SUL 406 includes only diffused rings indicative of the amorphous microstructure.

(33) FIGS. 5A and 5B illustrate X-ray diffraction (XRD) spectra as a function of annealing temperature and a bright field TEM micrograph for an SUL material annealed at 650° C., respectively. The SUL material in this example embodiment has a composition based upon CoFe and additives of Zr, B, and W, and has a Bs=10.6 kGauss.

(34) FIG. 5A illustrates XRD spectra for a substrate (e.g., substrate 302) only, and a media 500 (illustrated in part in FIG. 5B), with a structure similar to that illustrated in FIG. 3A, having a substrate 502, an NiTa adhesion layer 504, SUL 506, an overcoat layer (not shown), and a lubricant layer (not shown), annealed at 300° C., 500° C., and 650° C. As can be appreciated, the XRD spectra of the substrate alone, and media 500 at the three temperatures remain substantially similar/graph on top of each other. This indicates a desired lack of crystallization (as described above with reference to FIG. 4A), therefore, suggesting that SUL 506 is also amorphous at the aforementioned temperatures, including the deposition temperatures utilized in conjunction with HAMR media.

(35) FIG. 5B illustrates a bright field TEM micrograph for media 500, where it can be seen that SUL 506 remains amorphous when media 500 is annealed at 650° C. FIG. 5B additionally illustrates this amorphous state of SUL 506 given the lack of appearance of lattice fringes and diffraction contrast. Inset 520 of FIG. 5B further confirms the amorphous microstructure of SUL 506 because the FFT of CoFe-based SUL 506 includes only diffused rings indicative of the amorphous microstructure.

(36) It should be noted that another SUL alloy in accordance with another embodiment, may have a composition based on a CoFe alloy with Ta and B additives, and may have a Bs=12.3 kGauss, and which exhibits a high T.sub.x (greater than 600° C.). Referring back to FIG. 3C, it should be further noted that any of the aforementioned SUL alloys, whether it be the SUL 406, the SUL 506, or the aforementioned CoFe—Ta—B SUL, may be implemented, in any combination, as SUL 306-1 or SUL 306-2.

(37) It should be further noted that additional SUL layers/stacks may be implemented/incorporated into the media/media structures described herein. That is, there can be multiple laminated SUL stacks, for example, in a single media structure.

(38) As previously discussed, given a media structure like that of media structure 300b illustrated in FIG. 3B, utilizing Ru as spacer layer 308, and annealing at temperatures such as 500° C., can result in inter-diffusion where the Ru spacer layer 308 disappears into other layers. Thus, and in accordance with various embodiments, a spacer layer able to withstand the higher temperatures experienced with HAMR media, is utilized.

(39) FIG. 6A is a table of different materials having a melting point higher than, e.g., 1800° C., that would lend itself to use in HAMR media as a spacer layer between first and second SULs. FIG. 6A indicates that Magnesium Oxide (MgO), Ta, Rhenium (Re), and W, respectively having melting points at 2852° C., 3020° C., 3182° C., and 3422° C., can avoid inter-diffusion in the context of HAMR media, in particular, resistance to the temperatures required for HAMR media growth/processing and writing. In one embodiment, W is utilized as a spacer layer, the flattest microstructure and the highest of the indicated melting points associated with W, wherein a flat microstructure and high melting point are conducive to reducing noise. However, it should be noted that other materials or alloys may be utilized as a spacer layer, including but not limited to the following: Niobium (Nb), Vanadium (V), Mo, Osmium (Os), Carbon (C), Titanium Nitride (TiN), TiC, VN, MoC, TaN, TaC, ZrO2, Yttrium Oxide (Y203), or Silicon Dioxide (SiO2).

(40) FIGS. 6B and 6C illustrate representations of TEM micrographs for media 600a and 600b, respectively, each with a glass substrate 602, an NiTa adhesion layer 604, SUL A 606-1, SUL B 606-2, a carbon overcoat layer 610, and a lubricant layer 612. Furthermore, media 600a utilizes an MgO spacer layer 608, while media 600b utilizes a Ta spacer layer 608.

(41) FIG. 6D illustrates a representation of a TEM micrograph for media 600c, respectively, SUL 1 606-1, SUL 2 606-2, a carbon overcoat layer 610, a heatsink layer 614, an interlayer 616, and a recording layer 618. Furthermore, media 600c utilizes a W spacer layer 608.

(42) As can be appreciated from FIGS. 6B-6D, MgO, Ta, and W spacer layers are resistant to inter-diffusion, and show negligible diffraction contrast, indicating that these spacer layer materials have amorphous microstructures even after annealing at high temperatures, e.g., 550° C.

(43) FIG. 7 illustrates an example noise spectra comparison between a HAMR SUL material, such as those described herein, and a conventional, e.g., Co—Fe—Ta PMR SUL (Co being 20 to 40%, Fe being 40 to 60%, and Ta being 5-20%). As shown in FIG. 7, when a HAMR SUL material is utilized, integrated noise remains relatively low and constant. As previously described, the HAMR SUL material, due its ability to remain amorphous and flat, even at the higher temperatures associated with HAMR media growth and HAMR writing, can avoid contributing to noise. However, with a conventional PMR SUL, FIG. 7A illustrates that upon annealing at temperatures greater than 500° C., noise increases significantly. Accordingly the HAMR SUL materials contemplated in accordance with various embodiments results in noise generation as a result of the HAMR SUL material and HAMR-associated temperatures are independent of each other.

(44) FIG. 8 is a flow chart illustrating example processes for manufacturing a HAMR disk in accordance with various embodiments. At 810, a substrate is generated or otherwise provided. As previously discussed, the substrate may be a glass substrate. At 815, an adhesion layer is deposited over the substrate. At 820, an SUL is deposited over the adhesion layer. The SUL comprises first and second layers of a Co—Fe based alloy having at least one additive element and a spacer layer. The selection of a Co and Fe ratio and the at least one additive element in a saturation magnetization value greater than 9 kGuass, a Curie temperature exceeding 300° C., and a crystallization temperature exceeding 450° C., and wherein the spacer layer is resistant to inter-diffusion at or beyond 1800° C. The spacer layer is resistant to inter-diffusion at or beyond 1800° C. For example, and as described herein, each of the two layers making up the SUL may be a [CoFe]—ZrB or [CoFe]—ZrBW alloy, while the spacer layer can be one of the following: MgO; Re; W; or Ta. At 830, a heatsink layer is deposited over the SUL, or prior to deposition of the SUL, over the adhesion layer. At 840, an interlayer is deposited over one of the heatsink layer or SUL. At 850 a recording layer is deposited over the interlayer. At 860, an overcoat and lubricant layer are formed over the recording layer.

(45) FIG. 9 illustrates a disk drive 900 having one or more disks 940. Disk 940 resides on a spindle assembly 960 that is mounted to drive housing 980. Data may be stored along tracks in the magnetic recording layer of disk 940. The reading and writing of data is accomplished with head 950 that has both read and write elements. The write element is used to alter the properties of the perpendicular magnetic recording layer of disk 940. In one embodiment, head 950 may have magneto-resistive (MR), or giant magneto-resistive (GMR) elements. In an alternative embodiment, head 950 may be another type of head, for example, an inductive read/write head or a Hall effect head. In some embodiments, disk 940 has a media structure as depicted in FIG. 3C, and disk drive 900 is a heat assisted magnetic recording (HAMR) drive and incorporate components of a laser source, a waveguide, and a near-field transducer (not shown). Techniques in generating and focusing a laser beam are known in the art, and thus, are not described in particular detail. A spindle motor (not shown) rotates spindle assembly 960 and, thereby, disk 940 to position head 950 at a particular location along a desired disk track. The position of head 950 relative to disk 940 may be controlled by position control circuitry 970.

(46) Although described above in terms of various exemplary embodiments and implementations, it should be understood that the various features, aspects and functionality described in one or more of the individual embodiments are not limited in their applicability to the particular embodiment with which they are described, but instead can be applied, alone or in various combinations, to one or more of the other embodiments of the application, whether or not such embodiments are described and whether or not such features are presented as being a part of a described embodiment. Thus, the breadth and scope of the present application should not be limited by any of the above-described exemplary embodiments.

(47) The terms “over,” “under,” “between,” and “on” as used herein refer to a relative position of one media layer with respect to other layers. As such, for example, one layer disposed over or under another layer may be directly in contact with the other layer or may have one or more intervening layers. Moreover, one layer disposed between two layers may be directly in contact with the two layers or may have one or more intervening layers. In contrast, a first layer “on” a second layer is in contact with that second layer. Additionally, the relative position of one layer with respect to other layers is provided assuming operations are performed relative to a substrate without consideration of the absolute orientation of the substrate.

(48) Terms and phrases used in this document, and variations thereof, unless otherwise expressly stated, should be construed as open ended as opposed to limiting. As examples of the foregoing: the term “including” should be read as meaning “including, without limitation” or the like; the term “example” is used to provide exemplary instances of the item in discussion, not an exhaustive or limiting list thereof; the terms “a” or “an” should be read as meaning “at least one,” “one or more” or the like; and adjectives such as “conventional,” “traditional,” “normal,” “standard,” “known” and terms of similar meaning should not be construed as limiting the item described to a given time period or to an item available as of a given time, but instead should be read to encompass conventional, traditional, normal, or standard technologies that may be available or known now or at any time in the future. Likewise, where this document refers to technologies that would be apparent or known to one of ordinary skill in the art, such technologies encompass those apparent or known to the skilled artisan now or at any time in the future.

(49) The presence of broadening words and phrases such as “one or more,” “at least,” “but not limited to” or other like phrases in some instances shall not be read to mean that the narrower case is intended or required in instances where such broadening phrases may be absent. The use of the term “module” does not imply that the components or functionality described or claimed as part of the module are all configured in a common package. Indeed, any or all of the various components of a module, whether control logic or other components, can be combined in a single package or separately maintained and can further be distributed in multiple groupings or packages or across multiple locations.

(50) Additionally, the various embodiments set forth herein are described in terms of exemplary block diagrams, flow charts and other illustrations. As will become apparent to one of ordinary skill in the art after reading this document, the illustrated embodiments and their various alternatives can be implemented without confinement to the illustrated examples. For example, block diagrams and their accompanying description should not be construed as mandating a particular architecture or configuration.