LIGHTING MODULE COMPRISING AT LEAST ONE COMPONENT AND A CONNECTOR WHICH ARE DISPOSED ON A HEAT DISSIPATER, AND LIGHTING DEVICE FOR AUTOMOTIVE VEHICLE COMPRISING SUCH A MODULE

Abstract

A module comprising an electronic component and an electrical connector that are interconnected by a printed circuit board that is fastened to a heat sink, the connector includes a housing, connection contacts and a bundle of wires, which are secured to the housing and respectively interconnected electrically. The housing is arranged on one side of the board such that the contacts pass through the board so as to emerge onto the other side and to be connected electrically there. The board is fastened to the heat sink by the side thereof bearing the contacts. The surface of the heat sink receives the board having a boss at least level with the contacts, so as to avoid electrical contact between the contacts and the heat sink.

Claims

1. A lighting module comprising at least one electronic component and an electrical connector, the component and the connector being interconnected by an electrical interconnection device, the interconnection device being fastened to a heat sink, wherein the connector comprises electrical connection contacts, the connector is arranged on one side of the interconnection device such that the contacts pass through the interconnection device so as to emerge onto another of its sides, where they are connected electrically to the interconnection device, the interconnection device is fastened to the heat sink via the side onto which the contacts emerge, and the surface of the heat sink receiving the interconnection device has a cavity at least level with the contacts, so as to avoid electrical contact between the contacts and the heat sink.

2. The module according to claim 1, wherein the electronic component is arranged on the heat sink and is connected electrically to the interconnection device.

3. The module according to claim 1, wherein the electronic component is arranged on the interconnection device and connected electrically thereto.

4. The module according to claim 1, wherein the interconnection device makes thermal contact with the heat sink.

5. The module according to claim 1, wherein the cavity has a depth making it possible to leave a space between the contacts and the heat sink large enough to prevent electrical arcing between the contacts and the heat sink.

6. The module according to claim 1, wherein the electronic component comprises at least one semiconductor emitter chip.

7. The module according to claim 1, wherein the heat sink is substantially L-shaped.

8. The module according to claim 7, wherein the interconnection device is fastened to the heat sink via one of the arms of the L formed by the heat sink.

9. The module according to claim 1, wherein the cavity of the heat sink is formed by embossing.

10. The module according to claim 1, wherein the cavity of the heat sink comprises holes for draining any accumulation of water.

11. The module according to claim 1, wherein the electrical connection between the contacts and the interconnection device is obtained by wave soldering or a pushed-in-type contact.

12. A lighting device, in particular a lighting and/or signaling device for a motor vehicle, wherein the device comprises a carrier and a module according to claim 1, the latter being fastened to the carrier of said lighting device.

13. The lighting device according to claim 12, wherein the module is fastened to the carrier via the heat sink.

14. The lighting device according to claim 12, wherein the heat sink is fastened to the carrier via one of the arms of the L formed by the heat sink.

15. The lighting device according to claim 12, wherein the carrier is a reflector of said lighting device.

16. The module according to claim 3, wherein the interconnection device makes thermal contact with the heat sink.

17. The module according to claim 4, wherein the cavity has a depth making it possible to leave a space between the contacts and the heat sink large enough to prevent electrical arcing between the contacts and the heat sink.

18. The module according to claim 5, wherein the electronic component comprises at least one semiconductor emitter chip.

19. The module according to claim 6, wherein the heat sink is substantially L-shaped.

20. The module according to claim 8, wherein the cavity of the heat sink is formed by embossing.

Description

BRIEF DESCRIPTION OF THE FIGURES

[0030] Other features and advantages of the invention will emerge from the following detailed description, given by way of indication and illustrated by the appended drawings, in which:

[0031] FIG. 1 shows a cross-sectional perspective view of one embodiment of the module according to the invention;

[0032] FIG. 2 shows a cross-sectional view of the module of FIG. 1;

[0033] FIG. 3 shows a perspective view showing what is called the ventral side of the preceding module;

[0034] FIG. 4 shows a perspective view showing what is called the dorsal side of the previous module;

[0035] FIG. 5 shows a perspective view of the preceding module after it has been mounted on a carrier part of a lighting device, in particular a lighting and/or signaling device for a motor vehicle.

DETAILED DESCRIPTION OF THE FIGURES

[0036] In the remainder of the description, elements having an identical structure or analogous functions are referenced using the same reference.

[0037] FIG. 1 shows the module according to the invention seen both in perspective and in cross section, FIG. 2 shows the same module seen only in cross section, and FIG. 3 shows the same module seen in perspective.

[0038] The device comprises an electrical interconnection element 1, for example of the printed circuit board or PCB type, fastened and/or interconnected to which are electronic components 2. These components comprise, for example, one or more semiconductor emitter chips, preferably light-emitting diodes in the case of an application to a lighting device, in particular a lighting and/or signaling device for a motor vehicle.

[0039] The printed circuit board 1 bears at least one connector 3, which is arranged on one side 11 of the board and intended to ensure the electrical connection between the board and a bundle of electrical wires 4, establishing the electrical connection with the rest of the vehicle.

[0040] In the embodiment shown, the connector 3 comprises a single housing 31, fastened to which are electrical contact-making means, such as connection contacts or pins 32, which protrude from the housing, and connecting wires 4. The wires 4 and the contacts 32 are fastened to the inside of the housing 31 and respectively interconnected electrically, that is to say one contact in principle to one single connecting wire.

[0041] The contacts 32 pass through the board 1 in order to be connected electrically to the circuits borne by the board on the other side 12 of the board, opposite the side 11 and termed the protrusion side. This connection to the board may be established for example by a wave soldering process, which will also ensure that the connector is held in position. The wave soldering is preferably selective, that is to say it concerns only a chosen area. The connection may also be established using a pushed-in-type contact.

[0042] The board 1 is fastened to a heat sink 5, intended to dissipate the heat produced by the electronic components 2. The board 1 preferably makes thermal contact with the heat sink 5. The heat sink 5 is made from a material that is a good thermal conductor, preferably inexpensive, not excessively heavy and easy to manufacture, such as a metal, preferably aluminum.

[0043] In the embodiment shown in the figures, at least one component 2 is fastened to the heat sink 5 itself, for example by adhesive bonding, the component being connected electrically to the board 1 by jumping, using electrical connecting wires, for example of metal (not shown). This embodiment makes it possible to optimize the cooling of the component 2. In one variant, the components 2 may be borne by the board 1 and for example be soldered.

[0044] With continuing reference to the example shown in the figures, the heat sink 5 has a substantially-shaped ‘L’ general shape, the board 1 being arranged on one of the arms 54 of the L, on what is called a ventral side, that is to say the side oriented toward the inside of the L. The other arm of the L is referenced 55. The heat sink is provided with fins 51 arranged at least on the arm 55 of the L and which, in the variant shown, on each arm of the L, facilitate heat dissipation. Said heat sink is also provided with various apertures or bosses, indiscriminately referenced 52, which are intended for fastening the board 1 to the heat sink and for the subsequent fastening of the heat sink 5, and/or intended to allow air to circulate.

[0045] According to the invention, the heat sink 5 also comprises a cavity 53, preferably a boss, which extends at least plumb with the contacts 32 of the connector 3 toward the dorsal or outer side of the L formed by the heat sink, so as to create a space between the contacts and the heat sink in order to house them, while avoiding any electrical contact between the contacts and the heat sink. Preferably, the boss 53 has a depth such that it leaves a space between the contacts and the heat sink large enough to prevent any risk of electrical arcing between these elements; a space of approximately one millimeter is suitable in motor vehicle lighting applications.

[0046] In this way, it is possible to use a single connector 3 provided with contacts that pass through the electronic board and are connected thereto by a process such as wave soldering, involving a temperature increase that remains moderate and allows the use of less expensive components and materials; this single connector is easy to use, reliable and does not require any subsequent step of testing the connection, as is the case for two-part connectors.

[0047] Such a configuration according to the invention also makes it possible to avoid the use of any adhesive between the heat sink 5 and the board 1, which adhesive would also be electrically insulating.

[0048] It will be noted that the electrical interconnection tracks borne by the board 1 will have to be arranged either on the side 11 thereof or on the side 12 thereof, plumb with the boss 53.

[0049] FIG. 4 shows another perspective view of the preceding module, in which view the dorsal sides of the heat sink 5, that is to say the sides thereof turned toward the outside of the L, may be seen.

[0050] In this figure, the L-shaped heat sink 5 may be seen. The various bosses and fastening apertures 52 have been shown on the dorsal side of the arm 54 of the L, as has the boss 53 located opposite the connection contacts of the connector 3 (not visible in this figure) and the bundle of connecting wires 4.

[0051] The arm 55 of the L has also been shown, for example provided with two connecting apertures 52 and two fins 51.

[0052] FIG. 5 is a perspective view of the device according to the invention after it has been mounted on a carrier part of a lighting device, for example the reflector of a motor vehicle headlamp.

[0053] In this figure, the heat sink 5 is shown in a view analogous to that in FIG. 4, mounted on a reflector 6 in partial view.

[0054] The upper part of the reflector 6 comprises, for example, two slide rails 61 and 62, into which the upper part of the arms 55 of the heat sink 5 which bears the light sources (not visible in the figure) is inserted, such that said light sources illuminate the inside of the reflector. A number of the bosses 52 enable the arm 55 of the heat sink 5 to be fastened to the slide rails 61, 62 of the reflector 6.

[0055] The heat sink may also be secured to the reflector 6 by way of its arm 54, the apertures 52 of which receive, for example, screwing means (threaded screws or rods, for example).

[0056] With mounting of this kind, the heat sink 5 and the elements borne thereby are fastened durably and reliably to the reflector 6, without the presence of the connector 3 or of the boss 53 impairing or preventing the fastening or significantly increasing the bulk of the assembly. The boss 53 furthermore constitutes mechanical protection for the contacts of the connector 3.

[0057] In one variant embodiment, depending on the final orientation of the headlamp into which the device according to the invention is inserted, it is possible to produce holes in the boss 53 in order to drain any accumulation of water if the boss is oriented downward. Nevertheless, these holes must remain small in order not to limit the thermal dissipation provided by the heat sink 5.

[0058] In another variant embodiment, the bundle of wires 4 may be replaced by a flexible printed circuit board, commonly referred to as a ‘flex’, on which the wires are replaced by printed conductive tracks.