Solder Paste and Solder Joint

Abstract

Provided is a flux for a solder paste that can prevent peeling from electrode, which is seen in a component, a thickness of which is reduced, such a semiconductor package like BGA. Rosin, a glycol-ether-based solvent, an organic acid, a thixotropic agent, a halogen compound, and an imidazole compound are contained and the halogen compound is either an amine hydrohalide or an organohalogen compound or a combination of them. Their addition amounts stay within a range satisfying a formula of 2.5-X-0.625Y≧0 in which the addition amount of the amine hydrohalide is indicated by X (weight %) and the addition amount of the organohalogen compound is indicated by Y (weight %). However, the addition amount X of the amine hydrohalide and the addition amount Y of the organohalogen compound are such that 0≦X≦2.5 and 0≦Y≦4, excluding a range of 0≦X<0.02 and 0≦Y<0.1.

Claims

1.-6. (canceled)

7. A solder paste in which solder alloy powder and a flux are mixed, the flux comprising: rosin; a glycol-ether-based solvent; an organic acid; a thixotropic agent; a halogen compound; and an imidazole compound, wherein the halogen compound is either an amine hydrohalide or an organohalogen compound or a combination of them, the amine hydrohalide is salt of amine compound and hydrohalic acid, the hydrohalic acid includes any of hydrochloric acid and hydrobromic acid, an addition amount of the amine hydrohalide is 0 weight % or more to 2.5 weight % and an addition amount of the organohalogen compound is 0 weight % or more to 4 weight %, when the addition amount of the amine hydrohalide is 0 weight % or more to less than 0.02 weight %, the addition amount of the organohalogen compound of 0 weight % or more to less than 0.1 weight % is excluded, when the addition amount of the organohalogen compound is 0 weight % or more to less than 0.1 weight %, the addition amount of the amine hydrohalide of 0 weight % or more to less than 0.02 weight % is excluded, the addition amount of the amine hydrohalide and the addition amount of the organohalogen compound stay within a range satisfying a formula (1) as follows:
2.5−X−0.625Y≧0  (1) in which the addition amount of the amine hydrohalide is indicated by X (weight %) and the addition amount of the organohalogen compound is indicated by Y (weight %), an addition amount of the imidazole compound is 0.1 weight % to 10 weight %, and whereby activity of the flux acts in a temperature range from 120 degrees C. to 150 degrees C. to prevent the solder paste from being peeled from a substrate.

8. The solder paste according to claim 7, wherein the amine compound includes any of ethylamine, diethylamine, dibutylamine, tributylamine, isopropylamine, diphenylguanidine, cyclohexylamine and aniline, any of the amine hydrohalide, or a combination of them.

9. The solder paste according to claim 7, wherein the organohalogen compound includes any of 1-buromo-2-butanol, 1-buromo-2-propanol, 3-buromo-1-propanol, 3-buromo-1,2-propanediol, 1,4-diburomo-2-butanol, 1,3-diburomo-2-propanol, 2,3-diburomo-1-propanol, 2,3-diburomo-1,4-butanediol, and 2,3-diburomo-2-buten-1,4-diol, or a combination of them.

10. The solder paste according to claim 7, wherein the imidazole compound includes any of imidazole, 2-ethyl-4-methylimidazole, 4-methyl-2-phenylimidazole, 2-phenylimidazole, 2-ethylimidazole, and 2-methylimidazole, or a combination of them.

11. A solder joint wherein the solder joint is formed by the solder paste according to claim 7.

12. The solder paste according to claim 8, wherein the organohalogen compound includes any of 1-buromo-2-butanol, 1-buromo-2-propanol, 3-buromo-1-propanol, 3-buromo-1,2-propanediol, 1,4-diburomo-2-butanol, 1,3-diburomo-2-propanol, 2,3-diburomo-1-propanol, 2,3-diburomo-1,4-butanediol, and 2,3-diburomo-2-buten-1,4-diol, or a combination of them.

13. The solder paste according to claim 8, wherein the imidazole compound includes any of imidazole, 2-ethyl-4-methylimidazole, 4-methyl-2-phenylimidazole, 2-phenylimidazole, 2-ethylimidazole, and 2-methylimidazole, or a combination of them.

14. The solder paste according to claim 9, wherein the imidazole compound includes any of imidazole, 2-ethyl-4-methylimidazole, 4-methyl-2-phenylimidazole, 2-phenylimidazole, 2-ethylimidazole, and 2-methylimidazole, or a combination of them.

15. A solder joint wherein the solder joint is formed by the solder paste according to claim 8.

16. A solder joint wherein the solder joint is formed by the solder paste according to claim 9.

17. A solder joint wherein the solder joint is formed by the solder paste according to claim 10.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0025] FIG. 1A is a diagram showing an effect by a flux according to an embodiment of the present invention.

[0026] FIG. 1B is a diagram showing the effect by the flux according to the embodiment of the present invention.

[0027] FIG. 1C is a diagram showing the effect by the flux according to the embodiment of the present invention.

[0028] FIG. 2A is a diagram showing a problem when a semiconductor package has been reduced in thickness thereof.

[0029] FIG. 2B is a diagram showing the problem when the semiconductor package has been reduced in thickness thereof.

[0030] FIG. 2C is a diagram showing the problem when the semiconductor package has been reduced in thickness thereof.

EMBODIMENT FOR CARRYING OUT THE INVENTION

[0031] <Composition Example of Flux According to This Embodiment>

[0032] The flux according to this embodiment contains a halogen compound, an imidazole compound, an organic acid, rosin, a solvent, and a thixotropic agent. The flux according to this embodiment is mixed with the solder alloy powder to form a solder paste.

[0033] As the halogen compound, an amine hydrohalide and an organohalogen compound are exemplified. As an amine compound of the amine hydrohalide, ethylamine, diethylamine, dibutylamine, tributylamine, isopropylamine, diphenylguanidine, cyclohexylamine, aniline and the like are exemplified. As the hydrohalic acid, hydrochloric acid, hydrobromic acid and hydriodic acid are exemplified.

[0034] As the organohalogen compound, 1-buromo-2-butanol, 1-buromo-2-propanol, 3-buromo-1-propanol, 3-buromo-1,2-propanediol, 1,4-diburomo-2-butanol, 1,3-diburomo-2-propanol, 2,3-diburomo-1-propanol, 2,3-diburomo-1,4-butanediol, 2,3-diburomo-2-buten-1,4diol and the like are exemplified.

[0035] When an addition amount of the halogen compound is small, activity is weak and it is impossible to remove any oxide film at a predetermined low temperature region. On the other hand, when the addition amount of the halogen compound is large, viscosity of the solder paste is increased based on a change over time. Therefore, the addition amount of the halogen compound is set as follows.

[0036] The halogen compound is set to be either the amine hydrohalide or the organohalogen compound or a combination of them. The addition amount of the amine hydrohalide and the addition amount of the organohalogen compound stay within a range satisfying a following formula (1) in which the addition amount of the amine hydrohalide is indicated by X (weight %) and the addition amount of the organohalogen compound is indicated by Y (weight %).

[0037] [Numerical Formula 3]

2.5−X−0.625Y≧0  (1)

0≦X≦2.5

0≦Y≦4

[0038] However, a range of 0≦X<0.02 and 0≦Y<0.1 is excluded.

[0039] The amine compound is added to the flux as an activator for removing the metal oxide film by reacting with the metal oxide film at a predetermined low temperature range, other than the halogen compound. It is preferable that the amine compound to be added as the activator is an imidazole compound. It preferably includes any of imidazole, 2-ethyl-4-methylimidazole, 4-methyl-2-phenylimidazole, 2-phenylimidazole, 2-ethylimidazole, and 2-methylimidazole, or a combination of them.

[0040] When an addition amount of the imidazole compound is small, activity is weak and it is impossible to remove any oxide film at a predetermined low temperature region. On the other hand, when the addition amount of the imidazole compound is large, viscosity of the solder paste is increased based on a change over time. Therefore, the addition amount of the imidazole compound is set to be 0.1 weight % to 10 weight %.

[0041] The rosin protects the activator components such as the halogen compound and the imidazole compound from heat to prevent the activator components from volatilizing. As the rosin, hydrogenated rosin, acid-modified rosin, polymerized rosin, rosin ester and the like are exemplified.

[0042] The solvent dissolves solid components in the flux. The solvent is selected from generally known glycol-ether-based compounds. In order to efficiently work the activator, it is preferable not to volatilize at the low temperature range of 120 degrees C. to 150 degrees C. When the solvent volatilizes, fluidity of the flux deteriorates, so that it is difficult to permeate a function of the activator to whole of the metallic powder. Therefore, it is preferable that its boiling point is 200 degrees C. or more. It is very preferable that the boiling point is 240 degrees C. or more.

[0043] The thixotropic agent is added to give thixotropy. As the thixotropic agent, higher fatty acid amide, higher fatty acid ester, hydrogenated castor oil and the like are exemplified.

[0044] The organic acid is added as an activator component into the flux. As the organic acid, an organic acid that is solid at normal temperature such as adipic acid, suberic acid, and sebacic acid is preferable.

[0045] As other additive agent, any solvent other than the glycol-ether-based solvent, antioxidant, surfactant, defoaming agent, colorant or the like may be suitably added thereto unless the performance of flux is spoiled.

[0046] The organic acid is added for removing the oxide film from the solder alloy and the subject to be soldered over 150 degrees C. that is a normal preliminary heating temperature. The addition amount thereof is set to be 1 weight % to 10 weight %. The rosin protects the activator components such as the halogen compound and the amine compound from heat to prevent the activator components from volatilizing. The addition amount of the rosin is set to be 40 weight % to 60 weight %. The solvent dissolves solid components in the flux. The addition amount of the solvent is set to be 25 weight % to 35 weight %. The thixotropic agent gives the solder paste the viscosity. The addition amount of the thixotropic agent is set to be 5 weight % to 10 weight %.

[0047] The solder paste according to this embodiment is formed by mixing the flux having the above-mentioned compositions with the solder alloy powder. The solder paste according to this embodiment is formed by mixing the flux with the solder alloy powder having solder alloy composition of Sn-3Ag-0.5Cu (each numerical value indicates weight %). This invention, however, is not limited to this solder alloy.

EXECUTED EXAMPLES

[0048] The fluxes of the executed examples and the comparison examples, which have the compositions shown in the following tables, were prepared. The solder pastes were prepared using the fluxes of the executed examples and the comparison examples. Peeling prevention effects of the solder pastes were inspected. It is to be noted that the composition rates in the Tables 1 to 3 are their weight % in the flux compositions. The evaluation method of each inspection will be described.

[0049] (1) Inspection of Peeling Prevention Effects of Solder Pastes

[0050] (a) Evaluation Method

[0051] After the solder paste was printed on copper plate, the solder ball was mounted and maintained at 120 degrees C. for one minute. The solder ball was then pulled up in thermal insulation condition.

[0052] (b) Evaluation Criteria

[0053] O: The solder paste remained on the copper plate; or

[0054] X: The solder paste was peeled from the copper plate.

[0055] (2) Continuous Viscosity Measurement of Solder Pastes

[0056] (a) Measuring Method

[0057] A viscometer used in the measurement was PCU-205 made by Malcom Co., Ltd. The test conditions were set so that the viscosity was continuously measured for 8 hours while a number of revolutions were 10 rpm and the measuring temperature was 25 degrees C.

[0058] (b) Evaluation Criteria

[0059] When the viscosity after 8 hours elapsed was a value within a range of ±20% of the initial viscosity, it was evaluated as being passed and this was indicated by “O”.

[0060] In each of the executed examples 1 through 13, the amine hydrohalide was selected as the halogen compound and was added with it having a rate shown in the following Table 1. As the hydrohalic acid, hydrogen bromide (HBr) was selected. As the amine compound which forms salts by reacting with the hydrohalic acid, diphenylguanidine, diethylamine and isopropylamine were selected.

[0061] Further, in each of the executed examples 1 through 13, as the imidazole compound, imidazole, 2-ethyl-4-methylimidazole, 4-methyl-2-phenylimidazole, 2-phenylimidazole, 2-ethylimidazole, and 2-methylimidazole were added with them having rates shown in the following Table 1.

TABLE-US-00001 TABLE 1 EXE- EXE- EXE- EXE- EXE- EXE- EXE- EXE- CUTED CUTED CUTED CUTED CUTED CUTED CUTED CUTED EXECUTED EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAMPLE PLE PLE PLE PLE PLE PLE PLE PLE 1 2 3 4 5 6 7 8 9 ROSIN 55.9 46 51.98 49.5 44.5 51 51 51 51 SOLVENT 30 30 30 30 30 30 30 30 30 THIXOTROPIC AGENT 7 7 7 7 7 7 7 7 7 ORGANIC ACID 6 6 6 6 6 6 6 6 6 DIPHENYLGUANDNE .Math. HBr 1 1 0.02 2.5 2.5 1 1 DIETHYLAMINE .Math. HBr 1 ISOPROPYLAMINE .Math. HBr 1 IMIDAZOLE 0.1 10 5 5 10 5 5 5 2-METHYLIMIDAZOLE 5 2-ETHYLIMIDAZOLE 2-PHENYLIMIDAZOLE 2-ETHYL-4- METHYLIMIDAZOLE 4-METHYL-2- PHENYLIMIDAZOLE PEELING PREVENTION ∘ ∘ ∘ ∘ ∘ ∘ ∘ ∘ ∘ EFFECT CONTINUOUS VISCOSITY ∘ ∘ ∘ ∘ ∘ ∘ ∘ ∘ ∘ EXE- EXE- EXE- EXE- COMPAR- COMPAR- COMPAR- COMPAR- CUTED CUTED CUTED CUTED ISON ISON ISON ISON EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- PLE PLE PLE PLE PLE PLE PLE PLE 10 11 12 13 1 2 3 4 ROSIN 51 51 51 51 56.99 54 56.95 42 SOLVENT 30 30 30 30 30 30 30 30 THIXOTROPIC AGENT 7 7 7 7 7 7 7 7 ORGANIC ACID 6 6 6 6 6 6 6 6 DIPHENYLGUANDNE .Math. HBr 1 1 1 1 0.01 3 DIETHYLAMINE .Math. HBr ISOPROPYLAMINE .Math. HBr IMIDAZOLE 0.05 15 2-METHYLIMIDAZOLE 2-ETHYLIMIDAZOLE 5 2-PHENYLIMIDAZOLE 5 2-ETHYL-4- 5 METHYLIMIDAZOLE 4-METHYL-2- 5 PHENYLIMIDAZOLE PEELING PREVENTION ∘ ∘ ∘ ∘ x ∘ x ∘ EFFECT CONTINUOUS VISCOSITY ∘ ∘ ∘ ∘ ∘ x ∘ x

[0062] As shown in the Table 1, in the executed examples 1 through 13 which contained the amine hydrohalide and the imidazole compound, and in which the addition amount X of the amine hydrohalide was 0.02 weight % to 2.5 weight % and the addition amount of the imidazole compound was 0.1 weight % to 10 weight %, the solder paste remained on the copper plate. On the other hand, in the comparison example 1 which did not contain any organohalogen compound and in which the addition amount of the amine hydrohalide was less than 0.02 weight % and the imidazole compound was not contained, and the comparison example 3 which did not contain any halogen compound and in which the addition amount of the imidazole compound was less than 0.1 weight %, the solder paste was adhered to the solder ball and peeled from the copper plate. In the comparison example 2 which did not contain any organohalogen compound and in which the addition amount of the amine hydrohalide exceeded 2.5 weight % and the imidazole compound was not contained, and the comparison example 4 which did not contain any halogen compound and in which the addition amount of the imidazole compound exceeded 10 weight %, a tendency to increase the viscosity was seen in the continuous viscosity measurement.

[0063] In the executed examples 14 to 25, as the halogen compound, the organohalogen compounds were selected and 2,3-diburomo-1,4-butanediol and 2,3-diburomo-2-buten-1,4-diol were added with them having rates shown in the following Table 2.

[0064] In addition, in the executed examples 14 to 25, as the imidazole compound, imidazole, 2-ethyl-4-methylimidazole, 4-methyl-2-phenylimidazole, 2-phenylimidazole, 2-ethylimidazole, and 2-methylimidazole were added with them having rates shown in the following Table 2.

TABLE-US-00002 TABLE 2 EXE- EXE- EXE- EXE- EXE- EXE- EXE- CUTED CUTED CUTED CUTED CUTED CUTED CUTED EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- PLE PLE PLE PLE PLE PLE PLE 14 15 16 17 18 19 20 ROSIN 51.9 48 54.9 45 43 50 50 SOLVENT 30 30 30 30 30 30 30 THIXOTROPIC AGENT 7 7 7 7 7 7 7 ORGANIC ACID 6 6 6 6 6 6 6 2,3-DIBUROMO-1,4- 0.1 4 2 2 4 2 BUTANEDIOL 2,3-DIBUROMO-2- 2 BUTEN-1,4-DIOL IMIDAZOLE 5 5 0.1 10 10 5 5 2-METHYLIMIDAZOLE 2-ETHYLIMIDAZOLE 2-PHENYLIMIDAZOLE 2-ETHYL-4- METHYLIMIDAZOLE 4-METHYL-2- PHENYLIMIDAZOLE PEELING PREVENTION ∘ ∘ ∘ ∘ ∘ ∘ ∘ EFFECT CONTINUOUS VISCOSITY ∘ ∘ ∘ ∘ ∘ ∘ ∘ EXE- EXE- EXE- EXE- EXE- COMPAR- COMPAR- CUTED CUTED CUTED CUTED CUTED ISON ISON EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- PLE PLE PLE PLE PLE PLE PLE 21 22 23 24 25 5 6 ROSIN 50 50 50 50 50 56.95 52 SOLVENT 30 30 30 30 30 30 30 THIXOTROPIC AGENT 7 7 7 7 7 7 7 ORGANIC ACID 6 6 6 6 6 6 6 2,3-DIBUROMO-1,4- 2 2 2 2 2 0.05 5 BUTANEDIOL 2,3-DIBUROMO-2- BUTEN-1,4-DIOL IMIDAZOLE 2-METHYLIMIDAZOLE 5 2-ETHYLIMIDAZOLE 5 2-PHENYLIMIDAZOLE 5 2-ETHYL-4- 5 METHYLIMIDAZOLE 4-METHYL-2- 5 PHENYLIMIDAZOLE PEELING PREVENTION ∘ ∘ ∘ ∘ ∘ x ∘ EFFECT CONTINUOUS VISCOSITY ∘ ∘ ∘ ∘ ∘ ∘ x

[0065] As shown in the Table 2, in the executed examples 14 through 25 which contained the organohalogen compound and the imidazole compound, and in which the addition amount Y of the organohalogen compound was 0.1 weight % to 4 weight % and the addition amount of the imidazole compound was 0.1 weight % to 10 weight %, the solder paste remained on the copper plate. On the other hand, in the comparison example 5 which did not contain any amine hydrohalide and in which the addition amount of the organohalogen compound was less than 0.1 weight % and the imidazole compound was not contained, the solder paste was adhered to the solder ball and peeled from the copper plate. In the comparison example 6 which did not contain any amine hydrohalide and in which the addition amount of the organohalogen compound exceeded 4 weight % and the imidazole compound was not contained, a tendency to increase the viscosity was seen in the continuous viscosity measurement.

[0066] From the Tables 1 and 2, it is determined that the addition amount of the amine hydrohalide is 0.02 weight % or more to 2.5 weight % or less and the addition amount of the organohalogen compound is 0.1 weight % or more to 4 weight % or less.

[0067] Accordingly, as the halogen compound, both of the amine hydrohalide and the organohalogen compound were selected and diphenylguanidine.HBr and 2,3-diburomo-1,4-butanediol were added with them having rates shown in the following Table 3.

TABLE-US-00003 TABLE 3 EXE- EXE- EXE- EXE- EXE- COMPAR- COMPAR- COMPAR- CUTED CUTED CUTED CUTED CUTED ISON ISON ISON EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- EXAM- PLE PLE PLE PLE PLE PLE PLE PLE 26 27 28 29 30 7 8 9 ROSIN 49 49.5 48.5 49.95 48.99 47 48.5 47.5 SOLVENT 30 30 30 30 30 30 30 30 THIXOTROPIC AGENT 7 7 7 7 7 7 7 7 ORGANIC ACID 6 6 6 6 6 6 6 6 DIPHENYLGUANIDINE .Math. HBr 1.5 2 0.5 2 0.01 2 2.5 0.5 2,3-DIBUROMO-1,4- 1.5 0.5 3 0.05 3 3 1 4 BUTANEDIOL IMIDAZOLE 5 5 5 5 5 5 5 5 PEELING PREVENTION ∘ ∘ ∘ ∘ ∘ ∘ ∘ ∘ EFFECT CONTINUOUS VISCOSITY ∘ ∘ ∘ ∘ ∘ x x x

[0068] As shown in the Table 3, in the comparison examples 7 through 9, a tendency to increase the viscosity was seen in the continuous viscosity measurement even when the addition amount of the amine hydrohalide is 0.02 weight % or more to 2.5 weight % or less and the addition amount of the organohalogen compound is 0.1 weight % or more to 4 weight % or less.

[0069] According to the executed examples 1 through 28, when the addition amount of the amine hydrohalide is 0.02 weight % or more to 2.5 weight % or less and the addition amount of the organohalogen compound is 0.1 weight % or more to 4 weight % or less, the addition amount of the amine hydrohalide and the addition amount of the organohalogen compound become addition amounts satisfying a formula (1) as follows, in which the addition amount of the amine hydrohalide is indicated by X (weight %) and the addition amount of the organohalogen compound is indicated by Y (weight %).

[0070] [Numerical Formula 4]

2.5−X−0.625Y≧0  (1)

0.02≦X≦2.5

0.1≦Y≦4

[0071] The executed examples 29 and 30 indicated results satisfying both of the peeling prevention effect and the continuous viscosity measurement even when the addition amount of the amine hydrohalide and the addition amount of the organohalogen compound did not stay within the range such that the addition amount of the amine hydrohalide was 0.02 weight % or more to 2.5 weight % or less and the addition amount of the organohalogen compound was 0.1 weight % or more to 4 weight % or less. This indicates that when the addition amount of either the amine hydrohalide or the organohalogen compound to obtain the peeling prevention effect by itself is added, no problem occur even if the other has an addition amount not to obtain the peeling prevention effect by itself. However, it is expected that if each has an addition amount not to obtain the peeling prevention effect by itself, the prevention effect could be reduced.

[0072] From the Tables 1 to 3, the addition amount of the amine hydrohalide and the addition amount of the organohalogen compound become addition amounts satisfying the formula (1) as follows, in which the addition amount of the amine hydrohalide is indicated by X (weight %) and the addition amount of the organohalogen compound is indicated by Y (weight %).

[0073] [Numerical Formula 5]

2.5−X−0.625Y≧0  (1)

0≦X≦2.5

0≦Y≦4

[0074] However, a range of 0≦X<0.02 and 0≦Y<0.1 is excluded.

[0075] From the above inspection results, it is understood that the activator components in the flux reacts with any oxide on the metal surface in the low temperature range in which any reaction does not normally occur between the solder alloy in the solder paste and the flux to remove the metal oxide film, so that the adhesion of metal powder to each other in the solder paste is increased, which causes the solder paste to remain on the substrate. By a rise in such holding force, even if any stress by the bend of the substrate or the like is applied thereto, it is possible to prevent the solder paste from being peeled from the electrode.

[0076] <Example of Effect According to Embodiment of Present Invention>

[0077] FIGS. 1A to 1C are diagrams each showing the effect by the flux according to the embodiment of the present invention. A solder bump 2 is formed to an electrode, not shown, of a semiconductor package 1. Further, a solder paste 5A is applied onto an electrode 4 of a substrate 3. As shown in FIG. 1A, in a step before the reflow, the solder bump 2 and the solder paste 5A applied to the electrode 4 are contacted to each other.

[0078] In the preliminary heating step, by heating during the reflow, temperature of the substrate 3 and the like is gradually increased at temperature lower than the solder melting temperature. By reducing the thickness of semiconductor package 1, the bend occurs in the semiconductor package 1 in the low temperature range of about 120 degrees C. to about 150 degrees C. that is lower temperature range than the main active temperature zone of the flux.

[0079] Even when the bend occurs in the semiconductor package 1, as shown in FIG. 1B, the solder paste 5A is not peeled from the electrode 4 in the solder paste 5A in which the flux according to the embodiment and the solder alloy powder are mixed. Thus, even when the bend occurs in the semiconductor package 1 at pre-heating time, the solder paste 5A is not peeled from the electrode 4, so that it is possible to remove the metal oxide film from the surface of the electrode 4.

[0080] When increasing the temperature in the reflow furnace up to the main heating temperature at which the solder alloy is melted, the solder alloy in the solder paste 5A is melted, so that the electrode 4 and the solder alloy in the solder paste 5A are joined with each other, as shown in FIG. 1C.

[0081] When the solder alloy in the solder paste 5A is then melted, the semiconductor package 1 supported by the substrate 3 through the solder paste 5A creeps down. The descent of the semiconductor package 1 allows the solder bump 2 of the semiconductor package 1 and the solder paste 5A applied to the electrode 4, which has been away from each other by the bend of the semiconductor package 1, to be contacted to each other.

[0082] The volatilization of activator component in the flux is suppressed by the rosin and by contacting the solder bump 2 of the semiconductor package 1 and the solder paste 5A applied to the electrode 4 again, the metal oxide film on the surface of the solder bump 2 is removed.

[0083] The solder bump 2 and the solder alloy in the solder paste 5A are thereby fused. Therefore, even when the bend occurs in the semiconductor package 1 during the reflow process, the solder bump 2 of the semiconductor package 1 and the electrode 4 of the substrate 3 are electrically contacted to each other through the solder alloy.

INDUSTRIAL APPLICABILITY

[0084] This invention is applicable to the soldering of electronic component to which BGA is applied.

EXPLANATION OF REFERENCES

[0085] 1: Semiconductor Package [0086] 2: Solder Bump [0087] 3: Substrate [0088] 4: Electrode [0089] 5A, 5B: Solder Paste