Glass system for hermetically joining Cu components, and housing for electronic components
09807897 · 2017-10-31
Assignee
Inventors
Cpc classification
H01L2924/00014
ELECTRICITY
B32B2457/202
PERFORMING OPERATIONS; TRANSPORTING
H01L2924/00
ELECTRICITY
H01L2224/48235
ELECTRICITY
H01L2924/00014
ELECTRICITY
H01L2924/00
ELECTRICITY
C03C8/24
CHEMISTRY; METALLURGY
H01L2924/15153
ELECTRICITY
H01L33/647
ELECTRICITY
International classification
C03C8/24
CHEMISTRY; METALLURGY
Abstract
An housing for electronic components, such as LEDs and/or FETs, is provided. The housing has a base body having an upper surface that at least partially defines a mounting area for an electronic functional element, such that the base body provides a heat sink for the electronic functional element. The base body has a lower surface and a lateral surface and includes a connecting body for the electronic functional element, which is joined to the base body a glass layer formed by an alkali titanium silicate glass.
Claims
1. A housing for accommodating an electronic functional element, comprising: a base body comprising an upper surface, a lower surface, and a lateral surface, the body having a boundary surface, wherein the boundary surface comprises copper oxide, and wherein the upper surface at least partially defines a mounting area for the electronic functional element so that said base body forms a heat sink for the electronic functional element; a connecting body made of metal; a glass layer that connects the base body to the connecting body so that the connecting body is electrically insulated from the base body, wherein the at least one glass layer is formed by an alkali titanium silicate glass having a composition in weight percent of TiO.sub.2 greater than 25%.
2. The housing as claimed in claim 1, wherein the base body and the at least one connecting body comprise, at least at an interface to the glass layer, a material selected from the group consisting of copper, aluminum, austenitic steel, austenitic stainless steel, and combinations thereof, and wherein the alkali titanium silicate glass has a composition in weight percent of: TABLE-US-00007 SiO.sub.2 20-50, TiO.sub.2 >25-35, R.sub.2O 10-40, Al.sub.2O.sub.3 0-5, CaO + SrO 0-5, P.sub.2O.sub.5 0-5, V.sub.2O.sub.5 0-5, B.sub.2O.sub.3 0-5, Sb.sub.2O.sub.3 0-1, SnO.sub.2 0-5, Fe.sub.2O.sub.3 <1, CoO <1, NiO <1, ZnO 0-4, ZrO.sub.2 0-4, F 0-2, MoO.sub.3 0-1, N.sub.2O.sub.5 0-6, SO.sub.3 0-1, and wherein R.sub.2O comprises a sum of all alkali metal oxides.
3. The housing as claimed in claim 1, wherein the base body and the at least one connecting body comprise, at least at an interface to the glass layer, a material selected from the group consisting of copper, aluminum, austenitic steel, austenitic stainless steel, and combinations thereof, and wherein the alkali titanium silicate glass has a composition in weight percent of: TABLE-US-00008 SiO.sub.2 36-40, TiO.sub.2 >25-28, Na.sub.2O 15-19, K.sub.2O 10-14, Li.sub.2O >0-3, Al.sub.2O.sub.3 1-6, CaO >0-1, SrO <1, P.sub.2O.sub.5 >0-4, B.sub.2O.sub.3 >0-2, Fe.sub.2O.sub.3 0-2, CoO <1, NiO <1, ZnO <1, and ZrO.sub.2 <1.
4. The housing as claimed in claim 3, wherein the composition in weight percent is: TABLE-US-00009 SiO.sub.2 38, TiO.sub.2 26, Na.sub.2O 17, K.sub.2O 11.6, Li.sub.2O 1.22, Al.sub.2O.sub.3 3.7, CaO 0.3, P.sub.2O.sub.5 1.6, B.sub.2O.sub.3 0.29, Fe.sub.2O.sub.3 0.08, NiO <0.02, and ZrO.sub.2 0.1.
5. The housing as claimed in claim 1, wherein the at least one glass layer has a thickness of more than 30 μm.
6. The housing as claimed in claim 1, wherein the at least one glass layer has a thickness a range from 30 μm to 2000 μm.
7. The housing as claimed in claim 1, wherein the at least one glass layer is disposed in a location selected from the group consisting of between the lateral surface of the base body and the at least one connecting body, between the upper surface of the base body and the at least one connecting body, between the lower surface of the base body and the at least one connecting body, and combinations thereof.
8. The housing as claimed in claim 1, wherein at least portions of the at least one connecting body are arranged at a location selected from the group consisting of the upper surface of the base body, at the lower surface of the base body, and combinations thereof.
9. The housing as claimed in claim 8, wherein the at least one connecting body at least partially extends beyond the base body and forms at least one connection tab.
10. The housing as claimed in claim 1, wherein at least portions of the at least one connecting body is arranged at the lateral side of the base body and at least partially extends along the lateral surface of the base body.
11. A housing for accommodating an electronic functional element, comprising: a base body comprising an upper surface, a lower surface, and a lateral surface, wherein the base body has a boundary surface, wherein the boundary surface comprises copper oxide, and wherein the upper surface at least partially defines a mounting area for the electronic functional element so that said base body forms a heat sink for the electronic functional element; a connecting body made of metal; and a glass layer that connects the base body to the connecting body so that the connecting body is electrically insulated from the base body; and an insulation applied at least to the lower surface of the base body, wherein the glass layer is formed by an alkali titanium silicate glass.
12. An electronic component comprising the housing as claimed in claim 1, further comprising a component arranged in the housing, the component being selected from the group consisting of: at least one radiation emitting optoelectronic functional element, at least one radiation receiving optoelectronic functional element, an LED, at least one power electronics device, a FET, and combinations thereof.
13. A housing for accommodating an electronic functional element, comprising: a base body comprising an upper surface, a lower surface, a lateral surface, a boundary surface, and at least one channel, wherein the boundary surface comprises copper oxide, and wherein the upper surface at least partially defines a mounting area for the electronic functional element so that said base body forms a heat sink for the electronic functional element; at least one connecting body made of metal arranged in the at least one channel; and glass at least partially filling the at least one channel to join the base body to the at least one connecting body, so that the connecting body is electrically insulated from the base body, wherein the glass has a composition comprising, in weight percent, TiO.sub.2 of greater than 25%.
14. The housing as claimed in claim 13, wherein the at least one channel is provided at a location on the base body selected from the group consisting of the lateral side, in an interior of the base body, and combinations thereof.
15. The housing as claimed in claim 13, wherein the at least one channel is formed as a recess selected from the group consisting of a lateral recess in the base body, a non-lateral recess in the base body, and combinations thereof.
16. The housing as claimed in claim 13, wherein the at least one channel opens to a location selected from the group consisting of the upper surface, the lower surface, the lateral surface, and combinations thereof.
17. The housing as claimed in claim 13, wherein the at least one channel comprises a rectilinear first portion that extends along a central axis of the base body.
18. The housing as claimed in claim 17, wherein the rectilinear first portion of the channel is provided as an opening in the base body.
19. The housing as claimed in claim 17, wherein the at least one channel further comprises a rectilinear second portion that extends substantially transversely to the first portion, and wherein the first portion merges into the second portion.
20. The housing as claimed in claim 19, wherein the second portion is provided as a recess in a surface of the base body selected from the group consisting of the upper surface, the lower surface, and combinations thereof.
21. The housing as claimed in claim 19, wherein the second portion extends from the central axis towards the lateral surface.
22. The housing as claimed in claim 13, wherein the connecting body is a contact pin.
23. The housing as claimed in claim 13, wherein the glass is an alkali titanium silicate glass.
24. The housing as claimed in claim 13, wherein at least the upper surface of the base body has a depression with a bottom, and the mounting area for the optoelectronic functional element is provided by the bottom of the depression.
25. The housing as claimed in claim 24, wherein the at least one channel opens into a lateral surface of the depression.
26. The housing as claimed in claim 13, further comprising a component selected from the group consisting of an insulation at least partially covering the lower surface of the base body, a sleeve disposed at the lateral side of the base body that at least partially extends around a circumferential surface of the base body, and combinations thereof.
27. The housing as claimed in claim 1, wherein the base body and the at least one connecting body comprise, at least at an interface to the glass layer, a material selected from the group consisting of copper, aluminum, and combinations thereof.
28. The housing as claimed in claim 27, wherein the material comprises copper of at least 50 wt. %.
29. The housing as claimed in claim 27, wherein the material comprises copper of at least 80 wt. %.
30. The housing as claimed in claim 27, wherein the material comprises an oxide weight in mass per unit area from 0.02 to 0.25 mg/cm.sup.2.
31. The housing as claimed in claim 27, wherein the material comprises an oxide weight in mass per unit area from 0.067 to 0.13 mg/cm.sup.2.
32. The housing as claimed in claim 11, further comprising a sleeve disposed at the lateral side of the base body that at least partially extends around a circumferential surface of the base body.
Description
BRIEF DECSRIPTION OF THE DRAWINGS
(1) The present invention will now be explained in detail by way of the following exemplary embodiments. For this purpose, reference is made to the accompanying drawings. The same reference numerals in the various drawings designate the same parts.
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
(10)
(11)
(12)
(13)
(14)
(15)
DETAILED DESCRIPTION OF THE INVENTION
(16)
(17) The two connecting bodies 30 illustrated are disposed between base body 10 and head portion 70. Specifically, they are disposed within the glass layer 20. The glass layer 20 may also be implemented by two separate glass layers, with the two connecting bodies 30 placed between the two layers in this case. In this manner, the two connecting bodies 30 are electrically insulated from both the base body 10, and the head portion 70. The two connecting bodies 30 extend through glass layer 20. They provide an electrical connection or two electrical terminals between the interior and the exterior of the housing 100. The at least two or two connecting bodies 30 are positioned both on one side of housing 100, or on the same side of housing 100. They are arranged in a plane. In the present example, the connecting bodies 30 are two metallic plates, preferably copper plates. They may be bent or are bent, as illustrated, so that for example a connection may be established to a conductor trace of a circuit board to which the housing 100 will be placed when operated.
(18) Base body 10 has an upper surface 10a, a lower surface 10b, and a lateral surface 13. In the example shown, the base body 10 has a polygonal, preferably square, cross section. The cross section may also be round, preferably circular or oval. Base body 10 is likewise implemented as a metal plate, preferably as a copper plate. At the upper surface 10a of base body 10, a mounting area 14 is defined for at least one electronic functional element 40, such as a power electronics device. One example is a FET. Mounting area 14 is provided by the upper surface 10a of base body 10.
(19) Head portion 70 is arranged upon base body 10, specifically on the upper surface 10a of base body 10. It has substantially the same dimensions as base body 10. Head portion 70 is in particular implemented as a metal plate, preferably as a copper plate. Head portion 70 covers base body 10 in sections thereof. However, it does not necessarily form and end of housing 100 at the upper surface thereof. In particular, it forms at least a portion of a housing wall or the housing wall. Head portion 70 may also be referred to as a housing wall or frame. Head portion 70 surrounds the mounting area 14, in particular at least partially, or completely. Thus, an opening 71 or hole 71 is formed in head portion 70. The functional element 40 to be mounted is then placed in the hole 71, or within head portion 70. The opening 71 has a polygonal, preferably a square cross section. The cross section may also be round, preferably circular, or oval. Head portion 70 may constitute some kind of a cover for base body 10. It is also possible to additionally provide a lid on head portion 70, for closing the housing 100.
(20) Glass layer 20 is disposed between the upper surface 10a of base body 10 and head portion 70. It joins base body 10 to head portion 70. The glass is an alkali titanium silicate glass. Here, the thickness of the glass layer is from about 30 μm to about 500 μm, preferably from about 100 μm to about 300 μm.
(21)
(22) In the embodiment described above, base body 10 and connecting body/bodies 30 are joined by a glass layer 20 which is substantially disposed on the upper surface 10a of base body 10. In contrast, the embodiments described below illustrate a housing 100, in which the base body 10 and the connecting body 30 are joined by a glass layer 20 that is disposed between the circumferential or lateral surface 13 of base body 10 and the connecting body 30. Connecting body 30 is attached at the lateral side or lateral surface of base body 10. The glass is again an alkali titanium silicate glass. The thickness of the glass layer ranges from about 200 μm to about 2000 μm.
(23)
(24) In the cross-sectional view it can be seen that some kind of an I-shaped glass composite is formed. A kind of ring-in-ring system is formed around base body 10. Here, the bonding glass layer 20 defines a first ring, and sleeve 16 defines a second ring. Both, they are arranged around base body 10. Here, glass layer 20 and sleeve 16 extend completely and/or continuously around the circumference of base body 10. By way of example, housing 100 has a round cross section herein, in particular an oval one. However, the cross section may likewise be generally round, or may be polygonal.
(25)
(26)
(27)
(28) The housings 100 shown in
(29) With reference to the subsequent drawings of
(30) All of these figures illustrate a connecting body 30′ which is implemented as a contact pin 30′. First,
(31) The base body 10′ is a metal plate, in a preferred embodiment a copper plate. At the upper surface 10a′ of base body 10′ the mounting area 14′ for an optoelectronic functional element 40′ is defined. Here, it is provided by a planar or substantially planar upper surface 10a′.
(32) Especially in order to keep the production costs low, base body 10′ with channel 11′ formed therein is made by a stamping process. In this example, channel 11′ formed therein comprises a first portion 11-1′ and a second portion 11-2′.
(33) The first portion 11-1′ is formed as a non-lateral recess 13′, in the present case as a bore or through-hole in base body 10′. The first portion 11-1′ of channel 11′ extends from the upper surface 10a′ of base body 10′ to the rear face 10b′ of base body 10′. It forms some kind of a tube in base body 10′. Here, the first portion 11-1′ extends substantially in parallel to the central axis 10d′ of base body 10′.
(34) The second portion 11-2′ of channel 11′ extends transversely to the first portion 11-1′ of channel 11′, in the present case perpendicular thereto. The second portion 11-2′ also extends transversely to the central axis 10d′ of base body 10′, here perpendicular thereto.
(35) The second portion 11-2′ is formed as a recess in the rear face 10b′ of base body 10′. The recess extends from central axis 10d′ of base body 10′ towards the lateral surface 10c′ of base body 10′. It forms some kind of a downwardly opening channel 11′ in base body 10′. Second portion 11-2′ opens into lateral surface 10c′ of base body 10′.
(36) In the present embodiment, channel 11′ is formed by first portion 11-1′ and second portion 11-2′. First portion 11-1′ of channel 11′ merges into second portion 11-2′ of channel 11′. In a cross-sectional view, channel 11′ is substantially L-shaped (see
(37) In this example, channel 11′ or first 11-1′ and second 11-2′ portions of channel 11′ is/are substantially completely filled with a glass 20′. Glass 20′ serves to join base body 10′ to connecting body 30′. Glass 20′ is an alkali titanium silicate glass. Contact pin 30′ is disposed in channel 11′ and is embedded in the glass 20′.
(38) In a first method step, initially, base body 10′ is provided with channel 11′ or 11-1′ and 11-2′ formed therein. In one embodiment of the method, channel 11′ or 11-1′ and 11-2′ is first filled with the glass 20′ which preferably is in a liquid or low-viscosity state. For this purpose, glass 20′ is in an appropriately heated state. For the present glass 20′ this is at a temperature in a range from about 400° C. to about 1000° C., preferably from 500° C. to about 700° C. One example of filling is dispensing. Once channel 11′ or 11-1′ and 11-2′ is/are filled, the contact pin 30′ is inserted or pressed into the filled channel 11′ or 11-1′ and 11-2′, in this case via the rear face 10b′ of base body 10′.
(39) The dimensions and shape of contact pin 30′ are adapted to the dimensions and shape of the channel 11′ in which it is placed. In the example shown, contact pin 30′ is also substantially L-shaped, and thus also has a first portion 30-1′ and a second portion 30-2′. Contact pin 30′ has a hook shape.
(40) The first portion 30-1′ of contact pin 30′ is associated with the zone of the first portion 11-1′ of channel 11′. The second portion 30-2′ of the contact pin 30′ is associated with the zone of the second portion 11-2′ of channel 11′. The first portion 30-1′ is substantially completely surrounded by the glass 20′, except for its end face 30a′. This free end face 30a′ terminates at the upper surface 10a′ of base body 10′. It provides the terminal for optoelectronic functional element 40′. The free end face 30a′ may also be located above the upper surface 10a′.
(41) The second portion 30-2′, by contrast, is not completely enclosed by the glass 20′, in the example shown. This is because on the one hand the second portion 30-2′ does not terminate at lateral surface 10c′ of base body 10′. Rather, it extends beyond the lateral surface 10c′ of base body 10′. Thus, contact pin 30′ may for example be deflected appropriately to reach a connection element. Therefore, the end face 30b′ of second portion 30-2′ is also exposed. On the other hand, in addition thereto, the second portion 30-2′ is not completely immersed in the glass 20′ in the region of base body 10′. The rear side of the circumferential surface 30c′ of the second portion 30-2′ is exposed above the glass 20′. This additionally allows for back side contacting by simple placement onto a conductor trace (see
(42) In order to avoid repetitions, only the respective modifications will be described for the embodiments explained below. For identical or similar features, reference is made to the respective embodiments described above.
(43)
(44) If the functional element 40′ is implemented as an LED 40′, for example, the inner surface or lateral surface of depression 15′ may have reflective properties, in particular at least in sections thereof, to improve illumination. Therefore, depression 15′ may also be referred to as a reflector 15′. Depending on the material and/or manner of manufacturing, depression 15′ or the inner surface of depression 15′ may already have sufficiently good reflective properties. Usually, however, reworking of the inner surface or lateral surface of depression 15′ will be required. One way to achieve the reflective properties is by machining the inner surface, for example by polishing. As an alternative or in addition thereto, the inner surface may also be coated and/or covered, in sections thereof or completely, preferably with a metal.
(45) The material for producing the coating and/or lining, preferably the metal, is at least one material selected from a group consisting of silver, aluminum, nickel, palladium, and gold. The method for generating or producing the coating is at least one method selected from a group consisting of electro-plating, and vapor deposition, in particular PVD and/or CVD.
(46)
(47) Furthermore,
(48) Contact pin 30′ is arranged within channel 11′, or 11-1′. It is disposed substantially in the center of channel 11-1′. It is fixed at or in base body 10′, or at or in channel 11′ by means of a glass layer 20′. Channel 11′ is filled with the glass 20′ for providing the bonding glass layer 20′ only to such an extent that the interior of channel 11-1′ above the bottom of the depression 15′ is substantially free of glass 20′. In this manner the glass 20′ can be prevented from flowing into the depression 15′.
(49) In addition, an accommodating area 16′ for an optical component 60′ is provided in the upper surface 10a′ of base body 10′. The optical component 60′ is for example a lens 60′, in particular a glass lens 60′. The accommodating area 16′ is formed as a further depression in the upper surface 10a′ of base body 10′. This further depression has a larger cross section than that of the upper face of reflector 15′, and has a depth from about 0.1 to 1 mm, to give an example.
(50) In summary,
(51) First,
(52) The base body 10′ is substantially round, preferably circular. The circle is defined or approximated by a polygon. In the version shown, the lateral surface 10c′ or contour of base body 10′ is not formed by a curved line but by a 12-edged polygon (see
(53) Channels 11′ and contact pins 30′ are distributed along the periphery of mounting area 14′. They are not arranged at the lateral surface 10c′ or edge of base body 10′. Rather, they are offset inwardly, i.e. towards the center of base body 10′. They are arranged along a circumference of a circle in base body 10′. Preferably, they are arranged equidistantly from one another around the circumference of a circle. In the example shown, twelve channels 11′ and twelve contact pins 30′ are arranged in base body 10′.
(54) As already shown above in
(55)
(56) In contrast thereto, the second portions 30-2′ of contact pins 30′ do not extend beyond the lateral surface 10c′ of the base body 10′. They terminate at the lateral surface 10c′ of base body 10′. Moreover, not all channels 11′ and contact pins 30′ are of equal length. In the example shown, six short channels 11′ and six short contact pins 30′, and one long channel 11′ and one long contact pin 30′ are arranged at or in base body 10′.
(57) The short contact pins 30′, or the contact pins 30′ having a short second portion 30-2′ are disposed along the circumference of base body 10′ substantially equidistantly from one another. The long contact pin 30′, by contrast, has an enlarged second portion 30-2′. It terminates, with its first portion 30-1′, in the center or at the central axis 10d′ at the upper surface 10a′ of base body 10′.
(58) This arrangement may for example be used to drive six LEDs 40′ arranged upon the mounting area. The six LEDs 40′ have one common terminal, for example the central contact pin 30′, as an anode or cathode. However, they each have a separate terminal as the cathode or anode, for example a respective one of the six short contact pins 30′ distributed around the circumference, so that the six LEDs 40′ can be switched on and off separately.
(59)
(60)
(61) Channels 11′ and contact pins 30′ are distributed along the circumference of base body 10′, preferably substantially equidistantly to one another. Channels 11′ and contact pins 30′ are only defined by a first, straight section, 11-1′ and 30-1′. They are each substantially I-shaped. In contrast to the embodiments shown above, channels 11′ or first portions 11-1′ thereof are not arranged in the interior of base body 10′ (non-lateral), but are arranged at the lateral side of base body 10′ in this case. They constitute lateral channels 12′. The surface 30c′ of contact pins 30′ facing outwards is exposed here.
(62)
(63) It can be seen in the cross-sectional view that some kind of a ring-in-ring system is formed around base body 10′. Here, a bonding glass layer 35′ defines a first ring, and sleeve 36′ defines a second ring. Both, they are arranged around base body 10′. Here, glass layer 35′ and sleeve 36′ extend completely and/or continuously around the circumference of base body 10′. The cross section of base body 10′ or housing 100′ is illustrated herein within a polygonal shape, by way of example. The cross section may likewise be round.
(64) To give a first summary, the above described
(65) By contrast,
(66) After having been installed in the housing 10′ or placed upon the base body 10′, the functional element 40′ is in direct contact with the base body 10′. The upper surface 10a′ of base body 10′ or of the reflector 15′ is usually substantially planar. The functional element 40′ may, for example, be adhered or soldered to the base body 10′. Preferred solders that are used include lead-free soft solders. The adhesive is preferably a conductive adhesive, such as an epoxy enriched with silver. Therefore, direct contact also means a contact via an adhesive, a solder, or a binding agent.
(67) The form of contact pins 30′ chosen herein corresponds to the contact pins 30′ illustrated in
(68) First,
(69)
(70)
(71)
(72)
(73) As an enhancement to
(74) If a sufficient number of connecting bodies 30′ is provided for driving a functional element 40′ or a plurality of functional elements 40′, then the lower surface 10b′ of base body 10′ may be kept electrically floating, by using the base body 10′ exclusively as a support, and by using the connecting bodies to provide the terminals. This is for example true for the housings 10′ shown in
(75) While
(76) The embodiment illustrated in
(77) Finally,
(78) First,
(79)
(80)
(81)
(82) Finally,
(83) It will be apparent to those skilled in the art that the described embodiments are to be understood as examples. The invention is not limited to these embodiments but may be varied in many ways without departing from the spirit of the invention. Features of individual embodiments and the features described in the general part of the specification may be combined among each other and with each other.
LIST OF REFERENCE NUMERALS
(84) 10 Base body 10a Upper surface of base body 10b Lower surface of base body 13 Lateral or circumferential surface of base body 14 Mounting area for a functional element 15 Insulation, or insulating layer 16 Sleeve or sheath 20 Glass layer or glass for joining and insulating 23 Insulation, or further glass layer 30 Connecting Body 40 Functional element, or LED, or FET 50 Connecting means, or wire, or bonding wire 60 End element, or optical component, or lens 61 Holder for end element 70 Head portion 71 Opening in head portion 100 Housing 10′ Base body, or housing with channel formed therein and with connecting body mounted therein 10a′ Upper surface of base body 10b′ Lower surface of base body 10c′ Lateral surface of base body 10d′ Central axis of base body 11′ Channel in or at base body 11-1′ First portion or leg of the channel 11-2′ Second portion or leg of the channel 12′ Lateral channel or channel portion in the base body, or lateral recess in the base body 13′ Non-lateral channel or channel portion in the base body, or non-lateral recess in the base body 14′ Mounting area for functional element 15′ Depression, or reflector in the base body 16′ Accommodating area for an end element 17′ Insulation, or insulating layer 20′ Glass, or glass layer for joining and insulating 30′ Connecting body, or contact pin 30a′ First end face of connecting body 30b′ Second end face of connecting body 30c′ Lateral surface of connecting body 30-1′ First portion of connecting body 30-2′ Second portion of connecting body 35′ Insulation, or glass layer 36′ Sleeve or sheath 40′ Optoelectronic functional element, or LED 50′ Bonding wire, or wire 60′ End element, or lens, or glass lens 61′ Holder for end element