Core material, electronic component and method for forming bump electrode
11495566 · 2022-11-08
Assignee
Inventors
- Shigeki Kondoh (Tokyo, JP)
- Masato TSUCHIYA (Tokyo, JP)
- Hiroyuki Iwamoto (Tokyo, JP)
- Hiroshi Okada (Tokyo, JP)
- Daisuke Souma (Tokyo, JP)
Cpc classification
H01L2224/136
ELECTRICITY
B23K35/262
PERFORMING OPERATIONS; TRANSPORTING
B23K35/0244
PERFORMING OPERATIONS; TRANSPORTING
H01L2224/1319
ELECTRICITY
International classification
Abstract
A core material has a core; a solder layer provided outside the core and being a solder alloy containing Sn and at least any one element of Ag, Cu, Sb, Ni, Co, Ge, Ga, Fe, Al, In, Cd, Zn, Pb, Au, P, S, Si, Ti, Mg, Pd, and Pt; and a Sn layer provided outside the solder layer. The solder layer has a thickness of 1 μm or more on one side. The Sn layer has a thickness of 0.1 μm or more on one side. A thickness of the Sn layer is 0.215% or more and 36% or less of the thickness of the solder layer.
Claims
1. A core material comprising: a core; a solder layer provided outside the core and being a solder alloy containing only Sn and at least any one element of Ag, Cu, Sb, Ni, Co, Ge, Ga, Fe, Al, In, Cd, Zn, Pb, Au, P, S, Si, Ti, Mg, Pd, and Pt; and a Sn plating layer provided outside the solder layer, wherein the solder layer has a thickness of 1 μm or more on one side, the Sn plating layer has a thickness of 0.1 μm or more on one side, and a thickness of the Sn plating layer is 0.215% or more and 36% or less of the thickness of the solder layer.
2. The core material according to claim 1, wherein the solder layer is a (Sn-Ag-Cu)-based solder.
3. The core material according to claim 1, further comprising a base plating layer made of any one of Ni, Co, Ni—Co, Ni—P and Ni—B between the core and the solder layer.
4. The core material according to claim 1, wherein Cu ball or Cu column is used as the core.
5. An electronic component using the core material according to claim 1 as a solder bump.
6. A method for forming bump electrode comprising steps of: mounting the core material according to claim 1 on an electrode; forming a bump electrode by heating the mounted core material.
7. The core material according to claim 1, wherein the Sn plating layer is an outermost layer.
Description
BRIEF DESCRIPTION OF DRAWINGS
(1)
(2)
EMBODIMENT FOR CARRYING OUT INVENTION
(3) Hereinafter, preferred embodiments of the present embodiment will be described in detail. In the embodiment, a core material and an electronic component including a semiconductor package using the core material are provided.
(4) The core material of the present embodiment may include a core; a solder layer provided outside the core and being a solder alloy containing Sn and at least any one element of Ag, Cu, Sb, Ni, Co, Ge, Ga, Fe, Al, In, Cd, Zn, Pb, Au, P, S, Si, Ti, Mg, Pd, and Pt; and a Sn layer provided outside the solder layer. The thickness of the solder layer may be 1 μm or more on one side. The thickness of the Sn layer is considered to be 0.1 to 12 μm on one side, but the upper limit value thereof may exceed 12 μm as long as the thickness of the Sn layer is 0.215% or more and 36% or less of that of the solder layer.
(5) The Sn layer may be formed to have a thickness of preferably 0.26% or more and 33.3% or less of that of the solder layer. In the present embodiment, as an example, a solder plating layer is described as the solder layer to be used, and a Sn plating layer is described as the Sn layer to be used, but the present invention is not limited thereto. The solder layer may be formed by a method other than plating, and similarly, the Sn layer may be formed by a method other than plating. The Sn layer may contain a component other than Sn as an impurity such as Ag, Cu, Bi, Sb, Ni, Co, Ge, Ga, Fe, Al, In, Cd, Zn, Pb, Au, P, S, or Si.
(6) The solder alloy may be a Sn-based solder alloy. The Sn-based solder alloy can include other additive elements in addition to (Sn—Ag)-based and (Sn—Cu)-based solder alloys. The element that can be added to the (Sn—Ag)-based and (Sn—Cu)-based solder alloys is one or two or more elements of Ag, Cu, Ni, Bi, Ge, Ga, In, Zn, Fe, Pb, Sb, Au, Pd, and Co and the like. For example, a (Sn—Ag—Cu—Ni)-based solder alloy and a (Sn—Ag—Sb)-based solder alloy and the like are considered. A Pb-based solder alloy may be used; the content (main component) of Pb may be the largest in mass; a (Pb—Sn)-based solder alloy may be used; and the content of Pb may be more than that of Sn. In Examples to be described later, SAC 305 (Ag 3.0 Cu 0.5 Sn balance), SnAg (Ag 3.5 Sn balance), SnCu (Cu 0.7 Sn balance), SnSb (Sb 10 Sn balance), SnIn (In 45 Sn balance), and SnPb (Pb 37 Sn balance) are used, but the present invention is not limited thereto. For example, for SAC, the content of Ag and the content of Cu may be changed, and Ag 0.1 Cu 0.1 Sn balance to Ag 10 Cu 10 Sn balance may be used. For SnAg, Ag 0.1 Sn balance to Ag 10 Sn balance may be used by changing the content of Ag. For SnCu, Cu 0.1 Sn balance to Cu1Sn balance may be used by changing the content of Cu. For SnSb, Sb 0.1 Sn balance to Sb 15 Sn balance may be used by changing the content of Sb. For SnIn, In 0.1 Sn balance to In 95 Sn balance may be used by changing the content of In. For SnPb, Pb 0.1 Sn balance to Pb 95 Sn balance may be used by changing the content of Pb. In the present application, the numerical value of the addition amount of each element is represented by % by mass. For example, “Ag 3.0 Cu 0.5 Sn balance” indicates that 3.0% by mass of Ag and 0.5% by mass of Cu are contained, the balance being Sn.
(7) The Sn plating layer is formed after the solder plating layer is formed. As an example, a solder plating layer containing Sn and at least any one element of Ag, Cu, Sb, Ni, Co, Ge, Ga, Fe, Al, In, Cd, Zn, Pb, Au, P, S, Si, Ti, Mg, Pd, and Pt on the core is formed. The core material on which the solder plating layer is formed may be pulled up from a molten liquid containing Sn and at least any one element of Ag, Cu, Sb, Ni, Co, Ge, Ga, Fe, Al, In, Cd, Zn, Pb, Au, P, S, Si, Ti, Mg, Pd, and Pt, and then immersed in a molten liquid of Sn to form the Sn plating layer. Both the solder plating layer and the Sn plating layer may be formed using barrel electroplating. Electroless plating may be used as a plating method.
(8) When the Sn plating layer is not provided, and the solder plating layer contains 0.1% by mass or more of a component other than Sn, the problem of discoloration occurs. When the Sn plating layer is not provided, and the solder plating layer is 100% by mass of Sn, the problem of discoloration does not occur, but the problem of discoloration is confirmed to occur when the solder plating layer is made of the following components. In the case of electroplating, if Ag or the like remains in the plating liquid just before the end of solder plating, substitution deposition-based discoloration of the surface is considered to occur.
(9) Ag 0.05 Cu 0.05 Sn balance, discolored
(10) Ag 0.1 Sn balance, discolored
(11) Cu 0.1 Sn balance, discolored
(12) Sb 0.1 Sn balance, discolored
(13) In 0.1 Sn balance, discolored
(14) Pb 0.1 Sn balance, discolored
(15) Metal or a resin is conceivable as the core, and a shape of the core is conceivable to be a sphere or other shape (columnar column, sheet shape, and the like). In the embodiment, a case of a Cu core ball which is a sphere and uses a ball which is, particularly, formed of Cu as the core (also referred to as “Cu ball”) will be described. The Cu core ball in the embodiment only needs to contain Cu in the core, and other configurations are not particularly limited.
(16) A particle diameter (sphere diameter) of the core differs depending on size of the BGA, but in the following example, the core has a spherical shape of about 300 μmφ and a thickness of the solder plating layer on one side in a diameter direction is 1 μm to 100 μm. A thickness of the Sn plating layer on one side in the diameter direction may be determined based on the thickness of the solder plating layer, and as described above the thickness of the Sn plating layer on one side in the diameter direction is 0.215% or more and 36% or less of the thickness of the solder plating layer, preferably 0.26% or more and 33.3% or less of the thickness of the solder plating layer. The particle diameter of the Cu core ball is appropriately selected according to a density and size of the electronic components to be used. Therefore, the core having the particle diameter in a range of 1 μm to 1000 μm can be used, and the plating thickness can be appropriately selected according to the particle diameter of the core to be used. A typical particle diameter when being used as a ball is 200 μm to 300 μm. When the particle diameter is further minimized in the future, a mainstream particle diameter may be 100 μm to 160 μm, and the present application can be used without any problem even with this particle diameter. As a plating apparatus that performs the plating treatment, an electroplating apparatus may be used.
(17) Subsequently, an example of the Cu core ball using the Cu ball as a core will be described.
(18) As illustrated in
(19) Cu used in the core 12 may be pure copper or an alloy of copper.
(20) When the core 12 having an alloy composition containing Cu as a main component is used, purity of Cu is not particularly limited, but from a viewpoint of suppressing deterioration of electric conductivity and thermal conductivity of the Cu core ball due to a decrease in purity and suppressing α-rays as necessary, the purity of Cu is preferably 99.9% by mass or more.
(21) The core may be formed of a metal simple substance of Ni, Ag, Bi, Pb, Al, Sn, Fe, Zn, In, Ge, Sb, Co, Mn, Au, Si, Pt, Cr, La, Mo, Nb, Pd, Ti, Zr, Mg, an alloy made from two or more of these components, a metal oxide, or a metal mixture oxide in addition to Cu, and may be formed of a resin material. As the resin material, a resin material formed of an amino resin, an acrylic resin, an ethylene-vinyl acetate resin, a styrene-butadiene block copolymer, a polyester resin, a melamine resin, a phenol resin, an alkyd resin, a polyimide resin, a urethane resin, an epoxy resin, a crosslinked resin, or the like is exemplified. Of these, it is preferable to use conductive plastic such as polyacetylene, polypyrrole, polythiophene, and polyaniline. When the core is formed of the resin material, the Cu core ball can be formed by a resin core, a Cu plating layer coating an outer side of the resin core, a base plating layer such as Ni coating a surface of the Cu plating layer, and a solder plating layer coating a surface of the base plating layer. A laminated structure of the Cu core ball is not limited to the above example.
(22) When the core 12 is spherical, from a viewpoint of controlling a stand-off height, sphericity of the core 12 is preferably 0.95 or more, and more preferably 0.990 or more. When the sphericity of the core 12 is less than 0.95, the core 12 has an indefinite shape. Therefore, a bump having a height which is not uniform is formed at the time of forming the bump, and the possibility of causing defective bonding increases. Further, when the Cu core ball 10 is mounted on the electrode and reflowed, and the sphericity is low, the Cu core ball 10 is misaligned and a self-alignment property deteriorates.
(23) Here, the sphericity represents a deviation from the sphere. The sphericity is obtained by various methods such as a least squares center method (LSC method), a minimum zone center method (MZC method), a maximum inscribed center method (MIC method), and a minimum circumscribed center method (MCC method). Specifically, the sphericity is an arithmetic average value calculated when the diameter of each of 500 cores is divided by a long diameter, and the closer the value is to the upper limit of 1.00, the closer to the sphere. The length of the long diameter is a length measured by ULTRA QV350-PRO measurement device (ultra quick vision manufactured by MITUTOYO CORPORATION).
(24) It is preferable that the diameter of the entire Cu core ball 10 including the solder plating layer 16 is 1 μm to 1000 μm. Within this range, the spherical Cu core ball 10 can be stably manufactured, and by selecting the particle diameter, it is possible to suppress a connection short circuit when there is a narrow pitch between the electrode terminals.
(25) The solder plating layer 16 is made of a solder alloy, and includes Sn and at least any one element of Ag, Cu, Sb, Ni, Co, Ge, Ga, Fe, Al, In, Cd, Zn, Pb, Au, P, S, Si, Ti, Mg, Pd, and Pt in the present embodiment.
(26) The thickness of the solder plating layer 16 varies depending on the particle diameter of the core 12, but the thickness of the solder plating layer 16 on one side in the diameter direction is preferably 100 μm or less. For example, when the core 12 has a particle diameter of 300 μmφ, the solder plating layer 16 is formed so as to have a thickness of 1 μm to 100 μm on one side. This is for securing a sufficient amount of solder bonding.
(27) As the plating liquid, a known plating liquid can be appropriately used according to the solder composition to be formed.
EXAMPLE
(28) Hereinafter, the embodiment will be described in detail with reference to Examples and Comparative Examples. The embodiment is not limited to these Examples.
(29) As an evaluation of the core ball having a composition shown in each Table which will be described later, an evaluation of yellowness and an evaluation of a defect at the time of bonding were performed based on the following criteria.
(30) <Yellowness>
(31) The yellowness of the core ball was measured by using a CM-2600d spectrophotometer manufactured by KONICA MINOLTA. The yellowness of 8.5 or less in the L*a*b* table color system was set to “Good” and indicated as “0” in each Table. The yellowness of more than 8.5 in the L*a*b* table color system was determined to be “defective” and indicated as “x” in each Table.
(32) <Defect at the Time of Bonding>
(33) Ten core balls (samples) having a composition in each Example and each Comparative Example, which are produced in the same production batch as each sample of which yellowness was measured, were prepared, and each core ball was bonded to a substrate by normal reflow processing. Regarding defects at the time of bonding, a case where a bonding defect was not measured in all the ten samples was indicated as “Good” and indicated as “o” in each Table. On the other hand, a case where misalignment or a ball missing is caused at the time of bonding in even one sample or a case where a core bursts open as the time of bonding in even one sample was determined to be “defective”, and indicated as “x” in Table.
(34) Core balls 10 in Examples and Comparative Examples were prepared under the following conditions. Diameter of core 12: 300 μm Film thickness of Ni base plating layer 14: 2 μm on one side Film thickness of solder plating layer 16: 1 μm on one side, 18 μm or 38 μm on one side Diameter of core ball 10 excluding Sn plating layer 20: 306 μm, 340 μm or 380 μm
(35) As a method for plating the Ni base plating layer 14, an electroplating method (barrel electroplating) was used for a sample having a core made of Cu. An electroless plating method was used for a sample having a core made of a resin. Aluminum as a core was subjected to a double zincate treatment for a sample having a core made of aluminum. Ni plating was thinly applied to the treated aluminum by an electroless plating method, and the Ni plating was then grown to a desired thickness by an electroplating method.
(36) The solder plating layer 16 was plated by an electroplating method (barrel electroplating).
(37) The Sn plating layer 20 was formed by pulling up the core ball including the solder plating layer 16 from a molten liquid containing Sn, Ag and Cu, Cu, Ag, Sb, In or Pb, and then immersing the core ball in a molten liquid of Sn. More specifically, the sample on which the solder plating layer 16 was formed was taken out from a plating liquid containing Sn, Ag and Cu, Cu, Ag, Sb, In or Pb, washed, and dried.
(38) After that, the sample was put into a plating liquid containing methane sulfonic acid Sn, an organic acid and a surfactant, and the barrel electroplating was performed until the sample has the thickness of the Sn plating layer 20 described in each Example and each Comparative example (excluding Comparative example in which the Sn plating layer 20 is not formed).
(39) In the following Table 1, aspects in which copper is used as the material of the core and the solder layer composition is made of SAC 305 are shown as Examples 1 to 9. Also in the following Table 2, aspects in which copper is used as the material of the core and the solder layer composition is made of SAC 305 are shown as Comparative Examples 1 to 9. In Examples 1 to 3 and Comparative Examples 1 to 3, the thickness of the solder layer on one side is 18 μm, but the thicknesses of the Sn layer one side are different from each other. In Examples 4 to 6 and Comparative Examples 4 to 6, the thickness of the solder layer one side is 38 μm, but the thicknesses of the Sn layer on one side are different from each other. In Examples 7 to 9 and Comparative Examples 7 to 9, the thickness of the solder layer on one side is 1 μm, but the thicknesses of the Sn layer on one side are different from each other. The “Sn layer: solder layer” shown in each Table is calculated by an expression of Sn layer thickness (one side)/solder layer (one side)×100, and is a value obtained by dividing the thickness of the Sn layer on one side by the thickness of the solder layer on one side, and expressed in %. It has the same meaning in the other Tables. The phrase “less than the lower limit value” shown in Tables of Comparative Examples means that the thickness of the Sn layer is less than 0.215% of that of the solder layer, and the phrase “exceeding the upper limit value” shown in Tables of Comparative Examples means that the thickness of the Sn layer exceeds 36% of that of the solder layer. These have the same meanings in the other Tables. In all of Examples 1 to 9, good results could be confirmed to be obtained in each of yellowness and a defect at the time of bonding. Meanwhile, in all of Comparative Examples 1 to 9, any of yellowness and the time of bonding could be confirmed to be poor. In particular, it could be confirmed that when the Sn layer is not provided or when the thickness of the Sn layer is less than 0.215% of that of the solder layer, a problem in yellowness occurs. Meanwhile, it could be confirmed that when the thickness of the Sn layer exceeds 36% of that of the solder layer, a defect at the time of bonding occurs.
(40) TABLE-US-00001 TABLE 1 EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- PLE 1 PLE 2 PLE 3 PLE 4 PLE 5 PLE 6 PLE 7 PLE 8 PLE 9 CORE MATERIAL COPPER COPPER COPPER COPPER COPPER COPPER COPPER COPPER COPPER THICKNESS OF 18 μm ON 18 μm ON 18 μm ON 38 μm ON 38 μm ON 38 μm ON 1 μm ON 1 μm ON 1 μm ON SOLDER LAYER ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE COMPOSITION OF SAC305 SAC305 SAC305 SAC305 SAC305 SAC305 SAC305 SAC305 SAC305 SOLDER LAYER THICKNESS OF Sn 0.1 0.5 6 0.1 0.5 12 0.1 0.23 0.36 LAYER (μm) Sn 0.556 2.778 33.333 0.263 1.316 31.573 10.000 23.000 36.000 LAYER:SOLDER LAYER YELLOWNESS ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ DEFECT AT THE ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ TIME OF BONDING
(41) TABLE-US-00002 TABLE 2 COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- PLE 1 PLE 2 PLE 3 PLE 4 PLE 5 PLE 6 PLE 7 PLE 8 PLE 9 CORE MATERIAL COPPER COPPER COPPER COPPER COPPER COPPER COPPER COPPER COPPER THICKNESS OF 18 μm ON 18 μm ON 18 μm ON 38 μm ON 38 μm ON 38 μm ON 1 μm ON 1 μm ON 1 μm ON SOLDER LAYER ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE COMPOSITION OF SAC305 SAC305 SAC305 SACS 05 SAC305 SAC305 SAC305 SAC305 SAC305 SOLDER LAYER THICKNESS OF Sn 0 0.03 10 0 0.03 15 0 0.002 0.5 LAYER (μm) Sn 0.000 0.167 55.556 0.000 0.079 39.474 0.000 0.200 50.000 LAYER:SOLDER 0:100 LESS THAN EX- 0:100 LESS THAN EX- 0:100 LESS THAN EX- LAYER LOWER CEEDING LOWER CEEDING LOWER CEEDING LIMIT UPPER LIMIT UPPER LIMIT UPPER VALUE LIMIT VALUE LIMIT VALUE LIMIT VALUE VALUE VALUE YELLOWNESS X X ◯ X X ◯ X X ◯ DEFECT AT THE ◯ ◯ X ◯ ◯ X ◯ ◯ X TIME OF BONDING
(42) In the following Table 3, aspects in which copper is used as the material of the core and the solder layer composition is made of SnCu (Cu 0.7 Sn balance) are shown as Examples 10 to 18. Also in the following Table 4, aspects in which copper is used as the material of the core and the solder layer composition is made of SnCu are shown as Comparative Examples 10 to 18. In Examples 10 to 12 and Comparative Examples 10 to 12, the thickness of the solder layer on one side is 18 μm, but the thicknesses of the Sn layer on one side are different from each other. In Examples 13 to 15 and Comparative Examples 13 to 15, the thickness of the solder layer on one side is 38 μm, but the thicknesses of the Sn layer on one side are different from each other. In Examples 16 to 18 and Comparative Examples 16 to 18, the thickness of the solder layer on one side is 1 μm, but the thicknesses of the Sn layer on one side are different from each other. In all of Examples 10 to 18, good results could be confirmed to be obtained in each of yellowness and a defect at the time of bonding. Meanwhile, in all of Comparative Examples 10 to 18, any of yellowness and the time of bonding could be confirmed to be poor. In particular, it could be confirmed that when the Sn layer is not provided or when the thickness of the Sn layer is less than 0.215% of that of the solder layer, a problem in yellowness occurs. Meanwhile, it could be confirmed that when the thickness of the Sn layer exceeds 36% of that of the solder layer, a defect at the time of bonding occurs.
(43) TABLE-US-00003 TABLE 3 EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- PLE 10 PLE 11 PLE 12 PLE 13 PLE 14 PLE 15 PLE 16 PLE 17 PLE 18 CORE MATERIAL COPPER COPPER COPPER COPPER COPPER COPPER COPPER COPPER COPPER THICKNESS OF 18 μm ON 18 μm ON 18 μm ON 38 μm ON 38 μm ON 38 μm ON 1 μm ON 1 μm ON 1 μm ON SOLDER LAYER ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE COMPOSITION OF SnCu SnCu SnCu SnCu SnCu SnCu SnCu SnCu SnCu SOLDER LAYER THICKNESS OF Sn 0.1 0.5 6 0.1 0.5 12 0.1 0.23 0.36 LAYER (μm) Sn 0.556 2.778 33.333 0.263 1.316 31.579 10.000 23.000 36.000 LAYER:SOLDER LAYER YELLOWNESS ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ DEFECT AT THE ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ TIME OF BONDING
(44) TABLE-US-00004 TABLE 4 COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- PLE 10 PLE 11 PLE 12 PLE 13 PLE 14 PLE 15 PLE 16 PLE 17 PLE 18 CORE MATERIAL COPPER COPPER COPPER COPPER COPPER COPPER COPPER COPPER COPPER THICKNESS OF 18 μm ON 18 μm ON 18 μm ON 38 μm ON 38 μm ON 38 μm ON 1 μm ON 1 μm ON 1 μm ON SOLDER LAYER ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE COMPOSITION OF SnCu SnCu SnCu SnCu SnCu SnCu SnCu SnCu SnCu SOLDER LAYER THICKNESS OF Sn 0 0.03 10 0 0.03 15 0 0.002 0.5 LAYER (μm) Sn 0.000 0.167 55.556 0.000 0.079 39.474 0.000 0.200 50.000 LAYER:SOLDER 0:100 LESS THAN EX- 0:100 LESS THAN EX- 0:100 LESS THAN EX- LAYER LOWER CEEDING LOWER CEEDING LOWER CEEDING LIMIT UPPER LIMIT UPPER LIMIT UPPER VALUE LIMIT VALUE LIMIT VALUE LIMIT VALUE VALUE VALUE YELLOWNESS X X ◯ X X ◯ X X ◯ DEFECT AT THE ◯ ◯ X ◯ ◯ X ◯ ◯ X TIME OF BONDING
(45) In the following Table 5, aspects in which copper is used as the material of the core and the solder layer composition is made of SnAg (Ag 3.5 Sn balance) are shown as Examples 19 to 27. Also in the following Table 6, aspects in which copper is used as the material of the core and the solder layer composition is made of SnAg are shown as Comparative Examples 19 to 27. In Examples 19 to 21 and Comparative Examples 19 to 21, the thickness of the solder layer one side is 18 μm, but the thicknesses of the Sn layer one side are different from each other. In Examples 22 to 24 and Comparative Examples 22 to 24, the thickness of the solder layer on one side is 38 μm, but the thicknesses of the Sn layer on one side are different from each other. In Examples 25 to 27 and Comparative Examples 25 to 27, the thickness of the solder layer on one side is 1 μm, but the thicknesses of the Sn layer on one side are different from each other. In all of Examples 19 to 27, good results could be confirmed to be obtained in each of yellowness and a defect at the time of bonding. Meanwhile, in all of Comparative Examples 19 to 27, any of yellowness and the time of bonding could be confirmed to be poor. In particular, it could be confirmed that when the Sn layer is not provided or when the thickness of the Sn layer is less than 0.215% of that of the solder layer, a problem in yellowness occurs. Meanwhile, it could be confirmed that when the thickness of the Sn layer exceeds 36% of that of the solder layer, a defect at the time of bonding occurs.
(46) TABLE-US-00005 TABLE 5 EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- PLE 19 PLE 20 PLE 21 PLE 22 PLE 23 PLE 24 PLE 25 PLE 26 PLE 27 CORE MATERIAL COPPER COPPER COPPER COPPER COPPER COPPER COPPER COPPER COPPER THICKNESS OF 18 μm ON 18 μm ON 18 μm ON 38 μm ON 38 μm ON 38 μm ON 1 μm ON 1 μm ON 1 μm ON SOLDER LAYER ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE COMPOSITION OF SnAg SnAg SnAg SnAg SnAg SnAg SnAg SnAg SnAg SOLDER LAYER THICKNESS OF Sn 0.1 0.5 6 0.1 0.5 12 0.1 0.23 0.36 LAYER (μm) Sn 0.556 2.778 33.333 0.263 1.316 31.579 10.000 23.000 36.000 LAYER:SOLDER LAYER YELLOWNESS ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ DEFECT AT THE ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ TIME OF BONDING
(47) TABLE-US-00006 TABLE 6 COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- PLE 19 PLE 20 PLE 21 PLE 22 PLE 23 PLE 24 PLE 25 PLE 26 PLE 27 CORE MATERIAL COPPER COPPER COPPER COPPER COPPER COPPER COPPER COPPER COPPER THICKNESS OF 18 μm ON 18 μm ON 18 μm ON 38 μm ON 38 μm ON 38 μm ON 1 μm ON 1 μm ON 1 μm ON SOLDER LAYER ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE COMPOSITION OF SnAg SnAg SnAg SnAg SnAg SnAg SnAg SnAg SnAg SOLDER LAYER THICKNESS OF Sn 0 0.03 10 0 0.03 15 0 0.002 0.5 LAYER (μm) Sn 0.000 0.167 55.556 0.000 0.079 39.474 0.000 0.200 50.000 LAYER:SOLDER 0:100 LESS THAN EX- 0:100 LESS THAN EX- 0:100 LESS THAN EX- LAYER LOWER CEEDING LOWER CEEDING LOWER CEEDING LIMIT UPPER LIMIT UPPER LIMIT UPPER VALUE LIMIT VALUE LIMIT VALUE LIMIT VALUE VALUE VALUE YELLOWNESS X X ◯ X X ◯ X X ◯ DEFECT AT THE ◯ ◯ X ◯ ◯ X ◯ ◯ X TIME OF BONDING
(48) In the following Table 7, aspects in which copper is used as the material of the core and the solder layer composition is made of SnSb (Sb 10 Sn balance) are shown as Examples 28 to 36. Also in the following Table 8, aspects in which copper is used as the material of the core and the solder layer composition is made of SnSb are shown as Comparative Examples 28 to 36. In Examples 28 to 30 and Comparative Examples 28 to 30, the thickness of the solder layer on one side is 18 μm, but the thicknesses of the Sn layer on one side are different from each other. In Examples 31 to 33 and Comparative Examples 31 to 33, the thickness of the solder layer on one side is 38 μm, but the thicknesses of the Sn layer on one side are different from each other. In Examples 34 to 36 and Comparative Examples 34 to 36, the thickness of the solder layer on one side is 1 μm, but the thicknesses of the Sn layer on one side are different from each other. In all of Examples 28 to 36, good results could be confirmed to be obtained in each of yellowness and a defect at the time of bonding. Meanwhile, in all of Comparative Examples 28 to 36, any of yellowness and the time of bonding could be confirmed to be poor. In particular, it could be confirmed that when the Sn layer is not provided or when the thickness of the Sn layer is less than 0.215% of that of the solder layer, a problem in yellowness occurs. Meanwhile, it could be confirmed that when the thickness of the Sn layer exceeds 36% of that of the solder layer, a defect at the time of bonding occurs.
(49) TABLE-US-00007 TABLE 7 EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- PLE 28 PLE 29 PLE 30 PLE 31 PLE 32 PLE 33 PLE 34 PLE 35 PLE 36 CORE MATERIAL COPPER COPPER COPPER COPPER COPPER COPPER COPPER COPPER COPPER THICKNESS OF 18 μm ON 18 μm ON 18 μm ON 38 μm ON 38 μm ON 38 μm ON 1 μm ON 1 μm ON 1 μm ON SOLDER LAYER ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE COMPOSITION OF SnSb SnSb SnSb SnSb SnSb SnSb SnSb SnSb SnSb SOLDER LAYER THICKNESS OF 0.1 0.5 6 0.1 0.5 12 0.1 0.23 0.36 Sn LAYER (μm) Sn 0.556 2.778 33.333 0.263 1.316 31.579 10.000 23.000 36.000 LAYER:SOLDER LAYER YELLOWNESS ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ DEFECT AT THE ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ TIME OF BONDING
(50) TABLE-US-00008 TABLE 8 COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- PLE 28 PLE 29 PLE 30 PLE 31 PLE 32 PLE 33 PLE 34 PLE 35 PLE 36 CORE MATERIAL COPPER COPPER COPPER COPPER COPPER COPPER COPPER COPPER COPPER THICKNESS OF 18 μm ON 18 μm ON 18 μm ON 38 μm ON 38 μm ON 38 μm ON 1 μm ON 1 μm ON 1 μm ON SOLDER LAYER ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE COMPOSITION OF SnSb SnSb SnSb SnSb SnSb SnSb SnSb SnSb SnSb SOLDER LAYER THICKNESS OF Sn 0 0.03 10 0 0.03 15 0 0.002 0.5 LAYER (μm) Sn 0.000 0.167 55.556 0.000 0.079 39.474 0.000 0.200 50.000 LAYER:SOLDER 0:100 LESS THAN EX- 0:100 LESS THAN EX- 0:100 LESS THAN EX- LAYER LOWER CEEDING LOWER CEEDING LOWER CEEDING LIMIT UPPER LIMIT UPPER LIMIT UPPER VALUE LIMIT VALUE LIMIT VALUE LIMIT VALUE VALUE VALUE YELLOWNESS X X ◯ X X ◯ X X ◯ DEFECT AT THE ◯ ◯ X ◯ ◯ X ◯ ◯ X TIME OF BONDING
(51) In the following Table 9, aspects in which copper is used as the material of the core and the solder layer composition is made of SnIn (In 45 Sn balance) is shown as Examples 37 to 45. Also in the following Table 10, aspects in which copper is used as the material of the core and the solder layer composition is made of SnIn are shown as Comparative Examples 37 to 45. In Examples 37 to 39 and Comparative Examples 37 to 39, the thickness of the solder layer on one side is 18 μm, but the thicknesses of the Sn layer on one side are different from each other. In Examples 40 to 42 and Comparative Examples 40 to 42, the thickness of the solder layer on one side is 38 μm, but the thicknesses of the Sn layer on one side are different from each other. In Examples 43 to 45 and Comparative Examples 43 to 45, the thickness of the solder layer on one side is 1 μm, but the thicknesses of the Sn layer on one side are different from each other. In all of Examples 37 to 45, good results could be confirmed to be obtained in each of yellowness and a defect at the time of bonding. Meanwhile, in all of Comparative Examples 37 to 45, any of yellowness and the time of bonding could be confirmed to be poor. In particular, it could be confirmed that when the Sn layer is not provided or when the thickness of the Sn layer is less than 0.215% of that of the solder layer, a problem in yellowness occurs. Meanwhile, it could be confirmed that when the thickness of the Sn layer exceeds 36% of that of the solder layer, a defect at the time of bonding occurs.
(52) TABLE-US-00009 TABLE 9 EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- PLE 37 PLE 38 PLE 39 PLE 40 PLE 41 PLE 42 PLE 43 PLE 44 PLE 45 CORE MATERIAL COPPER COPPER COPPER COPPER COPPER COPPER COPPER COPPER COPPER THICKNESS OF 18 μm ON 18 μm ON 18 μm ON 38 μm ON 38 μm ON 38 μm ON 1 μm ON 1 μm ON 1 μm ON SOLDER LAYER ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE COMPOSITION OF SnIn SnIn SnIn SnIn SnIn SnIn SnIn SnIn SnIn SOLDER LAYER THICKNESS OF 0.1 0.5 6 0.1 0.5 12 0.1 0.23 0.36 Sn LAYER (μm) Sn 0.556 2.778 33.333 0.263 1.316 31.579 10.000 23.000 36.000 LAYER:SOLDER LAYER YELLOWNESS ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ DEFECT AT THE ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ TIME OF BONDING
(53) TABLE-US-00010 TABLE 10 COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- PLE 37 PLE 38 PLE 39 PLE 40 PLE 41 PLE 42 PLE 43 PLE 44 PLE 45 CORE MATERIAL COPPER COPPER COPPER COPPER COPPER COPPER COPPER COPPER COPPER THICKNESS OF 18 μm ON 18 μm ON 18 μm ON 38 μm ON 38 μm ON 38 μm ON 1 μm ON 1 μm ON 1 μm ON SOLDER LAYER ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE COMPOSITION OF SnIn SnIn SnIn SnIn SnIn SnIn SnIn SnIn SnIn SOLDER LAYER THICKNESS OF Sn 0 0.03 10 0 0.03 15 0 0.002 0.5 LAYER (μm) Sn 0.000 0.167 55.556 0.000 0.079 39.414 0.000 0.200 50.000 LAYER:SOLDER 0:100 LESS THAN EX- 0:100 LESS THAN EX- 0:100 LESS THAN EX- LAYER LOWER CEEDING LOWER CEEDING LOWER CEEDING LIMIT UPPER LIMIT UPPER LIMIT UPPER VALUE LIMIT VALUE LIMIT VALUE LIMIT VALUE VALUE VALUE YELLOWNESS X X ◯ X X ◯ X X ◯ DEFECT AT THE ◯ ◯ X ◯ ◯ X ◯ ◯ X TIME OF BONDING
(54) In the following Table 11, aspects in which copper is used as the material of the core and the solder layer composition is made of SnPb (Pb 37 Sn balance) are shown as Examples 46 to 54. Also in the following Table 12, aspects in which copper is used as the material of the core and the solder layer composition is made of SnPb are shown as Comparative Examples 46 to 54. In Examples 46 to 48 and Comparative Examples 46 to 48, the thickness of the solder layer on one side is 18 μm, but the thicknesses of the Sn layer on one side are different from each other. In Examples 49 to 51 and Comparative Examples 49 to 51, the thickness of the solder layer on one side is 38 μm, but the thicknesses of the Sn layer on one side are different from each other. In Examples 52 to 54 and Comparative Examples 52 to 54, the thickness of the solder layer on one side is 1 μm, but the thicknesses of the Sn layer on one side are different from each other. In all of Examples 46 to 54, good results could be confirmed to be obtained in each of yellowness and a defect at the time of bonding. Meanwhile, in all of Comparative Examples 46 to 54, any of yellowness and the time of bonding could be confirmed to be poor. In particular, it could be confirmed that when the Sn layer is not provided or when the thickness of the Sn layer is less than 0.215% of that of the solder layer, a problem in yellowness occurs. Meanwhile, it could be confirmed that when the thickness of the Sn layer exceeds 36% of that of the solder layer, a defect at the time of bonding occurs.
(55) TABLE-US-00011 TABLE 11 EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- PLE 46 PLE 47 PLE 48 PLE 49 PLE 50 PLE 51 PLE 52 PLE 53 PLE 54 CORE MATERIAL COPPER COPPER COPPER COPPER COPPER COPPER COPPER COPPER COPPER THICKNESS OF 18 μm ON 18 μM ON 18 μm ON 38 μm ON 38 μm ON 38 μm ON 1 μm ON 1 μm ON 1 μm ON SOLDER LAYER ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE COMPOSITION OF SnPb SnPb SnPb SnPb SnPb SnPb SnPb SnPb SnPb SOLDER LAYER THICKNESS OF 0.1 0.5 6 0.1 0.5 12 0.1 0.23 0.36 Sn LAYER (μm) Sn 0.556 2.778 33.333 0.263 1.316 31.579 10.000 23.000 36.000 LAYER:SOLDER LAYER YELLOWNESS ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ DEFECT AT THE ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ TIME OF BONDING
(56) TABLE-US-00012 TABLE 12 COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- PLE 46 PLE 47 PLE 48 PLE 49 PLE 50 PLE 51 PLE 52 PLE 53 PLE 54 CORE MATERIAL COPPER COPPER COPPER COPPER COPPER COPPER COPPER COPPER COPPER THICKNESS OF 18 μm ON 18 μm ON 18 μm ON 38 μm ON 38 μm ON 38 μm ON 1 μm ON 1 μm ON 1 μm ON SOLDER LAYER ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE COMPOSITION OF SnPb SnPb SnPb SnPb SnPb SnPb SnPb SnPb SnPb SOLDER LAYER THICKNESS OF 0 0.03 10 0 0.03 15 0 0.002 0.5 Sn LAYER (μm) Sn 0.000 0.167 55.556 0.000 0.079 39.474 0.000 0.200 50.000 LAYER:SOLDER 0:100 LESS THAN EX- 0:100 LESS THAN EX- 0:100 LESS THAN EX- LAYER LOWER CEEDING LOWER CEEDING LOWER CEEDING LIMIT UPPER LIMIT UPPER LIMIT UPPER VALUE LIMIT VALUE LIMIT VALUE LIMIT VALUE VALUE VALUE YELLOWNESS X X ◯ X X ◯ X X ◯ DEFECT AT THE ◯ ◯ X ◯ ◯ X ◯ ◯ X TIME OF BONDING
(57) In the following Tables 13 to 24, the solder layer composition was changed to
(58) TABLE-US-00013 TABLE 13 EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- PLE 55 PLE 56 PLE 57 PLE 58 PLE 59 PLE 60 PLE 61 PLE 62 PLE 63 CORE MATERIAL ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- NUM NUM NUM NUM NUM NUM NUM NUM NUM THICKNESS OF 18 μm ON 18 μm ON 18 μm ON 38 μm ON 38 μm ON 38 μm ON 1 μm ON 1 μm ON 1 μm ON SOLDER LAYER ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE COMPOSITION OF SAC305 SAC305 SAC305 SAC305 SAC305 SAC305 SAC305 SAC305 SAC305 SOLDER LAYER THICKNESS OF 0.1 0.5 6 0.1 0.5 12 0.1 0.23 0.36 Sn LAYER (μm) Sn 0.556 2.778 33.333 0.263 1.316 31.579 10.000 23.000 36.000 LAYER:SOLDER LAYER YELLOWNESS ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ DEFECT AT THE ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ TIME OF BONDING
(59) TABLE-US-00014 TABLE 14 COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- PLE 55 PLE 56 PLE 57 PLE 58 PLE 59 PLE 60 PLE 61 PLE 62 PLE 63 CORE MATERIAL ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- NUM NUM NUM NUM NUM NUM NUM NUM NUM THICKNESS OF 18 μm ON 18 μm ON 18 μm ON 38 μm ON 38 μm ON 38 μm ON 1 μm ON 1 μm ON 1 μm ON SOLDER LAYER ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE COMPOSITION OF SAC305 SAC305 SAC305 SAC305 SAC305 SAC305 SAC305 SAC305 SAC305 SOLDER LAYER THICKNESS OF 0 0.03 10 0 0.03 15 0 0.002 0.5 Sn LAYER (μm) Sn 0.000 0.167 55.556 0.000 0.079 39.474 0.000 0.200 50.000 LAYER:SOLDER 0:100 LESS THAN EX- 0:100 LESS THAN EX- 0:100 LESS THAN EX- LAYER LOWER CEEDING LOWER CEEDING LOWER CEEDING LIMIT UPPER LIMIT UPPER LIMIT UPPER VALUE LIMIT VALUE LIMIT VALUE LIMIT VALUE VALUE VALUE YELLOWNESS X X ◯ X X ◯ X X ◯ DEFECT AT THE ◯ ◯ X ◯ ◯ X ◯ ◯ X TIME OF BONDING
(60) TABLE-US-00015 TABLE 15 EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- PLE 64 PLE 65 PLE 66 PLE 67 PLE 68 PLE 69 PLE 70 PLE 71 PLE 72 CORE MATERIAL ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- NUM NUM NUM NUM NUM NUM NUM NUM NUM THICKNESS OF 18 μm ON 18 μm ON 18 μm ON 38 μm ON 38 μm ON 38 μm ON 1 μm ON 1 μm ON 1 μm ON SOLDER LAYER ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE COMPOSITION OF SnCu SnCu SnCu SnCu SnCu SnCu SnCu SnCu SnCu SOLDER LAYER THICKNESS OF 0.1 0.5 6 0.1 0.5 12 0.1 0.23 0.36 Sn LAYER (μm) Sn 0.556 2.778 33.333 0.263 1.316 31.579 10.000 23.000 36.000 LAYER:SOLDER LAYER YELLOWNESS ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ DEFECT AT THE ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ TIME OF BONDING
(61) TABLE-US-00016 TABLE 16 COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- PLE 64 PLE 65 PLE 66 PLE 67 PLE 68 PLE 69 PLE 70 PLE 71 PLE 72 CORE MATERIAL ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- NUM NUM NUM NUM NUM NUM NUM NUM NUM THICKNESS OF 18 μm ON 18 μm ON 18 μm ON 38 μm ON 38 μm ON 38 μm ON 1 μm ON 1 μm ON 1 μm ON SOLDER LAYER ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE COMPOSITION OF SnCu SnCu SnCu SnCu SnCu SnCu SnCu SnCu SnCu SOLDER LAYER THICKNESS OF 0 0.03 10 0 0.03 15 0 0.002 0.5 Sn LAYER (μm) Sn 0.000 0.167 55.556 0.000 0.079 39.474 0.000 0.200 50.000 LAYER:SOLDER 0:100 LESS THAN EX- 0:100 LESS THAN EX- 0:100 LESS THAN EX- LAYER LOWER CEEDING LOWER CEEDING LOWER CEEDING LIMIT UPPER LIMIT UPPER LIMIT UPPER VALUE LIMIT VALUE LIMIT VALUE LIMIT VALUE VALUE VALUE YELLOWNESS X X ◯ X X ◯ X X ◯ DEFECT AT THE ◯ ◯ X ◯ ◯ X ◯ ◯ X TIME OF BONDING
(62) TABLE-US-00017 TABLE 17 EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- PLE 73 PLE 74 PLE 75 PLE 76 PLE 77 PLE 78 PLE 79 PLE 80 PLE 81 CORE MATERIAL ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- NUM NUM NUM NUM NUM NUM NUM NUM NUM THICKNESS OF 18 μm ON 18 μm ON 18 μm ON 38 μm ON 38 μm ON 38 μm ON 1 μm ON 1 μm ON 1 μm ON SOWER LAYER ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE COMPOSITION OF SnAg SnAg SnAg SnAg SnAg SnAg SnAg SnAg SnAg SOLDER LAYER THICKNESS OF 0.1 0.5 6 0.1 0.5 12 0.1 0.23 0.36 Sn LAYER (μm) Sn 0.556 2.778 33.333 0.263 1.316 31.579 10.000 23.000 36.000 LAYER:SOLDER LAYER YELLOWNESS ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ DEFECT AT THE ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ TIME OF BONDING
(63) TABLE-US-00018 TABLE 18 COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- PLE 73 PLE 74 PLE 75 PLE 76 PLE 77 PLE 78 PLE 79 PLE 80 PLE 81 CORE MATERIAL ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- NUM NUM NUM NUM NUM NUM NUM NUM NUM THICKNESS OF 18 μm ON 18 μm ON 18 μm ON 38 μm ON 38 μm ON 38 μm ON 1 μm ON 1 μm ON 1 μm ON SOLDER LAYER ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE COMPOSITION OF SnAg SnAg SnAg SnAg SnAg SnAg SnAg SnAg SnAg SOLDER LAYER THICKNESS OF 0 0.03 10 0 0.03 15 0 0.002 0.5 Sn LAYER (μm) Sn 0.000 0.167 55.556 0.000 0.079 39.474 0.000 0.200 50.000 LAYER:SOLDER 0:100 LESS THAN EX- 0:100 LESS THAN EX- 0:100 LESS THAN EX- LAYER LOWER CEEDING LOWER CEEDING LOWER CEEDING LIMIT UPPER LIMIT UPPER LIMIT UPPER VALUE LIMIT VALUE LIMIT VALUE LIMIT VALUE VALUE VALUE YELLOWNESS X X ◯ X X ◯ X X ◯ DEFECT AT THE ◯ ◯ X ◯ ◯ X ◯ ◯ X TIME OF BONDING
(64) TABLE-US-00019 TABLE 19 EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- PLE 82 PLE 83 PLE 84 PLE 85 PLE 86 PLE 87 PLE 88 PLE 89 PLE 90 CORE MATERIAL ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- NUM NUM NUM NUM NUM NUM NUM NUM NUM THICKNESS OF 18 μm ON 18 μm ON 18 μm ON 38 μm ON 38 μm ON 38 μm ON 1 μm ON 1 μm ON 1 μm ON SOLDER LAYER ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE COMPOSITION OF SnSb SnSb SnSb SnSb SnSb SnSb SnSb SnSb SnSb SOLDER LAYER THICKNESS OF 0.1 0.5 6 0.1 0.5 12 0.1 0.23 0.36 Sn LAYER (μm) Sn 0.556 2.778 33.333 0.263 1.316 31.579 10.000 23.000 36.000 LAYER:SOLDER LAYER YELLOWNESS ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ DEFECT AT THE ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ TIME OF BONDING
(65) TABLE-US-00020 TABLE 20 COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- PLE 82 PLE 83 PLE 84 PLE 85 PLE 86 PLE 87 PLE 88 PLE 89 PLE 90 CORE MATERIAL ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- NUM NUM NUM NUM NUM NUM NUM NUM NUM THICKNESS OF 18 μm ON 18 μm ON 18 μm ON 38 μm ON 38 μm ON 38 μm ON 1 μm ON 1 μm ON 1 μm ON SOLDER LAYER ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE COMPOSITION OF SnSb SnSb SnSb SnSb SnSb SnSb SnSb SnSb SnSb SOLDER LAYER THICKNESS OF 0 0.03 10 0 0.03 15 0 0.002 0.5 Sn LAYER (μm) Sn 0.000 0.167 55.556 0.000 0.079 39.474 0.000 0.200 50.000 LAYER:SOLDER 0:100 LESS THAN EX- 0:100 LESS THAN EX- 0:100 LESS THAN EX- LAYER LOWER CEEDING LOWER CEEDING LOWER CEEDING LIMIT UPPER LIMIT UPPER LIMIT UPPER VALUE LIMIT VALUE LIMIT VALUE LIMIT VALUE VALUE VALUE YELLOWNESS X X ◯ X X ◯ X X ◯ DEFECT AT THE ◯ ◯ X ◯ ◯ X ◯ ◯ X TIME OF BONDING
(66) TABLE-US-00021 TABLE 21 EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- PLE 91 PLE 92 PLE 93 PLE 94 PLE 95 PLE 96 PLE 97 PLE 98 PLE 99 CORE MATERIAL ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- NUM NUM NUM NUM NUM NUM NUM NUM NUM THICKNESS OF 18 μm ON 18 μm ON 18 μm ON 38 μm ON 38 μm ON 38 μm ON 1 μm ON 1 μm ON 1 μm ON SOLDER LAYER ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE COMPOSITION OF SnIn Snln SnIn SnIn SnIn SnIn SnIn SnIn SnIn SOLDER LAYER THICKNESS OF 0.1 0.5 6 0.1 0.5 12 0.1 0.23 0.36 Sn LAYER (μm) Sn 0.556 2.778 33.333 0.263 1.316 31.579 10.000 23.000 36.000 LAYER:SOLDER LAYER YELLOWNESS ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ DEFECT AT THE ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ TIME OF BONDING
(67) TABLE-US-00022 TABLE 22 COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- PLE 91 PLE 92 PLE 93 PLE 94 PLE 95 PLE 96 PLE 97 PLE 98 PLE 99 CORE MATERIAL ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- NUM NUM NUM NUM NUM NUM NUM NUM NUM THICKNESS OF 18 μm ON 18 μm ON 18 μm ON 38 μm ON 38 μm ON 38 μm ON 1 μm ON 1 μm ON 1 μm ON SOLDER LAYER ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE COMPOSITION OF SnIn SnIn SnIn SnIn SnIn SnIn SnIn SnIn SnIn SOLDER LAYER THICKNESS OF 0 0.03 10 0 0.03 15 0 0.002 0.5 Sn LAYER (μm) Sn 0.000 0.167 55.556 0.000 0.079 39.474 0.000 0.200 50.000 LAYER:SOLDER 0:100 LESS THAN EX- 0:100 LESS THAN EX- 0:100 LESS THAN EX- LAYER LOWER CEEDING LOWER CEEDING LOWER CEEDING LIMIT UPPER LIMIT UPPER LIMIT UPPER VALUE LIMIT VALUE LIMIT VALUE LIMIT VALUE VALUE VALUE YELLOWNESS X X ◯ X X ◯ X X ◯ DEFECT AT THE ◯ ◯ X ◯ ◯ X ◯ ◯ X TIME OF BONDING
(68) TABLE-US-00023 TABLE 23 EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- PLE 100 PLE 101 PLE 102 PLE 103 PLE 104 PLE 105 PLE 106 PLE 107 PLE 108 CORE MATERIAL ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- NUM NUM NUM NUM NUM NUM NUM NUM NUM THICKNESS OF 18 μm ON 18 μm ON 18 μm ON 38 μm ON 38 μm ON 38 μm ON 1 μm ON 1 μm ON 1 μm ON SOLDER LAYER ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE COMPOSITION OF SnPb SnPb SnPb SnPb SnPb SnPb SnPb SnPb SnPb SOLDER LAYER THICKNESS OF 0.1 0.5 6 0.1 0.5 12 0.1 0.23 0.36 Sn LAYER (μm) Sn 0.556 2.778 33.333 0.263 1.316 31.579 10.000 23.000 36.000 LAYER:SOLDER LAYER YELLOWNESS ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ DEFECT AT THE ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ TIME OF BONDING
(69) TABLE-US-00024 TABLE 24 COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- PLE 100 PLE 101 PLE 102 PLE 103 PLE 104 PLE 105 PLE 106 PLE 107 PLE 108 CORE MATERIAL ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- ALUMI- NUM NUM NUM NUM NUM NUM NUM NUM NUM THICKNESS OF 18 μm ON 18 μm ON 18 μm ON 38 μm ON 38 μm ON 38 μm ON 1 μm ON 1 μm ON 1 μm ON SOLDER LAYER ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE COMPOSITION OF SnPb SnPb SnPb SnPb SnPb SnPb SnPb SnPb SnPb SOLDER LAYER THICKNESS OF 0 0.03 10 0 0.03 15 0 0.002 0.5 Sn LAYER (μm) Sn 0.000 0.167 55.556 0.000 0.079 39.474 0.000 0.200 50.000 LAYER:SOLDER 0:100 LESS THAN EX- 0:100 LESS THAN EX- 0:100 LESS THAN EX- LAYER LOWER CEEDING LOWER CEEDING LOWER CEEDING LIMIT UPPER LIMIT UPPER LIMIT UPPER VALUE LIMIT VALUE LIMIT VALUE LIMIT VALUE VALUE VALUE YELLOWNESS X X ◯ X X ◯ X X ◯ DEFECT AT THE ◯ ◯ X ◯ ◯ X ◯ ◯ X TIME OF BONDING
(70) In the following Tables 25 to 36, the solder layer composition was changed to SAC 305, SnCu (Cu 0.75 Sn balance), SnAg (Ag 3.5 Sn balance), SnSb (Sb 10 Sn balance), SnIn (In 45 Sn balance), and SnPb (Pb 37 Sn balance), and the thickness of the solder layer on one side and the thickness of the Sn layer on one side were changed in the same manner as in Examples 1 to 54 and Comparative Examples 1 to 54 shown in Tables 1 to 12, and Examples 55 to 108 and Comparative Examples 55 to 108 shown in Tables 13 to 24 except that a styrene-butadiene block copolymer as a resin was used as the material of the core. In all of Examples 109 to 162, good results could be confirmed to be obtained in each of yellowness and a defect at the time of bonding. Meanwhile, in all of Comparative Examples 109 to 162, any of yellowness and the time of bonding could be confirmed to be poor. In particular, it could be confirmed that when the Sn layer is not provided or when the thickness of the Sn layer is less than 0.215% of that of the solder layer, a problem in yellowness occurs. Meanwhile, it could be confirmed that when the thickness of the Sn layer exceeds 36% of that of the solder layer, a defect at the time of bonding occurs.
(71) TABLE-US-00025 TABLE 25 EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- PLE 109 PLE 110 PLE 111 PLE 112 PLE 113 PLE 114 PLE 115 PLE 116 PLE 117 COKE MATERIAL RESIN RESIN RESIN RESIN RESIN RESIN RESIN RESIN RESIN THICKNESS OF 18 μm ON 18 μm ON 18 μm ON 38 μm ON 38 μm ON 38 μm ON 1 μm ON 1 μm ON 1 μm ON SOLDER LAYER ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE COMPOSITION OF SAC305 SAC305 SAC305 SAC305 SAC305 SAC305 SAC305 SAC305 SAC305 SOLDER LAYER THICKNESS OF 0.1 0.5 6 0.1 0.5 12 0.1 0.23 0.36 Sn LAYER (μm) Sn 0.556 2.778 33.333 0.263 1.316 31.579 10.000 23.000 36.000 LAYER:SOLDER LAYER YELLOWNESS ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ DEFECT AT THE ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ TIME OF BONDING
(72) TABLE-US-00026 TABLE 26 COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- PLE 109 PLE 110 PLE 111 PLE 112 PLE 113 PLE 114 PLE 115 PLE 116 PLE 117 CORE MATERIAL RESIN RESIN RESIN RESIN RESIN RESIN RESIN RESIN RESIN THICKNESS OF 18 μm ON 18 μm ON 18 μm ON 38 μm ON 38 μm ON 38 μm ON 1 μm ON 1 μm ON 1 μm ON SOLDER LAYER ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE COMPOSITION OF SAC305 SAC305 SAC305 SAC305 SAC305 SAC305 SAC305 SAC305 SAC305 SOLDER LAYER THICKNESS OF Sn 0 0.03 10 0 0.03 15 0 0.002 0.5 LAYER (μm) Sn 0.000 0.167 55.556 0.000 0.079 39.474 0.000 0.200 50.000 LAYER:SOLDER 0:100 LESS THAN EX- 0:100 LESS THAN EX- 0:100 LESS THAN EX- LAYER LOWER CEEDING LOWER CEEDING LOWER CEEDING- LIMIT UPPER LIMIT UPPER LIMIT UPPER VALUE LIMIT VALUE LIMIT VALUE LIMIT VALUE VALUE VALUE YELLOWNESS X X ◯ X X ◯ X X ◯ DEFECT AT THE ◯ ◯ X ◯ ◯ X ◯ ◯ X TIME OF BONDING
(73) TABLE-US-00027 TABLE 27 EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- PLE 118 PLE 119 PLE 120 PLE 121 PLE 122 PLE 123 PLE 124 PLE 125 PLE 126 CORE MATERIAL RESIN RESIN RESIN RESIN RESIN RESIN RESIN RESIN RESIN THICKNESS OF 18 μm ON 18 μm ON 18 μm ON 38 μm ON 38 μm ON 38 μm ON 1 μm ON 1 μm ON 1 μm ON SOLDER LAYER ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE COMPOSITION OF SnCu SnCu SnCu SnCu SnCu SnCu SnCu SnCu SnCu SOLDER LAYER THICKNESS OF 0.1 0.5 6 0.1 0.5 12 0.1 0.23 0.36 Sn LAYER (μm) Sn 0.556 2.778 33.333 0.263 1.316 31.579 10.000 23.000 36.000 LAYER:SOLDER LAYER YELLOWNESS ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ DEFECT AT THE ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ TIME OF BONDING
(74) TABLE-US-00028 TABLE 28 COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- PLE 118 PLE 119 PLE 120 PLE 121 PLE 122 PLE 123 PLE 124 PLE 125 PLE 126 CORE MATERIAL RESIN RES IN RESIN RESIN RESIN RESIN RESIN RESIN RESIN THICKNESS OF 18 μm ON 18 μm ON 18 μm ON 38 μm ON 38 μm ON 38 μm ON 1 μm ON 1 μm ON 1 μm ON SOLDER LAYER ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE COMPOSITION OF SnCu SnCu SnCu SnCu SnCu SnCu SnCu SnCu SnCu SOLDER LAYER THICKNESS OF 0 0.03 10 0 0.03 15 0 0.002 0.5 Sn LAYER (μm) Sn 0.000 0.167 55.556 0.000 0.079 39.974 0.000 0.200 50.000 LAYER:SOLDER 0:100 LESS THAN EX- 0:100 LESS THAN EX- 0:100 LESS THAN EX- LAYER LOWER CEEDING LOWER CEEDING LOWER CEEDING LIMIT UPPER LIMIT UPPER LIMIT UPPER VALUE LIMIT VALUE LIMIT VALUE LIMIT VALUE VALUE VALUE YELLOWNESS X X ◯ X X ◯ X X ◯ DEFECT AT THE ◯ ◯ X ◯ ◯ X ◯ ◯ X TIME OF BONDING
(75) TABLE-US-00029 TABLE 29 EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- PLE 127 PLE 128 PLE 129 PLE 130 PLE 131 PLE 132 PLE 133 PLE 134 PLE 135 CORE MATERIAL RESIN RESIN RESIN RESIN RESIN RESIN RESIN RESIN RESIN THICKNESS OF 18 μm ON 18 μm ON 18 μm ON 38 μm ON 38 μm ON 38 μm ON 1 μm ON 1 μm ON 1 μm ON SOLDER LAYER ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE COMPOSITION OF SnAg SnAg SnAg SnAg SnAg SnAg SnAg SnAg SnAg SOLDER LAYER THICKNESS OF 0.1 0.5 6 0.1 0.5 12 0.1 0.23 0.36 Sn LAYER (μm) Sn 0.556 2.778 33.333 0.263 1.316 31.579 10.000 23.000 36.000 LAYER:SOLDER LAYER YELLOWNESS ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ DEFECT AT THE ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ TIME OF BONDING
(76) TABLE-US-00030 TABLE 30 COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- PLE 127 PLE 128 PLE 129 PLE 130 PLE 131 PLE 132 PLE 133 PLE 134 PLE 135 CORE MATERIAL RESIN RESIN RESIN RESIN RESIN RESIN RESIN RESIN RESIN THICKNESS OF 18 μm ON 18 μm ON 18 μm ON 38 μm ON 38 μm ON 38 μm ON 1 μm ON 1 μm ON 1 μm ON SOLDER LAYER ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE COMPOSITION OF SnAg SnAg SnAg SnAg SnAg SnAg SnAg SnAg SnAg SOLDER LAYER THICKNESS OF 0 0.03 10 0 0.03 15 0 0.002 0.5 Sn LAYER (μm) Sn 0.000 0.167 55.556 0.000 0.079 39.474 0.000 0.200 50.000 LAYER:SOLDER 0:100 LESS THAN EX- 0:100 LESS THAN EX- 0:100 LESS THAN EX- LAYER LOWER CEEDING LOWER CEEDING LOWER CEEDING LIMIT UPPER LIMIT UPPER LIMIT UPPER VALUE LIMIT VALUE LIMIT VALUE LIMIT VALUE VALUE VALUE YELLOWNESS X X ◯ X X ◯ X X ◯ DEFECT AT THE ◯ ◯ X ◯ ◯ X ◯ ◯ X TIME OF BONDING
(77) TABLE-US-00031 TABLE 31 EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- PLE 136 PLE 137 PLE 138 PLE 139 PLE 140 PLE 141 PLE 142 PLE 143 PLE 144 CORE MATERIAL RESIN RESIN RESIN RESIN RESIN RESIN RESIN RESIN RESIN THICKNESS OF 18 μm ON 18 μm ON 18 μm ON 38 μm ON 38 μm ON 38 μm ON 1 μm ON 1 μm ON 1 μm ON SOLDER LAYER ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE COMPOSITION OF SnSb SnSb SnSb SnSb SnSb SnSb SnSb SnSb SnSb SOLDER LAYER THICKNESS OF 0.1 0.5 6 0.1 0.5 12 0.1 0.23 0.36 Sn LAYER (μm) Sn 0.556 2.778 33.333 0.263 1.316 31.579 10.000 23.000 36.000 LAYER:SOLDER LAYER YELLOWNESS ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ DEFECT AT THE ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ TIME OF BONDING
(78) TABLE-US-00032 TABLE 32 COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- PLE 136 PLE 137 PLE 138 PLE 139 PLE 140 PLE 141 PLE 142 PLE 143 PLE 144 CORE MATERIAL RESIN RESIN RESIN RESIN RESIN RESIN RESIN RESIN RESIN THICKNESS OF 18 μm ON 18 μm ON 18 μm ON 38 μm ON 38 μm ON 38 μm ON 1 μm ON 1 μm ON 1 μm ON SOLDER LAYER ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE COMPOSITION OF SnSb SnSb SnSb SnSb SnSb SnSb SnSb SnSb SnSb SOLDER LAYER THICKNESS OF Sn 0 0.03 10 0 0.03 15 0 0.002 0.5 LAYER (μm) Sn 0.000 0.167 55.556 0.000 0.079 39.474 0.000 0.200 50.000 LAYER:SOLDER 0:100 LESS THAN EX- 0:100 LESS THAN EX- 0:100 LESS THAN EX- LAYER LOWER CEEDING LOWER CEEDING LOWER CEEDING LIMIT UPPER LIMIT UPPER LIMIT UPPER VALUE LIMIT VALUE LIMIT VALUE LIMIT VALUE VALUE VALUE YELLOWNESS X X ◯ X X ◯ X X ◯ DEFECT AT THE ◯ ◯ X ◯ ◯ X ◯ ◯ X TIME OF BONDING
(79) TABLE-US-00033 TABLE 33 EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- PLE 145 PLE 146 PLE 147 PLE 148 PLE 149 PLE 150 PLE 151 PLE 152 PLE 153 CORE MATERIAL RESIN RESIN RESIN RESIN RESIN RESIN RESIN RESIN RESIN THICKNESS OF 18 μm ON 18 μm ON 18 μm ON 38 μm ON 38 μm ON 38 μm ON 1 μm ON 1 μm ON 1 μm ON SOLDER LAYER ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE COMPOSITION OF SnIn SnIn SnIn SnIn SnIn SnIn SnIn SnIn SnIn SOLDER LAYER THICKNESS OF 0.1 0.5 6 0.1 0.5 12 0.1 0.23 0.36 Sn LAYER (μm) Sn 0.556 2.775 33.333 0.263 1.316 31.579 10.000 23.000 36.000 LAYER:SOLDER LAYER YELLOWNESS ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ DEFECT AT THE ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ TIME OF BONDING
(80) TABLE-US-00034 TABLE 34 COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- PLE 145 PLE 146 PLE 147 PLE 148 PLE 149 PLE 150 PLE 151 PLE 152 PLE 153 CORE MATERIAL RESIN RESIN RESIN RESIN RESIN RESIN RESIN RESIN RESIN THICKNESS OF 18 μm ON 18 μm ON 18 μm ON 38 μm ON 38 μm ON 38 μm ON 1 μm ON 1 μm ON 1 μm ON SOLDER LAYER ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE COMPOSITION OF SnIn SnIn SnIn SnIn SnIn SnIn SnIn SnIn SnIn SOLDER LAYER THICKNESS OF Sn 0 0.03 10 0 0.03 15 0 0.002 0.5 LAYER (μm) Sn 0.000 0.167 55.556 0.000 0.079 39.474 0.000 0.200 50.000 LAYER:SOLDER 0:100 LESS THAN EX- 0:100 LESS THAN EX- 0:100 LESS THAN EX- LAYER LOWER CEEDING LOWER CEEDING LOWER CEEDING LIMIT UPPER LIMIT UPPER LIMIT UPPER VALUE LIMIT VALUE LIMIT VALUE LIMIT VALUE VALUE VALUE YELLOWNESS X X ◯ X X ◯ X X ◯ DEFECT AT THS ◯ ◯ X ◯ ◯ X ◯ ◯ X TIME OF BONDING
(81) TABLE-US-00035 TABLE 35 EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- PLE 154 PLE 155 PLE 156 PLE 157 PLE 158 PLE 159 PLE 160 PLE 161 PLE 162 CORE MATERIAL RESIN RESIN RESIN RESIN RESIN RESIN RESIN RESIN RESIN THICKNESS OF 18 μm ON 18 μm ON 18 μm ON 38 μm ON 38 μm ON 38 μm ON 1 μm ON 1 μm ON 1 μm ON SOLDER LAYER ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE COMPOSITION OF SnPb SnPb SnPb SnPb SnPb SnPb SnPb SnPb SnPb SOLDER LAYER THICKNESS OF 0.1 0.5 6 0.1 0.5 12 0.1 0.23 0.36 Sn LAYER (μm) Sn 0.556 2.778 33.333 0.263 1.316 31.579 10.000 23.000 36.000 LAYER:SOLDER LAYER YELLOWNESS ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ DEFECT AT THE ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ TIME OF BONDING
(82) TABLE-US-00036 TABLE 36 COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- PLE 154 PLE 155 PLE 156 PLE 157 PLE 158 PLE 159 PLE 160 PLE 161 PLE 162 CORE MATERIAL RESIN RESIN RESIN RESIN RESIN RESIN RESIN RESIN RESIN THICKNESS OF 18 μm ON 18 μm ON 18 μm ON 38 μm ON 38 μm ON 38 μm ON 1 μm ON 1 μm ON 1 μm ON SOLDER LAYER ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE COMPOSITION OF SnPb SnPb SnPb SnPb SnPb SnPb SnPb SnPb SnPb SOLDER LAYER THICKNESS OF Sn 0 0.03 10 0 0.03 15 0 0.002 0.5 LAYER (μm) Sn 0.000 0.167 55.556 0.000 0.079 39.474 0.000 0.200 50.000 LAYER:SOLDER 0:100 LESS THAN EX- 0:100 LESS THAN EX- 0:100 LESS THAN EX- LAYER LOWER CEEDING LOWER CEEDING LOWER CEEDING LIMIT UPPER LIMIT UPPER LIMIT UPPER VALUE LIMIT VALUE LIMIT VALUE LIMIT VALUE VALUE VALUE YELLOWNESS X X ◯ X X ◯ X X ◯ DEFECT AT THE ◯ ◯ X ◯ ◯ X ◯ ◯ X TIME OF BONDING
(83) The present embodiment also provides a method for forming a bump electrode, the method including the steps of: mounting a core material on an electrode; and forming the bump electrode by heating the mounted core material.
(84) The shape of the core material also includes not only a spherical body but also a columnar column and a sheet and the like. For example, a core column in which a Ni base plating layer and Co base plating layer and the like of 1 to 4 μm on one side are provided on the surface of a Cu column having diameters of top and bottom surfaces of 1 to 1000 μm and a height of 1 to 3000 μm, and in the same condition as that of Examples, the Cu column is covered with a solder plating layer can provide the same effects as those in Examples described above, and good results could be obtained in each of yellowness and a defect at the time of bonding.
(85) As an example, the results of using an aspect in which a column having a diameter φ of 0.30 mm and a height of 0.53 mm is used and the Ni plating thickness is 2 μm on one side are shown below. The thickness of the solder layer is a value not including the Ni plating thickness.
(86) TABLE-US-00037 TABLE 37 EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- PLE 163 PLE 164 PLE 165 PLE 166 PLE 167 PLE 168 PLE 169 PLE 170 PLE 171 CORE MATERIAL COPPER COPPER COPPER COPPER COPPER COPPER COPPER COPPER COPPER THICKNESS OF 5.5 μm ON 5.5 μm ON 5.5 μm ON 38 μm ON 38 μm ON 38 μm ON 1 μm ON 1 μm ON 1 μm ON SOLDER LAYER ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE COMPOSITION OF SAC305 SAC305 SAC305 SAC305 SAC305 SAC305 SAC305 SAC305 SAC305 SOLDER LAYER THICKNESS OF Sn 0.1 0.5 1.8 0.1 0.5 12 0.1 0.23 0.36 LAYER (μm) Sn 1.818 9.091 32.727 0.263 1.316 31.579 10.000 23.000 36.000 LAYER:SOLDER LAYER YELLOWNESS ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ DEFECT AT THE ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ ◯ TIME OF BONDING
(87) TABLE-US-00038 TABLE 38 COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- COMPAR- ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE ATIVE EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- PLE 163 PLE 164 PLE 165 PLE 166 PLE 167 PLE 168 PLE 169 PLE 170 PLE 171 CORE MATERIAL COPPER COPPER COPPER COPPER COPPER COPPER COPPER COPPER COPPER THICKNESS OF 5.5 μm ON 5.5 μm ON 5.5 μm ON 38 μm ON 38 μm ON 38 μm ON 1 μm ON 1 μm ON 1 μm ON SOLDER LAYER ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE ONE SIDE COMPOSITION OF SAC305 SAC305 SAC305 SAC305 SAC305 SAC305 SAC305 SAC305 SAC305 SOLDER LAYER THICKNESS OF Sn 0 0.01 2.5 0 0.03 15 0 0.002 0.5 LAYER (μm) Sn 0.000 0.182 45.455 0.000 0.079 39.474 0.000 0.200 50.000 LAYER:SOLDER 0:100 LESS THAN EX- 0:100 LESS THAN EX- 0:100 LESS THAN EX- LAYER LOWER CEEDING LOWER CEEDING LOWER CEEDING LIMIT UPPER LIMIT UPPER LIMIT UPPER VALUE LIMIT VALUE LIMIT VALUE LIMIT VALUE VALUE VALUE YELLOWNESS X X ◯ X X ◯ X X ◯ DEFECT AT THE ◯ ◯ X ◯ ◯ X ◯ ◯ X TIME OF BONDING
(88) The description of the embodiments, the description of Examples, and the disclosure of the drawings described above are merely examples for describing the invention described in claims. The invention described in claims is not limited by the description of the embodiments or the disclosure of the drawings described above.
EXPLANATION OF REFERENCE
(89) 10 Cu core ball 12 Core 14 Base plating layer 16 Solder plating layer (solder layer) 20 Sn plating layer (Sn layer)