THERMAL MANAGEMENT OF PRINTED CIRCUIT BOARD COMPONENTS

Abstract

A first thermal management approach involves an air flow through cooling mechanism with multiple airflow channels for dissipating heat generated in a PCA. The air flow direction through at least one of the channels is different from the air flow direction through at least another of the channels. Alternatively or additionally, the airflow inlet of at least one channel is off-axis with respect to the airflow outlet. A second thermal management approach involves the fabrication of a PCB with enhanced durability by mitigating via cracking or PTH fatigue. At least one PCB layer is composed of a base material formed from a 3D woven fiberglass fabric, and conductive material deposited onto the base material surface. A conductive PTH extends through the base material of multiple PCB layers, where the CTE of the base material along the z-axis direction substantially matches the CTE of the conductive material along the x-axis direction.

Claims

1-10. (canceled)

11. A printed circuit board (PCB) with enhanced durability, said PCB comprising a plurality of PCB layers, wherein at least one of said PCB layers comprises: a base material formed from a three-dimensional (3D) woven fiberglass fabric impregnated with a resin, said 3D woven fiberglass fabric comprising: a first group of fibers arranged in a plurality of parallel layers, where each layer comprises a plurality of fibers extending along at least a first (x-axis) direction and aligned in a first (x-y) plane, and where said parallel layers are arranged along a second (z-axis) direction that is orthogonal to said first (x-y) plane; and a second group of fibers extending along at least said second (z-axis) direction, said second group of fibers being interlaced with said first group of fibers; a layer of conductive material deposited onto a surface of said base material; and at least one conductive plated through hole (PTH) extending through said base material of a plurality of said PCB layers, wherein the coefficient of thermal expansion (CTE) of said base material along said second (z-axis) direction substantially matches the CTE of said conductive material along said first (x-axis) direction.

12. The PCB of claim 11, wherein said second group of fibers are interlaced with said first group of fibers in a non-orthogonal weaving pattern.

13. The PCB of claim 12, wherein said non-orthogonal weaving pattern is selected from the list consisting of: an angle interlock weaving pattern; and a multilayer weaving pattern.

14. The PCB of claim 11, wherein said second group of fibers extend along a direction that is at a non-perpendicular angle with respect to said second (z-axis) direction.

15. The PCB of claim 11, wherein the geometry of at least one of: said first group of fibers; and said second group of fibers, is selected from the list consisting of: a solid geometry; a hollow geometry; a shell geometry; and a nodal geometry.

16. The PCB of claim 11, wherein said 3D woven fiberglass fabric is selected from the list consisting of: E-glass fibers; and FR-4 fiberglass.

17. The PCB of claim 11, wherein said PTH is copper-plated.

18. A method for fabricating a PCB with enhanced durability, the method comprising the procedures of: forming a base material for at least one PCB layer from a three-dimensional (3D) woven fiberglass fabric, said 3D woven fiberglass fabric comprising: a first group of fibers arranged in a plurality of parallel layers, where each layer comprises a plurality of fibers extending along a first (x-axis) direction and aligned in a first (x-y) plane, and where said parallel layers extend along a second (z-axis) direction that is orthogonal to said first (x-y) plane; and a second group of fibers extending along at least said second (z-axis) direction, said second group of fibers being interlaced with said first group of fibers; impregnated said base material with a resin; depositing a layer of conductive material onto a surface of said base material; and forming at least one conductive plated through hole (PTH) extending through said base material of a plurality of layers of said PCB, wherein the coefficient of thermal expansion (CTE) of said base material along said second (z-axis) direction substantially matches the CTE of said conductive material along said first (x-axis) direction.

19. The method of claim 18, wherein said second group of fibers are interlaced with said first group of fibers in a non-orthogonal weaving pattern.

20. The method of claim 19, wherein said non-orthogonal weaving pattern is selected from the list consisting of: an angle interlock weaving pattern; and a multilayer weaving pattern.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present invention will be understood and appreciated more fully from the following detailed description taken in conjunction with the drawings in which:

[0019] FIG. 1 is a cross-sectional schematic illustration of a plated-through hole via with via cracks, as known in the art;

[0020] FIG. 2 is a perspective view illustration of a PCA that includes an air flow through (AFT) cooling mechanism with multiple air flow channels, constructed and operative in accordance with an embodiment of the present invention;

[0021] FIG. 3 is a perspective view illustration of a PCA that includes an air flow through cooling mechanism with multiple channels having perpendicular inlets and outlets, constructed and operative in accordance with another embodiment of the present invention;

[0022] FIG. 4 is a schematic illustration of a PCB manufacturing process with a 3D woven fabric for the non-conductive substrate material, operative in accordance with an embodiment of the present invention;

[0023] FIG. 5A is a perspective view illustration of an exemplary configuration of a segment of 3D woven fabric with an orthogonal weaving pattern, constructed and operative in accordance with an embodiment of the present invention;

[0024] FIG. 5B is a cross-sectional illustration of a 3D woven fabric with an angle-interlock weaving pattern, constructed and operative in accordance with another embodiment of the present invention;

[0025] FIG. 5C is a perspective view illustration of a 3D woven fabric with a multilayer weaving pattern, constructed and operative in accordance with a further embodiment of the present invention;

[0026] FIG. 6A is an exploded longitudinal view illustration, and an exploded cross-sectional view illustration of an orthogonal weave pattern fiber exhibiting drill smear, operative in accordance with an embodiment of the present invention;

[0027] FIG. 6B is an exploded longitudinal view illustration, and an exploded cross-sectional view illustration of an angular weave pattern fiber without drill smear, operative in accordance with another embodiment of the present invention; and

[0028] FIG. 7 is a chart depicting the simulation results of mean fatigue life for PCB materials with different parameters, using the IPC-TR-579 Failure Model, operative in accordance with an embodiment of the present invention.

DETAILED DESCRIPTION OF THE EMBODIMENTS

[0029] The present invention overcomes the disadvantages of the prior art by providing thermal management approaches for a printed circuit board (PCB) and/or printed circuit assembly (PCA). The terms “printed circuit board (PCB)” and “printed wiring board (PWB)” are considered analogous and are used interchangeably herein. Correspondingly, the terms “printed circuit assembly (PCA)” and “printed wiring assembly (PWA)” are considered analogous and are used interchangeably herein, where a PCA is used to refer to the PCB board together with the electronic components assembled on the board. A first thermal management approach involves an air flow through cooling mechanism with multiple airflow channels for reducing the heat load in a PCA, where the air flow direction through at least one of the channels is different from the air flow direction through at least another of the channels. Alternatively or additionally, the airflow inlet of at least one of the channels is off-axis with respect to the airflow outlet of the channel. A second thermal management approach involves a fabrication technique for a PCB involving a 3D woven fabric, which helps mitigate the phenomenon of via cracking or PTH fatigue and increase the mean time between failures (MTBF) of the PCB.

[0030] According to one embodiment of the present invention, the multiple airflow channels of an individual PCA board are configured to direct cooling air in different (e.g., opposite) directions. Reference is now made to FIG. 2, which is a perspective view illustration of a PCA, generally referenced 100, that includes an air flow through (AFT) cooling mechanism with multiple airflow channels, constructed and operative in accordance with an embodiment of the present invention. Printed Circuit assembly (PCA) 100 includes a host-frame 102, a host-board 104, a mezzanine-frame 106, and a mezzanine-board 108. A first surface (e.g., “top side”) of host-board 104 is mounted or secured to one side of host-frame 102, while an opposite surface (e.g., “bottom side”) of host-board 104 is mounted or secured to one side of mezzanine-frame 106. Mezzanine-board 108 is mounted or secured to an opposite side of mezzanine-frame 106. PCA 100 may be enclosed in a housing or chassis, and may include any number of frames and boards.

[0031] Host-frame 102 and mezzanine-frame 106 each include an interior cavity or a substantially hollow core. Host-frame 102 includes multiple airflow channels 110, 112. In particular, a first edge surface 111 of host-frame 102 includes an inlet 110A of airflow channel 110, and a second edge surface 113 of host-frame 102 includes an outlet 110B of airflow channel 110. An inlet 112A of airflow channel 112 is on the second edge surface 113 of host-frame 102, and an outlet 112B of airflow channel 112 is on the first edge surface 111 of host-frame 102. Each inlet 110A, 112A and outlet 110B, 112B is an opening defined as at least one aperture disposed on the respective edge surface (111, 113) of the host-frame 102. Accordingly, airflow channel 110 extends through the volume cavity within host-frame 102, between inlet 110A on one end and outlet 110B on the other end. Similarly, airflow channel 112 extends in the opposite direction through the volume cavity within host-frame 102 between inlet 112A and outlet 112B. Correspondingly, mezzanine-frame 106 includes airflow channels 114, 116. In particular, airflow channel 114 extends through the interior cavity of mezzanine-frame 106 between inlet 114A on a first edge surface 115 and outlet 114B on a second edge surface 117 of mezzanine-frame 106. Airflow channel 116 extends in the opposite direction through the interior cavity of mezzanine-frame 106 between inlet 116A on second edge surface 117 and outlet 116B on first edge surface 115.

[0032] Each air flow channel (110, 112, 114, 116) may include at least one element or mechanism configured to direct air flow along a selected direction along the respective airflow channels, such as internal fins. The fins (or other mechanism) may be configured in various ways, such as in accordance with the particular characteristics of the PCA and channel designs. It is noted that host-frame 102 and mezzanine-frame 106 may generally include any number of (multiple) airflow channels, while two respective channels are depicted here for exemplary purposes only. It is further noted that PCA 100 may include multiple mezzanine-boards and/or multiple mezzanine-frame, and further alternatively there may be multiple boards mounted or secured within a single frame. For example, two additional mezzanine-boards may be mounted onto opposite sides of host-board 104 and attached to host-frame 102 to cool (resulting in a total of four mezzanine-boards in the PCA).

[0033] Airflow channels 110, 112 serve to allow air to pass through, in order to dissipate heat generated by the electronic components of host-board 104 during its operation, particularly the electronic components disposed on the regions of host-board 104 that are adjacent to airflow channels 110, 112 within host-frame 102. In particular, air enters inlet 110A and flows through channel 110 along the length of host-frame 102 and exits from outlet 110B, thereby cooling the electronic components of host-board 102 situated near and along channel 110. Similarly, air enters inlet 112A and flows through channel 112 along the length of host-frame 102 and exits from outlet 112B (i.e., in an opposite direction with respect to the air flow through channel 110), thereby cooling the electronic components of host-board 102 situated near and along channel 112.

[0034] Correspondingly, the airflow channels 114, 116 of mezzanine-frame 106 serve to dissipate heat generated by the electronic components on mezzanine-board 108, as well as dissipating heat generated by the electronic components on the host-board 104 which are situated adjacent to airflow channels 114, 116 of mezzanine-frame 106.

[0035] In particular, air enters respective inlets 114A, 116A and flows through respective channels 114, 116 along the length of mezzanine-frame 106 and exits from respective outlets 114B, 116B, thereby cooling the electronic components of host-board 102 and mezzanine-board 108 situated near and along channels 114, 116.

[0036] PCA 100 is characterized by multidirectional airflow cooling, since a first airflow channel outlet (110B) and a second airflow channel inlet (112B) are disposed on one edge surface (113) of host-frame 102, while the second airflow channel outlet (112A) and the first airflow channel inlet (110) are disposed on another edge surface (111) of host-frame 102. As a result, the cooling air flows along channel 110 from inlet 110A (edge surface 111) to outlet 110B (edge surface 113) in a first direction (i.e., from left to right as depicted in FIG. 2), while cooling air flows along channel 112 from inlet 112A (edge surface 113) to outlet 112B (edge surface 111) in an opposite direction (i.e., from right to left as depicted in FIG. 2). Such a multidirectional AFT channel configuration may provide a more uniform temperature distribution and a reduction in the overall PWA temperature, as compared to an AFT channel configuration with unidirectional airflow cooling.

[0037] According to another embodiment of the present invention, the airflow channel outlet may be configured in an off-axis alignment relative to the airflow channel inlet. Reference is now made to FIG. 3, which is a perspective view illustration of a PCA, generally referenced 120, that includes an air flow through cooling mechanism with multiple channels having perpendicular inlets and outlets, constructed and operative in accordance with another embodiment of the present invention. PCA 120 includes a host-frame 122 and a host-board 124. A surface of host-board 124 is mounted or secured to one side of host-frame 122. Host-frame 122 includes multiple airflow channels (132, 134, 136, 138, 140, 142) extending through an interior cavity of host-frame 122, where each airflow channel is aligned in an “L-shaped” configuration. In particular, a first edge surface 126 (e.g., “top side”) of host-frame 122 includes respective inlets 132A, 134A, 136A, 138A, 140A, 142A of respective airflow channels 132, 134, 136, 138, 140, 142. A second edge surface 128 (e.g., “left side”) of host-frame 122, which is substantially orthogonal to the first edge surface 126, includes respective outlets 132B, 134B, 136B of respective airflow channels 132, 134, 136. A third edge surface 130 (e.g., “right side”) of host-frame 122, which is substantially orthogonal to the first edge surface 126, includes respective outlets 138B, 140B, 142B of respective airflow channels 138, 140, 142. Accordingly, air passing through an airflow channel 132, 134, 136, 138, 140, 142 changes direction, as it enters host-frame 122 from a respective inlet on edge surface 126 (i.e., from the top side) along a first axis, and then exits host-frame 122 from a respective outlet on edge surface 128 or 130 (i.e., from the left or right side) along a second axis that is different from the first axis, such that the air flows in an “L-shaped” pattern. As air passes through the airflow channels 132, 134, 136, 138, 140, 142 of host-frame 122, the heat generated by the electronic components of host-board 124 that are situated adjacent to the respective channels is dissipated. Each air flow channel (132, 134, 136, 138, 140, 142) may include at least one element or mechanism (such as internal fins) configured to direct the air flow along selected directions through the respective airflow channels. It is appreciated that the “off-axis inlet/outlet” airflow channel configuration of PCA 120 may provide additional flexibility with regard to the layout of the board components, as compared to the parallel airflow channel configuration of PCA 100 (FIG. 2). Whereas a single straight airflow channel (i.e., single axis air flow) would be characterized by one cooled area and one uncooled (hot) area, an off-axis inlet/outlet airflow channel configuration allows a designer to divide the board into two separate cooling areas and two separate uncooled areas, providing greater flexibility when designing the layout of the integrated circuits on the board. For example, two high power components may be positioned on each side of host-board 124 with the same cooling conditions. Moreover, the off-axis inlet/outlet channel configuration of PCA 120 may provide a more uniform temperature distribution, as well as a substantially lower pressure drop for the same flow rate.

[0038] At least one of the airflow channels of PCA 100, 120 may be characterized by a single inlet and multiple outlets, or alternatively, multiple inlets and a single outlet. For example, referring to FIG. 3, a single airflow channel may extend from inlet 132A through to outlets 132B and 134B on edge surface 128. For another example, a single airflow channel may extend from inlet 132A through to outlets 132B and 142B on opposite edge surfaces 128, 130, resulting in a “T-shaped” channel configuration.

[0039] It is appreciated that the multiple airflow channels of PCAs 100, 120 (FIGS. 2 and 3) provide greater airflow cooling, in comparison to that provided by an AFT cooling configuration with a single airflow channel. The enhanced airflow cooling reduces the temperature distribution on the PCA board, which also allows for increasing the amount and/or the operational power of the electronic components mounted on the PCA board. In addition, multiple airflow channels allows the thermal distribution on the board to be more uniform as a function of the airflow per each inlet and the power distribution, than would be the case with a single channel with a single inlet. Moreover, the PCA designer is provided with greater flexibility regarding the distribution of the electronic components on the board, particularly the high power components. It is also noted that the multiple airflow channels results in a reduction in pressure drop in each channel, in comparison to an AFT cooling configuration with a single channel. Furthermore, having multiple channels reduces the heat load concentration on each individual channel, and therefore reduces the heat flux concentration on the individual channel. Multiple channels also increase the heat transfer area of the air (or other fluid) flowing through the channel, and increases the number, size and/or operating power of board components that can be in contact with the channel.

[0040] According to a further embodiment of the present invention, at least one airflow channel may be selectively regulated by modifying a property or characteristic of the channel, such as by adjusting the aperture diameter of the channel inlet and/or the channel outlet, adjusting the channel volume, or by changing the airflow direction through the channel. For example, with reference to PCA 100 (FIG. 2), a controller (not shown) is configured to adjust the diameter of an inlet (110A, 112A) and/or an outlet (110B, 112B) of an airflow channel 110, 112, in accordance with real-time requirements. For example, if the electronic components on host-board 104 situated near or along airflow channel 112 are characterized with greater power loads and/or produce more heat as compared to the components situated near or along airflow channel 110, then the controller may reduce the aperture size of inlet 110A and/or outlet 110B, or alternatively or additionally, may increase the aperture size of inlet 112A and/or outlet 112B, such that greater airflow will occur through channel 112 than through channel 110. For example, the cooling air may be diverted entirely to airflow channel 112. In another example, the controller may change the airflow direction through an airflow channel, such as by directing cooling air to flow in an opposite direction in airflow channel 110 (i.e., from the previous outlet 110B through the previous inlet 110A), or by establishing off-axis airflow from a different inlet and/or a different outlet of channel 110. The direction of air flow through a channel may be modified when there is an increase or decrease in the heat load on a particular area of the host-board. The controller may be coupled to at least one sensor (not shown), and may determine how or whether to adjust the properties of an airflow channel 110, 112 based on real-time feedback related to PCA 100 as obtained by the sensor. For example, the sensor is configured to detect at least one parameter of host-board 104 and/or mezzanine-board 108, such as the temperature level or current load (using a thermal sensor or a current sensor). The controller obtains an indication of the relevant parameter(s) from the sensor (e.g., real-time thermal level or current load of different board components), and then selectively modifies the properties of at least one airflow channel 110, 112 (e.g., by reducing or increasing at least one inlet/outlet aperture diameter, or by changing a direction of air flow) in accordance with the detected parameter(s). In general, the properties of the airflow channels that extend through the host-frame or mezzanine-frame may be selectively adjusted based on the real-time cooling requirements of the PCA. For example, a PCA may include multiple boards associated with different applications that each have different heat loads, such that greater air flow is directed through the airflow channels situated adjacent to the boards with greater heat loads (and vice-versa). The airflow cooling may also be selectively controlled on the level of the entire PCA chassis or housing, such as by dispersing air differentially between different frame pairs or board pairs (e.g., via non-unidirectional airflows).

[0041] In accordance with a second thermal management approach of the present invention, the nonconductive substrate or base material of the PCB is formed from a 3D woven fabric, such as 3D woven fiberglass impregnated with an epoxy resin, in order to mitigate the phenomenon of via cracking and PTH fatigue, thereby enhancing the PCB durability. Reference is now made to FIG. 4, which is a schematic illustration of a PCB manufacturing process with a 3D woven fabric for the nonconductive substrate material, operative in accordance with an embodiment of the present invention. The raw materials for the PCB manufacturing process include a glass fabric (e.g., fiberglass), an epoxy resin, and a copper foil, where the glass fabric is a 3D woven fabric, as discussed further hereinbelow. The 3D woven glass fabric is impregnated with the resin, following which the copper foil is laid up on and pressed together with the impregnated glass fabric. Subsequently, the pressed material is divided up into individual boards. It will be appreciated that manufacturing process shown in FIG. 4 is essentially a standard PCB manufacturing process, where a 3D woven glass fabric is used for the raw materials for the non-conductive substrate instead of a 2D glass fabric.

[0042] Reference is now made to FIG. 5A, which is a perspective view illustration of an exemplary configuration of a segment of a 3D woven fabric with an orthogonal weaving pattern, generally referenced 200, constructed and operative in accordance with an embodiment of the present invention. 3D woven fabric 200 includes a first group of fibers, referenced 202 and 204, and a second group of fibers, referenced 206. First group of fibers 202, 204 are stacked in multiple layers. Each fiber 202 extends (lengthwise) along the x-axis direction, and rows of fibers 202 are arranged sequentially along the y-axis direction, such that each layer of fibers 202 is aligned (in sequential rows) in a common plane (the x-y plane). Similarly, each fiber 204 extends (lengthwise) along the y-axis direction, and rows of fibers 204 are arranged sequentially along the x-axis direction, such that each layer of fibers 204 is also aligned (in sequential rows) in the same x-y plane. Layers of fibers 202, 204 are arranged or stacked along an orthogonal direction (z-axis) that is orthogonal to the x-y plane, thus forming a matrix of fibers that extend along the x-axis and y-axis direction and arranged along the z-axis directions. Second group of fibers 206 are interlaced with the first group of fibers 202 and 204. Second group of fibers 206 are arranged in the z-axis direction, such that the length of each fiber 206 substantially passes through or extends along at least the z-axis (i.e., but may also traverse the x-axis or y-axis), while being interlaced through the first group of fibers 202, 204.

[0043] A 3D woven fabric may be classified according to various parameters, including: shedding mechanisms; weaving processes; weaving pattern/architecture; geometries/structures; and interlacements and fiber axis. One classification of 3D woven fabrics involves a conventional 2D weaving process designed to interlace two orthogonal sets of threads (“warp” and “weft”), which produces an interlaced 2D fabric on a 2D weaving device. Another classification uses a conventional 2D weaving process designed to interlace two orthogonal sets of threads (warp and weft) with an additional set of yarns functioning as binder warps or interlacer yarns in the through-the-thickness or z-axis direction. This is referred to as “multilayer weaving” and produces an interlaced 3D fabric constituting two sets of yarns on a 2D weaving device. A further classification uses a conventional 2D weaving process with three sets of yarns (ground warp, pile warp, pile weft) to produce pile fabrics, known as “2.5D fabrics”. The fabric is manufactured by cutting a simple 3D weave consisting of two 2D fabrics connected by interwoven pile threads, to form a “hairy” fabric. These 2.5D fabrics are impregnated with epoxy resin in the standard manner, laminated and cured in an autoclave. Yet another classification involves a conventional 2D weaving process with three sets of yarns to produce a non-interlaced fabric with yarns in the warp, weft and through-the-thickness (z-axis) directions. Yet a further classification uses a 3D weaving process to interlace three orthogonal sets of yarns, to produce an “orthogonal weaving” pattern. The weaving shed operates both row-wise and column-wise. This produces a fully interlaced 3D fabric where all three sets of orthogonal yarns interlace, using a specifically designed 3D weaving machine. A final classification involves a non-woven, non-interlaced 3D fabric forming process designed to connect three orthogonal sets of yarns together with no interlacing (weaving), interloping (knitting), or intertwining (braiding). This fabric is held together by a special binding process.

[0044] In accordance with an embodiment of the present invention, the 3D woven fabric is characterized by an angular (i.e., non-orthogonal) weaving pattern or architecture, such as the multilayer and angle interlock weaving patterns shown in FIGS. 5B and 5C. FIG. 5B, is a cross-sectional illustration of a 3D woven fabric with an angle-interlock weaving pattern, generally referenced 210, constructed and operative in accordance with another embodiment of the present invention. FIG. 5C is a perspective view illustration of a 3D woven fabric with a multilayer weaving pattern, generally referenced 220, constructed and operative in accordance with a further embodiment of the present invention. Orthogonal weaving pattern 3D fabric 200 is characterized by straight yarns in all three principal directions, and is therefore useful for textiles where non-crimping is desired. Angle-interlock weaving pattern 3D fabric 210 is a 3D solid configuration in which the weft yarns are kept straight while the warp yarns are directed to pass through the fabric architecture diagonally with defined depth. Wadding yarns can be added in the warp direction to achieve high tensile modulus and strength. Multilayer weaving pattern 3D fabric 220 results in a fabric composed of two or more layers. Each layer may have its own weave, and the layers can be stitched to form an integral 3D architecture. The multilayer weaving process is designed to interlace two sets of yarns (warp and weft) with an additional set of yarns functioning as binder warps or interlacer yarns in the through-the-thickness or z-direction. It is noted that the angle interlock weaving pattern 210 and multilayer weaving pattern 220 can be produced with conventional 2D weaving machines, especially shuttle looms, whereas the orthogonal weaving pattern 200 requires a specially designed 3D weaving machine.

[0045] The fiber geometry (or “structure”) of a 3D woven fabric can be selected from a variety of known geometric forms, such as: solid, hollow, shell and nodal. A solid geometry has a compound structure, with a regular or tapered geometric shape. A solid geometry is typically used with multilayer and angle interlock architectures. A hollow geometry provides a shape with both even surfaces and uneven surfaces, and multi-directional tunnels on different levels. A hollow geometry is typically used with a multilayer architecture. A 3D-hollow structure has openings in the fabric cross-section, and so a multilayer weaving pattern can be applied to both hollow structures with flat surfaces and to hollow structures with wavy surfaces. A shell geometry has a shape with spherical shells and/or open box shells. A shell geometry is typically used with a multilayer or single layer architecture. A nodal geometry has a shape with tubular nodes and/or solid nodes. A nodal geometry is typically used with multilayer and angle interlock architectures.

[0046] It should be noted that in a PCB formed from a 3D woven fabric with a non-orthogonal weaving pattern (such as angle-interlock or multilayer) and a solid fiber geometry, the phenomenon of “drill smear” when drilling the PTH via is substantially minimized, as compared to a PCB composed of a 3D woven fabric with an orthogonal weaving pattern. Drill smear relates to the formation of specks and debris caused during the drilling process, which are difficult to remove and may cover the conductors in the inner layers and impair the PCB conductivity. Reference is made to FIGS. 6A and 6B. FIG. 6A is an exploded longitudinal view illustration, referenced 232, and an exploded cross-sectional view illustration, referenced 234, of an orthogonal weave pattern fiber exhibiting drill smear, operative in accordance with an embodiment of the disclosed technique. FIG. 6B is an exploded longitudinal view illustration, referenced 236, and an exploded cross-sectional view illustration, referenced 238, of an angular weave pattern fiber without drill smear, operative in accordance with another embodiment of the disclosed technique. An orthogonal weave pattern results in drill smear (as seen in illustrations 232 and 234), since the cross cut section of any single fiber is a rectangle along the hole barrel, and therefore copper plating continuity is detrimentally impacted. In contrast, there is substantially no drill smear when implementing an angle weave pattern (as seen in illustrations 236 and 238), since the cross cut section of any single fiber is a semi-elliptical shape. Thus, the copper plating continuity in a 3D woven fabric with an angular (non-orthogonal) weave pattern is virtually similar to that of a 2D fabric, in which the corresponding area is essentially angular. The properties of the z-axis fibers 206, such as the type of weaving pattern and the angle at which the (z-axis) fibers 206 are interlaced through the (x-y plane) fibers 202, 204, may be selected in accordance with the particular parameters and/or requirements of the PCB. For example, the z-axis interlacing angle is substantially acute, such as slightly less than 90 degrees (e.g., between 75-89 degrees), in order to avoid defects in the drilled hole and defects in the PTH copper plating (e.g., non-uniformity, dimpling, blistering, etc) that may result when drilling along a singular fiber or cluster. In general, exemplary parameters used for determining the properties of the z-axis fibers 206 include: the number of layers; the fabric density; the aspect ratio; the type of resin; and/or other relevant drilling parameters for producing a defect free hole after the copper plating.

[0047] Referring back to FIGS. 4, 5A, 5B and 5C, a layer of conductive material is deposited or disposed onto at least one surface of the non-conductive substrate of a PCB, such that one or more conductive PTH vias extend through the substrate to connect different layers of the PCB. 3D woven fabric (200, 210, 220) includes fibers 206 that are arranged in the through-the-thickness (z-axis) direction. As a result, the coefficient of thermal expansion along the z-axis direction (z-CTE) of a PCB substrate composed of a 3D woven fabric (200, 210, 220) substantially matches the z-CTE of the PCB via copper plating (e.g., approximately 17 ppm), thereby decreasing the thermal expansion of the PCB substrate over thermal cycling. In this manner, the phenomenon of via cracking (PTH fatigue) is substantially alleviated, and the ratio of thermal cycles to failure, or the “mean time between failures (MTBF”), is substantially increased (i.e., in comparison to a standard PCB with a substrate manufactured from a 2D woven fabric). Essentially, a standard PCB having a substrate composed of 2D woven fabric is anisotropic (i.e., the material properties depend on the direction), at least with respect to the CTE properties (i.e., the z-CTE is substantially different than the x-CTE and y-CTE). In contrast, a PCB with a 3D woven fabric based substrate is isotropic (i.e., the material properties are identical in all direction) in terms of the CTE, or perhaps “quasi-isotropic” in the case of the angular or non-orthogonal 3D fabric weaving patterns, such that the z-CTE substantially matches the x-CTE and y-CTE of the material. For comparison purposes, a typical x-CTE and y-CTE for commercially available 2D woven fabric is approximately 17 ppm below the glass transition temperature (Tg), while a typical z-CTE is approximately 50 ppm below Tg. The term “isotropic” is used herein in a sufficiently broad manner to encompass scenarios in which material properties are “substantially similar” in all directions (but not necessarily “identical”), for example encompassing the “quasi-isotropic” configuration of angular weaving patterns 210, 220.

[0048] In addition, if the 3D woven fabric is characterized with a non-orthogonal weaving pattern (such as patterns 210, 220), the z-axis fibers 206 of the 3D woven fabric (210, 220) are positioned at different (non-uniform) angles. Accordingly, the PCB substrate fabricated with the non-orthogonal pattern 3D woven fabric (210, 220) is characterized by reduced non-uniformity at the interface between the conductive surface and the nonconductive substrate when the PTHs are drilled, which further serves to substantially minimize defects in the drilled hole and defects in the PTH copper plating, such as non-uniformity, dimpling, blistering, drill smear, and the like.

[0049] 3D woven fabric 200, 210, 220 may be fiberglass, such as E-glass fibers or FR-4 fiberglass. The conductive material of the PCB may be, for example, copper (Cu), such that the PTH that extends through the PCB substrate is copper-plated. The PCB may include any type of via with any configuration, including but not limited to: a stub via, a through via, a blind via, a buried via, and/or a back-drilled via. The thickness of the fibers may be between approximately 10-20 μm. 3D woven fabric 200, 210, 220 may optionally include a surface treatment, such as primer or plasma, in order to improve the flow of the resin and its final adhesion to the fabric surface during the impregnation step of the PCB manufacturing process (FIG. 4).

[0050] Reference is now made to FIG. 7, which is a chart, generally referenced 250, depicting the simulation results of mean fatigue life (MTF) for PCB materials with different parameters, using the IPC-TR-579 Failure Model, operative in accordance with an embodiment of the present invention. The mean fatigue life is defined as the number of thermal cycles before failure, where “failure” is defined as a percentage increase in resistance of the PCB above the initial resistance measurement at a given test temperature. The simulation calculations are based on parameters such as: the type and thickness of the PCB material, the PTH size, and the expected thermal environment. In chart 250, all simulations were based on a generic PCB material with a thickness of 3 mm and a PCB elastic modulus of 3447 MPa, but varying values of z-CTE (50 ppm/° C.; 33 ppm/° C.; 17 ppm/° C.). All simulations of chart 250 were based on a PTH diameter of 0.3 mm, and PTH wall thickness of 0.025 mm, but varying values of PTH quality factors (either “poor” or “good”, as defined under the IPC-TR-579 Failure Model standard in relation to the workmanship of a shop or supplier). All simulations of chart 250 were based on a minimum temperature of −30° C. and a maximum temperature of 71° C. From the simulation results, it is evident that a PCB material with a z-CTE of 17 ppm/° C., such as a PCB composed from a 3D woven fabric in accordance with the present invention, results in a significantly larger “cycles to failure” value as compared to the other options. More particularly, the resultant cycles to failure value of a 3D fabric reinforced PCB is “virtually infinity”, and thus the durability improvement of such a PCB can be considered as conceivably unlimited, with respect to other PCBs that are characterized by anisotropic CTE properties. It is further noted that whereas a “good quality” PCB improves the cycles to failure ratio by at least an order of magnitude for the two non-3D fabric based PCBs (i.e., the “standard” and “best” solutions), the cycles to failure of the 3D fabric reinforced PCB remains “virtually infinity” regardless of whether the PCB quality is “poor” or “good”. Thus, even a poor quality material provides an essentially unlimited improvement in PCB durability and mean fatigue life for a 3D woven fabric based PCB.

[0051] It will be appreciated that a variety of methods for providing thermal management for a PCB and/or PCA result from the above description. One such method for providing thermal management is a method for cooling a PCA that includes a host-frame and at least one host-board mounted to the host-frame. The method includes the procedure of dissipating heat generated by the host-board using a plurality of airflow channels extending through respective apertures defined through a volume cavity within the host-frame, where each of the channels includes at least one inlet at a first edge surface of the host-frame, and at least one outlet at a second edge surface of the host-frame. At least one of the airflow channels is configured to direct air flow in a first direction, and at least another one of the airflow channels is configured to direct air flow in a second direction that is different from the first direction. Alternatively or additionally, at least one of the airflow channels is configured with at least one inlet that is off-axis with respect to at least one outlet thereof.

[0052] Another such method for providing thermal management is a method for fabricating a PCB with enhanced durability. The method includes the procedure of forming a base material from a 3D woven fiberglass fabric impregnated with a resin. The 3D woven fiberglass fabric including a first group of fibers arranged in a plurality of parallel layers, where each layer includes a plurality of fibers extending along at least a first (x-axis) direction and aligned in a first (x-y) plane, and where the parallel layers are arranged along a second (z-axis) direction that is orthogonal to the first (x-y) plane. The 3D woven fiberglass fabric further includes a second group of fibers extending along at least the second (z-axis) direction, the second group of fibers being interlaced with the first group of fibers, such as in a non-orthogonal weaving pattern. The CTE of the base material along the second (z-axis) direction substantially matches the CTE of the conductive material along the first (x-axis) direction. The method further includes the procedures of depositing a layer of conductive material onto a surface of the base material, and forming at least one conductive PTH extending through the base material of multiple PCB layers.

[0053] It will be appreciated that the different embodiments of the present invention are not mutually exclusive and can be combined in various combinations to form a single embodiment including one or more of the different aspects (e.g., multi-directional airflow channels, multiple airflow channels with off-axis inlets and outlets, and PCB substrate composed of a 3D woven fabric). For example, the respective boards 120, 122 of PCAs 100 or 120 (characterized by multi-directional airflow cooling channels and/or off-axis airflow channel inlets/outlets) can be fabricated with a 3D woven fabric as in PCBs 200, 210, 220.

[0054] Furthermore, the present invention can be combined or used in conjunction with other types of known internal or external cooling sources or heat mitigation devices, such as fans or heat sinks.

[0055] While certain embodiments of the disclosed subject matter have been described, so as to enable one of skill in the art to practice the present invention, the preceding description is intended to be exemplary only. It should not be used to limit the scope of the disclosed subject matter, which should be determined by reference to the following claims.