METHOD FOR SHORTENING THE PROCESS TIME DURING THE SOLDERING OF ELECTRIC OR ELECTRONIC COMPONENTS BY MEANS OF ELECTROMAGNETIC INDUCTION HEATING

Abstract

A method for reducing a process time for soldering electrical or electronic components by electromagnetic induction heating, in particular soldering electrical contact elements with solder connection surfaces which are applied to a non-metallic substrate, in particular a glass pane, the method comprising the steps providing an electrical contact element configured as a solder base and made from an iron nickel or iron chromium alloy material; applying a lead free connection material to the soldering base, wherein the connection material or the solder is made from a lead free material, in particular Bi.sub.57Sn.sub.42Ag.sub.1, Bi.sub.57Sn.sub.40Ag.sub.3, SAg.sub.3.8Cu.sub.0.7 or Sn.sub.55Bi.sub.44Ag.sub.1; positioning the soldering base on the respective solder contact surface; inductive heating of the solder base by high frequency energy with increased heating of the solder base material and reduced heating of the material of the respective solder connection surface; and completing the soldering step after a time period of less than or equal to 10 seconds, advantageously 4 to 6 seconds. The invention also relates to a contact element configured as a particular soldering base.

Claims

1. A method for reducing a process time for soldering electrical or electronic components by electromagnetic induction heating, in particular soldering electrical contact elements with solder connection surfaces which are applied to a non-metallic substrate, in particular a glass pane, the method comprising the steps: providing an electrical contact element configured as a solder base and made from an iron nickel or iron chromium alloy material; applying a lead free connection material to the soldering base, wherein the connection material or the solder is made from a lead free material, in particular Bi.sub.57Sn.sub.42Ag.sub.1, Bi.sub.57Sn.sub.40Ag.sub.3, SnAg.sub.3.8Cu.sub.0.7 or Sn.sub.55Bi.sub.44Ag.sub.1; positioning the soldering base on the respective solder contact surface; inductive heating of the solder base by high frequency energy with increased heating of the solder base material and reduced heating of the material of the respective solder connection surface; and completing the soldering step after a time period of less than or equal to 10 seconds, advantageously 4 to 6 seconds.

2. The method according to claim 1, characterized in that the high frequency energy is in a range of 700-1500 kHz, in particular at essentially 900 kHz.

3. The method according to claim 1, characterized in that a solder base is being used which is made from at least two non-engaging circular surfaces, circular rings, circular ring segments or circular surface segments, wherein the soldering base advantageously has protrusions forming a defined soldering gap wherein the protrusions are advantageously arranged outside of the connection surface portion.

4. An electrical connection element for contacting a conductive structure that is arranged on a flat carrier wherein the contacting is provided by a thermally bonded connection material, wherein devices for fixating a conductor are arranged on a side of the connection element that is oriented away from the conductive structure, wherein the connection element is provided as a soldering base which is approximately shaped like a figure eight, characterized in that the soldering base is made from two non-engaging circular surfaces, circular rings, circular ring segments or circular surface segments (1; 2) which are offset from each other by a connection surface element (3).

5. The electrical connection element according to claim 4, characterized in that the soldering base advantageously includes protrusions (4) outside of the connection surface portion (3) for forming a defined soldering gap.

6. The electrical connection element according to claim 4, characterized in that the device for fixating the conductor is arranged in or on the connection surface element (3).

7. The electrical connection element according to claim 4, characterized in that the thermally bonded connection material is applied on one side of the connection element and covers a surface thereon which is smaller than the circular surface or circular ring surface (1; 2).

8. The electrical connection element according to claim 7, characterized in that the connection material is configured as a soldering tin bead which is at least partially arranged in a recess (5) or bore hole in the portion of the respective circular surface or circular ring surface (1; 2).

9. The electrical connection element according to claim 4, characterized in that the connection element is made of an iron nickel or iron chromium alloy or from a mix thereof.

Description

[0046] Between the circular segments 1; 2 there is a connection surface element 3. Accordingly in top view according to FIG. 2 the soldering base is shaped like an elongated “eight” with two non-engaging circular surface segments 1; 2 and the connection surface portion 3.

[0047] Advantageously a conductor or a strand end sleeve (not illustrated) is attached in the portion of the connection surface portion 3 e.g. by welding or soldering.

[0048] In the portion of the circular surface segments 1; 2 protrusions 4 are formed at a bottom side of the soldering base wherein the protrusions are beads that are pressed through.

[0049] The protrusions 4 contact the surface of the structure during the soldering process and form a defined soldering gap with an exemplary height of 0.3 mm.

[0050] The solder is bondable in the sleeve shaped bore holes 5 so that a respective prefabrication of the soldering base including the solder can be performed in a simple manner.

[0051] In order to prevent detrimental electromagnetic scatter fields or a field concentration at least one of the surface sides of the solder base is provided with a circumferential radius 6 of e.g. 0.2 mm.

[0052] The dimensions illustrated in FIGS. 1 and 2 are purely exemplary and to not limit the teachings of the invention.

[0053] The connection surface portion 3 can have an elbow 7 with a radius R of 0.8 mm for example.

[0054] The taper 8 is defined so that a width of the connection surface element 3 is less than a diameter of the respective circular surface segment 1; 2. In the illustrated embodiment a width of the connection surface element 3 is 4 mm, however a diameter of the circular surface segments 1; 2 is 6 mm.