ELASTIC WAVE DEVICE
20170338795 ยท 2017-11-23
Inventors
- Ryo NAKAGAWA (Nagaokakyo-shi, JP)
- Chihiro KONOMA (Nagaokakyo-shi, JP)
- Masashi TSUBOKAWA (Nagaokakyo-shi, JP)
Cpc classification
B06B1/0644
PERFORMING OPERATIONS; TRANSPORTING
International classification
B06B1/06
PERFORMING OPERATIONS; TRANSPORTING
Abstract
An elastic wave device includes a substrate including a piezoelectric material layer and an IDT electrode on the piezoelectric material layer. The IDT electrode includes a Pt film, a Ti film on the Pt film, and an Al-based metal film on the Ti film. The Ti film is quasi-single-crystalline.
Claims
1. An elastic wave device comprising: a substrate including a piezoelectric material layer; and an IDT electrode on the piezoelectric material layer; wherein the IDT electrode includes a Pt film, a Ti film on the Pt film, and an Al-based metal film on the Ti film; and the Ti film is quasi-single-crystalline.
2. The elastic wave device according to claim 1, wherein an X-ray diffraction pole figure of a Ti(200) plane of the Ti film exhibits a peak pattern substantially having three- or six-fold symmetry.
3. The elastic wave device according to claim 1, wherein the Al-based metal film is an Al film or Al alloy film.
4. The elastic wave device according to claim 3, wherein the Al alloy film is an AlCu alloy film.
5. The elastic wave device according to claim 1, wherein the substrate is one of a LiTaO.sub.3 substrate and a LiNbO.sub.3 substrate.
6. The elastic wave device according to claim 1, wherein the substrate is a piezoelectric substrate.
7. The elastic wave device according to claim 1, wherein the substrate is one of a LiTaO.sub.3 substrate and a LiNbO.sub.3 substrate.
8. The elastic wave device according to claim 1, wherein the Ti film is an adhesion layer.
9. The elastic wave device according to claim 1, wherein the Ti film is a diffusion barrier layer that prevents atomic diffusion between the Pt film and the AlCu alloy film.
10. The elastic wave device according to claim 1, wherein the AlCu alloy layer reduces insertion loss due to its electric resistance lower than that of the Pt film.
11. The elastic wave device according to claim 1, wherein the IDT electrode includes another Ti film between the substrate and the Pt film.
12. The elastic wave device according to claim 1, wherein the IDT electrode includes an NiCr film between the substrate and the Pt film.
13. The elastic wave device according to claim 1, wherein the elastic wave device is one of a longitudinally coupled resonator-type elastic wave filter and an elastic wave resonator.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0012]
[0013]
[0014]
[0015]
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0016] The following makes the present invention more clearly understood by describing some specific preferred embodiments of the present invention with reference to the drawings.
[0017] The preferred embodiments set forth herein are illustrative. It is possible to replace or combine elements or features of the structure of a preferred embodiment with that of another preferred embodiment.
[0018]
[0019] The elastic wave device 1 includes a piezoelectric substrate 2. The piezoelectric substrate 2 is a LiTaO.sub.3 substrate, but the piezoelectric substrate 2 may alternatively be made from any other piezoelectric single crystal such as LiNbO.sub.3. In this preferred embodiment of the present invention, the substrate does not need to be a layer of a piezoelectric material as a whole, i.e., a piezoelectric substrate, as long as it has a piezoelectric material layer. The substrate may have a structure in which there is a piezoelectric material layer on a supporting substrate.
[0020] There is an IDT electrode 3 on the piezoelectric substrate 2. The IDT electrode 3 includes a Ti film 4, a Pt film 5, a Ti film 6, and an AlCu alloy film 7. The Ti film 4 more firmly adheres to the piezoelectric substrate 2 than the Pt film 5 does. The Ti film 4 is therefore an adhesion layer.
[0021] The Ti film 6 prevents atomic diffusion between the Pt film 5 and the AlCu alloy film 7. The Ti film 6 is therefore a diffusion barrier layer.
[0022] The AlCu alloy layer 7 reduces the insertion loss due to its electric resistance lower than that of the Pt film 5. The AlCu alloy film 7 is an AlCu alloy film in which Al is the base metal. In this preferred embodiment of the present invention, it is possible to use another kind of Al-based alloy film instead of the AlCu alloy film 7. The AlCu alloy film 7 can also be replaced with an Al film.
[0023] One of the unique features of the elastic wave device 1 is that the Ti film 6 is quasi-single-crystalline. Being quasi-single-crystalline means that the film is not polycrystalline but an X-ray diffraction (XRD) pole figure of its Ti(200) plane exhibits a peak pattern substantially having three- or six-fold symmetry.
[0024] In practice, since the IDT electrode 3 is provided on the piezoelectric substrate 2, the symmetry of the Ti film 6 is influenced by the crystal orientation of the piezoelectric substrate 2.
[0025]
[0026] A Ti film is generally accepted as being quasi-single-crystalline, not polycrystalline, when an X-ray diffraction pole figure of its Ti(200) plane exhibits a peak pattern substantially having three- or six-fold symmetry as in the foregoing. Such a Ti film contains much fewer grain boundaries than a polycrystalline Ti film. This makes the Ti film 6 an extremely effective diffusion barrier. The Ti film 6 is thus sufficiently effective in preventing atomic diffusion even when thin. This allows the manufacturer to provide an elastic wave device 1 in which the Ti film 6 is thin.
[0027] Since even a thin Ti film 6 is sufficiently effective in preventing atomic diffusion, the manufacturer is able to reduce the electric resistance of the electrode fingers, and therefore reduce the transmission loss through the device, by thickening the AlCu alloy film 7.
[0028] While
[0029] While in the above preferred embodiment, a Ti film 4, a Pt film 5, a Ti film 6, and an AlCu alloy film 7 are preferably stacked in this order from the piezoelectric substrate 2 side, the IDT electrode according to a preferred embodiment of the present invention only needs to have a multilayer structure in which there is a Ti film on a Pt film and there is an Al or AlCu alloy film on the Ti film. The rest of the multilayer portion of the IDT electrode is not critical. The Ti adhesion layer 4 may therefore be replaced with a NiCr film and can even be omitted.
[0030] Elastic wave devices according to this preferred embodiment of the present invention preferably include the above-described multilayer structure of an IDT electrode. The rest of their structure is therefore not critical. Preferred embodiments of the present invention are therefore able to be applied to various elastic wave devices including longitudinally coupled resonator-type elastic wave filters besides elastic wave resonators.
[0031] While preferred embodiments of the present invention have been described above, it is to be understood that variations and modifications will be apparent to those skilled in the art without departing from the scope and spirit of the present invention. The scope of the present invention, therefore, is to be determined solely by the following claims.