Resistive Random Access Memory

Abstract

A resistive random access memory overcomes the low durability of the conventional resistive random access memory. The resistive random access memory includes a first electrode, a second electrode, an enclosing layer and an oxygen-containing resistance changing layer. The first and second electrodes are separate from each other. The enclosing layer forms a first via-hole. The oxygen-containing resistance changing layer is arranged for the first via-hole. The first and second electrodes and the enclosing layer jointly enclose the oxygen-containing resistance changing layer. Each of the first electrode, the second electrode and the enclosing layer is made of an element not containing oxygen.

Claims

1. (canceled)

2. The resistive random access memory as claimed in claim 9, wherein each of the first and second electrodes is made of a metal material not containing oxygen.

3. The resistive random access memory as claimed in claim 2, wherein the metal material comprises iridium, platinum, gold, titanium nitride, hafnium, tantalum or tungsten.

4. The resistive random access memory as claimed in claim 9, wherein the enclosing layer is formed from silicon carbide, silicon nitride or boron nitride.

5. The resistive random access memory as claimed in claim 9, wherein the oxygen-containing resistance changing layer is formed from oxides doped with one or more elements including boron, carbon, nitrogen, fluorine, chlorine and bromine.

6. (canceled)

7. The resistive random access memory as claimed in claim 9, wherein the oxygen-containing resistance changing layer extends from a top face of the one of the first and second electrodes, which is exposed to the first via-hole, to a top face of the enclosing layer, and wherein the oxygen-containing resistance changing layer forms a recess.

8. The resistive random access memory as claimed in claim 7, wherein the oxygen-containing resistance changing layer has a part that is located outside the first via-hole, and wherein the part of the oxygen-containing resistance changing layer is jointly enclosed by the enclosing layer and another one of the first and second electrodes.

9. A resistive random access memory comprising: a first electrode; a second electrode separate from the first electrode; an enclosing layer forming a first via-hole; and an oxygen-containing resistance changing layer arranged for the first via-hole, wherein the first and second electrodes and the enclosing layer jointly enclose the oxygen-containing resistance changing layer, wherein each of the first electrode, the second electrode and the enclosing layer is made of an element not containing oxygen, wherein each of the first electrode, the second electrode and the enclosing layer abuts with the oxygen-containing resistance changing layer, wherein the enclosing layer is mounted on one of the first and second electrodes, and wherein the oxygen-containing resistance changing layer is completely located in the first via-hole.

10. The resistive random access memory as claimed in claim 7, wherein another one of the first and second electrodes extends out of the first via-hole from the oxygen-containing resistance changing layer and forms a second via-hole, and wherein the second via-hole is located in the first via-hole.

11. The resistive random access memory as claimed in claim 8, wherein another one of the first and second electrodes extends out of the first via-hole from the oxygen-containing resistance changing layer and forms a second via-hole, and wherein the second via-hole is located in the first via-hole.

12. The resistive random access memory as claimed in claim 9, wherein another one of the first and second electrodes extends out of the first via-hole from the oxygen-containing resistance changing layer and forms a second via-hole, wherein the second via-hole is located in the first via-hole.

13. The resistive random access memory as claimed in claim 9, wherein one of the first and second electrodes is arranged in the first via-hole.

14. A resistive random access memory comprising: a first electrode; a second electrode separate from the first electrode; an enclosing layer forming a first via-hole, wherein one of the first and second electrodes is arranged in the first via-hole; and an oxygen-containing resistance changing layer arranged for the first via-hole, wherein the first and second electrodes and the enclosing layer jointly enclose the oxygen-containing resistance changing layer, wherein each of the first electrode, the second electrode and the enclosing is made of an element not containing oxygen, and wherein the oxygen-containing resistance changing layer is completely located in the first via-hole.

15. A resistive random access memory comprising: a first electrode; a second electrode separate from the first electrode; an enclosing layer forming a first via-hole, wherein one of the first and second electrodes is arranged in the first via-hole; and an oxygen-containing resistance changing layer arranged for the first via-hole, wherein the first and second electrodes and the enclosing layer jointly enclose the oxygen-containing resistance changing layer, wherein each of the first electrode, the second electrode and the enclosing is made of an element not containing oxygen, and wherein the oxygen-containing resistance changing layer is arranged across an opening of the first via-hole.

16. The resistive random access memory as claimed in claim 9, wherein the oxygen-containing resistance changing layer comprises a bottom portion, an oxygen-rich portion and a top portion stacked upon one another, and wherein the oxygen-rich portion is formed from the oxides doped with less than 10% of a metal element.

17. The resistive random access memory as claimed in claim 14, wherein the oxygen-containing resistance changing layer comprises a bottom portion, an oxygen-rich portion and a top portion stacked upon one another, and wherein the oxygen-rich portion is formed from the oxides doped with less than 10% of a metal element.

18. The resistive random access memory as claimed in claim 15, wherein the oxygen-containing resistance changing layer comprises a bottom portion, an oxygen-rich portion and a top portion stacked upon one another, and wherein the oxygen-rich portion is formed from the oxides doped with less than 10% of a metal element.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The present disclosure will become more fully understood from the detailed description given hereinafter and the accompanying drawings which are given by way of illustration only, and thus are not limitative of the present invention, and wherein:

[0013] FIG. 1 is a cross sectional view of a resistive random access memory according to a first embodiment of the disclosure.

[0014] FIG. 2 is a cross sectional view of a resistive random access memory according to a second embodiment of the disclosure.

[0015] FIG. 3 is a cross sectional view of a resistive random access memory according to a third embodiment of the disclosure.

[0016] FIG. 4 is a cross sectional view of a resistive random access memory according to a fourth embodiment of the disclosure.

[0017] FIG. 5 is a cross sectional view of a resistive random access memory according to a fifth embodiment of the disclosure.

[0018] In the various figures of the drawings, the same numerals designate the same or similar parts. Furthermore, when the terms “first”, “second”, “third”, “fourth”, “inner”, “outer”, “top”, “bottom”, “front”, “rear” and similar terms are used hereinafter, it should be understood that these terms have reference only to the structure shown in the drawings as it would appear to a person viewing the drawings, and are utilized only to facilitate describing the invention.

DETAILED DESCRIPTION OF THE INVENTION

[0019] FIG. 1 is a cross sectional view of a resistive random access memory according to a first embodiment of the disclosure. The resistive random access memory may include two separate electrodes (including a first electrode 1 and a second electrode 4 as shown in FIG. 1), an enclosing layer 2 and an oxygen-containing resistance changing layer 3. The enclosing layer 2 may form a first via-hole 21 extending in an X direction. The first via-hole 21 is arranged with the oxygen-containing resistance changing layer 3. The first electrode 1, the enclosing layer 2 and the second electrode 4 jointly enclose the first via-hole 21. Each of the first electrode 1, the enclosing layer 2 and the second electrode 4 is made of elements not containing oxygen. The resistive random access memory of the first embodiment of the disclosure is elaborated below, but this is not used to limit the disclosure.

[0020] In the first embodiment shown in FIG. 1, both the first electrode 1 and the second electrode 4 may be made of a metal material not containing oxygen. The metal material may include iridium (Ir), platinum (Pt), gold (Au), titanium nitride (TiN), hafnium (Hf), tantalum (Ta) or tungsten (W) in order to avoid the oxidation reaction. The enclosing layer 2 may be formed from non-oxides such as silicon carbide (SiC), silicon nitride (Si3N4) or boron nitride (BN) in order to avoid the oxidation reaction. The oxygen-containing resistance changing layer 3 may be formed from oxides (such as SiO2 or HfO2) doped with one or more elements that can absorb oxygen, such as boron (B), carbon (C), nitrogen (N), fluorine (F), chlorine (Cl) and bromine (Br). Such doping can enhance the oxidation reaction. In this arrangement, the first electrode 1, the enclosing layer 2 and the second electrode 4 which do not contain oxygen can jointly enclose the oxygen-containing resistance changing layer 3, so as to ensure that the oxidation reaction takes place only in the oxygen-containing resistance changing layer 3. In this arrangement, the dispersion of the oxygen ions which are under the reaction can be prevented. Advantageously, the resistive random access memory will not encounter the problem of low durability resulting from the dispersion of the oxygen ions. In the following, other embodiments of the resistive random access memory are described, in which the shapes and locations of the elements 1, 4 and 3 can be changed.

[0021] For example, as shown in FIGS. 1-3, the bottom face of the enclosing layer 2 may be in contact with the top face of the first electrode 1. As such, the top face of the first electrode 1 is partially exposed to the first via-hole 21. In this arrangement, the oxygen-containing resistance changing layer 3 extends from the top face of the first electrode 1, which is exposed to the first via-hole 21, to the top face of the enclosing layer 2 (as shown in FIG. 1). The oxygen-containing resistance changing layer 3 may form a recess 3a (as shown in FIGS. 1 and 2). The part 3b of the oxygen-containing resistance changing layer 3 that is located outside the first via-hole 21 may be jointly enclosed by the enclosing layer 2 and the second electrode 4 (as shown in FIG. 2). Thus, the oxygen ions can be better limited in place. The oxygen-containing resistance changing layer 3 can be completely located in the first via-hole 21 in which said layer 3 includes a bottom portion 31, an oxygen-rich portion 32 and a top portion 33 stacked upon one another. The oxygen-rich portion 32 may be formed from the oxides doped with less than 10% of metal element, including gadolinium (Gd), titanium (Ti), zirconium (Zr), hafnium (Hf), tantalum (Ta) or tungsten (W) which has excellent electricity conductivity. As such, the limiting effect of the oxygen ions is enhanced and the reaction of the oxygen ions is facilitated. The second electrode 4 may extend out of the first via-hole 21 from the oxygen-containing resistance changing layer 3 and may form a second via-hole 41. The second via-hole 4 is located in the first via-hole 21. However, this is not used to limit the disclosure.

[0022] In another similar embodiments, the first electrode 1 may be completely located in the first via-hole 21 as shown in FIGS. 4 and 5. As such, the outer periphery of the first electrode 1 may abut with the wall of the first via-hole 21. The oxygen-containing resistance changing layer 3 may be completely located in the first via-hole 21 (as shown in FIG. 4). The oxygen-containing resistance changing layer 3 may also be arranged across an opening 21a of the first via-hole 21. The oxygen-containing resistance changing layer 3 has a diameter larger than a diameter of the opening 21a (as shown in FIG. 5). Similarly, the oxygen-containing resistance changing layer 3 may include a bottom portion 31, an oxygen-rich portion 32 and a top portion 33 stacked upon one another (as shown in FIGS. 4 and 5).

[0023] The first electrode 1, the enclosing layer 2 and the second electrode 4 can jointly enclose the oxygen-containing resistance changing layer 3 to enhance the limiting effect of the oxygen ions. However, this is not used to limit the disclosure.

[0024] Besides, during the use of the resistive random access memory of the embodiment of the disclosure, an electric field may be applied between the first electrode 1 and the second electrode 4 to trigger the redox reaction of the oxygen ions in the oxygen-containing resistance changing layer 3. Thus, the oxygen-containing resistance changing layer 3 can be switched between the high resistance state and the low resistance state. Since the oxygen-containing resistance changing layer 3 is enclosed by the first electrode 1, the enclosing layer 2 and the second electrode 4 which do not contain oxygen, the redox reaction can be limited in the oxygen-containing resistance changing layer 3 (the redox reaction does not take place outside the oxygen-containing resistance changing layer 3). As such, the dispersion of the oxygen ions of the oxygen-containing resistance changing layer 3 can be prevented or reduced after the resistive random access memory operates in a large number of times. As stated above, after the conventional resistive random access memory has been operated in a certain number of times (about 1*10.sup.8 times), said memory will be inoperable (i.e. having errors in reading the data due to the undistinguishable resistance states) due to the reduced difference between the resistances of LRS and HRS. In contrast to the conventional resistive random access memory, the resistive random access memories of the embodiments of the disclosure do not have such a problem and can provide a high durability.

[0025] In summary, in the resistive random access memories of the embodiments of the disclosure, the first electrode 1, the enclosing layer 2 and the second electrode 4 jointly enclose the oxygen-containing resistance changing layer 3, and each of the first electrode 1, the enclosing layer 2 and the second electrode 4 is made of elements not containing oxygen. As a result, the redox reaction can be limited in the oxygen-containing resistance changing layer 3, preventing or reducing the dispersion of the oxygen ions of the oxygen-containing resistance changing layer 3 after said memory operates in a large number of times. Advantageously, the distinguishability of the resistance states is not affected and the data errors are not resulted. Thus, the durability is high, the service life is prolonged, and the data errors are avoided.

[0026] Although the disclosure has been described in detail with reference to its presently preferable embodiments, it will be understood by one of ordinary skill in the art that various modifications can be made without departing from the spirit and the scope of the invention, as set forth in the appended claims.