MACHINING HEAD FOR LASER MACHINING MACHINE, AND LASER MACHINING MACHINE
20170304939 · 2017-10-26
Inventors
Cpc classification
B23K26/1462
PERFORMING OPERATIONS; TRANSPORTING
G02B5/0825
PHYSICS
B23K26/048
PERFORMING OPERATIONS; TRANSPORTING
International classification
B23K26/06
PERFORMING OPERATIONS; TRANSPORTING
B23K26/04
PERFORMING OPERATIONS; TRANSPORTING
B23K26/14
PERFORMING OPERATIONS; TRANSPORTING
Abstract
The invention relates to a machining head (1) for laser machining machines, in particular for laser cutting machines, having an interface to a laser light source (3), preferably to fiber-coupled or fiber-based laser sources. Said laser sources are designed for more than 500 W of average output power in the near infrared region. The interface is preferably designed for coupling an optical waveguide (2) for the working laser beam (6). The machining head (1) also has a focusing optical unit (11) having preferably only one imaging lens. A deflecting assembly (9, 10) for at least one single deflection of the working laser beam (6) is arranged between the interface and the focusing optical unit (11). Said deflecting assembly (9, 10) is designed as a passive optical element that changes the divergence of the working laser beam (6) in dependence on power.
Claims
1.-14. (canceled)
15. A machining head (1) for laser machining machines, with an interface to a laser light source (3), and with focusing optics (11), characterized in that a deflecting assembly (9, 10) for at least a single deflection of the working laser beam (6) is arranged between the interface and the focusing optics (11) and designed in the form of a passive optical element that changes the divergence of the working laser beam (6) in dependence on the power.
16. The machining head according to claim 15, characterized in that the deflecting assembly (9, 10) consists of a deflecting mirror (9) with essentially constant curvature.
17. The machining head according to claim 16, characterized by a planar deflecting mirror (9).
18. The machining head according to claim 16, characterized in that the deflecting mirror (9) is held in a stressfree mounting (10).
19. The machining head according to claim 16, characterized in that the deflecting mirror (9) of the deflecting assembly (9, 10) is formed by a substrate with a plurality of dielectric layers applied on its front side facing the working laser beam (6), wherein the dielectric layer system is optimized for maximum reflection in an angular range between 2° and 20° around the angle of incidence of the working laser beam (6), and wherein the angle of incidence of any region of the working laser beam (6) lies between 1° and 89°.
20. The machining head according to claim 19, characterized in that the dielectric layer system is optimized for maximum reflection in an angular range between 3° and 7° around the angle of incidence of the working laser beam (6).
21. The machining head according to claim 19, characterized in that the substrate of the deflecting assembly (9, 10) is realized in a wedge-shaped fashion.
22. The machining head according to claim 19, characterized in that a stress-compensating equalization coating is applied on the rear side of the substrate, wherein said equalization coating is at least one coating of a group that comprises coatings with the same properties as on the front side of the substrate, coatings identical to those on the front side, coatings with antireflective properties and pure glass coatings.
23. The machining head according to claim 19, characterized in that the substrate for a zinc sulfide lens or a sapphire lens preferably consists of silica glass and in that the substrate for a silica glass lens preferably consists of sapphire.
24. The machining head according to claim 19, characterized in that devices for monitoring beams transmitted through the substrate or reflected within the substrate are provided.
25. The machining head according to claim 15, characterized in that a protective window and/or, if applicable, an adjustable diaphragm (8) is arranged in the beam path (7) upstream of the deflecting assembly (9, 10).
26. The machining head according to claim 15, characterized in that the deflecting assembly (9, 10) is transmissive to the process light.
27. The machining head according to claim 26, characterized in that a dielectric layer system with sound transmission properties, in particular, in the range between 200 and 900 nm and also >1300 nm, is used on the substrate of the deflecting mirror (9).
28. The machining head according to claim 26, characterized in that a process light monitoring arrangement (12) is positioned on the side of the deflecting assembly (9, 10) lying opposite of the focusing optics (11).
29. The machining head according to claim 28, characterized in that another optical system is used between the deflecting mirror of the deflecting assembly (9, 10) and the process light monitoring arrangement (12).
30. The machining head according to claim 15, characterized in that a beam-shaping optical element is used downstream or upstream of the focusing optics (11).
31. The machining head according to claim 15, characterized in that the focusing optics (11) comprises only one imaging lens.
32. A laser machining machine, characterized by a machining head (1) according to claim 15.
33. The laser machining machine according to claim 32, characterized in that the laser light source (3) is connected to the machining head (1) by means of an optical waveguide (2).
34. The laser machining machine according to claim 32, characterized in that the machining head (1) is connected to a fiber coupled or fiber based laser light source (3).
35. The laser machining machine according to claim 32, characterized in that the laser light source (3) operates in the near-infrared range and has an average output power in excess of 500 W.
36. The laser machining machine according to claim 32, characterized in that it is realized as laser cutting machine and the machining head (1) is realized as laser cutting head.
Description
BRIEF DESCRIPTION OF DRAWINGS
[0046]
[0047]
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0048] The laser machining machine illustrated in
[0049] According to the exemplary embodiment illustrated in
[0050] The most important element of the deflecting assembly 9, 10 is an essentially planar deflecting mirror 9 that is held in a preferably stressfree mounting 10. This may be realized by means of a multi-point fastening arrangement or an adhesive connection on a supporting surface or similar structures. The deflecting mirror 9 of the deflecting assembly 9, 10 is preferably formed by a substrate with a plurality of dielectric layers applied on its front side facing the working laser beam 6. This dielectric layer system is optimized for maximum reflection in an angular range between 2° and 20°, preferably between 3° and 7°, around the angle of incidence of the working laser beam 6. In this case, any region of the working laser beam 6 typically has an angle of incidence between 1° and 89°. The angular range preferably lies between 20° and 70°.
[0051] The actual deflection takes place on the dielectric layer system of the deflecting mirror 9 applied on the front side thereof. The layer system consists of a plurality of dielectric layers in order to cover a broad angular range. If the central axis of the working laser beam 6 has an angle of incidence AOI=45°, the dielectric layer must be able to cover an angular range of AOI=45°±2° to ±20° in order to also deflect the outermost regions of the divergent working laser beam 6. The layer system is optimized for maximum reflection over the entire angular range of the laser light.
[0052] The end cap 5, any glass guards between the end cap 5 and the deflecting assembly 9, 10 and the deflecting mirror itself usually only change the divergence slightly and approximately also by the same order of magnitude. These are power-dependent thermal effects such that the influence on said divergences intensifies as the power increases. Optical elements can cause a reduction or an increase of the divergence depending on the material. At high output powers and therefore significant heating, in particular, of the substrate of the deflecting mirror 9, the divergence of the working laser beam 6 typically is slightly increased at the deflecting mirror 9, wherein this counteracts the focal point shifts of downstream optical components—particularly the focusing optics 11.
[0053] The generally complex layer system may cause stresses in the substrate of the deflecting mirror 9 which lead to a deformation. In the high-power range, additional thermal effects act upon optical components. The dielectric layer system illuminated with the laser particularly may heat up and cause a slight deformation of the substrate of the deflecting mirror 9 such that a thermal lens is created. If the mounting of the substrate allows a uniform deformation, a compensation or partial compensation of the usually occurring thermal lens of the respective imaging lens or imaging lenses can thereby be achieved. In addition to the thermal effects, scattered light effects are advantageously also taken into account in the mounting of the substrate. This is the reason why the substrate of the deflecting mirror is preferably mounted in the most stressfree fashion possible and such that the substrate can also expand or deform. This is preferably achieved by means of the aforementioned multi-point fastening arrangement or a suitable adhesive connection of the deflecting mirror 9 on a supporting surface.
[0054] In order to counteract a deformation of the substrate of the deflecting mirror 9, a stress-compensating equalization coating may be applied on the rear side of the substrate additionally or alternatively to the above-described mounting. The reflecting layer system of the front side can preferably be used for this purpose. However, the layer system may also be realized differently and, for example, have antireflective properties. A pure glass coating may likewise be considered as stress-compensating equalization layer.
[0055] The substrate of the deflecting mirror 9 may consist of different optical materials such as silica glass, sapphire or the like. The substrate may also have any geometric shape (for example angular, round or oval). The mounting 10 consists of materials (e.g. brass) that absorb as little light as possible.
[0056] At average output powers in excess of 500 W, for which the inventive system is primarily designed, the effect of a very fast shape change of the deflecting mirror 9 is achieved in any case if the deflecting mirror is respectively subjected to stress or heating. This shape change and the associated variation of the divergence-changing properties of the deflecting assembly 9, 10 at least partially compensate the variations of the divergence-changing properties of the focusing optics 11, particularly if the focusing optics are realized in the form of a single lens. The divergence-influencing effect of the deflecting assembly 9, 10 is preferably dependent on the output power of the laser source and therefore the relatively short thermalization time of the optical elements used. In this way, the deflecting assembly 9, 10 can compensate the influence of the focusing optics 11 on the divergence, which likewise changes with the output power.
[0057] An imaging optical system is arranged downstream of the deflecting assembly 9, 10 and preferably consists of a lens 11. This lens may be made of different optically transparent material such as, e.g., silica glass, ZnS, sapphire or the like. If so required, at least one beam-shaping optical element is used downstream or upstream of the focusing optics 11 in order to optimally shape the working laser beam 6 for the respective machining process.
[0058] A compensation or reduction of the focal point shift can be achieved in any case, particularly in machining heads with only one focusing lens, preferably an aspherical lens, by purposefully utilizing the power-dependent, divergence-changing properties of the deflecting assembly 9, 10. For this purpose, the materials of the focusing optics 11 and of the deflecting mirror 9 have to be adapted to one another.
[0059] A SiO.sub.2 deflecting mirror is preferably used for focusing optics 11 of zinc sulfide or sapphire such that the focal point shift of the ZnS lens is reduced due to the oppositely directed shift of the deflecting mirror 9. Alternatively, a similar effect can be achieved with a combination of a sapphire lens and a SiO.sub.2 deflecting mirror.
[0060]
[0061] In the direction extending opposite to the propagation direction of the working laser beam 6, the process light from the process zone is projected back on the deflecting assembly 9, 10 by the imaging optics 11 and is in contrast to the laser light transmitted as well as possible in this direction. For this purpose, the dielectric layer system is specified with sufficient transmission properties in the range between 200 and 900 nm—and preferably also above 1300 nm. In this case, the transmission of the divergent process light is typically projected on a camera arrangement 12 positioned downstream of the deflecting assembly 9, 10 referred to the propagation direction of the process light. This results in optical errors (coma errors and spherical aberrations) that can preferably be reduced with a slightly wedge-shaped design of the substrate of the deflecting mirror 9 and therefore of the entire deflecting mirror 9 including the coatings. In this case, the wedge angles lie between 0° and 5°, preferably between 0° and 3°.
[0062] An optical system with variable focal length is preferably located between the process light camera 12 and the deflecting mirror 9. In a single-lens system, the image of the process zone is thereby always projected on the CCD chip of the camera 12 in connection with effect of the wedge-shaped deflecting mirror 9. In this case, it is preferred to use modern lenses with electrically adjustable focal length (“electrically tunable lenses”), which make it possible to realize particularly lightweight and compact arrangements.
[0063] Devices for monitoring beams transmitted through the substrate or reflected within the substrate are advantageously also provided.
[0064] In summary, the inventive machining head, particularly with the proposed single-lens solution and with a deflection in the divergent beam, provides the following advantages: [0065] Compact structural shape [0066] Weight savings and therefore higher machine dynamics [0067] Cost-efficient production due to the reduction of optical elements [0068] Reduced adjustment and positioning effort [0069] Reduced aberrations [0070] Very high power capability [0071] Utmost process reliability
LIST OF REFERENCE SYMBOLS
[0072] 1 Machining head [0073] 2 Fiber-optic cable [0074] 3 Laser source [0075] 4 Connector of fiber-optic cable [0076] 5 End cap of fiber-optic cable [0077] 6 Working laser beam [0078] 7 Divergent beam path [0079] 8 Beam diaphragm [0080] 9 Deflecting mirror [0081] 10 Deflecting mirror mounting [0082] 11 Focusing optics [0083] 12 Process light camera [0084] 13 Process light [0085] 14 Leakage radiation [0086] 15 Scattered light