CERAMIC CARRIER BODY HAVING SOLAR CELLS

Abstract

The invention relates to a carrier body (1) for solar cells (2). According to the invention, in order to significantly improve the thermal resistivity of the connection between a solar cell (2) and the carrier body (1) or a cooling element, the carrier body (1) is made of a ceramic material having sintered metallization regions (3), at least one solar cell (2) is soldered or sintered onto the carrier body (1) and electrically connected to the metallization regions (3), and the carrier body (1) has ceramic cooling elements.

Claims

1. A carrier body for solar panels, wherein the carrier body is made of a ceramic material with sintered metallization regions, at least one solar cell is soldered or sintered onto the carrier body and is electrically connected to the metallization regions, and the carrier body has ceramic cooling elements.

2. The carrier body according to claim 1, wherein the carrier body has a three-dimensional structure as cooling elements, such as fins, for air cooling, or closed internal channels or chambers with supply ports to the outside, for a gas or a cooling liquid.

3. The carrier body according to claim 1, wherein the carrier body is plate-shaped in design, has a top side, a bottom side, and lateral surfaces, and sintered metallization regions are arranged both on the top side and on the bottom side and are electrically connected via sintered metallization regions on the lateral surfaces and on the corners, or by through-connections (vias).

4. The carrier body according to claim 3, wherein one or more solar cells are soldered onto the metallization regions on either the top side or the bottom side, and electrical or electronic controls for the at least one solar cell are soldered onto the metallization regions of the other respective top side or bottom side.

5. The carrier body according to claim 1, wherein the ceramic material is Al.sub.2O.sub.3, MgO, SiO.sub.2, mixed oxide ceramics, or nitride ceramics such as AlN, Si.sub.3N.sub.4.

6. A method for the production of a carrier body according to claim 1, wherein the carrier body is made with inner channels or chambers made of ceramic, and forms a cooling unit, and is printed with AgPt paste by means of a printing process (such as screen, pad or stencil printing), which is then burned in, and then a solar cell is electroplated on its reverse side with Ag, and the cooling unit and the solar cell are connected by a solder sheet interposed therebetween.

7. The method for the production of a carrier body according to claim 1, wherein the carrier body is produced with internal channels or chambers and forms a cooling unit, and is printed with AgPt paste by means of a printing process (screen, pad, or stencil printing), which is then burned in, and then a solar cell is degreased and a paste with ultra-fine silver particles is printed onto the cooling unit by means of a screen printing process, and then the solar cell is placed thereon and a solid metal composite is produced.

Description

EXAMPLE A

[0013] A cooling unit made of AlN is printed with AgPt by means of a screen printing process, which is then burned in. A solar cell is electroplated on the reverse side thereof with Ag. At about 265° C., the cooling unit and the solar cell are connected by a solder sheet interposed therebetween.

EXAMPLE B

[0014] A cooling unit made of AlN is printed with AgPt by means of a screen printing process, which is burned in at about 860° C. A solar cell is degreased. Then, a paste with ultra-fine silver particles is printed onto the cooling unit by means of a screen printing process. The solar cell is placed thereon, and at about 400° C. with access to air a solid metallic composite is produced.

[0015] FIG. 1 shows an inventive embodiment of a carrier body 1 of a ceramic material. The carrier body 1 has a top side 5, a bottom side 6, and lateral surfaces 7. The metallization regions which are sintered to the carrier body 1, and which form a printed circuit board, are indicated by the reference number 3. In the embodiment shown here, these metallization regions 3 are arranged on the top side 5 as well as on the bottom side 6 and the lateral faces 7 and the corners 8. Solar cells 2 are arranged only on the top side 5. Their control elements 9 are situated on the bottom side 6. FIG. 1 is not to scale. Cooling channels, which are not shown here, are arranged in the carrier body 1, which is also simultaneously the cooling element in this case, and are connected to the supply connections 4. Cooling fluid which cools the carrier body is conveyed via these supply connections 4 into the carrier body 1. Solar cells 2 are soldered in this case onto the metallization regions 3 only on the top side 5.