SENSOR ELEMENT OF AN INDUCTIVE PROXIMITY OR DISTANCE SENSOR AND METHOD FOR OPERATING THE SENSOR ELEMENT

Abstract

A sensor element of an inductive proximity sensor or distance sensor contains a coil arrangement with at least one excitation coil and at least one receiving coil and includes an electrically conductive shielding which contains a shielding cup that surrounds the coil arrangement laterally and on the rear face. A method operates the sensor element. The shielding of the sensor element further contains a flange which is provided on the front face of the sensor element, is connected to the shielding cup in an electrically conductive manner, and completely surrounds the coil arrangement.

Claims

1. Sensor element of an inductive proximity sensor or distance sensor (12) that contains a coil arrangement (26) having at least one excitation coil (T, C) and at least one receiving coil (R+, R−), having an electrically-conductive shielding, which contains a shielding cup (24), which surrounds the coil arrangement (26) laterally and on the rear face, wherein the shielding furthermore contains a flange (22), which is provided on the front face of the sensor element (10), which is connected to the shielding cup (24) in an electrically conductive manner and which completely encloses the coil arrangement (26).

2. Sensor element according to claim 1, wherein the shielding cup (24) is made from one piece.

3. Sensor element according to claim 1, wherein the shielding cup (24) and the flange (22) are made from one piece.

4. Sensor element according to claim 1, wherein the flange (22) is implemented as a metal film.

5. Sensor element according to claim 1, wherein the coil arrangement (26) contains an excitation coil (C) on its rear face that is used as a compensation coil.

6. Sensor element according to claim 1, wherein at least one part of the coil arrangement (26) is arranged on layers (30) of a multi-layer board (28).

7. Sensor element according to claim 6, wherein an electronic unit (32) is arranged on at least one layer (30) of the multi-layer board (28).

8. Sensor element according to claim 6, wherein the back part of the shielding cup (24) is implemented by at least one metallic layer of a multi-layer circuit board.

9. Sensor element according to claim 6, wherein the shielding cup (24) is soldered to the multi-layer board (28).

10. Sensor element according to claim 6, wherein the flange (22) is implemented by at least one metallic layer of the multi-layer board (28).

11. Sensor element according to claim 6, wherein the shielding cup (24) has at least one cantilever extension for fixing the shielding cup (24) on the multi-layer board (28).

12. Sensor element according to claim 1, wherein an ohmic resistor (98, 99) is switched in parallel to the excitation coil (T, C).

13. Sensor element according to claim 1, wherein the excitation coil (T, C) is connected to a voltage-controlled current source (70, 72), which provides the excitation current (iT, iC) of the excitation coil (T, C).

14. Sensor element according to claim 13, wherein, for controlling the voltage-controlled current source (70, 72), a signal shaper (66, 68) is provided for shaping the temporal current course (130) of the excitation current (iT, iC).

15. Sensor or element according to claim 14, wherein the signal shaper (66, 68) contains a bandpass filter which suppresses lower-frequency and higher-frequency signal components.

16. Sensor element according to claim 15, wherein an addition of a direct current voltage (82) on the output signal (78, 80) of the signal shaper (66, 68) is provided.

17. Sensor element according to claim 13, that wherein a microcontroller (58) for providing a digital output signal (60, 62) for controlling the signal shaper (66, 68) is provided.

18. Sensor element according to claim 1, wherein a two-level amplifier (102) is provided for amplifying the measuring voltage (100) provided by the at least one receiving coil (R+, R−).

19. Sensor element according to claim 18, wherein at least the first amplifier level (104) of the two-level amplifier (102) is a transimpedance amplifier that is coupled to a capacitor.

20. Sensor element according to claim 18, wherein a signal attenuator (108) that is able to be digitally switched is provided between the two amplifier levels (104, 106).

21. Sensor element according to claim 20, wherein the microcontroller (58) contains a function block (110) which provides a digital control signal (112) for the signal attenuator (108), which furthermore contains a time delay, the delayed time of which depends on a temporal signal course (142, 144, 146) of the output signal (U) of the amplifier (102), wherein the delayed time is set in such a way that an attenuation of the signal occurring between the two amplifying levels (104, 106) occurs in the region of the signal maximum such that overcontrolling the two amplifier levels (106) is avoided.

22. Sensor element according to claim 1, wherein the sensor element (10) having the coil arrangement (26) and the shielding (22, 24) are arranged in a sensor housing (50), which has a greater width (54) than depth (56), wherein the depth (56) is related to the measuring direction (18).

23. Sensor element according to claim 22, wherein the sensor housing (50) is installed to be flush in a metallic surface.

24. Method for operating a sensor element (10) according to claim 1, wherein a distance (16) of a measuring object (14) from the sensor element (10) is determined or switching the sensor element (10) at a certain distance (16) of the measuring object (14) from the sensor element (10) is predetermined.

25. Method according to claim 24, wherein the temporal course of the excitation current (IT, IC) flowing in at least one energy coil (T, C) is set in such a way that the background signal contained in the measuring voltage (100) or in the output signal (U) of the amplifier (102), said background signal being present without a measuring object (14), is minimized.

26. Method according to claim 24, wherein the current maximum (136) of the excitation current (iT, iC) flowing in at least one excitation coil (T, C) is set in such a way that the background signal contained in the measuring voltage (100) or in the output signal (U) of the amplifier (102), said background signal being present without a measuring object (14), is minimized.

27. Method according to claim 25, wherein the background signal is subtracted from the output signal (U) of the amplifier (102).

28. Method according to claim 25, wherein the temporal current course (130) of the excitation current (iT, iC) and/or the current maximum (136) are set in such a way that the sensitivity of the sensor element (10) to a measuring object (14) made from a certain material is maximized.

29. Method according to claim 25, wherein the excitation current (iT, iC) is set depending on the temperature of the at least one excitation coil (T, C).

30. Method according to claim 25, wherein all the excitation coils (T, C) are supplied with an excitation current (iT, iC) at the same time.

31. Method according to claim 24, wherein, in addition, the magnetic and/or electrical properties of the measuring object (14) are determined by means of evaluating the output signal (U) of the amplifier (102) in terms of the signal maximum (150, 152, 154) and/or the temporal signal course (142, 144, 146; 156, 158, 160).

32. Method according to claim 24, wherein the sensor element (10) is operated independently of the electric and magnetic properties of the material of the measuring object (14).

33. Method according to claim 24, wherein the sensor element (10) is operated depending on the electric and magnetic properties of the material of the measuring object (14).

Description

BRIEF DESCRIPTION OF THE FIGURES

[0052] FIG. 1 shows a partially cut isometric view of a sensor element according to the invention,

[0053] FIG. 2 shows an isometric view of the sensor element having soldering points and soldering connections according to a different embodiment,

[0054] FIG. 3 shows an embodiment of a flange as part of a shielding of the sensor element,

[0055] FIG. 4a shows an isometric view of the housing,

[0056] FIG. 4b shows an exploded drawing of a housing in which the sensor element is installed,

[0057] FIG. 5 shows a wiring of a coil arrangement of the sensor element according to the invention,

[0058] FIG. 6 shows a block wiring diagram of an electronic unit for operating the sensor element,

[0059] FIG. 7 shows two signal courses of an output signal,

[0060] FIG. 8 shows four signal courses of an output signal depending on a measuring object, the proximity of which to the sensor element or the distance of which from the sensor element is to be detected and

[0061] FIG. 9 shows three such signal courses of an output signal depending on the measuring object.

DETAILED DESCRIPTION OF THE EXEMPLARY EMBODIMENTS

[0062] FIG. 1 shows a partially cut isometric view of a sensor element 10 according to the invention. The sensor element 10 is part of an inductive proximity sensor with which the proximity of a measuring object 14 to the sensor element 10 is detected, or part of an inductive distance sensor with which the distance 16 of the measuring object 14 from the sensor element 10 is detected.

[0063] The measuring object 14 is located, in terms of the measuring direction 18, on the front face of the sensor element 10, wherein the proximity of the measuring object 14 or the distance 16 of the measuring object 14 from the sensor element 10 in relation to a sensor surface 20 is considered, which should be formed on the front face of the sensor element 10, preferably to be flush with a flange 22 of the sensor element 10.

[0064] The flange 22 is part of a shielding which further contains a shielding cup 24 that surrounds a coil arrangement 26 laterally and on the rear face of the coil arrangement 26, in relation to the measuring direction 18. The shielding containing the flange 22 and the shielding cup 24 is made from an electrically conductive material.

[0065] The shielding cup 24 is made of brass, for example, or a different material that is a good conductor of electricity. The material thickness can be in the region of 1 millimetre, for example. The material is preferably non-ferromagnetic, however can also be ferromagnetic. The shielding cup 24 shields, in particular, high-frequency signal components on the rear face of the sensor element 10. Thus, at least the higher-frequency signal components do not reach metal parts, if applicable arranged on the rear face of the sensor element 10, such as mounting parts. Furthermore, the shielding cup 24 prevents electromagnetic excitations laterally surrounding the coil arrangement 26. Thus, a flush installation of the sensor element 10 according to the invention in a surface, which can be metallically conductive, becomes possible.

[0066] The flange 22 completing the shielding, which completely encloses the coil arrangement 26, enables the formation of eddy currents. The flange 22 should extend as far as possible up to the borders of a sensor housing shown below. The flange 22 causes an electromagnetic separation of the two half spaces on the front face and on the rear face of the flange 22, in relation to the measuring object 14. The electromagnetic field of excitation coils T, C that would extend up to the rear face of the shielding cup 24, are effectively suppressed by the flange 22 because of the formation of eddy currents in the flange 22. Sensitivity of the sensor element 10 to the metallic objects that are present on the rear face of the sensor element 10 and would act as the measuring object are thus effectively suppressed.

[0067] The shielding cup 24 is preferably implemented in one piece, wherein the shielding cup 24 can be produced for example by deep-drawing of a circular metal part. The shielding cup 24 is connected to the flange 22 in an electrically conductive manner. Preferably, it is therefore provided that the shielding cup 24 and the flange 22 are also formed as one piece. The flange 22 can be implemented as a metal film, for example, which is electrically contacted by the shielding cup 24 at least on some connection points that are not shown in more detail.

[0068] In the shown exemplary embodiment, it can be assumed that the coil arrangement 26 is implemented by means of a multi-layer board 28, wherein, in the exemplary embodiment, four layers of the multi-layer board 28 can be assumed.

[0069] The multi-layer board 28 is a one-piece component. In the exemplary embodiment shown in FIG. 1, the four layers of the multi-layer board 28, are, however, shown with a distance to one another that, in practice, is treated as an optimisation parameter and is secured in a circuit-board technical manner.

[0070] On the front face of the coil arrangement 26, a first receiving coil R+ is provided, followed by the first excitation coil T, further followed by a second receiving coil R− and followed by a second excitation coil C on the rear face of the coil arrangement 26. The second excitation coil C is labelled as compensation coil C in the following. In the shown exemplary embodiment, the coils R+, T, R−, C are respectively arranged on one layer of the multi-layer board 28. An eight-layer multi-layer board 28 is provided expediently, wherein the coils R+, T, R−, C are formed to be distributed each on two adjacent layers. Purely in principle, it is also possible that two or more coils R+, T, R−, C are arranged on one single layer of the multilayer board 28.

[0071] FIG. 2 also shows an isometric back view of the sensor element 10 according to the invention. The parts that correspond to the parts shown in FIG. 1 are, in each case, provided with the same reference numeral. This agreement also applies for the following figures.

[0072] FIG. 2 shows an embodiment of the sensor element 10 according to the invention in which, on the rear face of the multi-layer board 28, soldering surfaces 30 are provided on which the shielding cup 24 is soldered by means of soldering connections 34. At the same time, the flange 22 is formed by means of the multi-layer board 28.

[0073] Additionally or alternatively, one or more cantilever extensions of the shielding cup 24 that are not shown in more detail in FIG. 2 are provided which can penetrate into corresponding recesses of the multi-layer board 28, whereby both the mechanical strength and the correct positioning of the shielding cup 24 in terms of the coil arrangement 26 can be ensured.

[0074] According to one embodiment, an electronic unit 32 can be provided on one or more layers, in the shown exemplary embodiment on the back-most side of the multi-layer board 28, said electronic unit 32 being electrically connected to the coils R+, T, R−, C, wherein a shortest possible cable run emerges. In the shown exemplary embodiment, however, such connections of the coils R+, T, R−, C to the electronic unit 32 are not shown. In FIG. 1, connection points of the coils R+, T, R−, C of the coil arrangement 26 that are not shown in more detail are inserted for generalisation.

[0075] FIG. 3 shows an embodiment of the flange 22 in which the flange 22 is formed as a conductive metal film which is fixed on the front face of the multi-layer board 28 or in the inside of a front housing part, for example by adhesion.

[0076] Advantageously, the whole flange 22—as shown in FIG. 2—is formed from the layers of the multi-layer board 28. Purely in principle, layers of the multi-layer board 28 can also still be in the shielding cup 24. The flange 22 has a circular opening 40 in the region of the coil arrangement 26.

[0077] In FIG. 3, an embodiment of the flange 22 is shown, on the corners of which at least one recess 46 and/or at least one cant 48 are provided. The recess 46 or the cant 48 enables a simple mounting of the sensor element 10 in a housing.

[0078] FIG. 4a shows an isometric view of the assembled housing 50. The housing 50 contains a back housing part 54 and a front housing part 56, The sensor element 10 or the housing 50 can have a comparatively large width 42 in comparison to the depth 44, because of the shielding 22, 24, wherein the depth 44 relates to the measuring direction 18. Thus, a large proximity region of the measuring object 14 on the sensor element 10 or a large distance 16 of the measuring object 10 from the sensor element 10 becomes possible, in which switching of the sensor element 10 occurs.

[0079] The housing 50 has a width 42, for example, of 40 millimetres and can be formed quadratically. In doing so, the depth 44, for example, can be 10 millimetres. With these dimensions, the proximity region of the measuring object 14 to the sensor element 10 or the distance 16 at which the sensor element 10 switches in the presence of the measuring object 14 can be in the region of a few tens of millimetres, for example 20 millimetres.

[0080] FIG. 4b shows an exploded drawing of such a housing 50 in which the sensor element 10 is installed. The housing 50 having the sensor element 10 forms an inductive proximity sensor 52 with which the proximity of the measuring object 14 to the sensor element 10 is detected, or forms an inductive distance sensor 52 with which the distance 16 of the measuring object 14 from the sensor element 10 is detected in each case.

[0081] In both housing parts 54, 56, formations 58 corresponding to the recesses 46 are provided. In particular, in the front housing part 56, a formation 59 corresponding to the cant 48 is provided.

[0082] The cant 48 prevents an incorrect positioning of the sensor element 10 in the housing 50. The cant 48 and the recesses 46 of the flange 22 enable the sensor element 10 to be reliably fixed in the housing 50.

[0083] In the exemplary embodiment shown in FIG. 4b, the multi-layer board 28 contains notches 55 in which, in the mounted state of the sensor element 10, corresponding cantilever extensions 57 of the shielding cup 24 engage.

[0084] Required connection cables and/or plug sets of the inductive proximity sensor 52 are not depicted in the figures for reasons of simplicity.

[0085] FIG. 5 shows a schematic sectional view through the coils R+, T, R−, C and the wiring thereof. The coils R+, T, R−, C can be arranged on different layers of the multi-layer board 28 that is not shown in more detail. It should be implied by the squares shown in the sectional view that the coils R+, T, R−, C can have a plurality of windings. It can be assumed in the shown exemplary embodiment that the two receiving coils R+, R− are inversely switched in terms of the measuring direction 18 and are switched in series. The inverse switching can also be expressed by the labelling with R+, R−. As previously mentioned, the coils R+, T, R−, C are preferably arranged to be distributed on two adjacent layers of an eight-layered multi-layer board 28.

[0086] FIG. 6 shows a block wire diagram of the electronic unit 32 for operating the sensor element 10. A microcontroller 58 provides a first and second rectangular output signal 60, 62 from which excitation currents iT, iC of the excitation coils T, C are obtained.

[0087] The two rectangular output signals 60, 62 are allocated to a first or a second signal shaper 66, 68 which are implemented in each case as bandpass filters, for example. The signal shapers 66, 68 form continuously running excitation currents iT, iC from the rectangular outputs signals 60, 62, said excitation currents iT, iC having a predetermined temporal current course in each case. The signal shapers 66, 68 are implemented as passive bandpass filters, for example. The bandpass filters initially suppress higher-frequency signal components of the original rectangular output signals 60, 62. By doing so, a saturation of successive electronic components is prevented that could arise because of the steep-edge signals. Furthermore, the bandpass filters suppress lower-frequency signal components of the original rectangular output signals 60, 62, in particular the DC part thereof that does not generate any measuring information because of the corresponding constant current amount of the excitation currents iT, iC, but provides an undesired contribution to the energy consumption of the total system. The corner frequencies of the bandpass filters can be, for example, between ten and a few hundred kilohertz.

[0088] The excitation currents iT, iC are provided by voltage-controlled current sources 70, 72. A saturation of the voltage-controlled current sources 70, 72 can occur not only because of a too steep-edged controlling, but also because of an intermittent operation in which the excitation currents iT, iC would fall to zero. This could occur if the controlling signals 74, 76 of the voltage-controlled current sources 70, 72 either fall to zero or if the voltage-controlled current sources 70, 72 have an input-voltage offset. Therefore, a direct current voltage 82 is preferably added to the output signals 78, 80 of the signal shapers 66, 68 in each case, so that the excitation currents iT, iC cannot fall to zero at any time during the course of the excitation and data detection. In addition, adders 84, 86 are provided which add the direct current voltage 82 provided by a direct current voltage source 88 respectively to the output signals 78, 80 of the signal shapers 66, 68. The adders 84, 86 provide the control signals 74, 76 of the voltage-controlled current sources 70, 72.

[0089] According to an advantageous embodiment, it is provided that the excitation currents iT, iC can be set depending on the temperature of the coil arrangement 26. To do so, the output signal 92 of a temperature determination 94 is allocated to the microcontroller 58 which increases or decreases the maxima of the excitation currents iT, iC by changing the amplitude at least of one rectangular output signal 60 or 62, depending on the temperature of the coil arrangement 26. The temperature determination 94 of the coil arrangement 26 can take place, for example, by means of an internal resistance measurement at least of one coil R+, T, R−, C. Where necessary, a temperature sensor that is not shown in more detail can be provided.

[0090] The excitation currents iT, iC flow through the first excitation coil T or through the wide second excitation coil C that acts as a compensation coil to a switching ground 96.

[0091] According to one embodiment, parallel resistors 98, 99 are provided that are switched in parallel to the excitation coils T, C. Such a parallel resistor 98, 99 ensures a stabile functioning of the voltage-controlled current source 70, 72 because of the present ohmic components in the load circuit, in addition to the inductance of the excitation coils T, C. The excitation currents iT, iC are provided, for example, by a field-effect transistor or bipolar transistor contained in each case in the voltage-controlled current sources 70, 72, said transistors being controlled by an operation amplifier. The inductances of the excitation coils T, C lie, for example, in the region of 12 microhenry and, at room temperature, have an ohmic resistance of 18 Ohm, for example. The parallel resistors 98, 99 are set to a value between 100-470 Ohm, for example.

[0092] It is assumed in the shown exemplary embodiment that the receiving coils R+, R− are switched in series inversely to each other. The measuring voltage 100 induced in the receiving coils R+, R− is allocated to an amplifier 102 that is preferably implemented on two levels. The first amplifier level 104 of the amplifier 102 is preferably implemented as a condenser-coupled transimpedance amplifier. A digitally switchable signal attenuator 108 is preferably provided between the first amplifier level 104 and the second amplifier level 106, said signal attenuator 108 enabling a signal adjustment to the second amplifier level 106.

[0093] The microcontroller 58 contains a function block 110 which provides a digital control signal 112 for the signal attenuator 108. The digital control signal 112 is set by the function block 110 depending on the output signal U of the amplifier 102, and indeed in such a way that overcontrolling the second amplifier level 106 of the amplifier 102 is avoided. Setting the digital control signal 112 expediently takes place adaptively. The digital control signal 112 preferably does not attenuate the whole signal equally. Advantageously, a time delay in terms of the start of an excitation current pulse iT, iC is provided, which ensures that the attenuation is only effective in the region of the signal maximum of the signal occurring between the two amplifier levels 104, 106 of the amplifier 102. Thus, on the one hand, a high total amplification of the measuring voltage 100 is ensured, however overcontrolling the second amplifier level 106 is avoided.

[0094] FIG. 7 shows a possible output signal U of the amplifier 102 depending on the time t. The first temporal signal course 120 that is depicted by the solid line, corresponds to a temporal signal course that would occur without the second excitation coil C that acts as a compensation coil. The second temporal signal course 122, which is depicted by the interrupted line, is obtained by the second excitation coil C that acts as a compensator coil, said excitation coil C being operated by an excitation current iC, the temporal course of which and the amplitude of which are able to deviate from the temporal course or the maximum of the excitation current iT of the first excitation coil T. The second temporal signal course 122 corresponds to the minimally obtainable background signal without a measuring object 14, for example. The output signal U is depicted with relative units, wherein the numerical data, however, can correspond to volt data.

[0095] For further compensation, the second temporal signal course 122 that is shown in FIG. 7 and corresponds to the background signal can be subtracted from the output signal U. Furthermore, a temperature-dependent background signal can be subtracted from the output signal U for the temperature compensation. The temperature-dependent background signal can be determined experimentally or be calculated by the microcontroller 58 from stored temperature coefficients depending on the temperature.

[0096] FIG. 8 shows four temporal signal courses 140-146 depending on the time t that occur with different measuring objects 14 at the same distance 16. The solid line corresponds to a first temporal signal course 140 that occurs with a measuring object 14 that is not present. The first signal course 140 thus corresponds to the background signal that is preferably subtracted from the output signal U in the microcontroller 58. The second temporal signal course 142 corresponds, for example, to a measuring object 14 made of steel, the third temporal signal course 144 corresponds, for example, to a measuring object 14, made of aluminium and the fourth temporal signal course 146 corresponds, for example, to a high-grade steel measuring object 14. The output signal U obtained from the measuring voltage 100 is depicted in relative units, wherein the numerical data, however, can be volt data, for example.

[0097] In FIG. 9, courses 156, 158, 160 corresponding to the second, third and fourth signal course 142-146 are depicted, wherein the courses 156, 158, 160 are calculated in each case by subtracting the background signal 140 from the signal courses 142, 144, 146, and wherein the first signal maxima 150, 152, 154 of the signal courses 156, 158, 160 and the points in time t1, t2, t3 are recorded, when the first signal maxima 150, 152, 154 occur. Furthermore, signal minima of the signal courses 156, 158, 160 occur at times that are determined, but not recorded in more detail.

[0098] According to an advantageous embodiment it is provided that measuring objects 14 made of different material are measured at a predetermined distance 16 and the emerging temporal signal courses 142, 144, 146 or 156, 158, 160 are recorded in a storage of the microcontroller 58 that is not shown in more detail for later comparison to the output signal U of the amplifier 102.

[0099] From FIGS. 8 and 9 it is immediately obvious that the sensor element 10 can be operated by recorded reference signal courses in such a way that identifying the material of the measuring object 14 is possible. Thus, different measuring objects 14 can be distinguished from one another. Identifying the material of the measuring object 14 is possibly, simply by means of determining the different points in time t1, t2, t3 at which the first signal maxima 150, 152, 154 of the temporal signal courses 156, 158, 160 occur. Alternatively or additionally, detecting and comparing the signal maxima 150, 152, 154 can take place. Further alternatively or additionally, the signal minima not recorded in more detail in FIG. 9 that also occur at times to be determined, can also be detected and used for the comparison.

[0100] In particular, the sensor element 10 according to the invention can also be operated independently of the material of the measuring object 14, whereby a so-called factor-1 operation of the inductive distance sensor or inductive proximity sensor is possible. In this case, a comparison of the temporal signal courses 142, 144, 146 or 156, 158, 160 to the reference signal courses recorded in a storage is made, wherein, however, in this case, distinctions are not made according to the material of the measuring object 14, but the proximity of the measuring object 14 to the sensor element 10 is detected or a certain distance 16 of the measuring object 14 from the sensor element 10 is recognised independent of the material of the measuring object 14, with which the sensor element 10 switches.