DEVICE FOR CONTROLLED HEAT TRANSFER TO AND FROM A COMPONENT

Abstract

A component coupling system for controllable heat transfer from or to a component which is heated by an external and/or internal heat source and is disposed adjacent to a cooler. The component coupling system includes a carrier plate, on which least one first means for spacing is disposed such that a component disposed on the means for spacing and the carrier plate, together with the means for spacing, form a first cavity. If needed, this cavity can be evacuated, filled with a fluid medium, or have a fluid medium flow through it, whereby the heat transfer or the heat dissipation from the component can be controlled in a simple manner.

Claims

1. A component coupling system for and controllable heat transfer from or to a component, comprising a carrier plate; at least one first means for spacing disposed on the carrier plate such that and a component disposed on the first means for spacing, the carrier plate and the first means for spacing being so configured that the first means for spacing together with the carrier plate and the component form a first cavity within a perimeter of the first means for spacing; and a first line for feeding a fluid medium to or discharging the fluid medium form the first cavity; wherein the carrier plate and the means for spacing each comprise a ceramic or metallic material.

2. The component coupling system according to claim 1, wherein the first means for spacing is a peripheral bead or an O-ring seal.

3. The component coupling system according to claim 1, wherein the first means for spacing has a triangular cross-section with a base of the triangle in contact with the carrier plate and an apex of the triangle in contact with the component.

4. The component coupling system according to claim 1, wherein the carrier plate comprises SiC, a titanium-zirconium-molybdenum material or tungsten.

5. The component coupling system according to claim 1, wherein the first means for spacing comprises SiC, a titanium-zirconium-molybdenum material or tungsten.

6. A component coupling system according to claim 1, further, comprising a second means for spacing so configured that the second means for spacing together with the, carrier plate and the component form a second cavity within a perimeter of the second means for spacing.

7. (canceled)

8. The component coupling system according to claim 6, wherein the second means for spacing has a triangular cross-section with a base of the triangle in contact with the carrier plate and an apex of the triangle in contact with the component.

9. The component coupling system according to claim 6, wherein the second cavity is between the respective perimeters of the first and second means for spacing and the component coupling system further comprises a second line for feeding a fluid medium to and discharging the fluid medium from the second cavity.

10. The component coupling system according to claim 1, wherein the first means for spacing has a height of more than 1 mm but less than 10 mm.

11. A method for operating a component coupling system according to claim 1, comprising evacuating a fluid medium the first cavity via at least the first line; or filling the first cavity with a fluid medium via at least the first line; or flowing a fluid medium through the first cavity by feeding the fluid into the first cavity via at least one feed line and discharging the fluid from the cavity via the first line.

12. A method for operating a component coupling system according to claim 6, comprising evacuating, a fluid medium form the first cavity via at least the first line; or filling the first cavity with a fluid medium via at least the first line; or flowing a fluid medium through the first cavity by feeding the fluid; medium into the first cavity via at least one feed line and discharging the fluid medium from the cavity via the first line; and evacuating a fluid medium from the second cavity via the second line.

13. The component coupling system according to claim 10, wherein the first means for spacing has a height less than 5 mm.

14. The component coupling system according to claim 6, wherein the first and second means for spacing each has a height of more than 1 mm but less than 10 mm.

15. The component coupling system according to claim 14, wherein the height of each of the first and the second means for spacing is less than 5 mm.

Description

SPECIFIC DESCRIPTION

[0071] The subject matter of the invention is described in more detail hereafter based on exemplary embodiments and figures. In the drawings:

[0072] FIG. 1 shows a schematic sectional drawing of a first embodiment of the component coupling system according to the invention in contact with a component and a cooler;

[0073] FIG. 2 shows a schematic sectional drawing of a further embodiment of the component coupling system according to the invention, comprising a feed line for a fluid medium;

[0074] FIG. 3 shows a schematic sectional drawing of a third embodiment of the component coupling system according to the invention, comprising a further means for spacing and a further feed or discharge line for a liquid medium;

[0075] FIG. 4 shows a sectional drawing of a target mount using a component coupling system according to the invention; and

[0076] FIG. 5 shows an enlarged detail of the component coupling system according to the invention of FIG. 4.

[0077] In FIGS. 1 to 3, the following meanings apply:

[0078] carrier plate as part of the component coupling system according to the invention

[0079] 2a first sealing element as part of the component coupling system according to the invention

[0080] 2b optional further sealing element component to be heated or cooled, optionally comprising internal heater

[0081] 4a defined cavity

[0082] 4b optional further defined cavity

[0083] 5a first feed line and/or evacuation option for a contact medium

[0084] 5b further feed line and/or evacuation option for a contact medium

[0085] 6a valve for a first feed or discharge line

[0086] 6b valve for a further feed or discharge line cooler

[0087] FIG. 1 schematically shows an arrangement using a component coupling system according to the invention, and in particular the coupling site at which the component to be heated is in contact with the component coupling system. A cavity 4a is generated by a raised concentric sealing element 2a, which is disposed on the carrier plate 1, between the component 3 and the coupling site. in the form of a carrier plate 1 and a means for spacing 2a. The carrier plate 1 is in direct planar contact with a cooler 7.

[0088] By way of a clamping device, which is not shown here, the component 3 can be pressed against the sealing element 2a having a corresponding suitable surface, whereby a defined sealed intermediate space, this being the cavity 4a, is obtained. Here, the sealing element 2a is designed as a one-sided blade having a triangular-like cross-section. Alternatively, another geometry is also conceivable, such as a labyrinth seal.

[0089] If the cavity were simply filled via the feed line 5a, this would influence the surroundings due to the egress of the medium once the connection is detached. Under these circumstances, in accordance with FIG. 2, an adapted evacuation option 5a should be provided for the cavity 4a within the carrier plate 1, which is advantageously designed to be controllable via a valve 6a.

[0090] Provided that at least one feed line and one discharge line are present, it is advantageously also possible for the selected contact medium to flow through the intermediate space.

[0091] By appropriately providing different pressure zones in the feed and discharge, in a particularly advantageous embodiment of the invention, the contact medium used could even change from the liquid phase to the gas phase, changing the state of aggregation thereof, for the purpose of greater heat absorption.

[0092] So as to address potential leaks of the first seal 2a, a further sealing element 2b, which encloses the first sealing element 2a, is advantageously provided in a further embodiment of the invention, see FIG. 3, and a further feed or discharge line 5b comprising further evacuation connections within the carrier plate 1 is provided between the two sealing elements 2a, 2b.

[0093] FIGS. 4 and 5 show sectional drawings of a specific embodiment of the component coupling system according to the invention in a target mount, wherein FIG. 5 shows an enlarged view of the circle represented in FIG. 4.

[0094] The sample 12 is fixed in the mount 14 by way of a mask. Adjoining to the outside is a radiation shield 15 for reflecting scattered rays. A heater 13 is disposed directly beneath the sample. The collar 16 forms the counter bearing for the pressing ring 17, which, adjusted by way of a worm and a servo motor, presses the mount comprising the sample against the carrier plate 1 of the component coupling system. On the outer circumference, two contact rings for the heater, including interposed insulation, are shown. The carrier plate 1 is placed onto a water cooler 7. The entire assembly is mounted on a base plate 18. Depending on ambient conditions, such as the required temperature, component rigidity or weight, the mount 14 can be made of different materials and thus represent an entire component according to 3. Due to the present requirements, the use of different materials is necessary and results in separation into components 11, 14.

[0095] In the enlarged view (FIG. 5), the use of an additional separate sealing disk 11 is apparent. In this embodiment, both the carrier plate 1 and the mount 14 comprise means for spacing 2a, 2b. Moreover, the sealing disk 11 has openings, which are not shown here. The cavity between the carrier plate and the sealing disk 11 is connected to the cavity between the sealing disk 11 and the mount 14, and can thus be connected only to one further feed or discharge line.

[0096] The following table provides an overview as to the effect that the use of a liquid medium, or a vacuum, within the defined cavity of the component coupling system, has on the heat transfer from and to the component (sample).

TABLE-US-00001 Target Component temperature coupling Flow for the External Internal Radiation system through component heater heater loss cavity is cooler Heating on off/on yes evacuated constant Heating off on yes evacuated constant Constancy on off yes filling or constant throughput (e.g., argon) Constancy off on yes filling or constant throughput (e.g., argon) Cooling on off yes filling or constant throughput or higher (e.g., He/H.sub.2O) Room on off yes filling or high temperature throughput with evaporation (e.g., He/H.sub.2O)