POLISHING APPARATUS

Abstract

A polishing apparatus includes: a plurality of polishing heads for holding a wafer, a polishing pad for polishing the wafer, a rotatable turn table having the polishing pad attached thereto, a turn table driving mechanism for rotating the turn table, a plurality of wafer-detecting sensors for detecting coming off of the wafer from the polishing head during polishing, wherein the polishing apparatus has the wafer-detecting sensor disposed above peripheral portions of the respective polishing heads and on each downstream side in a rotation direction of the turn table with respect to the respective polishing heads. The polishing apparatus can detect coming off of a wafer from a polishing head during polishing more rapidly, and can prevent a breakage of the wafer thereby.

Claims

1-4. (canceled)

5. A polishing apparatus comprising: a plurality of polishing heads for holding a wafer, a polishing pad for polishing the wafer, a rotatable turn table having the polishing pad attached thereto, a turn table driving mechanism for rotating the turn table, a plurality of wafer-detecting sensors for detecting coming off of the wafer from the polishing head during polishing, wherein the polishing apparatus has the wafer-detecting sensor disposed above peripheral portions of the respective polishing heads and on each downstream side in a rotation direction of the turn table with respect to the respective polishing heads.

6. The polishing apparatus according to claim 5, wherein the polishing apparatus also has the wafer-detecting sensor disposed above peripheral portions of the respective polishing heads and on each upstream side in a rotation direction of the turn table with respect to the respective polishing heads.

7. The polishing apparatus according to claim 5, wherein the wafer-detecting sensors takes 80 μs or less to output a detection signal from detecting the wafer.

8. The polishing apparatus according to claim 6, wherein the wafer-detecting sensors takes 80 μs or less to output a detection signal from detecting the wafer.

9. The polishing apparatus according to claim 5, wherein the turn table driving mechanism rotates the turn table directly by a motor without using a speed reducer and has a function of forcibly stopping a rotation of the motor.

10. The polishing apparatus according to claim 6, wherein the turn table driving mechanism rotates the turn table directly by a motor without using a speed reducer and has a function of forcibly stopping a rotation of the motor.

11. The polishing apparatus according to claim 7, wherein the turn table driving mechanism rotates the turn table directly by a motor without using a speed reducer and has a function of forcibly stopping a rotation of the motor.

12. The polishing apparatus according to claim 8, wherein the turn table driving mechanism rotates the turn table directly by a motor without using a speed reducer and has a function of forcibly stopping a rotation of the motor.

Description

BRIEF DESCRIPTION OF DRAWINGS

[0028] FIG. 1 is a schematic diagram showing an example of the inventive polishing apparatus;

[0029] FIG. 2 is a schematic diagram showing an example of the turn table driving mechanism in the inventive polishing apparatus;

[0030] FIG. 3 is a schematic diagram showing an example of positions where the wafer-detecting sensors are disposed in the inventive polishing apparatus;

[0031] FIG. 4 is a schematic diagram showing another example of positions where the wafer-detecting sensors are disposed in the inventive polishing apparatus;

[0032] FIG. 5 is a schematic diagram showing an example of an index mode polishing apparatus of the present invention;

[0033] FIG. 6 is a schematic diagram illustrating a travel angle of a wafer from detection of coming off of the wafer until contact of the wafer and a polishing head in Example 1;

[0034] FIG. 7 is a schematic diagram illustrating a travel angle of a wafer from detection of coming off of the wafer until contact of the wafer and a polishing head in Comparative Example 1;

[0035] FIG. 8 is a graph showing frequencies of coming off of wafers and wafer crash in Example 3 and Comparative Example 3;

[0036] FIG. 9 is a schematic diagram showing a previous polishing apparatus;

[0037] FIG. 10 is a schematic diagram showing positions where the wafer-detecting sensors are disposed in a previous polishing apparatus; and

[0038] FIG. 11 is a schematic diagram showing a turn table driving mechanism in a previous polishing apparatus.

DESCRIPTION OF EMBODIMENTS

[0039] Hereinafter, embodiments of the present invention will be described, but the present invention is not limited thereto.

[0040] As described above, it has been a problem of wafer polishing in which a wafer comes off from a polishing head and collides to another polishing head, generating a breakage of the wafer, thereby lowering the productivity.

[0041] Accordingly, the inventors have diligently investigated to solve such a problem. As a result, the inventors have conceived to dispose wafer-detecting sensors above peripheral portions of the respective polishing heads and dispose on each downstream side in a rotation direction of the turn table with respect to the respective polishing heads, and investigated on the best mode to accomplish these to complete the present invention.

[0042] As shown in FIG. 1, the inventive polishing apparatus 1 is provided with a plurality of polishing heads 2 for holding a wafer, a polishing pad 3 for polishing the wafer, a rotatable turn table 4 having the polishing pad 3 attached thereto, a turn table driving mechanism 5 for rotating the turn table 4 (see FIG. 2), and a plurality of wafer-detecting sensors 6 for detecting coming off of the wafer from the polishing head 2 during polishing.

[0043] The following illustration relates to a case in which two polishing heads are allocated to one turn table such as the polishing apparatus 1 shown in FIG. 1, but the present invention is not limited thereto. In such a polishing apparatus 1, two wafers can be polished simultaneously by one turn table.

[0044] As shown in FIG. 1, the two polishing heads 2 are disposed above the turn table 4. The polishing head 2 can hold a wafer in any method. For example, a vacuum suction method and a water paste method with a template can be used.

[0045] As shown in FIG. 2, the turn table driving mechanism 5 is disposed under the turn table 4. While rotating the turn table with the turn table driving mechanism 5, and supplying a polishing agent onto the turn table 4 from a polishing agent supply mechanism (not shown), the polishing head 2 holding a wafer is rotated, and the wafer is brought into sliding contact with the polishing pad 3, thereby polishing the wafer.

[0046] When the wafer come off from the polishing head 2, the wafer travels toward the rotation direction of the turn table 4 together with the turn table 4 in the wake of rotation of the turn table 4, which increases the amount of coming off of the wafer from the polishing head. The wafer-detecting sensors 6 are intended to detect such a wafer that has come off. The wafer-detecting sensor 6 can also detect a wafer left by a mistake for picking up the polished wafer.

[0047] The wafer-detecting sensor 6, when it detects coming off of a wafer from the polishing head 2 during polishing, outputs a detection signal (forcibly stopping signal) to the turn table driving mechanism 5 to stop the rotation of the turn table 4. This makes it possible to prevent the detached wafer from being in contact with another polishing head 2 and broken, and to prevent continuing the polishing with the wafer being broken. The wafer-detecting sensor 6 can have a function to stop the polishing apparatus and to raise an alarm to let an operator know an accident.

[0048] Herein, when the turn table 4 is rotating counterclockwise in a direction from x.sub.1 to x.sub.2 as shown in FIG. 3, for example, the x.sub.1 side is referred to as an upstream side of a rotation direction of the turn table 4 with respect to the polishing head 2a, and the x.sub.2 side is referred to as a downstream side of a rotation direction of the turn table 4 with respect to the polishing head 2a. Similarly, as to the polishing head 2b, the x.sub.1 side comes to be an upstream side, and the x.sub.2 side comes to be a downstream side.

[0049] As shown in FIG. 3, each wafer-detecting sensor 6 is disposed at the downstream side (the x.sub.2 side) of a rotation direction of the turn table 4 with respect to the respective polishing heads 2a and 2b and, in addition, over the peripheral portion of the respective polishing heads.

[0050] In this constitution, the wafer detached from the polishing head 2 travels to the rotation direction of the turn table 4 as described above, and accordingly it is possible to detect coming off of the wafer from the polishing head 2 more rapidly. As a result, it is possible to prevent the wafer detached from the polishing head 2 from colliding with another polishing head.

[0051] In addition to the wafer-detecting sensors 6 disposed as shown in FIG. 3, it is preferable that the wafer-detecting sensors 6 be also disposed above peripheral portions of the respective polishing heads 2a and 2b on each upstream side (the x.sub.1 side) in a rotation direction of the turn table 4 with respect to the respective polishing heads 2a and 2b as shown in FIG. 4.

[0052] This makes it possible to detect coming off of the wafer from the polishing head during polishing more rapidly even when the wafer is polished with the turn table being rotated to the opposite direction (clockwise rotation in a direction from x.sub.2 to x.sub.1) to the foregoing rotation (counterclockwise rotation in a direction from x.sub.1 to x.sub.2) without changing the positions of the wafer-detecting sensors 6. As a result, it is possible to prevent the wafer detached from the polishing head from colliding with another polishing head when the turn table 4 is rotated in either direction.

[0053] The wafer-detecting sensors 6 are preferably the one which can rapidly output a detection signal, and are preferably the one in which the time for outputting a detection signal from detecting the wafer is 80 μs or less. As the wafer-detecting sensor, a reflection type razor sensor can be used, for example.

[0054] Such a sensor can distinguish a wafer and a polishing agent on the polishing pad, and can securely detect whether the wafer is present or not. Moreover, it can rapidly output a detection signal from detecting the wafer, thereby making it possible to prevent the wafer detached from the polishing head from colliding with another polishing head more securely.

[0055] It is preferable that the turn table driving mechanism 5 rotate the turn table 4 directly by a motor without using a speed reducer as shown in FIG. 2, and have a function of forcibly stopping a rotation of the motor. As the turn table driving mechanism 5, it is preferable to use a direct drive servo motor, for example.

[0056] Such a mechanism can rapidly stop the turn table, thereby making it possible to prevent the wafer detached from the polishing head from colliding with another polishing head more securely. It is also possible to prevent damage of the turn table driving mechanism 5 such as a breakage of the gear, tooth skipping and wearing of the belt in the speed reducer due to forcibly stopping the turn table 4.

[0057] The inventive polishing apparatus can also be applied to an index system polishing apparatus provided with three turn tables 4 and a loading-unloading stage 7, in which two polishing heads 2 are allocated to each of the turn tables 4 and the loading-unloading stage 7 as shown in FIG. 5, for example.

EXAMPLE

[0058] Hereinafter, the present invention will be specifically described with reference to the inventive Examples and Comparative Examples, but the present invention is not limited thereto.

Example 1

[0059] First, a silicon wafer with a diameter of 300 mm was prepared. The wafer was polished by using the inventive polishing apparatus. The polishing apparatus had the wafer-detecting sensors 6 at positions shown in FIG. 4, separated upwardly from the turn table 4 by 150 cm or more in a vertical direction. The wafer-detecting sensor 6 was a reflective raiser sensor (LV-H32 manufactured by KEYENCE CORPORATION), which takes 80 μs to output a detection signal from detecting a wafer. The turn table driving mechanism used was a direct drive servo motor which rotates the turn table 4 directly by a motor without using a speed reducer and has a function of forcibly stopping a rotation of the motor as shown in FIG. 2.

[0060] An angle θ.sub.1 shown in FIG. 6 was determined, the angle being formed between a line (a.sub.1) passing through the center of the wafer W and the center of the turn table 4 when the wafer-detecting sensor 6 detected coming off of the wafer W from the polishing head 2a during polishing and a line (b.sub.1) passing through the center of the wafer W and the center of the turn table 4 when the wafer W came into contact with the adjacent polishing head 2b. This angle θ.sub.1 indicates a travel angle of the wafer W traveling toward the rotation direction of the turn table 4, beginning from detection of coming off of the wafer W till it finally came into contact with another polishing head. Larger value of this angle represents rapid detection, and means increased acceptable time for stopping the turn table from the detection.

[0061] As the result, the θ.sub.1 was 33.5°. This θ.sub.1 was a larger value compared to θ.sub.2 in Comparative Example 1 described below. That is, in Example 1, the wafer that had come off from the polishing head could be detected more rapidly than in Comparative Example 1.

Comparative Example 1

[0062] A wafer was polished by using a previous polishing apparatus provided with wafer-detecting sensors 106 at two points above the turn table 104 in the middle of the adjacent polishing heads 102a and 102b as shown in FIG. 7. The wafer-detecting sensor 106 used was a general optical fiber type which takes 500 μs to output a detection signal from detecting a wafer. The turn table driving mechanism used was composed of a warm speed reducer 111 and a constant torque motor 112 for inverter driving as shown in FIG. 11.

[0063] An angle θ.sub.2 was determined during polishing of a wafer W having a diameter of 300 mm in the same manner with Example 1 except for using a previous polishing apparatus described above, the angle being formed between a line (a.sub.2) passing through the center of the wafer W and the center of the turn table 104 when detecting coming off of the wafer W from the polishing head 102a and a line (b.sub.2) passing through the center of the wafer W and the center of the turn table 104 when the wafer W came into contact with the adjacent polishing head 102b.

[0064] As the result, θ.sub.2 was 11.0°.

Example 2

[0065] Wafers each having a diameter of 300 mm were polished by using the inventive polishing apparatus similar to that in Example 1. The rotation rate of the turn table 4 was altered from 10 rpm to 40 rpm when polishing to determine times taken for stopping the turn table actually (times for stopping the turn table) and rotated angles of the turn table until stopping the turn table actually (travel angles of the turn table) beginning from detecting coming off of a wafer from the polishing head with the wafer-detecting sensors during polishing. These results are shown in Table 1 for each rotation rate of the turn table 4 that had been altered together with the existence or nonexistence of a collision (a crash) between the wafer and the polishing head at each case. Incidentally, Table 1 also represents the measured results of Comparative Example 2 described below.

TABLE-US-00001 TABLE 1 Comparative Example 2 Example 2 Rotation Travel Time for Travel Time for rate of angle stopping angle stopping turn of turn turn of turn turn table table table table table (rpm) (°) (ms) Crash (°) (ms) Crash 10 9 150 None 3.6 60 None 20 30 250 Exit 7.2 60 None 30 63 350 Exit 10.8 60 None 40 108 450 Exit 14.4 60 None

[0066] In Example 2, the times for stopping the turn table were always 60 ms independent of the rotation rate of the turn table as shown in Table 1 since a direct drive servo motor was used as the turn table driving mechanism. The travel angle of the turn table became larger as the rotation rate of the turn table was increased, and was 14.4° when the rotation rate of the turn table was 40 rpm. This angle was a smaller value compared to the θ.sub.1 determined in Example 1 (33.5°) even when the rotation rate of the turn table was 40 rpm, and accordingly there was no crash due to coming off of the wafer.

[0067] On the other hand, Comparative Example 2 generated crashes when the rotation rate of the turn table was 20 rpm or more as will be described below.

Comparative Example 2

[0068] Wafers each having a diameter of 300 mm were polished in the same manner with Example 2 except for using a prior polishing apparatus similar to that in Comparative Example 1 to measure the times for stopping the turn table and the travel angles of the turn table, beginning from detection of coming off of the wafer from the polishing heads with the wafer-detecting sensor. These results are shown in Table 1 together with existence or nonexistence of a crash of the wafer at that time.

[0069] When the rotation rate of the turn table was 10 rpm, the travel angle of the turn table was 9°, which was a smaller value compared to the θ.sub.2 determined in Comparative Example (=11.0°), and accordingly there was no crash due to coming off of the wafer as shown in Table 1. When the rotation rate of the turn table became higher, the time for stopping the turn table became longer, which made the travel angle of the turn table larger. When the rotation rate of the turn table was 20 rpm or more, the travel angle of the turn table were 30° or more, which were larger values compared to the θ.sub.2, thereby generating crashes.

Example 3

[0070] Wafers each having a diameter of 300 mm were polished by using an index system polishing apparatus (SRED manufactured by FUJIKOSHI MACHINERY CORP.) provided with three turn tables 4 and a loading-unloading stage 7, in which two polishing heads 2 were allocated to each of the turn tables 4 and the loading-unloading stage 7 as shown in FIG. 5. The three turn tables 4 were provided with polishing pads of suede and nonwoven fabric. Incidentally, the sensor for detecting a wafer and the turn table driving mechanism used had the same constitutions with those used in Example 1.

[0071] The wafers were polished by rotating the turn table 4 and the polishing heads 2 in the same rotational direction under the load of 120 g/cm.sup.2, with the rotation rates of the turn table and the polishing head were altered in stages to 6.6 to 29.0 rpm and 6.6 to 31 rpm respectively. The frequency of coming off of the wafer from the polishing heads 2 during polishing was measured. Moreover, the frequency of wafer crash due to coming off of the wafer was measured, which are shown in FIG. 8 and Table 2.

TABLE-US-00002 TABLE 2 Comparative Example 3 Example 3 Frequency of coming off of 0.070 0.092 wafer (%) Frequency of wafer crash (%) 0.027 0

[0072] The frequency of coming off of the wafer from the polishing heads 2 during polishing was 0.092%, which was an equal level to Comparative Example 3 described below. While the frequency to generate wafer crash was 0%, that is, wafer crash did not occur in Example 3. On the other hand, wafer crash occurred in Comparative Example 3. As a result, Example 3 showed higher productivity of wafers compared to Comparative Example 3 since wafer crash could be prevented.

Comparative Example 3

[0073] Wafers each having a diameter of 300 mm were polished in the same manner with Example 3 except for using an index mode polishing apparatus composed of wafer-detecting sensors and a turn table driving mechanism as that of Comparative Example 1 to measure the frequency of coming off of the wafer and the frequency of wafer crash. These results are shown in FIG. 8 and Table 2.

[0074] The frequency of coming off of the wafer from the polishing heads during polishing was 0.070%, and the frequency to generate wafer crash was 0.027%. As described above, in Comparative Example 3, wafer crash occurs, and breakage of a wafer was generated, which make the polishing apparatus be stopped for a long time to exchange the polishing pads and the polishing heads. Accordingly, the productivity was substantially lower compared to Example 3.

[0075] It is to be noted that the present invention is not limited to the foregoing embodiment. The embodiment is just an exemplification, and any examples that have substantially the same feature and demonstrate the same functions and effects as those in the technical concept described in claims of the present invention are included in the technical scope of the present invention.