Method of forming a piezoelectric actuator
09825215 · 2017-11-21
Assignee
Inventors
- Franz Rinner (Deutschlandsberg, AT)
- Dieter Somitsch (Gross St. Florian, AT)
- Jan-Thorsten Reszat (Karlsruhe, DE)
- Reinhard Gabl (Kufstein, AT)
- Martin Galler (Kalsdorf, AT)
- Christoph Auer (Graz, AT)
- Georg Kuegerl (Eibiswald, AT)
Cpc classification
C23C4/02
CHEMISTRY; METALLURGY
Y10T29/42
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
H10N30/063
ELECTRICITY
H10N30/872
ELECTRICITY
H10N30/06
ELECTRICITY
H10N30/071
ELECTRICITY
Y10T156/10
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
International classification
H04R17/00
ELECTRICITY
C23C4/02
CHEMISTRY; METALLURGY
Abstract
A piezoelectric actuator of a multilayer design includes outer electrodes that are fastened by means of a bonding layer applied by thermal spraying. For example, the outer electrodes are formed as a woven wire fabric. Furthermore, a method for fastening an outer electrode in a piezoelectric actuator is specified.
Claims
1. A method of forming a piezoelectric actuator, comprising: providing a stack having piezoelectric layers and electrode layers arranged between the piezoelectric layers; placing an outer electrode onto an outer side of the stack; and thermally spraying a material onto parts of an upper side of the outer electrode and the outer side of the stack; wherein the material forms a bonding layer on the parts of the outer electrode and outer side of the stack.
2. The method according to claim 1, wherein thermally spraying the material comprises performing a method selected from the group consisting of flame spraying, plasma spraying, cold-gas spraying and arc spraying.
3. The method according to claim 2, wherein a temperature of the stack during the thermal spraying is below a melting temperature of the material.
4. The method according to claim 3, wherein the temperature of the stack is less than 200° C. during the thermally spraying the material.
5. The method according to claim 4, wherein the thermally spraying comprises thermally spraying the material at a temperature and speed that, when the material impinges on a surface of the outer electrode or the stack, particles of the material bond to one another and to the surface to form the bonding layer.
6. The method according to claim 1, wherein the material comprises an electrically conductive material.
7. The method according to claim 6, wherein the material comprises a metal.
8. The method according to claim 7, wherein the metal is selected from the group consisting of copper, silver, aluminum and tin.
9. The method according to claim 1, wherein the outer electrode comprises holes and wherein thermally spraying the material comprises spraying the material into the holes.
10. The method according to claim 1, further comprising sintering the stack prior to the thermally spraying.
11. The method according to claim 10, wherein all layers of the stack are sintered at one and the same time.
12. The method according to claim 1, wherein the bonding layer extends contiguously from past a first edge of the outer electrode over an upper side of the bonding layer and past a second edge of the outer electrode opposite the first edge; wherein the bonding layer extends past a third edge of the outer electrode at a first end of the outer electrode, wherein the third edge is adjacent to the first edge and the second edge; and wherein a second end of the outer electrode opposite the first end extends past the bonding layer such a first portion of the outer electrode is free of the bonding layer.
13. The method according to claim 12, further comprising mounting a lead on, and electrically connected to, the outer electrode; wherein the lead is fastened to the upper side of the first portion of the outer electrode.
14. The method according to claim 12, further comprising mounting a lead on, and electrically connected to, an outer surface of the bonding layer.
15. The method according to claim 1, further comprising: providing a contact layer on the outer side of the stack, the contact layer for electrical contacting the electrode layers; and wherein the placing an outer electrode onto an outer side of the stack comprises placing the outer electrode on the contact layer.
16. The method according to claim 1, wherein the bonding layer bonds to the entire upper side of the outer electrode.
17. The method according to claim 1, wherein the outer electrode comprises a wire fabric.
18. A method of forming a piezoelectric actuator, comprising: providing a stack comprising piezoelectric layers and electrode layers arranged between the piezoelectric layers; providing an outer electrode; fastening the outer electrode to the stack by applying a bonding layer by thermal spraying.
19. The method according to claim 18, wherein the outer electrode comprises a wire fabric.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) The specified piezoelectric actuator and advantageous configurations thereof are explained below on the basis of schematic figures that are not to scale and in which:
(2)
(3)
(4)
(5) The following list of reference symbols may be used in conjunction with the drawings: 1 pieozoelectric actuator 81 soldered joint 11 stack 2 piezoelectric layer 3 electrode layer 31a, 31b inactive zone 4, 4a, 4b bonding layer 41 material 5a, 5b contact layer 6, 6a, 6b outer electrode 63 holes 8 lead
DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS
(6)
(7) The outer electrode 6 may be designed in the form of a wire fabric and fastened to the stack 11 by means of a bonding layer 4 applied by thermal spraying. The outer electrode 6 is covered by the bonding layer 4. In
(8)
(9) The outer electrodes 6a, 6b are designed in the form of wire fabrics in which metal wires are interwoven. Between the wires there are holes 63 in the outer electrode 6a, 6b. The bonding layer 4a, 4b bonds on parts of the upper side of the outer electrode 6a, 6b and parts of the outer side of the stack 11 and also reaches into the holes 63 in the outer electrode 6a, 6b. Consequently, the bonding layer 4a, 4b bonds to the contact layer 5a, 5b on the outer side of the stack 11 in the region of the holes 63 and around the outer electrode 6a, 6b. The bonding layer 4a, 4b also bonds to the upper side of the outer electrode 6a, 6b, in particular, also at lateral regions of the wires of the outer electrode 6a, 6b. These lateral regions are, for example, the regions that surround the holes 63 in the outer electrode 6a, 6b, as well as peripheral regions of the outer electrode 6a, 6b. On the other hand, the bonding layer 4a, 4b does not extend under the outer electrode 6a, 6b, i.e., there is no bonding layer 4a, 4b directly between the outer side of the stack 11 and the outer electrode 6a, 6b.
(10) In
(11) In
(12) In
(13) During the spraying-on operation, the temperature of the material 41 may lie above the melting temperature of the material 41. However, it is also possible that the temperature of the material 41 lies below the melting temperature and that, when they impact on the component, the particles of the material 41 bond to one another and to the component as a result of the frictional heat that is produced.
(14) In
(15) In order to apply an outer electrode 6b likewise to the opposite outer side of the stack 11, the stack 11 is turned around and
(16) The invention is not restricted by the description on the basis of exemplary embodiments to these embodiments but comprises each novel feature and any combination of features. This includes, in particular, any combination of features in the patent claims, even if this feature or this combination itself is not explicitly specified in the patent claims or exemplary embodiments.