THERMOELECTRIC CONVERSION MATERIAL, THERMOELECTRIC CONVERSION ELEMENT, AND THERMOELECTRIC CONVERSION MODULE

Abstract

There is provided a thermoelectric conversion material containing Cu and Se as main components, an element M including one or two or more elements selected from Group 10 elements and Group 11 elements excluding Cu, and optional element of Te. The thermoelectric conversion material is represented by the following chemical formula. Chemical Formula: Cu.sub.xSe.sub.(1−y)Te.sub.yM.sub.z,

1.95≤x<2.05,0≤y≤0.1,0.002≤z≤0.03.

Claims

1. A thermoelectric conversion material comprising: Cu and Se as main components; an element M including one or two or more elements selected from Group 10 elements and Group 11 elements excluding Cu; and optional element of Te, wherein the thermoelectric conversion material is represented by the following chemical formula, Chemical Formula: Cu.sub.xSe.sub.(1−y)Te.sub.yM.sub.z
1.95≤x<2.05
0≤y≤0.1
0.002≤z≤0.03.

2. The thermoelectric conversion material according to claim 1, wherein in the chemical formula, the following expressions are satisfied,
1.95≤x<2.05
0.05≤y≤0.1
0.002≤z≤0.01.

3. A thermoelectric conversion element comprising: the thermoelectric conversion material according to claim 1; and electrodes each joined to a first surface of the thermoelectric conversion material and a second surface facing the first surface.

4. A thermoelectric conversion module comprising: the thermoelectric conversion element according to claim 3; and terminals each joined to the electrodes of the thermoelectric conversion element.

Description

BRIEF DESCRIPTION OF DRAWINGS

[0028] FIG. 1 is a cross-sectional view of a thermoelectric conversion material, a thermoelectric conversion element, and a thermoelectric conversion module according to an embodiment of the present invention.

[0029] FIG. 2 is a graph showing the relationship between electrical resistivity and the temperature in Examples.

[0030] FIG. 3 is a graph showing the relationship between the Seebeck coefficient and the temperature in Examples.

[0031] FIG. 4 is a graph showing the relationship between the power factor and the temperature in Examples.

DESCRIPTION OF EMBODIMENTS

[0032] Hereinafter, a thermoelectric conversion material, a thermoelectric conversion element, and a thermoelectric conversion module according to an embodiment of the present invention will be described with reference to the attached drawings. Each embodiment to be described below is specifically described for a better understanding of the gist of the invention and does not limit the present invention unless otherwise specified. In addition, in the drawings used in the following description, for convenience, a portion that is the main part may be enlarged in some cases in order to make the features of the present invention easy to understand, and the dimensional ratio or the like of each component is not always the same as an actual one.

[0033] FIG. 1 shows a thermoelectric conversion material 11 according to an embodiment of the present invention, a thermoelectric conversion element 10 using the thermoelectric conversion material 11, and a thermoelectric conversion module 1.

[0034] The thermoelectric conversion element 10 includes a thermoelectric conversion material 11 according to the present embodiment, and electrodes 18a and 18b formed on a first surface 11a and a second surface 11b of the thermoelectric conversion material 11.

[0035] Further, the thermoelectric conversion module 1 includes terminals 19a and 19b each joined to the electrodes 18a and 18b of the thermoelectric conversion element 10 described above.

[0036] Nickel, silver, cobalt, tungsten, molybdenum, or the like is used in the electrodes 18a and 18b. The electrodes 18a and 18b can be formed by energized sintering, plating, electrodeposition, or the like.

[0037] The terminals 19a and 19b are formed of a metal material having excellent conductivity, for example, a plate material such as copper or aluminum. In the present embodiment, a rolled aluminum plate is used. Further, the thermoelectric conversion element 10 (the electrodes 18a and 18b) can be joined to the terminals 19a and 19b with an Ag joining material or solder by Ag brazing, or by Ag plating, Au plating, or the like of the electrodes 18a and 18b.

[0038] In addition, the thermoelectric conversion material 11 according to the present embodiment contains Cu and Se as main components and further contains optional element of Te, and an element M including one or two or more elements selected from Group 10 elements and Group 11 elements excluding Cu, where the thermoelectric conversion material is represented by the following chemical formula,

[0039] Chemical Formula: Cu.sub.xSe.sub.(1−y)Te.sub.yM.sub.z

1.95≤x<2.05

0≤y≤0.1

0.002≤z≤0.03.

[0040] Here, in the thermoelectric conversion material 11 according to the present embodiment, it is preferable that x, y, and z in the above chemical formula are each in the following range.

1.95≤x<2.05

0.05≤y≤0.1

0.002≤z≤0.01.

[0041] That is, the thermoelectric conversion material 11 according to the present embodiment contains copper selenide (Cu.sub.2Se) that contains a trace amount of an element M including one or two or more elements selected from Group 10 elements and Group 11 elements excluding Cu, and optional element of Te.

[0042] Since trace amounts of the element M and Te are contained, the electrical resistivity is decreased. Further, even in a case where trace amounts of the element M and Te are added to copper selenide (Cu.sub.2Se), the power factor is not significantly affected.

[0043] Here, in a case of setting x to 1.95≤x<2.05 in the above chemical formula, it is possible to secure the basic characteristics as a thermoelectric conversion material made of copper selenide.

[0044] In addition, in a case of setting y to 0≤y≤0.1, preferably 0.05≤x≤0.1 in the above chemical formula, it is possible to secure the basic properties as a thermoelectric conversion material made of copper selenide even in a case where a part of Se is replaced with Te.

[0045] Further, in a case of setting z to 0.002≤z≤0.03, preferably 0.002≤z≤0.01 in the above chemical formula, it is possible to decrease the electrical resistivity without decreasing the Seebeck coefficient more than necessary.

[0046] The thermoelectric conversion material 11 according to the present embodiment can be produced by weighing and mixing each of a Cu raw material, a Se raw material, a Te raw material, and a raw material containing the element M, and sintering the obtained mixture. It is noted that a Cu raw material or a Se raw material, which contains the element M and Te, may be used since trace amounts of the element M and Te are to be contained.

[0047] According to the thermoelectric conversion material 11 according to the present embodiment having such a configuration as described above, since the thermoelectric conversion material contains, in addition to Cu and Se, an element M including one or two or more elements selected from Group 10 elements and Group 11 elements excluding Cu, and further contains Te, as necessary, the electrical resistivity is decreased. However, the Seebeck coefficient is not decreased more than necessary. As a result, the power factor (PF), which is an indicator of the thermoelectric conversion efficiency, is excellent, and the thermoelectric conversion efficiency is high even in low voltage and high current applications.

[0048] Further, in the present embodiment, the electrical resistivity is further decreased, and the power factor (PF) is excellent in a case where the following expressions are satisfied in the above chemical formula; 1.95≤x<2.05, 0.05≤y≤0.1, and 0.002≤z≤0.01.

[0049] Although the embodiment of the present invention has been described above, the present invention is not limited thereto and can be appropriately modified without departing from the technical idea of the invention.

[0050] For example, in the present embodiment, although a description has been made such that a thermoelectric conversion module having a structure as shown in FIG. 1 is constituted, the present embodiment is not limited to this, and in a case where the thermoelectric conversion material of the present invention is used, there are no particular limitations on the structure and arrangement of electrodes or terminals.

EXAMPLES

[0051] Hereinafter, the results of experiments carried out to confirm the effect of the present invention will be described.

[0052] As shown in Table 1, a Cu raw material, a Se raw material, a Te raw material, and a raw material containing the element M were weighed and mixed.

[0053] Specifically, copper selenide (Cu.sub.2Se), a compound containing Te, and a compound containing the element M were used to obtain a mixture satisfying the composition shown in Table 1.

[0054] It is noted that in Present Invention Examples 1 to 3, a compound containing Pd and Ag was used as the raw material containing the element M, and in Present Invention Examples 4 to 6, a compound containing Ag was used as the raw material containing the element M.

[0055] The obtained mixture was pressed to be pelletized at 4 GPa for 1 minute with a hand press and subjected to primary sintering using a tube furnace. The conditions for the primary sintering were a sintering temperature of 100° C. to 200° C. in an Ar atmosphere and a holding time of 3 hours at the sintering temperature. Then, the obtained sintered body was weighed and subjected to secondary sintering using a tube furnace. The conditions for the secondary sintering were a sintering temperature of 850° C. in an Ar atmosphere and a holding time of 3 hours at the sintering temperature.

[0056] Finally, the obtained sintered body was cut to a predetermined size using a diamond band saw, and the surface of the cut sintered body was polished with sandpaper of various grit size. As a result, a thermoelectric conversion material having the composition shown in Table 1 was obtained.

[0057] The electrical resistivity R, the Seebeck coefficient, and the power factor PF at various temperatures were evaluated for the thermoelectric conversion material obtained as described above. The evaluation results are shown in FIGS. 2 to 4.

[0058] In FIGS. 2 to 4, (1) is Present Invention Example 1, (2) is Present Invention Example 2, (3) is Present Invention Example 3, (4) is Present Invention Example 4, and (5) is Present Invention Example 5, (6) is Present Invention Example 6, and Ref. is the comparative example.

[0059] The electrical resistivity R and the Seebeck coefficient S were measured by ZEM-3 manufactured by ADVANCE RIKO, Inc.

[0060] The power factor (PF) was determined according to Expression (1).

PF=S.sup.2/R . . .  (1)

[0061] Here, S: Seebeck coefficient (V/K), R: electrical resistivity (am)

TABLE-US-00001 TABLE 1 Composition (atomic %) Cu.sub.xSe.sub.(1−y)Te.sub.yM.sub.z Cu Se Te Element M x y z Present 66.1 32.9 0.10 0.84 2.0 0.003 0.025 Invention Example 1 Present 66.1 33.0 0.00 0.85 2.0 0.000 0.026 Invention Example 2 Present 66.0 33.0 0.00 0.99 2.0 0.000 0.030 Invention Example 3 Present 66.7 31.0 2.23 0.08 2.0 0.067 0.002 Invention Example 4 Present 66.7 30.7 2.49 0.09 2.0 0.075 0.003 Invention Example 5 Present 66.8 31.0 2.06 0.09 2.0 0.062 0.003 Invention Example 6 Comparative 66.7 33.3 0.00 0.00 2.0 0.000 0.000 Example

[0062] In FIGS. 2 to 4, Present Invention Examples 1 to 6 are shown as (1) to (6), and the comparative example is shown as “Ref.”.

[0063] As shown in FIG. 2, in Present Invention Examples 1 to 6, containing an element M including one or two or more elements selected from Group 10 elements (Ni, Pt, Pd, and the like) and Group 11 elements (Au, Ag, and the like) excluding Cu and containing Te, as necessary, the electrical resistivity is sufficiently decreased as compared with the comparative example which does not contain the element M and Te.

[0064] Further, as shown in FIG. 3, in Present Invention Examples 1 to 6, the Seebeck coefficient is decreased as compared with the comparative example. However, as shown in FIG. 4, there is no significant difference in the power factor (PF).

[0065] From the above, it has been confirmed that according to the present invention examples, it is possible to provide a thermoelectric conversion material having a low electrical resistivity, a sufficiently high power factor, and excellent thermoelectric conversion efficiency, as well as a thermoelectric conversion element and a thermoelectric conversion module, in which this thermoelectric conversion material is used.

REFERENCE SIGNS LIST

[0066] 1: Thermoelectric conversion module [0067] 10: Thermoelectric conversion element [0068] 11: Thermoelectric conversion material [0069] 18a, 18b: Electrode [0070] 19a, 19b: Terminal