Heating block for heating water

Abstract

A heating block including a heating block body which receives/guides a liquid medium, an electric heating element arranged in the cavity for heating the medium via electric current, a semiconductor switch for controlling the electric current flowing through the heating element to control a heating power of the heating element, and a closure piece for closing an opening in the heating block body to the cavity element. The semiconductor switch is electrically and thermally conductively connected to the closure piece via first connection terminal to electrically connect the first connection terminal to the heating element via the closure piece, and to thermally connect the first connection terminal to the medium via the closure piece. The semiconductor switch is directly connected to a control board by a second connection terminal so that the semiconductor switch is spatially arranged and mechanically connected directly between the control board and the connection piece.

Claims

1. A heating block for heating a liquid medium, comprising: a heating block body with a cavity for receiving or guiding the medium; an electric heating element arranged in the cavity, and configured to heat the medium by means of electric current passing through the heating element; a semiconductor switch configured to control the electric current flowing through the heating element so as to control a heating power of the heating element; and a closure piece configured to close an opening in the heating block body to the cavity element; and a heating coil fastening pin which electrically connects the semiconductor switch to the heating element; wherein the semiconductor switch is electrically and thermally conductively connected to the closure piece by a first connection terminal, such that an electrical connection of the first connection terminal to the heating element is carried out via the closure piece and a thermal connection of the first connection terminal to the medium is carried out via the closure piece; and wherein the semiconductor switch is directly connected to a control board by a second connection terminal so that the semiconductor switch is spatially arranged and mechanically connected directly between the control board and the connection piece, and wherein the heating coil fastening pin thermally connects the semiconductor switch and the medium so that the semiconductor switch is cooled through the medium via the heating coil fastening pin.

2. The heating block according to claim 1; wherein the control board is mechanically connected to the closure piece via the semiconductor switch.

3. The heating block according to claim 1; wherein the semiconductor switch is arranged between the control board, or a portion thereof, and the closure piece to form a sandwich structure.

4. The heating block according to claim 1; wherein the closure piece is configured to be in direct electrical contact with the medium.

5. A Continuous-flow heater comprising: a heating block according to claim 1.

6. The heating block according to claim 1; wherein the closure piece has an outer rim, and is inserted into the opening of the heating block body from an inner side proceeding from the cavity of the heating block body so that the outer rim is placed at the opening.

7. A heating block for heating a liquid medium, comprising: a heating block body with a cavity for receiving or guiding the medium; an electric heating element arranged in the cavity, and configured to heat the medium by means of electric current passing through the heating element; a semiconductor switch configured to control the electric current flowing through the heating element so as to control a heating power of the heating element; a closure piece configured to close an opening in the heating block body to the cavity element; a heating coil fastening pin which is integrated in the closure piece, and which comprises: a connection means, at a side facing the medium, configured to electrically connect the heating element; and a receptacle, at a side remote of the medium, configured to receive a fastening means which fastens the semiconductor switch to the heating coil fastening pin, wherein the semiconductor switch is electrically and thermally conductively connected to the closure piece by a first connection terminal, such that an electrical connection of the first connection terminal to the heating element is carried out via the closure piece and a thermal connection of the first connection terminal to the medium is carried out via the closure piece; and wherein the semiconductor switch is directly connected to a control board by a second connection terminal so that the semiconductor switch is spatially arranged and mechanically connected directly between the control board and the connection piece.

8. The heating block according to claim 7; wherein the heating coil fastening pin and the closure piece are substantially formed as a one-piece metal body with a seal.

9. The heating block according to claim 7; wherein the receptacle is formed as a blind bore hole with internal thread; and wherein the fastening means is provided with an external thread to screw the fastening means into the receptacle.

10. A heating apparatus comprising: a semiconductor switch configured to control the current flowing through a heating element so as to control a heating power of the heating element; a closure piece configured to close an opening in a heating block body; and a control board; and a heating coil fastening pin which electrically connects the semiconductor switch to the heating element, wherein the semiconductor switch is electrically and thermally conductively connected to the closure piece by a first connection terminal, such that an electrical connection of the first connection terminal to the heating element is carried out via the closure piece and a thermal connection of the first connection terminal to a medium to be heated is carried out via the closure piece; wherein the semiconductor switch is directly connected to the control board by a second connection terminal so that the semiconductor switch is spatially arranged and mechanically connected directly between the control board and the connection piece, wherein the heating coil fastening pin thermally connects the semiconductor switch and the medium so that the semiconductor switch is cooled through the medium via the heating coil fastening pin.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 shows a semiconductor switch between a board and a closure piece and part of a heating element schematically in a side sectional view;

(2) FIG. 2 schematically shows a detail of a heating block body in a perspective view of two closure pieces;

(3) FIG. 3 shows a semiconductor switch with a closure piece in a perspective view;

(4) FIG. 4 shows the semiconductor switch with closure piece from FIG. 3 in a side view;

(5) FIG. 5 shows the semiconductor switch with closure piece from FIGS. 3 and 4 in a front view;

(6) FIG. 6 shows the semiconductor switch with closure piece from FIGS. 3 to 5 in a top view.

DETAILED DESCRIPTION OF EMBODIMENTS

(7) It is to be understood that the figures and descriptions of the present invention have been simplified to illustrate elements that are relevant for a clear understanding of the present invention, while eliminating, for purposes of clarity, many other elements which are conventional in this art. Those of ordinary skill in the art will recognize that other elements are desirable for implementing the present invention. However, because such elements are well known in the art, and because they do not facilitate a better understanding of the present invention, a discussion of such elements is not provided herein.

(8) The present invention will now be described in detail on the basis of exemplary embodiments.

(9) FIG. 1 shows a sandwich structure in which a semiconductor switch 2 is arranged between a control board 4 and a closure piece 6. The semiconductor switch 2 lies flat against an upper contact surface 8 at the control board 4. The semiconductor switch 2 lies flat against a lower contact surface 10 at the closure piece 6.

(10) The control board 4 can accordingly provide the semiconductor switch 2 fastened thereto. For purposes of contacting, the semiconductor switch 2 has a plurality of connections 12, namely three connections 12, only one of which is shown because of the side view. A possible contacting of the connections 12 is shown schematically in FIG. 1, and the connections 12 accordingly pass at an angle directly into a board connection area 14 on the control board 4. The connection can also be carried out differently; a direct contacting of the connections 12 on the control board 4 is advantageous. Only a detail of the control board 4 is shown in FIG. 1.

(11) The closure piece 6 has a sealing ring 16. Therefore, the closure piece 6 can be sealingly inserted into an opening. In so doing, the portions shown above the sealing ring 16, particularly the lower contact surface 10 and, along with it, the semiconductor switch 2, are outside of the heating block body into whose opening the closure piece 16 is inserted from the inner side, the closure piece 6 being inserted into the opening outward from the heating block body. An outer rim 50 is provided by which the closure piece 16 contacts a rim of the opening of the heating block body from the inner side. The rest of the elements are positioned substantially facing toward the cavity of the heating block body. In particular, the heating element 18 which is formed as heating wire and which is shown only partially and only schematically is located as intended in the medium to be heated, particularly in the water to be heated. The heating element 18 is fastened to and electrically connected with a connection wire portion 20 in a heating coil fastening pin 22. The fastening is carried out in connection means 24 which are formed approximately like a bore hole 24.

(12) The above-mentioned heating coil fastening pin 22 is actually a portion of the closure piece 6. This heating coil fastening pin 22 projects far into the medium in every case when used as intended. In this respect, the liquid medium also extends up to an inner surface 26 of the closure piece 6 which is basically provided adjacent to the lower contact surface 10. Accordingly, there is merely a relatively thin cover layer 28 between the lower contact surface 10 and the inner surface 26. Accordingly, heat from the semiconductor switch 2 can be given off via the cover layer 18 over a fundamentally large surface area to the liquid medium to be heated, particularly water. The lower contact surface 10 between semiconductor switch 2 and closure piece 6 and the inner surface 26 between cover layer 28 and liquid medium offer only a low thermal resistance insofar as this is noteworthy at all.

(13) A fastening of the semiconductor switch 2 is carried out via a fastening tab 30 having a fastening opening 32. A fastening screw 34 is snugly guided through the fastening opening 32 and screwed into a blind hole 36 having internal thread 38. The blind hole 36 reaches far into the heating coil fastening pin 22. In this way, a stronger and more secure connection can be produced between semiconductor switch 2 and closure piece 6. An electric heating current for heating the heating element 18 can also flow via this connection. To this extent, the fastening tab 30 also forms a first connection terminal 30 of the semiconductor switch 2.

(14) Further the fixed mechanical connection by means of the fastening screw 34 which also produces an electrical connection is suitable for transmitting heat. Accordingly, heat can flow additionally to the indicated path directly via the cover layer 28 and also via the heating coil fastening pin 22 into the medium which is to be heated.

(15) FIG. 1 shows a sandwich-type structure of—from top to bottom—control board 4, semiconductor switch 2 and closure piece 6. This sandwich-type structure allows a simple connection of the semiconductor switch to the heating element 18 as well as to the control board 4. The entire construction which is achieved is relatively simple and in particular is formed directly and prevents unnecessary connection elements, particularly unnecessary wiring.

(16) FIG. 2 shows a detail of a heating block body 200 with two closure pieces 206 inserted into corresponding openings. Located in the heating block body 200 below each closure piece 206 is a heating conduit 240 shown only by an outward curvature in the heating block body 200. A heating element 18 which is connected to the respective closure piece 206 is inserted in each of these heating conduits.

(17) Each of the two closure pieces 206 has a blind hole 236 with an internal thread so that a semiconductor switch can be placed on the closure piece 206 and screwed into this blind hole 236. A common board, i.e., a collective board for the heating block body 200, having the plurality of semiconductor switches can be provided for both closure pieces 206 and any further closure piece. The semiconductor switches can be arranged at the board in such a way that when the board is mounted at the heating block body 200 in an intended position a semiconductor switch is seated at a closure piece 206, particularly in such a way that the semiconductor switch can be screwed to the respective blind hole 236. The positioning means 242 shown in FIG. 2, which can also be referred to and formed as positioning projections or positioning pins, can be used to position a control board of this type. The heating block body 200 can be formed of two injection molded parts, for example, namely particularly an upper partial shell and a lower partial shell. FIG. 2 correspondingly shows an upper heating block body partial shell 244 which is fabricated as injection molded parts, and the positioning means 242 are formed in the injection mold and, correspondingly, integrally in this upper partial shell 244. Accordingly, when a control board is neatly positioned by these positioning means 242, the semiconductor switches fastened thereto are also correctly placed at the position for connecting to the respective closure piece 206.

(18) FIGS. 3 to 6 show four different views of a semiconductor switch 102 which is fastened to a closure piece 306 by means of a fastening screw 343. Depending upon the view, it can be seen that the semiconductor switch 302 sits directly on a cover layer 328 with a fastening tab 330. To this end, the fastening screw 334 is screwed through the fastening tab 330 into a blind hole of the closure piece 306. The fastening screw 334 is approximately aligned with a heating coil fastening pin 322. The heating coil fastening pin 322 has a bore hole 324 as connection means for connecting a heating element, particularly a heating wire.

(19) A sealing ring 316 is provided for sealing the inserts. Further, the semiconductor switch 302 has three connections 312 which can be used for actuating and for supplying with supply current.

(20) Therefore, a solution is proposed which does away with the previous cooling zones which were coupled directly with the control electronics. Cooling subassemblies of this kind were very cost-intensive and also necessitated costly devices for handling in electronics manufacture. A solution is now suggested in which semiconductor switches, particularly triacs, namely triacs such as semiconductor switch 2 in FIG. 1 or semiconductor switch 302 in FIGS. 3 to 6, can be connected in a more economical way than heretofore.

(21) In the suggested solution, cooling surfaces such as the lower contact surface 10 in FIG. 1 inter alia are also coupled with heating coil fastening pins such as heating coil fastening pins 22 and 322. This coupling also advantageously includes the use of fastening screws 34 according to FIG. 1 and fastening screws 344 from FIGS. 3 to 6 which achieve a direct fastening of the semiconductor switches or triacs and which also produces a good thermal connection with potential for cooling. A thermal connection is also formed via the fastening screws 34 and 334.

(22) In this case, the semiconductor switches or triacs contact the heating coil fastening pin and also the fastening screw in the manner of an electrically conductive unit so that additional connections, particularly connection cables or cords from the triac to the heating body pin and fastening screw, are dispensed with.

(23) Accordingly, it is suggested that the triacs be constructed as non-insulated component parts. The triacs are arranged on the electronics board or control board in such a way that, when assembled, they are seated directly over the heating conduits, e.g., heating conduits 240. In so doing, the heating body pins are spatially arranged in such a way that they lie directly below the triacs.

(24) While this invention has been described in conjunction with the specific embodiments outlined above, it is evident that many alternatives, modifications, and variations will be apparent to those skilled in the art. Accordingly, the preferred embodiments of the invention as set forth above are intended to be illustrative, not limiting. Various changes may be made without departing from the spirit and scope of the inventions as defined in the following claims.