METHOD FOR TREATING GRAPHENE SHEETS FOR LARGE-SCALE TRANSFER USING FREE-FLOAT METHOD
20170298504 · 2017-10-19
Assignee
Inventors
- Scott E. Heise (San Jose, CA, US)
- Peter V. Bedworth (Los Gatos, CA)
- Jacob L. Swett (Redwood City, CA, US)
- Steven W. Sinton (Palo Alto, CA)
Cpc classification
C23C16/01
CHEMISTRY; METALLURGY
International classification
Abstract
A method for transferring a graphene sheet from a copper substrate to a functional substrate includes forming the graphene sheet on the copper substrate using chemical vapor deposition, and irradiating the graphene sheet disposed on the copper substrate with a plurality of xenon ions using broad beam irradiation to form a prepared graphene sheet. The prepared graphene sheet is resistant to forming unintentional defects induced during transfer of the prepared graphene sheet to the functional substrate. The method further includes removing the copper substrate from the prepared graphene sheet using an etchant bath, floating the prepared graphene sheet in a floating bath, submerging the functional substrate in the floating bath, and decreasing a fluid level of the floating bath to lower the prepared graphene sheet onto the functional substrate.
Claims
1. A method for transferring a graphene sheet from a copper substrate to a functional substrate comprising: forming the graphene sheet on the copper substrate using chemical vapor deposition; irradiating the graphene sheet formed on the copper substrate with a plurality of xenon ions using broad beam irradiation to form a prepared graphene sheet removing the copper substrate from the prepared graphene sheet using an etchant bath; floating the prepared graphene sheet in a floating bath; submerging the functional substrate in the floating bath; and decreasing a fluid level of the floating bath to lower the prepared graphene sheet onto the functional substrate.
2. The method of claim 1, wherein the graphene sheet comprises an area of 1 cm.sup.2 or larger.
3. The method of claim 1, wherein the broad beam irradiation is collimated.
4. The method of claim 1, wherein the plurality of xenon ions is applied at a voltage in a range of about 100 V to about 1500 V.
5. The method of claim 1, wherein the plurality of xenon ions is applied at a voltage in a range of about 250 V to about 750 V.
6. The method of claim 1, wherein the plurality of xenon ions is applied at a voltage of about 500 V.
7. The method of claim 1, further comprising heating the graphene sheet formed on the copper substrate to a temperature ranging from about 50° C. to about 100° C.
8. The method of claim 1, further comprising heating the graphene sheet disposed on the copper substrate to a temperature of about 80° C.
9. The method of claim 1, wherein the plurality of xenon ions is provided at a flux of about 6.24×10.sup.11 Xe.sup.+/cm.sup.2/s to about 6.24×10.sup.14 Xe.sup.+/cm.sup.2/s.
10. The method of claim 1, wherein the plurality of xenon ions is provided at a flux of about 6.24×10.sup.12 Xe.sup.+/cm.sup.2/s to about 6.24×10.sup.13 Xe.sup.+/cm.sup.2/s.
11. The method of claim 1, wherein the plurality of xenon ions is provided at a flux of about 3.75×10.sup.13 Xe.sup.+/cm.sup.2/s.
12. The method of claim 1, wherein the graphene sheet formed on the copper substrate is irradiated with the plurality of xenon ions for a contact time resulting in a total fluence of about 6.24×10.sup.12 Xe.sup.+/cm.sup.2 to about 2.5×10.sup.13 Xe.sup.+/cm.sup.2.
13. The method of claim 1, wherein the graphene sheet formed on the copper substrate is irradiated with the plurality of xenon ions for a contact time resulting in a total fluence of about 1.25×10.sup.13 Xe.sup.+/cm.sup.2.
14. A method for transferring a graphene sheet from a copper substrate to a functional substrate comprising: forming the graphene sheet on the copper substrate using chemical vapor deposition; irradiating the graphene sheet formed on the copper substrate with a plurality of neon ions using broad beam irradiation to form a prepared graphene sheet removing the copper substrate from the prepared graphene sheet using an etchant bath; floating the prepared graphene sheet in a floating bath; submerging the functional substrate in the floating bath; and decreasing a fluid level of the floating bath to lower the prepared graphene sheet onto the functional substrate.
15. The method of claim 14, further comprising heating the graphene sheet formed on the copper substrate to a temperature of about 50° C. to about 100° C.
16. The method of claim 14, wherein the graphene sheet formed on the copper substrate is irradiated with the plurality of neon ions for a contact time resulting in a total fluence of about 6.24×10.sup.12 ions/cm.sup.2 to about 7.5×10.sup.13 ions/cm.sup.2.
17. The method of claim 14, wherein the graphene sheet formed on the copper substrate is irradiated with the plurality of neon ions for a contact time resulting in a total fluence of up to 2×10.sup.14 ions/cm.sup.2.
18. A method for transferring a graphene sheet from a growth substrate to a functional substrate comprising: forming the graphene sheet on the growth substrate; irradiating the graphene sheet formed on the growth substrate with a plurality of ions to form a prepared graphene sheet removing the growth substrate from the prepared graphene sheet using an etchant bath; floating the prepared graphene sheet in a floating bath; submerging the functional substrate in the floating bath; and decreasing a fluid level of the floating bath to lower the prepared graphene sheet onto the functional substrate.
19. The method of claim 18, wherein the graphene sheet comprises an area of 1 cm.sup.2 or larger.
20. The method of claim 18, wherein the growth substrate is a copper substrate.
21. The method of claim 18, wherein the growth substrate is a nickel substrate.
22. The method of claim 20, wherein the graphene sheet is formed on the copper substrate using chemical vapor deposition.
23. The method of claim 21, wherein the graphene sheet is formed on the nickel substrate using chemical vapor deposition.
24. The method of claim 18, wherein the plurality of ions comprises noble gas ions.
25. The method of claim 24, wherein the noble gas ions comprise xenon ions.
26. The method of claim 24, wherein the noble gas ions comprise neon ions.
27. The method of claim 24, wherein the noble gas ions comprise argon ions.
28. The method of claim 18, wherein the plurality of ions is applied to the graphene sheet formed on the growth substrate using broad beam irradiation.
29. The method of claim 28, wherein the broad beam irradiation is collimated.
30. The method of claim 18, wherein the plurality of ions is applied to the graphene sheet formed on the growth substrate at a voltage of about 100 V to about 1500 V.
31. The method of claim 18, wherein the plurality of ions is applied at a flux of about 1 nA/mm.sup.2 to about 1000 nA/mm.sup.2.
32. The method of claim 18, wherein the plurality of ions is applied at a flux of about 10 nA/mm.sup.2 to about 100 nA/mm.sup.2
33. The method of claim 18, wherein the plurality of ions is applied at a flux of about 40 nA/mm.sup.2 to about 80 nA/mm.sup.2.
34. The method of claim 18, wherein the plurality of ions is applied at a flux of about 60 nA/mm.sup.2.
35. The method of claim 18, wherein the graphene sheet formed on the growth substrate is irradiated with the plurality of ions for a contact time resulting in a total fluence of about 10 nAs/mm.sup.2 to about 120 nAs/mm.sup.2.
36. The method of claim 18, wherein the graphene sheet formed on the growth substrate is irradiated with the plurality of ions for a contact time resulting in a total fluence of about 10 nAs/mm.sup.2 to about 40 nAs/mm.sup.2.
37. The method of claim 18, wherein the graphene sheet formed on the growth substrate is irradiated with the plurality of ions for a contact time resulting in a total fluence of about 20 nAs/mm.sup.2.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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DETAILED DESCRIPTION
[0050] Some embodiments provide a system and method for treating graphene sheet that has been grown on a growth substrate before the growth substrate is removed and the graphene sheet transferred to a functional substrate using the free-float transfer method. The treatment provides a pristine (e.g., substantially residual/contaminant-free) graphene sheet having little to no unintended defects, which is capable of being transferred from the growth substrate with reduced risk of failure (e.g., little risk of tearing, cracking, or forming other undesirable defects) in transferring the sheet to a functional substrate during the free-float transfer method. In some embodiments, the graphene sheet is modified, and thus prepared for transfer, through an application of energy to the graphene sheet while it is disposed on the growth substrate. The energetic application may be in the form of a broad beam ion source configured to irradiate the graphene sheet with ions (e.g., group 18 element ions) such that the graphene sheet is prepared for reliable, large-scale transfer while disposed on the growth substrate. Thus, some of the systems and methods described herein eliminate the need of secondary coating materials (e.g., polymers) to aid in the transfer of the graphene sheet to the functional substrate, thus eliminating the risk of lowering the quality of the graphene sheet through contaminants introduced by the use of secondary coating materials. Accordingly, the transfer preparation method of some of the embodiments allows for the reliable transfer of high quality graphene sheets on a large-scale (i.e., 1 cm.sup.2 or larger) using the free-float transfer method.
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[0052] After preparation of the growth substrate 10, graphene is grown on both the upper and bottom surface of the growth substrate 10, which may be accomplished through chemical vapor deposition (CVD) by exposing the growth substrate 10 to gaseous reactants until graphene is formed. The CVD process results in graphene sheets being synthesized on both a bottom surface of the growth substrate 10 and an upper surface of the growth substrate 10. As shown in
[0053] Once the graphene sheet 20 has been deposited onto the upper surface of the growth substrate 10, the graphene sheet 20 may then be transferred to a substrate for a desired application. As shown in
[0054] In certain embodiments, the transfer preparation apparatus 100 may be configured to provide broad beam ion irradiation to the graphene sheet 20 and the growth substrate 10. The broad beam ion source may be collimated or substantially collimated (e.g., five degrees from normal). The plurality of ions 50 may comprise of ions that are singly charged or multiply charged. In some embodiments, the plurality of ions 50 may be noble gas ions, such as ions of an element from Group 18 of the periodic table. In some embodiments, the plurality of ions 50 may be organic ions or organometallic ions. The organic or organometallic ions may have an aromatic component. In addition, the molecular mass of the organic or organometallic ions may range from 75 to 200 or 90 to 200. In some embodiments, the plurality of ions 50 may comprise Ne.sup.+ ions, Ar.sup.+ ions, tropylium ions, and/or ferrocenium ions. In certain embodiments, the plurality of ions 50 comprises Xe.sup.+ ions.
[0055] The ion source may be configured to supply the plurality of ions 50 at a voltage in a range of about 100 V to about 1500 V. In some embodiments, the plurality of ions 50 may be applied at a voltage in a range of about 250 V to about 750 V. In certain embodiments, the plurality of ions 50 (e.g., Xe.sup.+ ions) may be applied at a voltage of about 500 V.
[0056] During the transfer preparation process, the graphene sheet 20 and the growth substrate 30 may be heated to a temperature ranging from about 50° C. to about 100° C. In some embodiments, the graphene sheet 20 and the growth substrate 30 may be heated to a temperature of about 80° C. In other embodiments, the graphene sheet 20 and the growth substrate 30 may be kept at room temperature. In addition, the graphene sheet 20 and the growth substrate 30 may be exposed to a pressure of less than 5×10.sup.−7 Torr. In some embodiments, the graphene sheet 20 and the growth substrate 30 may be exposed to a pressure ranging from 1×10.sup.−7 Torr to 5×10.sup.−6 Torr. In some embodiments, this process may be set to occur over several hours or overnight.
[0057] The ion source may be configured to provide the plurality of ions 50 at a flux of about 1 nA/mm.sup.2 (6.24×10.sup.11 ions/cm.sup.2/s) to about 1000 nA/mm.sup.2 (6.24×10.sup.14 ions/cm.sup.2/s). In some embodiments, the plurality of ions 50 is provided at a flux of about 10 nA/mm.sup.2 (6.24×10.sup.12 ions/cm.sup.2/s) to about 100 nA/mm.sup.2 (6.24×10.sup.13 ions/cm.sup.2/s) In certain embodiments, the plurality of ions 50 is provided at a flux of about 40 nA/mm.sup.2 (2.5×10.sup.13 ions/cm.sup.2/s) to about 80 nA/mm.sup.2 (5.0×10.sup.13 ions/cm.sup.2/s). In certain embodiments, the plurality of ions 50 is provided at a flux of about 60 nA/mm.sup.2 (3.75×10.sup.13 ions/cm.sup.2/s). In embodiments where the plurality of ions 50 comprises Xe.sup.+ ions, the plurality of ions 50 may be provided at a flux of about 6.24×10.sup.11 Xe.sup.+/cm.sup.2/s to about 6.24×10.sup.14 Xe.sup.+/cm.sup.2/s. In other embodiments, the plurality of ions 50 comprises Xe.sup.+ ions provided at a flux of about 6.24×10.sup.12 Xe.sup.+/cm.sup.2/s to about 6.24×10.sup.13 Xe.sup.+/cm.sup.2/s. In other embodiments, the plurality of ions 50 comprises Xe.sup.+ ions provided at a flux of about 3.75×10.sup.13 Xe.sup.+/cm.sup.2/s.
[0058] The graphene sheet 20 and the growth substrate 30 may be exposed to the ion source for a contact time resulting in a total fluence of about 10 nAs/mm.sup.2 (6.24×10.sup.12 ions/cm.sup.2) to about 40 nAs/mm.sup.2 (2.5×10.sup.13 ions/cm.sup.2). In certain embodiments, the graphene sheet 20 and the growth substrate 30 are exposed for under a second such that the total fluence is 20 nAs/mm.sup.2 (1.25×10.sup.13 ions/cm.sup.2). In embodiments where the plurality of ions comprises Xe.sup.+ ions, the graphene sheet 20 and the growth substrate 30 may be exposed for a contact time that results in a total fluence of about 10 nAs/mm.sup.2 to about 40 nAs/mm.sup.2 (or about 6.24×10.sup.12 Xe.sup.+/cm.sup.2 to about 2.5×10.sup.13 Xe.sup.+/cm.sup.2). In certain embodiments where the plurality of ions 50 comprises Xe.sup.+ ions, the total exposure time results in a total fluence of about 1.25×10.sup.13 Xe.sup.+/cm.sup.2. The upper limit of total fluence for the transfer preparation process may increase as the atomic number of the plurality of ions 50 decreases. In some embodiments, the upper limit of the total fluence may be about 120 nAs/mm.sup.2. In other embodiments, the upper limit of the total fluence may be about 500 nAs/mm.sup.2. In some embodiments, the upper limit of the total fluence may be about 1000 nAs/mm.sup.2. For example, in embodiments where the plurality of ions comprises Ne.sup.+ ions, the graphene sheet 20 and the growth substrate 30 may be exposed for a contact time that results in a total fluence of about 10 nAs/mm.sup.2 (6.24×10.sup.12 ions/cm.sup.2) to about 120 nAs/mm.sup.2(7.5×10.sup.13 ions/cm.sup.2/s). In some embodiments, the graphene sheet 20 and the growth substrate 30 may be exposed to a plurality of neon ions for a contact time that results in a total fluence of about about 10 nAs/mm.sup.2 to about 500 nAs/mm.sup.2. In other embodiments, the graphene sheet 20 and the growth substrate 30 may be exposed to a plurality of neon ions for a contact time that results in a total fluence of about about 10 nAs/mm.sup.2 to about 1000 nAs/mm.sup.2. In yet other embodiments, the graphene sheet 20 and the growth substrate 30 may be exposed to a plurality of neon ions for a contact time that results in a total fluence of up to 2×10.sup.14 ions/cm.sup.2.
[0059] After the above treatment, the graphene sheet 20 and the growth substrate 30 may be exposed to about 1 atm of N.sub.2 as a final step in the process before transferring of the graphene sheet 20 to the functional substrate. The result of the preparation process is, in effect, a “toughened” graphene sheet 20 that may be reliably transferred to a functional substrate using the unsupported free-float transfer method while being resistant to forming or inducing unintentional defects (tears, cracks, wrinkles, unintentionally-created pores) in the graphene sheet 20 during the free-float transfer process. The treatment thus provides a toughened graphene sheet 20 that is capable of providing a high coverage area (e.g., 99% or more of the functional substrate is covered by the graphene sheet) over the functional substrate and a clean surface for effective use of other treatment processes (e.g., perforating processes). While not being restricted to any particular theory for the mechanism that prepares or toughens the graphene sheet 20 for transfer, the toughening may be facilitated by the presence of the carbonaceous material and the interaction between the graphene sheet 20 and the copper growth substrate 10 interface. The ion beam irradiation may provide sufficient energy to the carbonaceous material to reform the graphene sheet 20 while on the copper substrate 10 to a pristine layer due to the sputtering of the carbon atoms present in and/or on the surface of the graphene sheet 20.
[0060] Once the graphene sheet 20 has been prepared using the transfer preparation apparatus 100, the graphene sheet 20 and the growth substrate 10 composite is placed in an etchant bath 30, as shown in
[0061] As shown in
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[0065] The pores present in the polymer substrate that are covered by the prepared graphene sheet are shown as medium gray in
[0066] Some embodiments have been described in detail with particular reference to preferred embodiments thereof, but it will be understood by those skilled in the art that variations and modifications may be effected within the spirit and scope of the claims.