DIVERSION STRUCTURE FOR HEAT DISSIPATION OF DISPLAY CARD
20220061196 ยท 2022-02-24
Inventors
Cpc classification
H05K1/0272
ELECTRICITY
H05K7/20145
ELECTRICITY
H05K7/20972
ELECTRICITY
International classification
Abstract
A diversion structure for heat dissipation of display card including a display card module, a heat dissipation module, and a backplate module. The display card module is provided with a plurality of electronic component areas, a plurality of wiring areas and a plurality of empty plate areas thereon, a plurality of guide holes are formed in the empty plate area, and the heat dissipation module is disposed on an upper side of the display card module and is provided with at least one fan and at least one heat dissipation fin set. Thereby after an airflow generated by the fan takes away the heat energy of the heat dissipation fin set, the airflow is sent toward the display card module and passes through the guide holes to be away from the display card module and the heat dissipation module.
Claims
1. A diversion structure for heat dissipation of display card including: a display card module, the display card module being provided with a plurality of electronic component areas and a plurality of wiring areas thereon, and a plurality of empty plate areas being formed on the display card module, a plurality of guide holes being formed in the empty plate area; a heat dissipation module, the heat dissipation module being disposed on an upper side of the display card module, and the heat dissipation module being provided with at least one fan and at least one heat dissipation fin set; and a backplate module, the backplate module being disposed on a lower side of the display card module.
2. The diversion structure for heat dissipation of display card as claimed in claim 1, wherein the empty plate areas are formed between the adjacent electronic component areas.
3. The diversion structure for heat dissipation of display card as claimed in claim 1, wherein the empty plate areas are formed between the adjacent wiring areas.
4. The diversion structure for heat dissipation of display card as claimed in claim 1, wherein the empty plate areas are formed between the adjacent electronic component areas and the wiring areas.
5. The diversion structure for heat dissipation of display card as claimed in claim 1, wherein a plurality of through holes are formed on the backplate module.
6. The diversion structure for heat dissipation of display card as claimed in claim 5, wherein the through hole communicates with the guide hole.
7. The diversion structure for heat dissipation of display card as claimed in claim 5, wherein the through holes are adjacent to the guide holes.
8. The diversion structure for heat dissipation of display card as claimed in claim 1, wherein the heat dissipation module is further provided with at least one bottom plate, and the heat dissipation module is attached to the display card module via the bottom plate.
9. The diversion structure for heat dissipation of display card as claimed in claim 1, wherein the heat dissipation fin set communicates with the guide holes.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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DETAILED DESCRIPTION OF THE INVENTION
[0023] The above objects of the invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the accompanying drawings.
[0024] Please refer to
[0025] Wherein the display card module 3 is provided with a plurality of electronic component areas 31 and a plurality of wiring areas 32 thereon, wherein the electronic component areas 31 are provided for disposition of electronic components, and the wiring areas 32 are provided for disposition of power conducting wires. A plurality of empty plate areas 33 are further formed on the display card module 3, wherein the empty plate areas 33 can be formed between the adjacent electronic component areas 31, between the adjacent wiring areas 32, and between the adjacent electronic component areas 31 and the wiring areas 32, the empty plate areas 33 are formed with a plurality of guide holes 331 thereon, and the guide holes 331 penetrate the display card module 3.
[0026] Wherein the heat dissipation module 4 is disposed at a position on an upper side of the display card module 3, and the heat dissipation module 4 has at least one fan 41, at least one heat dissipation fin set 42 and at least one bottom plate 43. The heat dissipation module 4 is attached on the display card module 3 via the bottom plate 43, the heat dissipation fin set 42 is provided with a thermal conductive pipe 421, and the heat dissipation fin set 42 communicates with the guide holes 331.
[0027] Wherein the backplate module 5 is disposed on a lower side of the display card module 3, a plurality of through holes 51 are formed on the backplate module 5, and the through holes 51 communicate with the guide holes 331, or the through holes 51 are disposed adjacent to the guide holes 331.
[0028] Please continue to refer to the aforementioned figures and
[0029] It is to be understood that the above description of the preferred embodiments of the present invention is not used to limit the present invention, and changes in accordance with the concepts of the present invention may be made without departing from the spirit of the present invention, for example, the equivalent effects produced by various transformations, variations, modifications and applications made to the configurations or arrangements shall still fall within the scope covered by the appended claims of the present invention.