LIGHT-EMITTING DIODE AND SURVEILLANCE CAMERA DEVICE USING THE SAME
20170302834 · 2017-10-19
Inventors
Cpc classification
F21V5/04
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21Y2115/10
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
G03B15/03
PHYSICS
F21V33/0052
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21V19/003
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21V29/70
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
International classification
F21V33/00
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21V19/00
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
H04N7/18
ELECTRICITY
F21V5/04
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
Abstract
A light-emitting diode (LED) includes s a substrate, a LED chip, and an optical lens. The LED chip is fixedly mounted to the substrate for emitting a light beam. The optical lens is mounted to the substrate and covers the LED chip. The optical lens has a light exit surface, which directs the light beam from the LED chip to travel in a direction along an optical axis to form a non-symmetric light shape. Also disclosed is a surveillance camera device that uses the LED. As such, the drawback of a conventional surveillance camera being incapable of acquiring an excellent image due to light source being overly concentrated can be eliminated.
Claims
1. A light-emitting diode (LED) that provides high intensity, coverage, and homogenous illumination, the LED comprising, in combination: a substrate that has an installation surface; a wiring layer, which is formed on the installation surface; an LED chip, which is directly mounted on the installation surface and is in electrical connection with the wiring layer, the LED chip being square in shape and comprising an optical axis; and an optical lens that is overmolding on and fixedly mounted to the installation surface to encapsulate the LED chip such that the optical lens has no air gap with respect to the substrate and the LED chip, the optical lens being asymmetric and formed of a light transmitting material, the optical lens being formed to comprise a light exit surface, wherein a large width extension direction of the light exit surface is defined as an X-axis direction; a small width extension direction of the light exit surface is defined as a Y-axis direction, wherein the X-axis direction and the Y-axis direction are perpendicular to each other; and a direction perpendicular to the installation surface is defined as a Z-axis direction, wherein the light exit surface protrudes from the installation surface in the Z-axis direction, the light exit surface being formed of at least two curved surfaces having different curvatures; wherein a surface middle portion of light exit surface is recessed along the optical axis to define a divergent surface and an outer portion of the light exit surface extends toward the installation surface to define a convergent surface; wherein the divergent surface has negative diopter and the convergent surface has positive diopter; and wherein a light beam emitting from the LED chip travels in a direction along the optical axis and is subjected to refraction by the divergent surface and the convergent surface to form a non-symmetric light shape having high homogeneity.
2. The LED as claimed in claim 1, wherein the light exit surface shows a contour having an M-shape in the X-axis direction having two end portions in the X-axis direction raised and is recessed along the optical axis and the light exit surface shows an arch shape in the Y-axis direction that is raised along the optical axis and has two end portions extending in the Y-axis direction.
3. The LED as claimed in claim 2, wherein the optical lens satisfies the following conditions:
0.3<D1/D2≦3; and
0.65<D3/D4<1, where D1 is the widthwise distance between two outermost side edges of the light exit surface along the Y-axis; D2 is the lengthwise distance between two opposite ends of the light exit surface along the X-axis; D3 is a distance from the installation surface to a lowest surface of the divergent surface in a direction along the optical axis; and D4 is a distance from the installation surface to a highest surface of the convergent surface in a direction along the optical axis.
4. The LED as claimed in claim 3, wherein the optical lens further satisfies the following conditions:
0.1≦L1/D1≦0.5; and
0.1≦L2/D2≦0.5, where D1 is the widthwise distance between two outermost side edges of the light exit surface along the Y-axis; D2 is the lengthwise distance between two opposite ends of the light exit surface along the X-axis; L1 is a widthwise distance of the LED chip along the Y-axis; and L2 is a lengthwise distance of the LED chip along the X-axis.
5. The LED as claimed in claim 4, wherein the convergent surface has a diopter value between 25 and 100 and the divergent surface has a diopter value between −1500 and −500.
6. The LED as claimed in claim 5, wherein a half-power view angle on a plane passing through the optical axis and in the X-axis direction is between 40 and 160 degrees and a half-power view angle on a plane passing the optical axis and in a direction orthogonal to and perpendicular to the X-axis direction is between 30 and 100 degrees.
7. The LED as claimed in claim 6, wherein the light exit surface is an aspheric surface satisfying the following conditions
8. The LED as claimed in claim 7, wherein the diopter value of the convergent surface is 25 and the diopter value of the divergent surface is −500.
9. The LED as claimed in claim 8, wherein the half-power view angle on a plane passing through the optical axis and in the X-axis direction is 47 degrees and the half-power view angle on a plane passing the optical axis and in a direction orthogonal to and perpendicular to the X-axis direction is between 31 degrees.
10. The LED as claimed in claim 6, wherein the light exit surface of the optical lens is a free-form surface and the half-power view angle on a plane passing through the optical axis and in the X-axis direction is 130 degrees in a bat-wing shape and the half-power view angle on a plane passing the optical axis and in a direction orthogonal to and perpendicular to the X-axis direction is 85 degrees in a light concentration form.
11. The LED as claimed in claim 10, wherein a maximum luminous intensity emitting from the light exit surface is located between 40° and 60° and luminous intensity of normal vector is 75% of the maximum luminous intensity.
12. The LED as claimed in claim 4, wherein the non-symmetric light shape is a rectangular light shape or an elliptic light shape that has an aspect ratio between 1.51 and 1.6.
13. The LED as claimed in claim 5, wherein the light-emitting diode chip generates infrared light having a wavelength between 790 and 830 nm, or infrared light having a wavelength between 830 and 870 nm, or infrared light having a wavelength between 900 and 1000 nm.
14. The LED as claimed in claim 4, wherein multiple ones of the light-emitting diode chip are arranged in a n*n (n by n) square light emission array, n being a positive integer greater than or equal to 2, the multiple light-emitting diode chips being arranged in tight arrangement with respect to each other.
15. The LED as claimed in claim 14, wherein the multiple light-emitting diode chips are spaced from each other by a spacing distance between 0.0508 mm and 0.1016 mm.
16. A surveillance camera device, comprising: a casing; an image capturing element, which is arranged inside the casing to capture an image; and at least one light-emitting diode (LED), which is arranged at one side of the image capturing element to provide lighting necessary for the image capturing element to capture the image, the at least one LED comprising a substrate, a wiring layer, and at least one LED chip, and an optical lens, wherein the substrate comprises an installation surface; the wiring layer is formed on the installation surface; the LED chip is fixedly mounted to the installation surface and in electrical connection with the wiring layer, wherein the LED chip has an optical axis and the optical lens is fixedly mounted to the installation through overmolding to encapsulate the LED chip, such that the optical lens has no air gap with respect to the substrate and the LED chip, the optical lens being asymmetric and formed of a light transmitting material, the optical lens being formed to comprise a light exit surface, wherein a large width extension direction of the light exit surface is defined as an X-axis direction; a small width extension direction of the light exit surface is defined as a Y-axis direction, wherein the X-axis direction and the Y-axis direction are perpendicular to each other; and a direction perpendicular to the installation surface is defined as a Z-axis direction, wherein the light exit surface protrudes from the installation surface in the Z-axis direction, the light exit surface being formed of at least two curved surfaces having different curvatures; wherein a surface middle portion of light exit surface is recessed along the optical axis to define a divergent surface and an outer portion of the light exit surface extends toward the installation surface to define a convergent surface; and wherein a light beam emitting from the LED chip travels in a direction along the optical axis and is subjected to refraction by the divergent surface and the convergent surface to form a non-symmetric light shape having high homogeneity.
17. The surveillance camera device as claimed in claim 16, wherein the optical lens satisfies the following conditions:
0.3<D1/D2≦3; and
0.65<D3/D4<1, where D1 is the widthwise distance between two outermost side edges of the light exit surface along the Y-axis; D2 is the lengthwise distance between two opposite ends of the light exit surface along the X-axis; D3 is a distance from the installation surface to a lowest surface of the divergent surface in a direction along the optical axis; and D4 is a distance from the installation surface to a highest surface of the convergent surface in a direction along the optical axis.
18. The surveillance camera device as claimed in claim 17, wherein the optical lens further satisfies the following conditions:
0.1≦L1/D1≦0.5; and
0.1≦L2/D2≦0.5; where D1 is the widthwise distance between two outermost side edges of the light exit surface along the Y-axis; D2 is the lengthwise distance between two opposite ends of the light exit surface along the X-axis; L1 is a widthwise distance of the LED chip along the Y-axis; and L2 is a lengthwise distance of the LED chip along the X-axis.
19. The surveillance camera device as claimed in claim 18, wherein the number of the at least one LED is plural and the plural LEDs are arranged in a circumference of the image capturing element in an angularly equally spaced manner to circumferentially enclose the image capturing element therein.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0051] The patent or application file contains at least one drawing executed in color. Copies of this patent or patent application publication with color drawing(s) will be provided by the Office upon request and payment of the necessary fee.
[0052] The present invention will be apparent to those skilled in the art by reading the following description of preferred embodiments thereof with reference to the drawings, in which:
[0053]
[0054]
[0055]
[0056]
[0057]
[0058]
[0059]
[0060]
[0061]
[0062]
[0063]
[0064]
[0065]
[0066]
[0067]
[0068]
[0069]
[0070]
[0071]
[0072]
[0073]
[0074]
[0075]
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0076] Referring to
[0077] The light-emitting diode chip 102 has a shape that is square and has an optical axis 1034. In the instant embodiment, the number of the light-emitting diode chip 102 is one that generates visible light having white light color temperature between 2700K and 7000K, infrared light having a wavelength between 800 and 1000 nm (for example, infrared light having a wavelength between 790 and 830 nm with a peak value being 810 nm, infrared light having a wavelength between 830 and 870 nm with a peak value being 850 nm, or infrared light having a wavelength between 900 and 1000 nm with a peak value being 940 nm), ultraviolet light having a wavelength between 365 and 405 nm, or a laser beam having a wavelength between 800 and 1000 nm. In other words, specific examples of the light-emitting diode chip 102 may include a light-emitting diode that emits visible light, a light-emitting diode that emits invisible light (such as infrared light and ultraviolet light), and a laser semiconductor chip.
[0078] The optical lens 103 can be a curable sealer that is moisture resistant. The optical lens 103 is fixedly mounted on the installation surface 1011 of the substrate 101 to encapsulate the light-emitting diode chip 102. To reduce light refraction and loss, the light-emitting diode 10 of the present invention adopts a primary optical design, meaning the optical lens 103 is integrally formed on the installation surface 1011 of the substrate 101 through overmolding and set in tight engagement with the light-emitting diode chip 102. The overmolding of the method injects the material of the optical lens 103 into a chamber of a die first, inserts the light-emitting diode chip 102 mounted on the installation surface 1011, heats the material of the optical lens 103 directly such that it is curable and then takes it out from the chamber of the die to shape. Alternatively, after the light-emitting diode chip 102 is mounted on the installation surface 1011, deposing into the die, combining a top of the die and a bottom of the die by the hydraulic machine and vacuuming the die, deposing the material of the optical lens 103 on an entrance of the injecting channel, applying a pressure to the material of the optical lens 103 to enter every forming grooves along the injecting channel and heating the material of the optical lens 103 to be curable and takes it out from the chamber of the die to shape. By the method, the optical lens 103 has no air gap (i.e. single reflectivity) with respect to the substrate 101 and the light-emitting diode chip 102. In other words, the optical lens 103 and the light-emitting diode chip 102 are not bonded to each other with adhesive so that the manufacturing process is simplified to greatly reduce cost and shorten fabrication time and also to prevent the issue of positional shift of the optical elements and lighting module during an assembly process and the gap between the optical element and the lighting module may generate more surface reflection or refraction so as to reduce the total amount of light that can be extracted.
[0079] In the instant embodiment, the curable sealer can be selected from one of a transparent material having a refractive index of 1.4˜1.6, preferably 1.5, such as epoxy resin, acrylic resin, silicon resin, and silicone, but not limited thereto.
[0080] Further, the optical lens 103 has a light exit surface 1032. With a large width extension direction of the light exit surface 1032 defined as an X-axis direction, a small width extension direction of the light exit surface 1032 defined as a Y-axis direction, where the X-axis direction and the Y-axis direction are perpendicular, and a direction perpendicular to the installation surface 1011 defined as a Z-axis direction, then the light exit surface 1032 protrudes from the installation surface 1011 in the Z-axis direction.
[0081] Further, the light exit surface 1032 is formed of at least two curved surfaces 1033 having different curvatures. As such, the light exit surface 1032 of the optical lens 103 may guide a light beam emitting from the light-emitting diode chip 102 to travel in a direction along the optical axis 1034 to project onto a light receiving plane 20 and also form a non-symmetric light shape 21. It is noted that the non-symmetric light shape 21 has a shape that is approximately a rectangle or an ellipse. Preferably, the non-symmetric light shape 21 has an aspect ratio between 1.51 and 1.6. The term “aspect ratio” used herein refers to the ratio of a maximum cross-sectional dimension of the non-symmetric light shape with a maximum cross-sectional dimension perpendicular to the maximum cross-sectional dimension.
[0082] The optical lens 103 is asymmetric. The light exit surface 1032 of the optical lens 103 is selected from an aspheric surface, a cambered surface, a parabolic surface, a hyperbolic surface, and a free-form surface.
[0083] In a polar coordinate system, incident light I has a vector:
I=(sin φ.sub.I cos θi, sin φ.sub.I sin θj, cos φ.sub.Ik)
[0084] Further, according to Snell's law, when light wave propagates from one medium to another medium, if the two media have different refractive indexes, then reflection may occur. Thus, a regular secondary optical design (φ.sub.I″) is as follows:
φ.sub.I=φs−α1+α2=φ.sub.I″
[0085] while the primary optical design (φ.sub.I′) involves propagation among two or more different media, so that φ.sub.I′=φs and φ.sub.I′>φ.sub.I″.
[0086] Further, according to the following luminous flux formula
[0087] It is known that when sin φ get larger, luminous flux gets larger and thus, when φ.sub.I=φ.sub.I′=φs, sin φ.sub.I′>sin φ.sub.I″. Thus, the optical energy of the non-symmetric light shape 21 generated by the primary optical design adopted in this invention is increased by 10%˜20% as compared to the optical energy of the secondary optics.
Second Embodiment
[0088] Referring to
[0089] Although in the light-emitting diode 10b illustrated in
[0090] Further referring to
0.3<D1/D2≦3 [condition 1]
[0091] wherein D1 is the widthwise distance between two outermost side edges of the light exit surface 1032 along the Y-axis, and D2 is the lengthwise distance between two opposite ends of the light exit surface 1032 along the X-axis.
[0092] Further, the optical lens 103 and the light-emitting diode chips 102 satisfy the following condition 2:
0.1≦L1/D1≦0.5; 0.1≦L2/D2≦0.5 [condition 2]
[0093] wherein D1 is the widthwise distance between two outermost side edges of the light exit surface 1032 along the Y-axis; D2 is the lengthwise distance between two opposite ends of the light exit surface 1032 along the X-axis; L1 is a widthwise distance of the light-emitting diode chips 102 along the Y-axis; and L2 is a lengthwise distance of the light-emitting diode chips 102 along the X-axis.
[0094] Further referring to
0.65<D3/D4<1 [condition 3]
[0095] wherein D3 is a distance from the installation surface 1011 to a lowest surface of the divergent surface 1036 in a direction along the optical axis 1034, and D4 is a distance from the installation surface 1011 to a highest surface of the convergent surface 1037 in a direction along the optical axis 1034.
[0096] Further referring to
Third Embodiment
[0097] Referring to
D1/D2=0.9375 [condition 1]
L1/D1=0.1693; L2/D2=0.15875 [condition 2]
D3/D4=0.99 [condition 3]
[0098] Further, the divergent surface 1036 of the light exit surface 1032 has a diopter value of −1500, while the convergent surface 1037 has a diopter value of 100. Thus, based on the above conditions, the light exit surface 1032 of the optical lens 103 may direct a light beam emitting from the light-emitting diode chip 102 to travel in a direction along the optical axis 103 and to project to a light receiving plane 20 through light refraction caused by the divergent surface 1036 and the convergent surface 1037 so as to form a non-symmetric light shape 21 projected onto the light receiving plane 20. The non-symmetric light shape 21 has a configuration that is roughly a rectangle or an ellipse. Preferably, the non-symmetric light shape 21 has an aspect ratio between 1.51 and 1.6 in order to satisfy the ratio of image information acquired by a camera. The term “aspect ratio” used herein refers to the ratio of a maximum cross-sectional dimension of the non-symmetric light shape with a maximum cross-sectional dimension perpendicular to the maximum cross-sectional dimension.
[0099] Further referring to
[0100] Further referring to
[0101] In the detail in contrast with the prior art, an example as
Fourth Embodiment
[0102] Referring to
D1/D2=1 [condition 1]
L1/D1=0.1693; L2/D2=0.1693 [condition 2]
D3/D4=0.99 [condition 3]
[0103] Further, the aspheric surface is represented in equation 1 as follows:
[0104] where c denotes curvature, r indicates radius of curvature of an apex, and k indicate conic constant, and c=1/r and k<0.
[0105] In the instant embodiment, data are listed in the following Table 1, wherein the radius of curvature of apex (r), the conic constant (k), and aspheric coefficients of Nth orders (A4, A6, A8, A10, A12, A14, A16) are provided.
TABLE-US-00001 TABLE 1 r 9.03 k −0.522 A.sup.4 −1.872 × 10.sup.−4 A.sup.6 5.099 × 10.sup.−5 A.sup.8 −7.519 × 10.sup.−6 A.sup.10 6.093 × 10.sup.−7 A.sup.12 −2.766 × 10.sup.−8 A.sup.14 6.591 × 10.sup.−10 A.sup.16 .sup. −6.416 × 10.sup.−12
[0106] Further, the divergent surface 1036 of the light exit surface 1032 has a diopter value of −500 and the convergent surface 1037 has a diopter value of 25. Thus, when the optical lens 103 satisfies the above conditions and Table 1, the light exit surface 1032 of the optical lens 103 may direct a light beam emitting from the light-emitting diode chip 102 to travel in a direction along the optical axis 1034 and to project to a light receiving plane 20 through light refraction caused by the divergent surface 1036 and the convergent surface 1037 so as to form a non-symmetric light shape 21. The non-symmetric light shape 21 has a configuration that is roughly a rectangle or an ellipse. Preferably, the non-symmetric light shape 21 has an aspect ratio between 1.51 and 1.6 in order to satisfy the ratio of image information acquired by a camera device. The term “aspect ratio” used herein refers to the ratio of a maximum cross-sectional dimension of the non-symmetric light shape with a maximum cross-sectional dimension perpendicular to the maximum cross-sectional dimension.
[0107] Further referring to
[0108] Further referring to
[0109] In the detail in contrast with the prior art, an example as
[0110] Referring to
[0111] Referring to
[0112] Further referring to
[0113] In summary, the light-emitting diode according to the present invention and the surveillance camera device using the light-emitting diode are applicable to a security surveillance system, wherein the light-emitting diode adopts primary optic design to allow for direct projection of non-symmetric light shape for matching an imaging system of the surveillance camera device, without the need of additional optical elements for multiple times of reflection for secondary optics thereby effectively improving utilization performance of the light source, reducing power consumption of the surveillance camera device, and also simplifying parts design of the security surveillance system to reduce overall size thereof.
[0114] Although the present invention has been described with reference to the preferred embodiments thereof, it is apparent to those skilled in the art that a variety of modifications and changes may be made without departing from the scope of the present invention which is intended to be defined by the appended claims.