Low-pressure chip packaging type junction box and processing method thereof for solar power generation assembly

Abstract

Provided is a low-pressure chip packaging type junction box for a solar power generation assembly and a processing method thereof, and more particularly, relates to a low-pressure chip packaging type junction box for a solar power generation assembly integrating techniques relating to development and manufacturing of junction boxes with semiconductor packaging techniques to increase a degree of product automation and a processing method thereof. The low-pressure chip packaging type junction box for a solar power generation assembly comprises a box body, N chips, N connection members, and N+1 copper conductors, where N≥1. At least one accommodation recess is arranged at the box body. The box body is provided with a transverse bar. Chip installation positions are arranged at N copper conductors. The N+1 copper conductors are provided with lead-out positions positioned at a top surface of the transverse bar. The chip is welded and fixed to the installation position at the copper conductor.

Claims

1. A low-pressure chip packaging type junction box for a solar power generation assembly, comprising a box body, N chips, N connection members and N+1 copper conductors, with N≥1, comprising: at least one accommodation recess is arranged at the box body; and a transverse bar with a top surface higher than a bottom surface of the accommodation recess arranged on the box body; wherein N of the N+1 copper conductors correspond to the N chips one to one; wherein chip installation positions are arranged at N copper conductors, and the N+1 copper conductors are provided with lead-out positions positioned at a top surface of the transverse bar, the N chips being soldered and fixed to the chip installation positions at the N+1 copper conductors and are connected to connection positions of adjacent copper conductors via connection members; wherein the N+1 copper conductors are connected in series by the N chips and the connection members, and form a bypass circuit with an output end; wherein the chip installation positions at the N+1 copper conductors, the N chips and the connection members are potted, fixed and packaged within the accommodation recess by a potting adhesive, and the lead-out positions of the N+1 copper conductors are located above the transverse bar and higher than a top surface of the potting adhesive; wherein busbar guide holes are arranged on the transverse bar and run through the transverse bar from a back face of the box body, and lower portions of the busbar guide holes at the back face of the box body are larger than upper portions of the busbar guide holes; and wherein threading holes corresponding to the busbar guide holes are arranged on the lead-out positions of the N+1 copper conductors.

2. The low-pressure chip packaging type junction box for a solar power generation assembly according to claim 1, wherein a process connecting strip is arranged between adjacent copper conductors.

3. The low-pressure chip packaging type junction box for a solar power generation assembly according to claim 1, wherein when N>1, a process connection ring is arranged between at least two copper conductors.

4. The low-pressure chip packaging type junction box for a solar power generation assembly according to claim 1, wherein when N>1, connection positions connecting the output end are further arranged on the first and the last copper conductors.

5. The low-pressure chip packaging type junction box for a solar power generation assembly according to claim 1, wherein when N>2, the N chips are arranged on two sides of the transverse bar, respectively.

Description

BRIEF DESCRIPTION

(1) Some of the embodiments will be described in detail, with references to the following Figures, wherein like designations denote like members, wherein:

(2) FIG. 1 is a structural schematic view of a first embodiment of the present invention;

(3) FIG. 2 is a structural schematic view of a box body in FIG. 1;

(4) FIG. 3 is an A-A section view of FIG. 2;

(5) FIG. 4 is a structural schematic view of a copper conductor frame in FIG. 1;

(6) FIG. 5 is a left view of FIG. 4;

(7) FIG. 6 is a structural schematic view for connection between a copper conductor frame and chips in FIG. 1;

(8) FIG. 7 is a structural schematic view for connection between copper conductors and chips in FIG. 1;

(9) FIG. 8 is a top view of FIG. 7;

(10) FIG. 9 is a structural schematic view for potting in a box body in embodiments of the present invention;

(11) FIG. 10 is a structural schematic view of embodiments of the present invention;

(12) FIG. 11 is a structural schematic view 1 of a lead-out end of the box body in FIG. 1;

(13) FIG. 12 is a structural schematic view 2 of a lead-out end of the box body in FIG. 1;

(14) FIG. 13 is a structural schematic view of a second embodiment of the present invention;

(15) FIG. 14 is a structural schematic view of a box body in FIG. 13;

(16) FIG. 15 is a B-B section view of FIG. 14;

(17) FIG. 16 is a structural schematic view of a copper conductor frame in FIG. 13;

(18) FIG. 17 is a left view of FIG. 16;

(19) FIG. 18 is a structural schematic view for connection between copper conductors and chips in FIG. 13;

(20) FIG. 19 is a structural schematic view of a third embodiment of the present invention;

(21) FIG. 20 is a structural schematic view of a box body in FIG. 19;

(22) FIG. 21 is a C-C section view of FIG. 20;

(23) FIG. 22 is a structural schematic view of a copper conductor frame in FIG. 19;

(24) FIG. 23 is a left view of FIG. 22;

(25) FIG. 24 is a structural schematic view 1 of a lead-out end of the box body in FIG. 19;

(26) FIG. 25 is a structural schematic view 2 of a lead-out end of the box body in FIG. 19;

(27) FIG. 26 is a structural schematic view for connection between a copper conductor frame and chips in FIG. 19;

(28) FIG. 27 is a structural schematic view of a fourth embodiment of the present invention;

(29) FIG. 28 is a structural schematic view of a box body in FIG. 27;

(30) FIG. 29 is a D-D section view of FIG. 28;

(31) FIG. 30 is a structural schematic view of a copper conductor frame in FIG. 27;

(32) FIG. 31 is a left view of FIG. 30;

(33) FIG. 32 is a structural schematic view 1 of a lead-out end of the box body in FIG. 27;

(34) FIG. 33 is a structural schematic view 2 of a lead-out end of the box body in FIG. 27;

(35) FIG. 34 is a structural schematic view for connection between a copper conductor frame and chips in FIG. 27;

(36) FIG. 35 is a structural schematic view of ultrasonic aluminum wire wedge bonding in the known art; and

(37) FIG. 36 is a structural schematic view of a high-pressure injection process in the known art;

(38) In the figures, 1 denotes a box body, 11 denotes an accommodation recess, 12 denotes a transverse bar, 120 denotes a busbar guide hole, 13 denotes a positioning stud, 14 denotes a conical blind hole, 2 denotes a chip, 3 denotes a connection member, 4 denotes a copper conductor, 41 denotes an installation hole, 42 denotes a lead-out position, 420 denotes a threading hole, 43 denotes a connection position, 5 denotes a potting adhesive, 6 denotes a process connecting strip, 7 denotes a process connection ring, 8 denotes a heat sink, 9 denotes a copper conductor frame, and 10 denotes an ultrasonic bonding tool.

DETAILED DESCRIPTION

(39) The embodiments, as shown in FIGS. 1-34, comprise a box body 1, N chips 2, N connection members 3 and N+1 copper conductors 4, with N≥1. At least one accommodation recess 11 is arranged at the box body, and a transverse bar 12 with a top surface higher than a bottom of the accommodation recess is arranged on the box body;

(40) The shape of the accommodation recess can be designed to be square, oval or polygonal depending on product requirements;

(41) Distribution of the accommodation recesses in a junction box: When the junction box has one accommodation recess, the accommodation recess is distributed on one side of the junction box; when the junction box has two or more accommodation recesses, the accommodation recesses are distributed on two sides or periphery of the junction box; the purpose is to maximally disperse heat sources and make use of limited heat dissipation space of the junction box;

(42) N of the N+1 copper conductors 4 correspond to the N chips one to one. Chip installation positions 41 are arranged at N copper conductors. The N+1 copper conductors are provided with lead-out positions 42 positioned at a top surface of the transverse bar so that the copper conductors have at least two planes with unequal heights;

(43) In this way, sinking locations of diode chips and copper conductors in the copper conductors soldered with diode chips are inlaid in the accommodation recesses of the box body, and are sealed and fixed inside the box body through potting of an epoxy resin adhesive with high thermal conductivity and high mechanical strength;

(44) In each accommodation recess, one or more chips can be inlaid, sealed and fixed; and sinking locations of two or more cooper conductors can be inlaid and sealed; for a copper conductor having a plurality of sinking locations, sinking locations are inlaid in different accommodation recesses in the junction box respectively.

(45) Sinking copper conductors are made of red copper, brass or alloy copper through punching and bending. The lower plane after bending is a sinking location. Each copper conductor has one or more sinking location; the sinking locations are distributed on one side or a few sides or at a middle position of the copper conductor.

(46) As shown in FIG. 19 and FIG. 27, when there is only one chip, chip installation positions are arranged on one of the two copper conductors, and lead-out positions are arranged on both of the copper conductors;

(47) As shown in FIG. 1 and FIG. 13, when there are three chips, chip installation positions are arranged on three of the four copper conductors, and lead-out positions are arranged on all of the four copper conductors;

(48) The chips are soldered on the installation positions of the copper conductors in a fixed manner and are connected to connection positions 43 of adjacent copper conductors via connection members;

(49) The N+1 copper conductors are connected in series by means of the chips and the connection members and form a bypass circuit with an output end; N surface of a diode chip in the junction box is soldered on a copper conductor, P of the diode chip is connected to an adjacent copper conductor in a jumping manner by means of soldered connection members, realizing series connection, and copper conductors are used as nodes for customer's soldering of a busbar and connection of output cables.

(50) When N=1, one node is formed; or when N>1, N+1 nodes are formed;

(51) The installation positions at the copper conductors, the chips and the connection members are potted, fixed and packaged within the accommodation recess by means of a potting adhesive 5, and the lead-out positions of the copper conductors are located above the transverse bar and higher than a top surface of the potting adhesive.

(52) A process connecting strip 6 is arranged between adjacent copper conductors so that a plurality of copper conductors temporarily forms an integral body to eliminate a pull stress on the chips resulting from relative movement of the copper conductors in the manufacturing process.

(53) When N>1, a process connection ring 7 is arranged between at least two copper conductors so that a plurality of copper conductors temporarily forms an integral body to eliminate a pull stress on the chips resulting from relative movement of the copper conductors in the manufacturing process.

(54) When N>1, connection positions connecting the output end are further arranged on the first and the last copper conductors. When N=1, a connection position connecting the output end is arranged on one copper conductor; and typically, when there is only one chip, a combined use is needed.

(55) A clearance is arranged between copper conductors, which are electrically connected by means of chips and connection members, wherein the first copper conductor has an anode cable lead-out end and the last copper conductor has a cathode cable lead-out end, and the anode cable lead-out end and the cathode cable lead-out end are both arranged outside the box body;

(56) The anode cable lead-out end and the cathode cable lead-out end are set to be perpendicular to the box body;

(57) The anode cable lead-out end and the cathode cable lead-out end are set to be in parallel with the box body;

(58) The anode cable lead-out end and the cathode cable lead-out end are set to be at any angle with the box body;

(59) When N>2, the chips are arranged on two sides of the transverse bar respectively. This distribution mode enables dispersion of heat sources during work of diodes, makes full use of the limited heat dissipation space in the junction box and reduces mutual impact.

(60) Busbar guide holes 120 are arranged on the transverse bar 12 and run through the transverse bar from a back face of the box body; and the lower openings of the busbar guide holes are large and the upper openings are small to play a guiding role and facilitate placement of a busbar;

(61) Threading holes 420 corresponding to the busbar guide holes are arranged on the lead-out positions 42 of the copper conductors.

(62) Threading holes and solder pads for customer's installation and soldering of a busbar are arranged on upper-layer stepped planes (i.e. lead-out positions) of sinking copper conductors; for copper conductors with one sinking location, threading holes and solder pads for customer's installation and soldering of a busbar are arranged on one side of the copper conductors; for copper conductors with two or more sinking locations, threading holes and solder pads for customer's installation and soldering of a busbar are arranged in the middle of the copper conductors.

(63) The processing method of a low-pressure chip packaging type junction box for a solar power generation assembly comprises the following steps:

(64) 1). Processing of copper conductors: punching copper sheets to form a copper conductor frame 9 where adjacent copper conductors are connected into a body via a process connecting structure and there is a clearance between them;

(65) Process connection rings or process connecting strips are arranged among copper conductors so that the copper conductors temporarily form an integral body. After chip soldering, potting and curing, the process connection rings or process connecting strips are removed;
2). Chip connection: soldering chips onto the copper conductors via connection members to form a copper conductor frame having a bypass circuit structure;
3). Packaging: putting the copper conductor framework at the foregoing step into the box body, potting an epoxy resin adhesive into the accommodation recess to package the chips and the connection members inside the epoxy resin adhesive and curing the epoxy resin adhesive; and
4). Cutting: cutting off the process connecting structure to obtain a low-pressure chip packaging type junction box for a solar power generation assembly.

(66) The process connecting structure at step 1) is a process connecting strip, which is located on a transverse bar and connected between lead-out positions of adjacent conductors,

(67) At step 4), process connecting strips between adjacent copper conductors are cut off by blanking machine.

(68) The embodiments reserve a space on the transverse bar of the box body to punch and remove connecting strips after curing of epoxy resin in the accommodation recess.

(69) The process connecting structure at step 1) is a process connection ring;

(70) At step 3), a positioning stud 13 is arranged in the accommodation recess of the box body, which is inside the process connection ring, and a conical blind hole 14 consistent with the centerline of the positioning stud is arranged on the bottom surface of the box body;

(71) At step 4), the process connection ring between adjacent copper conductors is removed through drilling and passing through the conical blind hole.

(72) The embodiments arrange positioning studs matched with process connection rings of copper conductors inside accommodation recesses of the box body, and arranges conical blind holes corresponding to the positioning studs on a back face of the box body to play a guiding role to accurately remove the process connection rings by means of drilling.

(73) A heat sink 8 is further comprised, which is packaged inside an epoxy resin adhesive, plays a heat sinking effect and can be made of copper sheets or aluminum sheets, etc.

(74) Although the present invention has been disclosed in the form of preferred embodiments and variations thereon, it will be understood that numerous additional modifications and variations could be made thereto without departing from the scope of the invention.

(75) For the sake of clarity, it is to be understood that the use of “a” or “an” throughout this application does not exclude a plurality, and “comprising” does not exclude other steps or elements. The mention of a “unit” or a “module” does not preclude the use of more than one unit or module.