Process for fabricating high-precision objects by high-resolution lithography and dry deposition and objects thus obtained
09796581 · 2017-10-24
Assignee
Inventors
- Stéphane Landais (Chaville, FR)
- Fayçal Bouamrane (Gif sur Yvette, FR)
- Thomas Bouvet (Paris, FR)
- Olivier Dessornes (Villebon s/Yvette, FR)
- Pierre Josso (Erquy, FR)
- Stéphan Megtert (Villebon sur Yvette, FR)
- Roger Valle (Clamart, FR)
Cpc classification
B81B5/00
PERFORMING OPERATIONS; TRANSPORTING
C23C18/1657
CHEMISTRY; METALLURGY
B82Y10/00
PERFORMING OPERATIONS; TRANSPORTING
B82Y40/00
PERFORMING OPERATIONS; TRANSPORTING
F16C17/12
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B81C1/00198
PERFORMING OPERATIONS; TRANSPORTING
G03F7/0002
PHYSICS
International classification
C23C14/00
CHEMISTRY; METALLURGY
B81C1/00
PERFORMING OPERATIONS; TRANSPORTING
G03F7/00
PHYSICS
B82Y40/00
PERFORMING OPERATIONS; TRANSPORTING
B82Y10/00
PERFORMING OPERATIONS; TRANSPORTING
F16C17/12
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
Abstract
The invention relates to a process for fabricating a high-precision object made of at least one inorganic material, comprising the following steps: using a high-resolution photolithography process, employing X-rays or UV rays depending on the desired degree of precision, in a chosen direction Z, to form a negative mold, which does not deform at the microscale during the steps of the process, in a material able to withstand a step for forming the object by dry deposition and capable of either being removed without altering the object fabricated or being separated from said object; choosing, independently of the normal redox potential of its constituent elements, at least one inorganic material from the set of materials that can be deposited by dry deposition and that allow the object to be fabricated to meet its thermomechanical and environmental specifications; and forming, by means of the non-deformable negative mold, the object to be fabricated by dry deposition of said at least one inorganic material, thereby allowing an object to be fabricated with better than microscale precision, especially with respect to the angle between the walls generated by the dry deposition and said direction Z. The invention is preferably applied to the fabrication of high-precision micromechanical objects, in particular in the aeronautical and clock-/watch-making fields.
Claims
1. Process for fabricating a micromechanical object of millimetric size or larger, of high precision, formed of at least one inorganic material, characterized in that it comprises the following steps: using a high-resolution photolithography process employing, in a chosen direction Z, radiation of a wavelength adapted to a desired degree of precision, to form a negative mold, which is not deformable on the micrometric scale during the steps of the process, in a resistant material that is resistant to a step of forming the object by dry deposition and that can either be removed without altering the fabricated object or separated from said object; choosing, independently of the normal redox potential of its constituent elements, at least one inorganic material selected from the group of materials that cannot be deposited by electroplating but can be deposited by dry deposition and that satisfy the severe thermomechanical and environmental demands of a gas turbine; and carrying out, by means of the non-deformable negative mold, by dry deposition of said at least one inorganic material, the forming of the micromechanical object that is of millimetric size or larger while having micrometric precision, comprising at least one part in the form of a straight cylinder whose generating line is parallel to the chosen direction Z, the slope error between said direction Z and walls of said part generated by dry deposition being less than 1 micrometer per millimeter of thickness.
2. Process according to claim 1, comprising a prior step in which there is chosen a substrate which will subsequently be used in the high-resolution photolithography process to produce the negative mold.
3. Process according to claim 2, wherein the negative mold is formed directly in the resistant material.
4. Process according to claim 2, wherein the resistant material is a photosensitive resin deposited on said substrate.
5. Process according to claim 2, wherein the resistant material is a metal deposited on said substrate.
6. Process according to claim 1, wherein the high-resolution photolithography process is a photolithography process that employs X-radiation.
7. Process according to claim 1, wherein the high-resolution photolithography process is a photolithography process that employs UV radiation.
8. Process according to claim 1, comprising the following subsequent steps: removing the negative mold or separating it from the object to be fabricated; and recovering the object so fabricated.
9. Process according to claim 1, wherein the step of the process relating to the high-resolution photolithography comprises the following sub-steps: forming a positive mold of the object to be fabricated in a first material, producing in or on the positive mold an electrolytic deposit of a second metallic material, which is the resistant material that is to constitute the negative mold, removing the first material in order to recover the negative mold constituted by the second material, and wherein the step of dry deposition is carried out in or on the negative mold of the second material.
10. Process according to claim 9, wherein the first material is a photosensitive resin.
11. Process according to claim 9, wherein the second material forming the negative mold is an electrolytic deposit.
12. Process according to claim 9, wherein the second material forming the negative mold is removed by chemical dissolution.
13. Process according to claim 1, wherein the dry deposition is chosen from: deposition by triode sputtering (TS), chemical vapor deposition (CVD) or plasma-enhanced CVD, deposition by spark plasma sintering (SPS), physical vapor deposition (PVD), physical deposition by evaporation, for example electron beam physical vapor deposition (EB-PVD).
14. Process according to claim 13, wherein the dry deposition is deposition by triode sputtering (TS).
15. Process according to claim 1, wherein the step of high-resolution lithography and the step of dry deposition are repeated at least once with a different inorganic material in order to produce an object formed of at least two different inorganic materials.
16. Process according to claim 1, wherein the inorganic material is chosen from: pure metals, multi-component alloys, superalloys, or any ceramic obtained by that process, and mixtures thereof.
17. Micromechanical object as obtained by carrying out the process according to claim 1, characterized in that the object is of millimetric size or larger while having micrometric precision, in that the object comprises at least one part in the form of a straight cylinder whose generating line is parallel to the direction Z, the slope error between said direction Z and the walls of the part being less than 1 micrometer per millimeter of thickness, and in that the object comprises the at least one inorganic material that cannot be deposited by electroplating but can be deposited by dry deposition and that satisfies the severe thermomechanical and environmental demands of a gas turbine.
18. Object according to claim 17, produced in the form of a spiral thrust bearing comprising an annular face on which there are formed bosses delimiting spiral grooves having a depth of several micrometers.
19. Object according to claim 17, produced in the form of a lobe bearing of millimetric size.
Description
(1) In the accompanying drawings:
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EXAMPLE I
Fabrication of a Gas Thrust Bearing Having Spiral Grooves Made of Superalloy (Direct Process)
(15) It is proposed to fabricate a gas thrust bearing with spiral grooves 1 for a microturbine, as shown in
(16) Likewise, UV photolithography associated with electroplating cannot produce objects made of nickel-based superalloy.
(17) According to the invention, in order to ensure a slope error of less than 1 μm/mm for the walls generated in direction Z, it has been chosen to construct this type of thrust bearing with spiral grooves by producing the negative of the bosses either by X-ray photolithography, for a constant height of the order of several micrometers, or by X-ray or UV photolithography for a smaller height, the photolithography step being followed by TS deposition of superalloy.
(18) There is used here a process of photolithography on a suitable substrate. To that end, the substrate used is a superalloy called “IN 100” having the following composition:
(19) TABLE-US-00001 Elements Ni Co Cr Al Ti Fe Mo V Nb C Zr B wt. % 59.2 13.2 10.3 5.2 4.2 3.3 3.0 0.9 0.6 0.17 0.05 0.01
(20) The substrate was coated with photosensitive resin (for example SU-8) (negative resin), which is able to withstand temperatures of the order of 300° C. in vacuo. A photolithographic mask is placed on the resin and photolithography is carried out in order to produce a negative mold of photosensitive resin. This point was verified by thermogravimetric analysis (TGA). A target of IN 738LC superalloy, the function of which is to supply the material constituting the object to be fabricated, was machined and put in place. The composition of this alloy is as follows:
(21) TABLE-US-00002 Elements Ni Cr Co Mo W Ta Nb Al Ti C B Zr wt. % 61 16.0 8.5 1.7 2.6 1.7 0.9 3.4 4.5 0.1 0.02 0.1
(22) The substrate was placed on a substrate holder cooled in such a manner that its temperature is always below 300° C. The chosen sputtering parameters are as follows: dissipated power less than 7.6 W/cm.sup.2 (i.e. a polarization current of the target of 0.8 A) for a target-substrate distance of 40 mm. Under these conditions, a coating was obtained, the chemical composition of which is identical to that of the target. It is to be noted that dry depositions can be carried out parallel to the photolithography direction Z (as for this example and Example 4 hereinbelow) or perpendicular to the direction Z (as for Examples 2 and 3 hereinbelow) or at a different angle.
(23) At this stage, the coating still does not have the characteristic microstructure of a superalloy. Therefore, the operations of elimination of the mask of SU-8 resin used in the lithography were combined with the homogenization treatment of the superalloy. To that end, the assembly of IN 100 substrate+1N738 LC spiral bosses+SU-8 resin was heated to a temperature of 1120° C. for two hours under argon and was then annealed at 845° C. for 24 hours in air. It goes without saying that the first treatment eliminated the organic resin completely and the second treatment removed any traces containing carbon from the surface.
(24) A metallographic examination carried out at the end of these operations shows three important results: 1) The substrate/coating interface is almost invisible. It is as if the bosses had been machined in the bulk; 2) The coating has a typical microstructure of γ/γ′ superalloy but with a finer distribution of the γ′ phase than that found in the IN100 substrate; 3) The heat treatment has not deformed the coating.
(25) Finally, the object so created was subjected to a high-temperature oxidation test, as is conventional for any object that is to be used under the severe environmental conditions (corrosive atmosphere, etc.) of a gas turbine. To that end, the spiral thrust bearing fabricated by photolithography followed by TS deposition was tested in isothermal oxidation at 1100° C. for 50 hours. No detachment of the spirals was observed. At the end of the test, a layer of oxides is found to have formed on the surface of the spirals. The subjacent microstructure has become monophase γ again, which is explained by the consumption of the aluminum from the γ′ phase to form an Al.sub.2O.sub.3 protective oxide. However, it was noted that, relative to the bulk alloy constituting the substrate, the zone of aluminum depletion is small. This better resistance of the TS coating is probably due to the obtainment of an extremely fine microstructure, finer than that obtained with a bulk material.
(26) By means of this technique, it is possible in future to create objects of superalloy having a precision that has never before been achieved: dimensions guaranteed to the micrometer, with a microstructure adapted to the use.
EXAMPLE II
Fabrication of a Gas Bearing of Superalloy (Indirect Process)
(27) It is proposed to fabricate lobe bearings, which are constituted by off-center circular arcs, of high precision and great length. Such a gas bearing 4 is shown in a front view in
(28) The resin previously deposited on the substrate is then eliminated, which allows a negative mold of electrolytic nickel to be obtained. The negative mold is then placed in the center of a circular target of IN738 LC (superalloy) and the phase of deposition in the strict sense can begin. The thickness of the deposit is 0.5 mm. At the end of this operation and before removal, the outside of the deposit is ground so that it can fit with a slight clearance (standard ISO H7/g6) in another tube, which in this case is smooth. After this grinding operation, the nickel is dissolved in a nitric acid solution (50% by volume) supplemented with one gram of potassium chloride per liter. The superalloy cannot be chemically etched under these conditions.
(29) At the end of these operations, the lobe bearing of superalloy is homogenized at 1120° C. for two hours under argon with a getter for oxygen, which treatment is followed by annealing at 845° C. for 24 hours, still under argon, with a getter for oxygen. The latter precaution is taken in order to avoid oxidation of the lobes. This two-step treatment is conventionally applied to superalloys during their production in order, in the first instance, to precipitate a finely dispersed γ′ phase and, in the second instance, to stabilize that γ′ phase. At the end of this treatment, a two-phase γ/γ′ microstructure is obtained.
(30) Once introduced into a receiving tube or sleeve, a lobe bearing of very high precision of IN738 LC superalloy having a fine microstructure is obtained. It was hitherto not possible to machine such a superalloy (IN738 LC) over such a length (4 mm) with such precision (less than a micrometer), whatever the machining method used.
EXAMPLE III
Fabrication of a Gas Bearing of Superalloy (Indirect Process)
(31) As in Example II, it is proposed to fabricate a lobe bearing of large size and great length of superalloy. The gas bearing 4 of
(32) As compared with Example II, only the process of obtaining the complementary form of nickel changes. In this example, the complementary forms of the lobe bearings are produced by deep X-ray photolithography in a layer 12 of PMMA (polymethyl methacrylate) resin on an electrically conductive substrate 13 (
(33) Subsequently, an imprint of the lobes is made by electroforming of nickel in the polymer mold to form a nickel object 14 of annular shape (
(34) Mechano-chemical polishing allows each of the nickel objects 14 to be brought to the correct thickness (for example 1 mm). Electrochemical deburring is carried out in order to remove the residual chips produced during polishing. The PMMA mold is then eliminated by dissolution in an organic solvent and detachment of the nickel objects 14 is carried out by chemical etching of the substrate. In the case of the AU4G (2017) alloy, etching is carried out in a basic sodium hydroxide solution (NaOH) at 10 g/l, this solution being harmless for the electroformed nickel.
(35) There are thus obtained nickel objects 14 analogous to those shown in
(36) The objects 14 (of which there are four here) are stacked one on top of the other on a centering shaft 17, as shown in
(37) The assembly so formed is then placed in the center of a circular target of IN738 LC alloy, and the phase of TS deposition in the strict sense can begin. The thickness of the deposit 18 is 0.5 mm (
(38) As in Example II, at the end of this operation and before removal, the outside of the deposit 18 is ground so as to obtain a smooth cylindrical surface (
(39) This allows the assembly so obtained to fit (normalized clearance H7/g6) in another smooth tube which constitutes the receiving tube 11 of
(40) After this grinding operation, the nickel is dissolved in a nitric acid solution (50% by volume) supplemented with one gram of potassium chloride per liter. The superalloy cannot be chemically etched under these conditions.
(41) At the end of these operations, the superalloy lobe bearing is homogenized at 1120° C. for two hours under argon with a getter for oxygen, which treatment is followed by annealing at 845° C. for 24 hours, still under argon, with a getter for oxygen. The latter precaution is taken in order to avoid oxidation of the lobes. This two-step treatment is conventionally applied to superalloys during their production in order, in the first instance, to precipitate a finely dispersed γ′ phase and, in the second instance, to stabilize that γ′ phase. At the end of this treatment, a two-phase γ/γ′ structure is obtained.
(42) Once introduced into the receiving tube 11, there is obtained a lobe bearing of very high precision of IN738 LC superalloy with a fine microstructure. It was hitherto impossible to machine such a superalloy (IN738 LC) over such a length (4 mm) with such precision (less than a micrometer), whatever the machining method used.
EXAMPLE IV
Fabrication of a High-Precision Object Starting from a Plurality of Materials
(43) It is proposed to fabricate a demonstration object of millimetric size using a plurality of materials. The first alloy chosen is a shape-memory alloy, namely nitinol of stoichiometric composition NiTi. The second material is an alumina-type ceramic, and the third is another intermetallic, γ-TiAl. To that end, the substrate on which the sample is to be constructed is a ceramic sheet. Here too, the precision of the various parts must be of the order of a micrometer.
(44) To that end, the following sequence is used: depositing a photosensitive resin SU-8 on an alumina sheet. Revealing the desired form after illumination with a UV or X-ray source; depositing NiTi on a cooled substrate (less than 300° C.) by TS; positioning an electrolytic nickel mask obtained by X-ray photolithography; depositing the ceramic by radiofrequency PVD (PVD-RF); depositing a final layer of SU-8 (resin) on the NiTi+alumina assembly; revealing the last form after illumination with a UV or X-ray source; depositing the third alloy, γ-TiAl, by TS; removing all the residues of SU-8 and dissolving the electrolytic nickel in a bath of HNO.sub.3 at half, supplemented with 1 g/l of KCl.
(45) At the end of these operations, a bimetallic object with a ceramic mandrel is obtained. In view of the nature of the deposited materials, it is impossible to obtain this by direct fabrication (electrolytic deposition, etc.). This example has been chosen to demonstrate the versatility of the process of the invention.
(46) Accordingly, the invention is used preferably in the fabrication of high-precision micromechanical objects, in particular in the field of aeronautics, watch-/clock-making, etc.