HYBRID PRINTED CIRCUIT ASSEMBLY WITH LOW DENSITY MAIN CORE AND EMBEDDED HIGH DENSITY CIRCUIT REGIONS

Abstract

A high density region for a low density circuit. At least a first liquid dielectric layer is deposited on the first surface of a first circuitry layer. The dielectric layer is imaged to create plurality of first recesses. Surfaces of the first recesses are plated electro-lessly with a conductive material to form first conductive structures electrically coupled to, and extending generally perpendicular to, the first circuitry layer. A plating resist is applied. A conductive material is electro-plated to the first conductive structure to substantially fill the first recesses, and the plating resist is removed.

Claims

1. A high density region for a low density circuit comprising: at least a first dielectric layer deposited on the first surface of a first circuitry layer imaged to create a plurality of first recesses; surfaces of the first recesses plated electro-lessly with a conductive material comprising a first conductive structure electrically coupled to, and extending generally perpendicular to, the first circuitry layer, a conductive material electro-plated to the first conductive structure to substantially fill the first recesses; at least a second dielectric layer deposited on the first dielectric layer to include a plurality of second recesses imaged to generally align with a plurality of the first conductive structures; surfaces of the second recesses plated electro-lessly with a conductive material comprising second conductive structures electrically coupled to, and extending generally perpendicular to, the first conductive structures; and a conductive material electro-plated to the second conductive structures to substantially fill the second recesses.

2. The high density region for a low density circuit of claim 1 comprising an IC device electrically coupled to the plating in a plurality of the second recesses.

3. The high density region for a low density circuit of claim 1 comprising: a second circuitry layer located on the second dielectric layer and electrically coupled with a plurality of the second conductive structures; and at least a third dielectric layer deposited on the second dielectric layer imaged to include a plurality of third recesses generally aligned with a plurality of the second conductive structures.

4. The high density region for a low density circuit of claim 3 wherein portions of the second circuitry layer located in the third recesses is etched away to expose a plurality of the second conductive structures.

5. The high density region for a low density circuit of claim 3 comprising: a conductive material plated on surfaces of a plurality of the third recesses comprising a third conductive structure electrically coupled to, and extending parallel to the second conductive structures; a conductive material electro-plated to the third conductive structures to substantially fill the third recesses; and an IC device including a plurality of contact pads electrically coupled to a plurality of the third conductive structures, wherein the IC device is electrically coupled by one of a flip chip attachment directly to a plurality of third conductive structures, solder balls, or wire bonding.

6. The high density region for a low density circuit of claim 3 comprising: a third circuitry layer located on the third dielectric layer; and a covering layer extending across the third circuitry layer, the covering layer comprising a plurality of openings exposing contact pads on the third circuitry layer configured to electrically couple with an IC device.

7. The high density region for a low density circuit of claim 1 wherein the high density circuit is constructed on the low density circuit.

8. The high density region for a low density circuit of claim 1 wherein the first circuitry layer is formed on the low density circuit and the high density circuit is formed on the first circuitry layer.

9. The high density region of a low density circuit of claim 1 wherein the high density printed circuit board comprises a discrete structure configured to electrically couple with the low density circuit.

10. The high density region of a low density circuit of claim 1 wherein the first and second dielectric layers are one of a film or a liquid.

11. The high density region of a low density circuit of claim 1 wherein the first and second dielectric layers comprises one of UV stabilized tetrafunctional epoxy resin systems, bismaleimide-triazine thermoset epoxy resins, and liquid crystal polymers (LCP).

12. The high density region of a low density circuit of claim 1 wherein one or more of the first or second dielectric layers comprises a film of liquid crystal polymer (LCP).

13. A high density region for a low density circuit comprising: at least a first dielectric layer comprising a liquid crystal polymer film deposited on the first surface of a first circuitry layer imaged to create a plurality of first recesses; surfaces of the first recesses plated electro-lessly with a conductive material comprising a first conductive structure electrically coupled to, and extending generally perpendicular to, the first circuitry layer; a conductive material electro-plated to the first conductive structure to substantially fill the first recesses; at least a second dielectric layer comprising a liquid crystal polymer deposited on the first dielectric layer to include a plurality of second recesses imaged to generally align with a plurality of the first conductive structures; and surfaces of the second recesses plated electro-lessly with a conductive material comprising second conductive structures electrically coupled to, and extending generally perpendicular to, the first conductive structures.

14. The high density region of a low density circuit of claim 13 comprising a conductive material electro-plated to the second conductive structures to substantially fill the second recesses.

15. The high density region of a low density circuit of claim 13 wherein the second dielectric layer comprises one of a film or a liquid.

16. The high density region of a low density circuit of claim 13 comprising contact pads on an IC device electrically coupled to a plurality of the second conductive structures.

17. The high density region of a low density circuit of claim 13 comprising a dielectric material deposited in one or more of the recesses to surround one or more of the conductive structures.

18. The high density region of a low density circuit of claim 13 comprising at least one electrical device printed on one of the dielectric layers and electrically coupled to at least a portion of the first circuitry layer.

Description

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING

[0030] FIGS. 1A and 1B are top and side views of a plurality of high density circuit structures combined with a low density PCB in accordance with an embodiment of the present disclosure.

[0031] FIG. 1C is a side view of the PCB merged with the high density circuit structures in accordance with an embodiment of the present disclosure.

[0032] FIG. 2A is a cross-sectional view of a method of making a high density circuit structure in accordance with an embodiment of the present disclosure.

[0033] FIG. 2B is a cross-sectional view of an alternate method of making a high density circuit structure in accordance with an embodiment of the present disclosure.

[0034] FIG. 3 illustrates an optional additional layer on the high density electrical circuit of FIG. 1 in accordance with an embodiment of the present disclosure.

[0035] FIG. 4 illustrates application to a second circuitry layer to the high density electrical circuit of FIG. 1 in accordance with an embodiment of the present disclosure.

[0036] FIG. 5 illustrates an optional dielectric layer on the high density electrical circuit of FIG. 1 in accordance with an embodiment of the present disclosure.

[0037] FIG. 6 illustrates an optional etching step on the high density electrical circuit of FIG. 1 in accordance with an embodiment of the present disclosure.

[0038] FIG. 7 illustrates an electrical interconnect interfaced with a BOA device in accordance with an embodiment of the present disclosure.

[0039] FIG. 8 illustrates an electrical interconnect for a flexible circuit in accordance with an embodiment of the present disclosure.

[0040] FIG. 9 illustrates an electrical interconnect for an IC package in accordance with an embodiment of the present disclosure.

[0041] FIG. 10 illustrates an alternate electrical circuit for an IC package in accordance with an embodiment of the present disclosure.

[0042] FIG. 11 is a side sectional view of an electrical circuit in accordance with an embodiment of the present disclosure.

[0043] FIG. 12 is a side sectional view of an alternate electrical circuit with printed compliant material in accordance with an embodiment of the present disclosure.

[0044] FIG. 13 illustrates an electrical circuit with optical features in accordance with an embodiment of the present disclosure.

[0045] FIG. 14 illustrates an alternate high density electrical circuit with optical features in accordance with an embodiment of the present disclosure.

[0046] FIG. 15 illustrates an alternate high density circuit structure with printed vias in accordance with an embodiment of the present disclosure.

[0047] FIG. 16 illustrates an alternate high density circuit structure with printed electrical devices in accordance with an embodiment of the present disclosure.

[0048] FIG. 17 illustrates an alternate high density electrical circuit with printed compliant electrical pads to plug into another connector in accordance with an embodiment of the present disclosure.

[0049] FIG. 18 is a top view of a high density electrical circuit in accordance with an embodiment of the present disclosure.

[0050] FIG. 19 is a side view of an alternate high density circuit with RF wave guides in accordance with an embodiment of the present disclosure.

[0051] FIG. 20 is a side view of various methods of coupling a high density circuit with a low density circuit in accordance with an embodiment of the present disclosure.

DETAILED DESCRIPTION OF THE INVENTION

[0052] A high density circuit structure according to the present disclosure may permit fine contact-to-contact spacing (pitch) on the order of less than 1.0 mm pitch, and more preferably a pitch of less than about 0.7 millimeter, and most preferably a pitch of less than about 0.4 millimeter. Such fine pitch high density circuit structures are especially useful for communications, wireless, and memory devices.

[0053] The present high density circuit structure can be configured as a low cost, high signal performance electrical interconnect assembly, which has a low profile that is particularly useful for desktop and mobile PC applications. IC devices can be installed and uninstalled without the need to reflow solder. The solder-free electrical connection of the IC devices is environmentally friendly. In another embodiment, the high density circuit structure can also be a portion of a socket or semiconductor package.

[0054] FIGS. 1A and 1B schematically illustrate the merger of a lower density circuit 20 with one or more high density circuits 22A, 22B, 22C, 22D (“22”) into the contiguous assembly of FIG. 1C. The lower density circuit 20 may be a printed circuit board, a flexible circuit, or the like. The high density circuit 22 can be a printed circuit board, an IC socket, a semiconductor package, or the like.

[0055] Dielectric material 24 is optionally applied to the surface 26 of the low density circuit 20 so the location of the high density circuits 22 is at least partially defined and isolated. The dielectric material 24 may be a film or a liquid dielectric. The dielectric material 24 is imaged to expose the circuit locations 28 for the high density circuits 22, improving alignment of vias on the lower density main core 20 with the high density circuits 22.

[0056] As will be discussed in more detail below, the dielectric 24 is optionally processed to enable electro-less or electrolytic copper plating to adhere to the surface of the dielectric and grow a thick trace or pillar or via structure within the imaged region with undesired areas remaining un-plated or post plate etched to remove unwanted copper. Once the surfaces are plated, a higher deposition rate electroplate copper can be applied to build up the thickness or area of copper as desired.

[0057] If the circuit assembly 30 is a flexible circuit, the base layer can be a material such as polyimide or liquid crystal polymer. If the circuit assembly 30 is a rigid circuit board, the base can be FR4 or one of many high speed laminates or substrates. If the circuit assembly 30 is a semiconductor package, the base can be a material such as FR4, BT resin of any one of a variety of laminate or substrate materials. If the circuit assembly 30 is an electrical connector or socket, the base can be molded LCP, machined plastic, or a variety of films or substrate materials.

[0058] The high density circuits 22 (also referred to as “coupons”) can be made using conventional build up technology described above or using the process described below. The high density circuits 22 are then merged with the low density circuit 20. In another embodiment, the high density circuits 22 can be fabricated in-situ directly on the low density circuit 20 using the processes described herein. The present method permits the high density circuits 22 to be formed directly in the circuit locations 28, without having to extend the processing across the entire low density circuit 20.

[0059] FIG. 2A is a side cross-sectional view of a method of making the high density electrical circuits 22 in accordance with an embodiment of the present disclosure. The first step is to start with base material of some sort, such as a copper foil 32A or a core 34 of some sort to act as a support member. If the starting base is copper foil 32A, then the foil can act as the first layer circuitry or escape layer which would be the layer to be merged with the circuit locations 28 on the low density circuit 20. In the case where the high density circuit 22 is a semiconductor package, the foil 32A can be the termination points for BGA attachment to the low density circuit 20. The base 34 can also be a sacrificial member that is removed at some point later in the process to reveal the individual coupons 22.

[0060] In the illustrated embodiment, copper foil circuitry layer 32A is located on reinforcing layer 34. The layer 34 can be a traditional PCB or laminated to a stiffening layer or core, such as glass-reinforced epoxy laminate sheets (e.g., FR4). The circuitry layer 32A can be preformed or can be formed using a fine line imaging step is conducted to etch copper foil as done with many PCB processes.

[0061] Liquid dielectric material 36 is applied to surface 38 and flows between the regions of the circuitry 32A. A dry dielectric film, by contrast, does not flow into the recessed regions. The dielectric layer 36 can be tack cured to partially link the polymer and allow for handling, while retaining the ability to image the material in a photolithography process. Alternatively, the dielectric layer 36 can be processed with a laser direct imaging process known as LDI.

[0062] The dielectric material 36 is typically imaged to create recesses 37 that expose the desired locations 40 on circuitry layer 32A with theoretical via locations 37 created as part of the image directly in proximity to the circuitry layer 32A. One benefit of imaging the dielectric layer 36 is that the via structures do not need to be round as with traditional drilled vias. Any shape that can be imaged and will result in a grown full metal via 54 of the desired shape.

[0063] The dielectric surface 46 can be planarized to create a very consistent dielectric thickness and planarity, as well as assist with preparing select surfaces for electro-less copper plating adhesion. Planarization also permits as many layers to be added to the circuit 22 as needed.

[0064] The dielectric layer 36 is preferably processed to promote electro-less copper plating using one or more of plasma treatment, permanganate, carbon treatment, impregnating copper nano-particles to activate the desired surfaces to promote electroplating. In the illustrated embodiment, the dielectric material 36 is processed to promote plating adhesion to the side walls 44 of the recesses 37. Electro-less copper plating is applied to the side walls 44 of the recesses 37 to create conductive structures 50, resulting in a three-dimensional landscape. Additional discussion of the use of electro-less plating of the dielectric structure is disclosed in PCT/US2012/53848, filed Sep. 6, 2012, entitled DIRECT METALIZATION OF ELECTRICAL CIRCUIT STRUCTURES, the entire of disclosure of which is hereby incorporated by reference.

[0065] A plating resist is applied, imaged and developed to expose the via location 37 and previous circuit layer 32A. In the illustrated embodiment, the conductive structure 50 is an annular-shaped via electrically coupled to the circuitry layer 32A with a center opening or recess 52. Once the surfaces 44 of the dielectric material 36 are plated, a higher deposition rate electroplate copper can be used to fill the recess 52 with conductive material 54 to form a conductive pillar 56. The plating resist is stripped and the copper deposition 50, 54 is optionally planarized. The resulting conductive pillars 56 include a shell 50 of electro-less conductive material and a core 54 of electro-plated conductive material.

[0066] A present process creates the ability to stack full metal vias 54 in subsequent deposition steps to create a high aspect ratio via without the need to drill through the entire stack 22 in one operation. Another benefit is the ability to provide a mounting point for a packaged semiconductor device where a copper pillars 54 are created as an alternative to conventional via in pad construction which can be plagued with reliability issues and high costs to manufacture.

[0067] In another embodiment, the present process enhances the electroplating process is to deposit electro-less copper or copper flash to provide a bus structure for bulk copper electro plating. The copper bus structure is subsequently removed with a differential etch process that leaves bulk copper 54 intact. An alternate step can be employed to add multiple layers of resist 36 and continue the copper growth procedure if desired, with the resulting structures encapsulated by the next dielectric application.

[0068] The shape of the conductive structures 50, 54 is dictated by the shape of the recesses 37. A square recess 37 results in a square-shaped conductive structure 54. The plating process can be controlled to a certain degree, but in some cases with fine pitch geometries and high speed circuits, upper surfaces 46 of the dielectric 36 and the conductive structure 54 may vary in topography or height relative to the field, and the dielectric material 36 may vary in thickness slightly especially if liquid material is used. Consequently, it is preferred to planarize to surfaces 46 of the conductive structures 54 and the exposed surface 46 of the dielectric 36 between steps to control thickness and flatness of the electrical circuit 22.

[0069] In the illustrated embodiment, additional foil layer 32B is applied and processed to create a circuit structure using any of the techniques discussed herein. The conductive material 54 electrically couples the circuit layer 32A to the circuit layer 32B.

[0070] The present method permits the material between layers and within each layer to be varied. One aspect of the present process that differs from the traditional dry film build up process is the nature of the dielectric deposition in liquid form. The dielectric layer 36 can be applied by screen printing, stencil printing, jetting, flooding, spraying etc. The liquid material 36 flows and fills any recessed regions within a previous circuit landscape 32A. During the development process, desired regions remain and the regions that are not desired are washed away with fine resolution of the transition regions within the landscape. Multiple depositions steps can be tack cured and imaged such that thicker sections of dielectric 36 can be developed and washed away in one or multiple strip operations. As a result, internal cavities or mass regions can be excavated and subsequently filled at the next dielectric layer with materials that have physical properties differing from the base dielectric 36. In other words, the excavated regions can be filled or treated with materials that have a different dielectric constant, vary in conductive or mechanical or thermal properties to achieve a desired performance function not possible with a contiguous dry film technique. In basic terms, the present process not only provides the ability to alter the material set and associated properties in a given layer, but the material set can be altered at any given point within a given deposition or layer.

[0071] The present process can also be used in combination with existing dry film techniques. For example, one or more of the layers can be a preformed dielectric film to leave air dielectric gaps between traces. Recesses 37 in the dielectric layer 36 that expose circuitry 32A can be formed by printing, embossing, imprinting, laser cutting, chemical etching with a printed mask, or a variety of other techniques.

[0072] FIG. 2B illustrates an alternate high density electrical circuit 22 in accordance with an embodiment of the present disclosure. The process is the same as discussed in connection with FIG. 2A, except that the sidewalls 44 of the dielectric material 36 are not processed to receive electro-less plating. Rather, a bulk conductive material 42 is applied directly to exposed portions 40 of the circuit layer 32A. The surface 46 is preferably planarized and the circuit layer 32B is applied using any of the techniques disclosed herein.

[0073] FIG. 3 illustrates higher aspect ratio conductive pillar 60 formed on the high density electrical circuit 22 without the foil layer 32B. The process discussed above is repeated by applying another layer 62 of dielectric 36 that is imaged to created recesses 64 that expose the upper surface 66 of the copper pillar 42. The upper surfaces 66 of the copper pillars 42 are then plated as discussed above to create conductive extension 68 of the copper pillar 42.

[0074] In one embodiment, the conductive extensions 68 are planarized to permit die attach point 70 to facilitate flip chip attach of the die 72 to the conductive extensions 68 directly. In another embodiment, exposed surfaces 74 of the plating can be enlarged to facilitate soldering of the die 72 to the conductive extensions 68.

[0075] FIG. 4 illustrates circuitry layer 80 is applied to the top surface 78 of the electrical circuit 22 and coupled to the conductive extensions 68. The circuitry layer 80 creates the base for additional routing layers and to facilitate vertical connection to subsequent layers in the stack in accordance with an alternate embodiment of the present disclosure.

[0076] FIG. 5 illustrates dielectric layer 90 added to the subsequent circuitry layer 80 in accordance with an alternate embodiment of the present disclosure. The dielectric layer 90 is imaged to create recesses 92 that expose portions 94 of the circuitry layer 80 that corresponds with the via extensions 68. The dielectric layer 90 protects the portions of the circuitry layers 80 that are not to be etched and provides access to the foil intimate to the conductive structures 42 and 68. In one embodiment, the extension 68 is optionally conductive structure 50 with a core 54 of conductive or non-conductive material.

[0077] FIG. 6 illustrates a subsequent etch process that removes the copper foil 94 (see FIG. 5) located in the recesses 92 to allow access for the next plating step to join the layers together in accordance with an alternate embodiment of the present disclosure.

[0078] Depending on the dielectric material 90 and desired final construction, the resist layer 90 can be stripped to provide a level to be planarized as the base of further processing or the resist layer 90 can be left in place provided it is of the proper material type. The exposed regions that provided access for etch and plating can be filled with similar material to seal the layer which can be planarized for further processing if desired.

[0079] FIG. 7 illustrates one possible variation of the electrical circuit 22. Recesses 92 are filled with a dielectric material 96 and the surface 98 is planarized to receive circuitry plane 100. Dielectric layer 102 is deposited on the circuitry plane 100 to expose selective regions 104. The selective regions 104 are configured to correspond to solder balls 120 on BGA device 122. In the illustrated embodiment, bottom dielectric layer 106 is optionally deposited on circuitry layer 52 in a manner to expose selective regions 108.

[0080] In one embodiment, the electrical circuit 22 is further processed with conventional circuit fabrication processes to create larger diameter through vias or through holes plated 110 as needed, solder mask applied and imaged to expose device termination locations 104, 108, laser direct imaging, legend application etc. In another embodiment, the via 110 is formed using electro-less plating of each layer of the stack, as illustrated in FIG. 6.

[0081] FIG. 8 illustrate an alternate embodiment in which the electrical circuit 22 is used in a flexible circuit applications. The electrical circuit 22 is laminated with ground planes and cover layers 112, 114. In some applications the insulating layers 112, 114 are applied by jet printing of polyimide or liquid crystal polymers (LCP) inks as a final layer or as a combination of laminated film and jetted material.

[0082] FIG. 9 illustrates an electrical circuit 22 for semiconductor packaging applications in accordance with an embodiment of the present disclosure. The stack 152 can be final processed with a variety of options to facilitate electrical connections to IC devices 162, 166, 172 and to system level attachment to low density circuit 20.

[0083] In one embodiment, the plating 160 is planarized to facilitate flip chip attach to the structure directly (see e.g., FIG. 2) or to receive BGA device 162. In other embodiment, plating 164 is extended to facilitate direct soldering of IC device die 166 with paste. In yet another embodiment, plating 168 is wire bonded 170 to the IC device 172.

[0084] The low density main core 20 can be processed to accept a traditional ball grid array attachment 182 for an area array configuration or plated with solder/tin etc. for a no lead peripheral termination. The low density main core 20 can also be fashioned to have plating or post extensions 184 to facilitate direct solder attach with paste and provide a natural standoff from the low density circuit 20.

[0085] FIG. 10 illustrates an electrical circuit 22 for a semiconductor packages 202 with dielectric materials 204 surrounding the conductive structures 206 in accordance with an embodiment of the present disclosure. Internal circuits and terminations may also be added by imaging or drilling the core material with a larger opening than needed and filling those openings with dielectric and imaging the desired geometry to facilitate conductive structure formation.

[0086] FIG. 11 illustrates an alternate electrical circuit 230 with an insulating layer 232 applied to the circuit geometry 234. The nature of the liquid dielectric application process allows for selective application of dielectric layer 232 to leave selected portions 236 of the circuit geometry 234 expose if desired. The resulting high density electrical circuit 230 can potentially be considered entirely “green” with limited or no chemistry used to produce beyond the direct write materials.

[0087] The dielectric layers of the present disclosure may be constructed of any of a number of dielectric materials that are currently used to make sockets, semiconductor packaging, and printed circuit boards. Examples may include UV stabilized tetrafunctional epoxy resin systems referred to as Flame Retardant 4 (FR-4); bismaleimide-triazine thermoset epoxy resins referred to as BT-Epoxy or BT Resin; and liquid crystal polymers (LCPs), which are polyester polymers that are extremely unreactive, inert and resistant to fire. Other suitable plastics include phenolics, polyesters, and Ryton® available from Phillips Petroleum Company.

[0088] In one embodiment, one or more of the dielectric materials are designed to provide electrostatic dissipation or to reduce cross-talk between the traces of the circuit geometry. An efficient way to prevent electrostatic discharge (“ESD”) is to construct one of the layers from materials that are not too conductive but that will slowly conduct static charges away. These materials preferably have resistivity values in the range of 10.sup.5 to 10.sup.11 Ohm-meters.

[0089] FIG. 12 illustrates an alternate high density electrical circuit 250 in accordance with an embodiment of the present disclosure. Dielectric layer 252 includes openings 254 into which compliant material 256 is deposited or printed before formation of circuit geometry 258. The compliant material 256 improves reliability during flexure of the electrical circuit 250.

[0090] FIG. 13 illustrates an alternate high performance electrical circuit 260 in accordance with an embodiment of the present disclosure. Optical fibers 262 are located between layers 264, 266 of dielectric material. In one embodiment, optical fibers 262 are positioned over compliant layer 268, and dielectric layer 270 is formed over and around the optical fibers 262. A compliant layer 272 is preferably provided above the optical fiber 262 as well. The compliant layers 268, 272 support the optical fibers 262 during flexure. In another embodiment, the dielectric layer 270 is imaged with recesses into which the optical fibers 262 are deposited.

[0091] In another embodiment, optical quality materials 274 are printed during assembly of the high density electrical circuit 260. The optical quality material 274 and/or the optical fibers 262 comprise optical circuit geometries. The printing process allows for deposition of coatings in-situ that enhances the optical transmission or reduces loss. The precision of the printing process reduces misalignment issues when the optical materials 274 are optically coupled with another optical structure.

[0092] FIG. 14 illustrates another embodiment of a present high density electrical circuit 280 in accordance with an embodiment of the present disclosure. Embedded coaxial RF circuits 282 or printed micro strip RF circuits 284 are located within the dielectric layers 286. These RF circuits 282, 284 are preferably created by printing dielectrics and metallization geometry.

[0093] As illustrated in FIG. 15, use of the present process allows the creation of a high density electrical circuit 290 with inter-circuit, 3D lattice structures 292 having intricate routing schemes. Conductive pillars 294 can be plated with each layer, without drilling.

[0094] The nature of the present process permit controlled application of dielectric layers 296 creates recesses 298 that control the location, cross section, material content, and aspect ratio of the conductive traces 292 and the conductive pillars 294. Maintaining the conductive traces 292 and conductive pillars 294 with a cross-section of 1:1 or greater provides greater signal integrity than traditional subtractive trace forming technologies. For example, traditional methods take a sheet of a given thickness and etches the material between the traces away to have a resultant trace that is usually wider than it is thick. The etching process also removes more material at the top surface of the trace than at the bottom, leaving a trace with a trapezoidal cross-sectional shape, degrading signal integrity in some applications.

[0095] Using the imaged recesses 298 to control the aspect ratio of the conductive traces 292 and the conductive pillars 294 results in a more rectangular or square cross-section, with the corresponding improvement in signal integrity. The recesses 298 are preferably processed to receive electro-less plating, followed by electroplating to build up the conductive traces 292.

[0096] In another embodiment, pre-patterned or pre-etched thin conductive foil circuit traces are transferred to the recesses 298. For example, a pressure sensitive adhesive can be used to retain the copper foil circuit traces in the recesses 298. The trapezoidal cross-sections of the preformed conductive foil traces are then post-plated. The plating material fills the open spaces in the recesses 298 not occupied by the foil circuit geometry, resulting in a substantially rectangular or square cross-sectional shape corresponding to the shape of the recesses 298.

[0097] In another embodiment, a thin conductive foil is pressed into the recesses 298, and the edges of the recesses 298 acts to cut or shear the conductive foil. The process locates a portion of the conductive foil in the recesses 298, but leaves the negative pattern of the conductive foil not wanted outside and above the recesses 298 for easy removal. Again, the foil in the recesses 298 is preferably post plated to add material to increase the thickness of the conductive traces 292 in the circuit geometry and to fill any voids left between the conductive foil and the recesses 298.

[0098] FIG. 16 illustrates a high density electrical circuit 300 with printed electrical devices 302. The electrical devices 302 can include passive or active functional elements. Passive structure refers to a structure having a desired electrical, magnetic, or other property, including but not limited to a conductor, resistor, capacitor, inductor, insulator, dielectric, suppressor, filter, varistor, ferromagnet, and the like. In the illustrated embodiment, electrical devices 302 include printed LED indicator 304 and display electronics 306. Geometries can also be printed to provide capacitive coupling 308. Compliant material can be added between circuit geometry, such as discussed above, so the present electrical circuit can be plugged into a receptacle or socket, supplementing or replacing the need for compliance within the connector.

[0099] The electrical devices 302 are preferably printed during construction of the circuit assembly 300. The electrical devices 302 can be ground planes, power planes, electrical connections to other circuit members, dielectric layers, conductive traces, transistors, capacitors, resistors, RF antennae, shielding, filters, signal or power altering and enhancing devices, memory devices, embedded IC, and the like. For example, the electrical devices 302 can be formed using printing technology, adding intelligence to the high performance electrical circuit 300. Features that are typically located on other circuit members can be incorporated into the circuit 300 in accordance with an embodiment of the present disclosure.

[0100] The availability of printable silicon inks provides the ability to print electrical devices 302, such as disclosed in U.S. Pat. No. 7,485,345 (Renn et al.); U.S. Pat. No. 7,382,363 (Albert et al.); U.S. Pat. No. 7,148,128 (Jacobson); U.S. Pat. No. 6,967,640 (Albert et al.); U.S. Pat. No. 6,825,829 (Albert et al.); U.S. Pat. No. 6,750,473 (Amundson et al.); U.S. Pat. No. 6,652,075 (Jacobson); U.S. Pat. No. 6,639,578 (Comiskey et al.); U.S. Pat. No. 6,545,291 (Amundson et al.); U.S. Pat. No. 6,521,489 (Duthaler et al.); U.S. Pat. No. 6,459,418 (Comiskey et al.); U.S. Pat. No. 6,422,687 (Jacobson); U.S. Pat. No. 6,413,790 (Duthaler et al.); U.S. Pat. No. 6,312,971 (Amundson et al.); U.S. Pat. No. 6,252,564 (Albert et al.); U.S. Pat. No. 6,177,921 (Comiskey et al.); U.S. Pat. No. 6,120,588 (Jacobson); U.S. Pat. No. 6,118,426 (Albert et al.); and U.S. Pat. Publication No. 2008/0008822 (Kowalski et al.), which are hereby incorporated by reference. In particular, U.S. Pat. No. 6,506,438 (Duthaler et al.) and U.S. Pat. No. 6,750,473 (Amundson et al.), which are incorporated by reference, teach using ink-jet printing to make various electrical devices, such as, resistors, capacitors, diodes, inductors (or elements which may be used in radio applications or magnetic or electric field transmission of power or data), semiconductor logic elements, electro-optical elements, transistor (including, light emitting, light sensing or solar cell elements, field effect transistor, top gate structures), and the like.

[0101] The electrical devices 302 can also be created by aerosol printing, such as disclosed in U.S. Pat. No. 7,674,671 (Renn et al.); U.S. Pat. No. 7,658,163 (Renn et al.); U.S. Pat. No. 7,485,345 (Renn et al.); U.S. Pat. No. 7,045,015 (Renn et al.); and U.S. Pat. No. 6,823,124 (Renn et al.), which are hereby incorporated by reference.

[0102] Printing processes are preferably used to fabricate various functional structures, such as conductive paths and electrical devices, without the use of masks or resists. Features down to about 10 microns can be directly written in a wide variety of functional inks, including metals, ceramics, polymers and adhesives, on virtually any substrate—silicon, glass, polymers, metals and ceramics. The substrates can be planar and non-planar surfaces. The printing process is typically followed by a thermal treatment, such as in a furnace or with a laser, to achieve dense functionalized structures.

[0103] Ink jet printing of electronically active inks can be done on a large class of substrates, without the requirements of standard vacuum processing or etching. The inks may incorporate mechanical, electrical or other properties, such as, conducting, insulating, resistive, magnetic, semi conductive, light modulating, piezoelectric, spin, optoelectronic, thermoelectric or radio frequency.

[0104] A plurality of ink drops are dispensed from the print head directly to a substrate or on an intermediate transfer member. The transfer member can be a planar or non-planar structure, such as a drum. The surface of the transfer member can be coated with a non-sticking layer, such as silicone, silicone rubber, or Teflon.

[0105] The ink (also referred to as function inks) can include conductive materials, semi-conductive materials (e.g., p-type and n-type semiconducting materials), metallic material, insulating materials, and/or release materials. The ink pattern can be deposited in precise locations on a substrate to create fine lines having a width smaller than 10 microns, with precisely controlled spaces between the lines. For example, the ink drops form an ink pattern corresponding to portions of a transistor, such as a source electrode, a drain electrode, a dielectric layer, a semiconductor layer, or a gate electrode.

[0106] The substrate can be an insulating polymer, such as polyethylene terephthalate (PET), polyester, polyethersulphone (PES), polyimide film (e.g. Kapton, available from DuPont located in Wilmington, Del.; Upilex available from Ube Corporation located in Japan), or polycarbonate. Alternatively, the substrate can be made of an insulator such as undoped silicon, glass, or a plastic material. The substrate can also be patterned to serve as an electrode. The substrate can further be a metal foil insulated from the gate electrode by a non-conducting material. The substrate can also be a woven material or paper, planarized or otherwise modified on at least one surface by a polymeric or other coating to accept the other structures.

[0107] Electrodes can be printed with metals, such as aluminum or gold, or conductive polymers, such as polythiophene or polyaniline. The electrodes may also include a printed conductor, such as a polymer film comprising metal particles, such as silver or nickel, a printed conductor comprising a polymer film containing graphite or some other conductive carbon material, or a conductive oxide such as tin oxide or indium tin oxide.

[0108] Dielectric layers can be printed with a silicon dioxide layer, an insulating polymer, such as polyimide and its derivatives, poly-vinyl phenol, polymethylmethacrylate, polyvinyldenedifluoride, an inorganic oxide, such as metal oxide, an inorganic nitride such as silicon nitride, or an inorganic/organic composite material such as an organic-substituted silicon oxide, or a sol-gel organosilicon glass. Dielectric layers can also include a bicylcobutene derivative (BCB) available from Dow Chemical (Midland, Mich.), spin-on glass, or dispersions of dielectric colloid materials in a binder or solvent.

[0109] Semiconductor layers can be printed with polymeric semiconductors, such as, polythiophene, poly(3-alkyl)thiophenes, alkyl-substituted oligothiophene, polythienylenevinylene, poly(para-phenylenevinylene) and doped versions of these polymers. An example of suitable oligomeric semiconductor is alpha-hexathienylene. Horowitz, Organic Field-Effect Transistors, Adv. Mater., 10, No. 5, p. 365 (1998) describes the use of unsubstituted and alkyl-substituted oligothiophenes in transistors. A field effect transistor made with regioregular poly(3-hexylthiophene) as the semiconductor layer is described in Bao et al., Soluble and Processable Regioregular Poly(3-hexylthiophene) for Thin Film Field-Effect Transistor Applications with High Mobility, Appl. Phys. Lett. 69 (26), p. 4108 (December 1996). A field effect transistor made with a-hexathienylene is described in U.S. Pat. No. 5,659,181, which is incorporated herein by reference.

[0110] A protective layer can optionally be printed onto the electrical devices. The protective layer can be an aluminum film, a metal oxide coating, a polymeric film, or a combination thereof.

[0111] Organic semiconductors can be printed using suitable carbon-based compounds, such as, pentacene, phthalocyanine, benzodithiophene, buckminsterfullerene or other fullerene derivatives, tetracyanonaphthoquinone, and tetrakisimethylanimoethylene. The materials provided above for forming the substrate, the dielectric layer, the electrodes, or the semiconductor layer are exemplary only. Other suitable materials known to those skilled in the art having properties similar to those described above can be used in accordance with the present disclosure.

[0112] The ink-jet print head preferably includes a plurality of orifices for dispensing one or more fluids onto a desired media, such as for example, a conducting fluid solution, a semiconducting fluid solution, an insulating fluid solution, and a precursor material to facilitate subsequent deposition. The precursor material can be surface active agents, such as octadecyltrichlorosilane (OTS).

[0113] Alternatively, a separate print head is used for each fluid solution. The print head nozzles can be held at different potentials to aid in atomization and imparting a charge to the droplets, such as disclosed in U.S. Pat. No. 7,148,128 (Jacobson), which is hereby incorporated by reference. Alternate print heads are disclosed in U.S. Pat. No. 6,626,526 (Ueki et al.), and U.S. Pat. Publication Nos. 2006/0044357 (Andersen et al.) and 2009/0061089 (King et al.), which are hereby incorporated by reference.

[0114] The print head preferably uses a pulse-on-demand method, and can employ one of the following methods to dispense the ink drops: piezoelectric, magnetostrictive, electromechanical, electro pneumatic, electrostatic, rapid ink heating, magneto hydrodynamic, or any other technique well known to those skilled in the art. The deposited ink patterns typically undergo a curing step or another processing step before subsequent layers are applied.

[0115] While ink jet printing is preferred, the term “printing” is intended to include all forms of printing and coating, including: pre-metered coating such as patch die coating, slot or extrusion coating, slide or cascade coating, and curtain coating; roll coating such as knife over roll coating, forward and reverse roll coating; gravure coating; dip coating; spray coating; meniscus coating, spin coating, brush coating, air knife coating; screen printing processes; electrostatic printing processes; thermal printing processes; and other similar techniques.

[0116] FIG. 17 illustrates an alternate high density electrical circuit 320 with compliant material 322 added between circuit geometries 324, 326 to facilitate insertion of circuit geometries 328, 330 into a receptacle or socket. The compliant material 322 can supplement or replace the compliance in the receptacle or socket. In one embodiment, the compliance is provided by a combination of the compliant material 322 and the exposed circuit geometries 328, 330.

[0117] FIG. 18 illustrates the unique nature of the present high density circuit construction, where the various circuits and via locations are surrounded by the deposited dielectric within a single layer, rather than layer by layer differential in dielectric or laminate material as seen with conventional methods. In this example, lower level circuit structures 352, 356 are visible through an optically transparent metalized dielectric. Metalized dielectric 350 and printed dielectric 358 can exist in the same layers. Optically imaged via structures 354 span multiple layers.

[0118] FIG. 19 illustrates a high density circuit 400 with optical waveguides in accordance with an embodiment of the present disclosure. Metalized channels 402, 404 can function as RF waveguides, embedded antennae, embedded microstrip, and the like. The channels 402, 404 can be metalized using the electro-less plating discussed herein. In one embodiment, the channels 402, 404 in the dielectric 406 are filled with optical transmission material. The channels 402, 404 can optionally be sealed or encapsulated by subsequent dielectric layers.

[0119] In another embodiment, the channel 404 includes optional directional mirror 408 to direct the light with low loss in the X and Y planes in ways that are not possible to bend glass fiber. In the illustrated embodiment, the mirror 408 creates an Z-axis optical via 410.

[0120] In yet another embodiment, metal circuits 412, 414 are created at the top and bottom of the channel 402, and/or on the side walls 416 of the channel 402. The channel 402 is preferably filled with the appropriate optical material 418. The combined or hybrid channel 402 can act as an optical waveguide through the optical material, with an RF signal passing through the optical material of a given dielectric constant guided by the Metalized surfaces 412, 414. The photonic source can be external to the high density circuit 400 or embedded within the circuit 400 and activated by the appropriate metal circuitry. FIG. 20 illustrates an embodiment for merging a high density circuit 22 with a low density circuit 20 in accordance with an embodiment of the present disclosure. Assuming the high density circuit is created as a discrete structure separate from the low density circuit 20, various methods can be used to merge the two circuit structures 20, 22. For example, FIG. 20 illustrates various termination points that can be formed on the high density coupon 22 and/or the low density board 20.

[0121] In the left hand side of FIG. 20, copper pillar 430 is plated up to correspond to a through hole 432 in the mating circuit such that the post 430 resides inside the hole 432. The hole 432 is slightly larger than the post 430 for alignment purposes and the two 430, 432 are plated together. The center left version shows a post 434 with a tapered top 436 that is essentially a friction or slight deformation fit to mechanically join with the recess 438. The center right shows a through hole 440 and a corresponding pad or trace 442 that align with the hole 440. The two features 440, 442 are preferably plated together. The right hand shows a stud bump or plated bump 444 that is configured to pierce the circuit layer 446. Each of these types of interfaces can be on the high density coupon 22, or on the low density circuit 20 or a mixture of both locations as well as a mixture of types within the same construction. In practice, the interconnect points are typically buried by the final solder mask and reinforced mechanically, or they may reside directly under the high density coupon 22 in some cases.

[0122] An alternate method is to mimic the traditional build up process, a portion of the final copper layer on the low density base board 20 is designed and structured to act as the first circuit layer 32A for the high density circuit 22 (see FIG. 2A). The high density circuit 22 is then constructed directly on the low density circuit 20 at that location as described herein. Once the high density circuit 22 is processed and terminate in a manner desired to facilitate subsequent component mounting to the high density circuit 22, a final solder mask is applied to fully encapsulate the high density regions 22 and leave desired high density terminals flush with the final solder mask. The resulting hybrid structure 30 appears to resemble a board that was built entirely with the low density process, but actually contains the high density regions deposited and grown in place with underlying circuit structures encapsulated and reinforced with the final solder mask layer.

[0123] Where a range of values is provided, it is understood that each intervening value, to the tenth of the unit of the lower limit unless the context clearly dictates otherwise, between the upper and lower limit of that range and any other stated or intervening value in that stated range is encompassed within the embodiments of the disclosure. The upper and lower limits of these smaller ranges which may independently be included in the smaller ranges is also encompassed within the embodiments of the disclosure, subject to any specifically excluded limit in the stated range. Where the stated range includes one or both of the limits, ranges excluding either both of those included limits are also included in the embodiments of the present disclosure.

[0124] Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the embodiments of the present disclosure belong. Although any methods and materials similar or equivalent to those described herein can also be used in the practice or testing of the embodiments of the present disclosure, the preferred methods and materials are now described. All patents and publications mentioned herein, including those cited in the Background of the application, are hereby incorporated by reference to disclose and described the methods and/or materials in connection with which the publications are cited.

[0125] The publications discussed herein are provided solely for their disclosure prior to the filing date of the present application. Nothing herein is to be construed as an admission that the present disclosure is not entitled to antedate such publication by virtue of prior invention. Further, the dates of publication provided may be different from the actual publication dates which may need to be independently confirmed.

[0126] Other embodiments of the disclosure are possible. Although the description above contains much specificity, these should not be construed as limiting the scope of the disclosure, but as merely providing illustrations of some of the presently preferred embodiments of this disclosure. It is also contemplated that various combinations or sub-combinations of the specific features and aspects of the embodiments may be made and still fall within the scope of the present disclosure. It should be understood that various features and aspects of the disclosed embodiments can be combined with or substituted for one another in order to form varying modes of the disclosed embodiments of the disclosure. Thus, it is intended that the scope of the present disclosure herein disclosed should not be limited by the particular disclosed embodiments described above.

[0127] Thus the scope of this disclosure should be determined by the appended claims and their legal equivalents. Therefore, it will be appreciated that the scope of the present disclosure fully encompasses other embodiments which may become obvious to those skilled in the art, and that the scope of the present disclosure is accordingly to be limited by nothing other than the appended claims, in which reference to an element in the singular is not intended to mean “one and only one” unless explicitly so stated, but rather “one or more.” All structural, chemical, and functional equivalents to the elements of the above-described preferred embodiment(s) that are known to those of ordinary skill in the art are expressly incorporated herein by reference and are intended to be encompassed by the present claims. Moreover, it is not necessary for a device or method to address each and every problem sought to be solved by the present disclosure, for it to be encompassed by the present claims. Furthermore, no element, component, or method step in the present disclosure is intended to be dedicated to the public regardless of whether the element, component, or method step is explicitly recited in the claims.