ARRANGEMENT FOR MAKING CONTACT WITH A PRINTED CIRCUIT BOARD

20170311459 · 2017-10-26

Assignee

Inventors

Cpc classification

International classification

Abstract

The present disclosure pertains to an arrangement comprising a housing, a circuit board arranged in the housing and at least one flat contact to connect the circuit board with an electrical component arranged outside of the housing, whereby the housing has a breakthrough that the flat contact protrudes from, whereby the circuit board has breakthrough that the flat contact reaches through, that the circuit board has a contact tab on the side facing away from the housing breakthrough and whereby a molded seal is inserted in the housing breakthrough and the molded seal positively encloses the flat contact and whereby the contact tab is connected with the flat contact in an electrically conductive manner.

Claims

1. An arrangement comprising: a housing, a circuit board arranged in the housing, and at least one flat contact configured to connect the circuit board with an electrical component arranged outside of the housing, wherein the housing comprises an opening that the flat contact protrudes from, wherein the circuit board has an opening that the flat contact is configured to protrude through, wherein the circuit board has a contact tab on a side facing away from the housing opening, wherein a molded seal is in the housing opening and the molded seal encloses the flat contact, and wherein the contact tab is connected with the flat contact in an electrically conductive manner.

2. The arrangement according to claim 1, wherein an end of the flat contact toward the circuit board has a meander-shaped section.

3. The arrangement according to claim 1, wherein the molded seal closes the housing opening in a media-tight manner.

4. The arrangement according to claim 1, wherein the molded seal closes the housing opening in a water-tight manner.

5. The arrangement according to claim 1, wherein the contact tab is an SMD contact tab.

6. The arrangement according to claim 1, wherein the circuit board includes a conducting path, wherein the contact tab is configured to be connected to the conducting path.

7. The arrangement according to claim 1, wherein the flat contact is a first flat contact, wherein the contact tab comprises a first section configured to be connected to the first flat contact and a second section configured to be connected to a second flat contact.

8. The arrangement according to claim 7, wherein the electrical component comprises a coil body with a first coil end and a second coil end, wherein the first flat contact is configured to be connected with the first coil end and the second flat contact is configured to be connected with the second coil end.

9. The arrangement according to claim 1, wherein the circuit board is a lead frame.

10. The arrangement according to claim 9, wherein the circuit board is at least partially over molded with a synthetic material.

11. The arrangement according to claim 10, wherein the synthetic material is thermoset or thermoplastic resin.

12. The arrangement according to claim 1, wherein the molded seal is comprised of rubber.

13. The arrangement according to claim 1, wherein the housing opening is cast.

14. The arrangement according to claim 13, wherein the molded seal closes the housing opening in a gas-tight manner.

15. The arrangement according to claim 2, wherein the meander-shaped section is generally S-shaped.

16. The arrangement according to claim 2, wherein the meander-shaped section includes a one-hundred and eighty degree bend.

17. The arrangement according to claim 2, wherein the meander-shaped section has a reduced width in comparison to an end of the flat contact away from the circuit board.

18. The arrangement according to claim 2, wherein the meander-shaped section is configured to reduce tension forces created by connecting the contact tab to flat contact.

19. The arrangement according to claim 2, wherein the meander-shaped section provides flexibility to the flat contact.

20. A flat contact configured to connect a circuit board within an housing to an electrical component located outside of the housing, the flat contact comprising: a first end configured to be connected to the electrical component, a second end configured to be connected to the circuit board through a contact tab, a meander-shaped section disposed between the first end and the second end, wherein the meander-shaped section is configured to protrude through an opening in the circuit board.

Description

[0012] The disclosure is subsequently further explained by means of a FIGURE. The only FIGURE schematically shows an arrangement per the disclosure in a cross-section.

[0013] A flat contact can be recognized in the only FIGURE. This flat contact 1 reaches through an opening 4 in a housing 2 and through an opening 5 in a circuit board 3. On the connection area 10 of the flat contact 1 facing away from the circuit board 3, the flat contact 1 is connected to a terminal of an electrical component (not represented). The flat contact 1 has a meander-shaped section 6 on the end of the flat contact 1 facing the circuit board 3 and is connected with a contact tab 8 attached on the circuit board 3. The flat contact 1 has a contact surface 7 in this area that the flat contact 1 is connected with a contact surface 9 of the contact tab 8.

[0014] There is a molded seal 11 in the housing breakthrough 4, which completely encloses the flat contact 1 in this area. With this molded seal 11, it is ensured that no moisture can penetrate through the housing breakthrough 4 in the direction of the circuit board 3.

REFERENCE SIGNS

[0015] 1 Flat contact [0016] 2 Housing [0017] 3 Circuit board [0018] 4 Breakthrough in the housing [0019] 5 Breakthrough in the circuit board [0020] 6 Meander-shaped section [0021] 7 Contact surface on the flat contact [0022] 8 Contact tab [0023] 9 Contact surface on the contact tab [0024] 10 Connecting area of the flat contact [0025] 11 Molded seal