Encapsulation film and method for encapsulating organic electronic device using same

Abstract

Provided are an encapsulation film, a product for encapsulating an organic electronic device (OED) using the same, and a method of encapsulating an OED. The encapsulation film may effectively block moisture or oxygen permeating into the OED from an external environment, prevent adhesion failure and damage to an organic film due to volume expansion occurring by a reaction between a moisture adsorbent and moisture, and provide high reliability due to increases in a lifespan and durability of the OED.

Claims

1. An encapsulation film for encapsulating an organic electronic device, comprising: an encapsulating layer comprising a crack barrier layer having a tensile modulus of 0.001 to 500 mpa at room temperature and a moisture barrier layer having a tensile modulus of 500 to 1000 mpa at room temperature, of which the crack barrier layer is formed to be in contact with the organic electronic device upon encapsulation of the organic electronic device, wherein the crack barrier layer and the moisture barrier layer comprise an encapsulation resin or a moisture adsorbent.

2. The film according to claim 1, wherein the crack barrier layer comprises an encapsulation resin having a glass transition temperature of 0° C. or less.

3. The film according to claim 2, wherein the encapsulation resin is a styrene-based resin, a polyolefin-based resin, a thermoplastic elastomer, a polyoxyalkylene-based resin, a polyester-based resin, a polyvinylchloride-based resin, a polycarbonate-based resin, a polyphenylenesulfide-based resin, a mixture of hydrocarbon, a polyamide-based resin, an acrylate-based resin, an epoxy-based resin, a silicon-based resin, a fluorine-based resin, or a mixture thereof.

4. The film according to claim 2, wherein the encapsulation resin is a copolymer of an olefin-based compound comprising a carbon-carbon double bond.

5. The film according to claim 1, wherein the moisture barrier layer comprises an encapsulation resin having a glass transition temperature of 85° C. or more.

6. The film according to claim 5, wherein the encapsulation resin comprises a curable resin.

7. The film according to claim 6, wherein the curable resin comprises an epoxy resin comprising a cyclic structure in a molecule structure.

8. The film according to claim 6, wherein the curable resin is a silane-modified epoxy resin.

9. The film according to claim 1, wherein the moisture adsorbent is included in the crack barrier layer at 0 to 20% and in the moisture barrier layer at 80 to 100% based on a total weight of the moisture adsorbent in the encapsulation film.

10. The film according to claim 1, wherein the moisture adsorbent is a moisture reactive adsorbent, a physical adsorbent, or a mixture thereof.

11. The film according to claim 10, wherein the moisture reactive adsorbent is alumina, a metal oxide, a metal salt, or phosphorus pentoxide, and the physical adsorbent is silica, zeolite, zirconia, titania, or montmorillonite.

12. The film according to claim 10, wherein the moisture reactive adsorbent is at least one selected from the group consisting of P.sub.2O.sub.5, Li.sub.2O, Na.sub.2O, BaO, CaO, MgO, Li.sub.2SO.sub.4, Na.sub.2SO.sub.4, CaSO.sub.4, MgSO.sub.4, CoSO.sub.4, Ga.sub.2(SO.sub.4).sub.3, Ti(SO.sub.4).sub.2, NiSO.sub.4, CaCl.sub.2, MgCl.sub.2, SrCl.sub.2, YCl.sub.3, CuCl.sub.2, CsF, TaF.sub.5, NbF.sub.5, LiBr, CaBr.sub.2, CeBr.sub.3, SeBr.sub.4, VBr.sub.3, MgBr.sub.2, BaI.sub.2, MgI.sub.2, Ba(ClO.sub.4).sub.2, and Mg(ClO.sub.4).sub.2.

13. The film according to claim 1, wherein the crack barrier layer further comprises a tackifier.

14. The film according to claim 13, wherein the tackifier is a hydrogenated cyclic olefin-based polymer.

15. The film according to claim 1, wherein the encapsulating layer further comprises a laminating layer, the laminating layer is disposed below the crack barrier layer, and the laminating layer is formed to be in contact with the organic electronic device upon encapsulation of the organic electronic device.

16. The film according to claim 15, wherein the laminating layer comprises an encapsulation resin or a moisture adsorbent.

17. A product for encapsulating an organic electronic device, comprising: a substrate; an organic electronic device formed on the substrate; and the encapsulation film according to claim 1 to encapsulate the organic electronic device, wherein the encapsulation film is attached to an entire surface of the organic electronic device.

18. The product according to claim 17, wherein the organic electronic device is an organic light emitting diode.

19. A method of encapsulating an organic electronic device, comprising: applying the encapsulation film according to claim 1 to a substrate on which an organic electronic device is formed to be attached to an entire surface of the organic electronic device; and curing the encapsulation film.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIGS. 1 to 3 are cross-sectional views of an encapsulation film according to an exemplary embodiment of the present application; and

(2) FIG. 4 is a cross-sectional view of an encapsulation product of an OED according to an exemplary embodiment of the present application.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

(3) Hereinafter, the present invention will be described in further detail with reference to Examples according to the present invention and Comparative Examples not according to the present invention, but the scope of the present invention is not limited to the following Examples.

Example 1

(4) (1) Preparation of Solution for Crack Barrier Layer

(5) 100 g of a silane-modified epoxy resin (KSR-177, Kukdo Chemical Co., Ltd.), 100 g of a butadiene rubber-modified epoxy resin (KR-450, Kukdo Chemical Co., Ltd.), and 150 g of a phenoxy resin (YP-50, Tohto Kasei Co., Ltd.) were added to a reaction vessel at room temperature, and diluted with Methyl ethyl ketone (MEK). 4 g of imidazole (Shikoku Chemicals Co., Ltd.) was added as a curing agent to the homogenized solution, and stirred at a high speed for 1 hour, resulting in a solution for a crack barrier layer.

(6) (2) Preparation of Solution for Moisture Barrier Layer

(7) A moisture adsorbent solution was prepared by adding 100 g of calcined dolomite as a moisture adsorbent and MEK having a solid content of 50 wt % as a solvent. 200 g of a silane-modified epoxy resin (KSR-177, Kukdo Chemical Co., Ltd.) and 150 g of a phenoxy resin (YP-50, Tohto Kasei Co., Ltd.) were added to a reaction vessel at room temperature, and diluted with MEK. Afterward, 4 g of imidazole (Shikoku Chemicals Co., Ltd.) was added as a curing agent to the homogenized solution, and the resulting solution was stirred at a high speed for 1 hour, and thus a solution for a moisture barrier layer was prepared. The moisture adsorbent solution previously prepared was added to the resulting solution to have a content of the calcined dolomite of 50 parts by weight relative to 100 parts by weight of an encapsulating resin of a second layer, resulting in preparing a solution for a second layer.

(8) (3) Manufacture of Film

(9) A moisture barrier layer was formed to have a thickness of 40 μm by coating the solution for a moisture barrier layer previously prepared on a releasing surface of releasing PET and drying the coated surface at 110° C. for 10 minutes.

(10) A crack barrier layer was formed to have a thickness of 15 μm by coating the solution for a crack barrier layer previously prepared on a releasing surface of releasing PET and drying the coated surface at 130° C. for 3 minutes.

(11) The moisture barrier layer and the crack barrier layer were laminated, thereby manufacturing a multilayer film.

Example 2

(12) An encapsulation film was manufactured by the same method as described in Example 1, except that 100 g of a silane-modified epoxy resin (KSR-177, Kukdo Chemical Co., Ltd.), 100 g of an acryl rubber-modified epoxy resin (KR-692, Kukdo Chemical Co., Ltd.), and 150 g of a phenoxy resin (YP-50, Tohto Kasei Co., Ltd.) were added to a reaction vessel at room temperature and diluted with MEK, and 4 g of imidazole (Shikoku Chemicals Co., Ltd.) was added as a curing agent to the homogenized solution and stirred at a high speed for 1 hour, resulting in a solution for a first layer.

Example 3

(13) An encapsulation film was manufactured by the same method as described in Example 1, except that 50 g of a polyisobutene resin (weight average molecular weight: 450,000) as an encapsulation resin of a crack barrier layer and 50 g of a hydrogenated dicyclopentadiene-based resin (softening point: 125° C.) as a tackifier were added into a reaction vessel at room temperature, and 10 g of a DCPD-based epoxy resin and 1 g of imidazole (Shikoku Chemicals Co., Ltd.) were diluted with toluene to have a solid content of approximately 30 wt %.

Example 4

(14) An encapsulation film was manufactured by the same method as described in Example 1, except that 50 g of a polyisobutene resin (weight average molecular weight: 450,000) as an encapsulation resin of a crack barrier layer and 50 g of a hydrogenated dicyclopentadiene-based resin (softening point: 125° C.) as a tackifier were added into a reaction vessel at room temperature, and 20 g of a multifunctional acryl monomer (TMPTA) and 1 g of a photoinitiator were diluted with toluene to have a solid content of approximately 25 wt %.

Example 5

(15) An encapsulation film was manufactured by the same method as described in Example 1, except that 50 g of a polyisobutene resin (weight average molecular weight: 450,000) as an encapsulation resin of a crack barrier layer and 50 g of a hydrogenated dicyclopentadiene-based resin (softening point: 125° C.) as a tackifier were added into a reaction vessel at room temperature, and 10 g of a multifunctional acryl monomer (TMPTA) and 1 g of a photoinitiator were diluted with toluene to have a solid content of approximately 25 wt %.

Comparative Example 1

(16) An encapsulation film was manufactured by the same method as described in Example 1, except that 200 g of a silane-modified epoxy resin (KSR-177, Kukdo Chemical Co., Ltd.) and 150 g of a phenoxy resin (YP-50, Tohto Kasei Co., Ltd.) were added to a reaction vessel at room temperature, and diluted with MEK, and a solution for a crack barrier layer was prepared by adding 4 g of imidazole (Shikoku Chemicals Co., Ltd.) as a curing agent to the homogenized solution, and stirring the resulting solution at a high speed for 1 hour.

Comparative Example 2

(17) An encapsulation film was manufactured by the same method as described in Example 1, except that 180 g of a silane-modified epoxy resin (KSR-177, Kukdo Chemical Co., Ltd.), 50 g of a butadiene rubber-modified epoxy resin (KR-450, Kukdo Chemical Co., Ltd.), and 150 g of a phenoxy resin (YP-50, Tohto Kasei Co., Ltd.) were added to a reaction vessel at room temperature and diluted with MEK, and a solution for a crack barrier layer was prepared by adding 4 g of imidazole (Shikoku Chemicals Co., Ltd.) as a curing agent to the homogenized solution and stirring the resulting solution at a high speed for 1 hour.

Comparative Example 3

(18) An encapsulation film was manufactured by the same method as described in Example 1, except that 50 g of a polyisobutene resin (weight average molecular weight: 450,000) as an encapsulation resin of a crack barrier layer and 60 g of a hydrogenated dicyclopentadiene-based resin (softening point: 125° C.) as a tackifier were added into a reaction vessel at room temperature, and diluted with toluene to have a solid content of approximately 30 wt %.

(19) 1. Measurement of Tensile Modulus

(20) A coating film was manufactured to have a thickness of 40 μm by laminating the crack barrier layer or moisture barrier layer manufactured in Example or Comparative Example. A sample was prepared by cutting the manufactured coating film to a size of 50 mm×10 mm (length×width) by setting a coating direction in the manufacture to a length direction, and both sides of the sample were taped to only have a length of 25 mm. Subsequently, the taped parts were extended at a speed of 18 mm/min at 25° C., and a tensile modulus was measured.

(21) 2. Adhesion Failure in Evaluation of High Temperature and High Humidity Reliability

(22) A sample was manufactured by laminating the film manufactured in Example and Comparative Example on a cover substrate and between glass substrates, and pressured and thermal pressing the resulting substrate at 70° C. Afterward, the sample was maintained in a constant temperature and constant humidity chamber at 85° C. and a relative humidity of 85% for approximately 300 hours. When the adhesion failure occurred, it is represented as X, and when the adhesion failure did not occur, it is represented as O.

(23) 3. Heat Resistant Sustaining Property

(24) After the encapsulating layer of Example or Comparative Example was attached to one end of a PET film having a size of 2.5 cm×5 cm to have a size of 2.5 cm×2.5 cm, and attached to one end of a different PET having the same size, one end of the resulting film was fixed, and 1 kg of a load was hung to the other end of the film in a chamber at 85° C. Through 24-hour observation, when the encapsulating layer was dislocated or the load was dropped, it was represented as X.

(25) TABLE-US-00001 TABLE 1 Adhesion failure in evaluation of high Tensile Tensile temperature Heat modulus of modulus and resistant moisture of crack high humidity sustaining barrier layer barrier layer reliability property Example 1 650 MPa 400 MPa ◯ ◯ Example 2 900 MPa 450 MPa ◯ ◯ Example 3 900 MPa 100 MPa ◯ ◯ Example 4 900 MPa 10 MPa ◯ ◯ Example 5 900 MPa 1 MPa ◯ ◯ Comparative 1 GPa 900 MPa X ◯ Example 1 Comparative 900 MPa 550 MPa X ◯ Example 2 Comparative 900 MPa 0.005 MPa ◯ X Example 3

DESCRIPTION OF REFERENCE NUMERALS

(26) 11, 14: base or releasing film 12: encapsulating layer 12a: crack barrier layer 12b: moisture barrier layer 12c: laminating layer 13: moisture adsorbent 21: substrate 24: cover substrate 25: organic electronic device