SEMICONDUCTOR STRUCTURE

Abstract

A semiconductor structure includes a first-type doped semiconductor layer, a light emitting layer, a second-type doped semiconductor layer comprising Al.sub.xIn.sub.yGa.sub.l-x-yN layers, at least one GaN based layer, and an ohmic contact layer. The light emitting layer is disposed on the first-type doped semiconductor layer, and the second-type doped semiconductor layer is disposed on the light emitting layer. The Al.sub.xIn.sub.yGa.sub.l-x-yN layers stacked on the light emitting layer, where 0<x<1, 0≦y<1, and 0<x+y<1, and the GaN based layer interposed between two of the Al.sub.xIn.sub.yGa.sub.l-x-yN layers, and the ohmic contact layer is disposed on the Al.sub.xIn.sub.yGa.sub.l-x-yN layers.

Claims

1. A semiconductor structure comprising: a first-type doped semiconductor layer; a light emitting layer disposed on the first-type doped semiconductor layer; a second-type doped semiconductor layer disposed on the light emitting layer, the second-type doped semiconductor layer comprising: a plurality of Al.sub.xIn.sub.yGa.sub.l-x-yN layers stacked on the light emitting layer, where 0<x<1, 0≦y<1, and 0<x+y<1; at least one GaN based layer interposed between two of the Al.sub.xIn.sub.yGa.sub.l-x-yN layers; and an ohmic contact layer disposed on the Al.sub.xIn.sub.yGa.sub.l-x-yN layers.

2. The semiconductor structure as claimed in claim 1, wherein the Al.sub.xIn.sub.yGa.sub.l-x-yN layers comprises: an AlInGaN based stress control layer; and an AlGaN based carrier blocking layer, the AlInGaN based stress control layer being disposed between the light emitting layer and the AlGaN based carrier blocking layer.

3. The semiconductor structure as claimed in claim 2, wherein the AlInGaN based stress control layer is doped with a second-type dopant at a concentration higher than 10.sup.19 cm.sup.−3.

4. The semiconductor structure as claimed in claim 1, wherein the Al.sub.xIn.sub.yGa.sub.l-x-yN layers comprises: a first AlInGaN based layer disposed on light emitting layer, the first AlInGaN based layer being doped with carbon (C); and a second AlInGaN based layer disposed on the first AlInGaN based layer.

5. The semiconductor structure as claimed in claim 4, wherein the first AlInGaN based layer is doped with carbon (C) at a concentration higher than 5×10.sup.17 cm−3.

6. The semiconductor structure as claimed in claim 4, wherein the second AlInGaN based layer contains hydrogen (H) at a concentration higher than 10.sup.18 cm.sup.−3.

7. The semiconductor structure as claimed in claim 1, wherein the light emitting layer comprises a first-type dopant at a concentration higher than 10.sup.17 cm−3.

8. The semiconductor structure as claimed in claim 1, wherein the light emitting layer comprises a multiple quantum well (MQW) structure, the MQW structure comprises a plurality of well layers and a plurality of barrier layers stacked alternately, and a concentration of indium (In) in one of the Al.sub.xIn.sub.yGa.sub.l-x-yN layers is smaller than a concentration of indium (In) in each of the well layers of the MQW structure.

9. The semiconductor structure as claimed in claim 1, wherein the GaN based layer comprises a second-type dopant at a first concentration, the Al.sub.xIn.sub.yGa.sub.l-x-yN layers comprise the second-type dopant at a second concentration, and the first concentration is higher than the second concentration.

10. The semiconductor structure as claimed in claim 1 further comprising a substrate, wherein the first-type doped semiconductor layer is disposed on the substrate and is between the light emitting layer and the substrate.

11. The semiconductor structure as claimed in claim 1 further comprising a superlattice layer disposed between the light emitting layer and the first-type doped semiconductor layer.

12. A semiconductor structure comprising: a first-type doped semiconductor layer; a light emitting layer disposed on the first-type doped semiconductor layer, the light emitting layer comprising silicon (Si) at a concentration higher than 1017 cm−3; and a second-type doped semiconductor layer disposed on the light emitting layer, the second-type doped semiconductor layer comprising: a first AlInGaN based layer disposed on light emitting layer, the first AlInGaN based layer being doped with carbon (C); a second AlInGaN based layer disposed on the first AlInGaN based layer; at least one GaN based layer interposed between the first AlInGaN based layer and the second AlInGaN based layer; and an ohmic contact layer disposed on the second AlInGaN based layer.

13. The semiconductor structure as claimed in claim 12, wherein the first AlInGaN based layer is doped with carbon (C) at a concentration higher than 5×10.sup.17 cm.sup.−3.

14. The semiconductor structure as claimed in claim 12, wherein the second AlInGaN based layer contains hydrogen (H) at a concentration higher than 10.sup.18 cm.sup.−3.

15. The semiconductor structure as claimed in claim 12, wherein the light emitting layer comprises a multiple quantum well (MQW) structure, the MQW structure comprises a plurality of well layers and a plurality of barrier layers stacked alternately, and a concentration of indium (In) in the first AlInGaN based layer is smaller than a concentration of indium (In) in each of the well layers of the MQW structure.

16. The semiconductor structure as claimed in claim 12, wherein the light emitting layer comprises a multiple quantum well (MQW) structure, the MQW structure comprises a plurality of well layers and a plurality of barrier layers stacked alternately, and a concentration of indium (In) in the second AlInGaN based layer is smaller than a concentration of indium (In) in each of the well layers of the MQW structure.

17. The semiconductor structure as claimed in claim 12, wherein the GaN based layer comprises a second-type dopant at a first concentration, the first or second AlInGaN based layer comprises the second-type dopant at a second concentration, and the first concentration is higher than the second concentration.

18. The semiconductor structure as claimed in claim 12 further comprising a substrate, wherein the first-type doped semiconductor layer is disposed on the substrate and is between the light emitting layer and the substrate.

19. The semiconductor structure as claimed in claim 12 further comprising a superlattice layer disposed between the light emitting layer and the first-type doped semiconductor layer.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0028] FIG. 1 illustrates a sectional view of a semiconductor structure according to the first embodiment of the present invention.

[0029] FIG. 2 is a sectional view of active layer of the semiconductor structure according to the first embodiment of the present invention.

[0030] FIG. 3 illustrates a sectional view of a semiconductor structure and an active layer thereof according to the second embodiment of the present invention.

DESCRIPTION OF THE EMBODIMENTS

[0031] Reference will now be made in detail to the present preferred embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.

[0032] In the following embodiments, when it is mentioned that a layer of something (or membrane) or a structure is disposed over or under a substrate, another layer of something (or membrane), or another structure, that means the two structures, the layers of something (or membranes), the layer of something and the substrate, or the structure and the substrate can be directly or indirectly connected. The indirect connection means there is at least one intermediate layer disposed therebetween.

[0033] An embodiment of the present invention provides a semiconductor structure being configured to emit light, and the light emitting efficiency and the electrical conductivity of the semiconductor structure are both improved. In other words, the semiconductor structure is a light emitting semiconductor structure, and the light emitting semiconductor has good light emitting efficiency over spectrum of, for example, blue light and near-UV light.

[0034] FIG. 1 is a sectional view of a semiconductor structure according to the first embodiment of the present invention. Referring to FIG. 1, semiconductor structure 100 includes first-type doped semiconductor layer 110, light emitting layer 120, and second-type doped semiconductor layer 130. The light emitting layer 120 is disposed on the first-type doped semiconductor layer 110, and the second-type doped semiconductor layer 130 is disposed on the light emitting layer 120. The second-type doped semiconductor layer 130 includes Al.sub.xIn.sub.yGa.sub.l-x-yN layers 132A, 132B, where 0<x<1, 0≦y<1, and 0<x+y<1, a GaN based layer 134, and an ohmic contact layer 136. The Al.sub.xIn.sub.yGa.sub.l-x-yN layers 132A, 132B are stacked on the light emitting layer 120, and the GaN based layer 134 is interposed between the Al.sub.xIn.sub.yGa.sub.l-x-yN layers 132A and the Al.sub.xIn.sub.yGa.sub.l-x-yN layers 132B, and the ohmic contact layer 136 is disposed on the Al.sub.xIn.sub.yGa.sub.l-x-yN layers 132A, 132B. In other words, in the semiconductor structure 100, the Al.sub.xIn.sub.yGa.sub.l-x-yN layers 132A, 132B are placed between the light emitting layer 120 and the ohmic contact layer 136, and the GaN based layer 134 is placed at an intervening position of the Al.sub.xIn.sub.yGa.sub.l-x-yN layers 132A, 132B.

[0035] The GaN based layer 134 between the Al.sub.xIn.sub.yGa.sub.l-x-yN layers 132A, 132B can improve the electrical connection of the semiconductor structure 100. Also, the ohmic contact layer 136 disposed on the Al.sub.xIn.sub.yGa.sub.l-x-yN layers 132A, 132B can also improve the electrical connection of the semiconductor structure 100 and the resistance reduction of the semiconductor structure 100. Therefore, the semiconductor structure 100 can provide high light emitting efficiency and high electrical conductivity.

[0036] In details, the semiconductor structure 100 further includes a first electrode 150 disposed on the first-type doped semiconductor layer 110 and a second electrode 160 disposed on the second-type doped semiconductor layer 130, so as to provide the electricity to the first-type doped semiconductor layer 110 and the second-type doped semiconductor layer 130.

[0037] The semiconductor structure 100 further includes a substrate 140, and the first-type doped semiconductor layer 110 is disposed between the substrate 140 and the light emitting layer 120. To be specific, the semiconductor structure 100 is used for a flip-chip connection, or a wire bonding connection, for example, but the invention is not limited thereto.

[0038] The substrate 140 of this embodiment is a substrate for growing a GaN-based semiconductor structure, and includes a sapphire substrate, a Si substrate, an AlN substrate, or a SiC substrate, but without being limited thereto.

[0039] The first-type doped semiconductor layer 110 of the first embodiment is an n-type doped semiconductor layer, for example. To be more specific, the first-type doped semiconductor layer 110 may be an n-type impurity-doped semiconductor layer, for example, Si-doped GaN-based semiconductor, and may be formed to a thickness of about 1˜3 μm, but without being limited thereto.

[0040] The light emitting layer 120 of the semiconductor structure 100 of the embodiment includes a first-type dopant at a concentration higher than 10.sup.17 cm.sup.−3. To be more specific, the light emitting layer 120 may be an n-type impurity-doped light emitting layer, for example, Si-doped, but without being limited thereto, and the light emitting layer 120 is configured to emit light having wavelength falling into a range from UV, purple, blue to green.

[0041] FIG. 2 is a sectional view of active layer of the semiconductor structure according to the first embodiment of the present invention. In details, referring to FIG. 2, the light emitting layer 120 includes a MQW structure, and the MQW structure includes a plurality of well layers 124 and a plurality of barrier layers 122 stacked alternately, and a concentration of indium (In) in one of the Al.sub.xIn.sub.yGa.sub.l-x-yN layers 132A, 132B is smaller than a concentration of indium (In) in each of the well layers 124 of the MQW structure, but without being limited thereto. Therefore, the forward voltage for the semiconductor structure 100 can be reduced.

[0042] The second-type doped semiconductor layer 130 of the first embodiment is a p-type doped semiconductor layer, for example. To be more specific, the second-type doped semiconductor layer 130 may be a p-type impurity-doped semiconductor layer, for example, Mg-doped GaN-based semiconductor, and may be formed to a thickness of about 10 nm-200 nm, but without being limited thereto.

[0043] In the second-type doped semiconductor layer 130, the Al.sub.xIn.sub.yGa.sub.l-x-yN layer 132B is located above the Al.sub.xIn.sub.yGa.sub.l-x-yN layer 132A. The Al.sub.xIn.sub.yGa.sub.l-x-yN layer 132A located between the light emitting layer 120 and the Al.sub.xIn.sub.yGa.sub.l-x-yN layer 132B is an Al, In-containing GaN based layer doped with carbon (C).

[0044] To be specific, the Al.sub.xIn.sub.yGa.sub.l-x-yN layer 132A is doped with carbon (C) at a concentration higher than 5×10.sup.17 cm.sup.−3, and the Al.sub.xIn.sub.yGa.sub.l-x-yN layer 132B is doped with hydrogen (H) at a concentration higher than 10.sup.18 cm.sup.−3, but without being limited thereto. Therefore, the hole concentration can be increased.

[0045] In the second-type doped semiconductor layer 130 of this embodiment, the GaN based layer 134 includes a second-type dopant at a first concentration, and the Al.sub.xIn.sub.yGa.sub.l-x-yN layers 132A, 132B include the second-type dopant at a second concentration, and the first concentration is higher than the second concentration. In details, the GaN based layer 134 includes a p-type dopant at a higher concentration, and the Al.sub.xIn.sub.yGa.sub.l-x-yN layers 132A, 132B include the p-type dopant at a lower concentration, and the p-type dopant is Mg, for example.

[0046] Also, the GaN based layer 134 may be formed to a thickness of about 1-50 nm, but without being limited thereto. Therefore, the GaN based layer 134 not only can improve the electrical connection of the semiconductor structure 100, but the light absorption of the first-typed doped semiconductor layer 130 can be properly controlled.

[0047] In the second-type doped semiconductor layer 130 of this embodiment, the material of the ohmic contact layer 136 includes but not limited to nickel (Ni), indium tin oxide (ITO), indium zinc oxide (IZO) or gallium zinc oxide (GZO) etc., so as to improve the electrical connection between the second electrode 160 and the rest of the semiconductor structure 100.

[0048] FIG. 3 illustrates a sectional view of a semiconductor structure and an active layer thereof according to the second embodiment of the present invention. Referring to FIG. 3, semiconductor structure 200 of the embodiment includes substrate 240, first-type doped semiconductor layer 210, superlattice layer 270, light emitting layer 220, and second-type doped semiconductor layer 230. The light emitting layer 220 is disposed on the first-type doped semiconductor layer 210, and the second-type doped semiconductor layer 230 is disposed on the light emitting layer 220. The second-type doped semiconductor layer 230 includes AlInGaN based stress control layer 238, AlGaN based carrier blocking layer 231, Al.sub.xIn.sub.yGa.sub.l-x-yN layer 232A, GaN based layer 234, Al.sub.xIn.sub.yGa.sub.l-x-yN layer 232B, and ohmic contact layer 236, where 0<x<1, 0≦y<1, and 0<x+y<1. The Al.sub.xIn.sub.yGa.sub.l-x-yN layer 232B is disposed on the Al.sub.xIn.sub.yGa.sub.l-x-yN layer 232A, and the GaN based layer 234 is interposed between the Al.sub.xIn.sub.yGa.sub.l-x-yN layers 232A and the Al.sub.xIn.sub.yGa.sub.l-x-yN layers 232B, and the ohmic contact layer 236 is disposed on the Al.sub.xIn.sub.yGa.sub.l-x-yN layer 232B. In other words, in the semiconductor structure 200 of the embodiment, the Al.sub.xIn.sub.yGa.sub.l-x-yN layers 232A, 232B are placed between the light emitting layer 220 and the ohmic contact layer 236, and the GaN based layer 234 is placed at an intervening position of the Al.sub.xIn.sub.yGa.sub.l-x-yN layers 232A and 232B.

[0049] The substrate 240 of this embodiment is a substrate for growing a GaN-based semiconductor structure, and includes a sapphire substrate, an AlN substrate, a Si substrate, or a SiC substrate, but without being limited thereto.

[0050] The first-type doped semiconductor layer 210 of the second embodiment is an n-type doped semiconductor layer, for example. To be more specific, the first-type doped semiconductor layer 210 of this embodiment may be an n-type impurity-doped semiconductor layer, for example, Si-doped GaN-based semiconductor, and may be formed to a thickness of about 1˜3 μm, but without being limited thereto.

[0051] The superlattice layer 270 of the semiconductor structure 200 is disposed between the light emitting layer 220 and the first-type doped semiconductor layer 210, and the superlattice layer 270 may be formed by alternately stacking first and second InAlGaN layers having different compositions in about 2˜40 cycles, but without being limited thereto. The superlattice layer 270 is formed beside the light emitting layer 220, so as to reduce the current leakage of the semiconductor structure 200.

[0052] The light emitting layer 220 of the semiconductor structure 200 of the embodiment includes a first-type dopant at a concentration higher than 10.sup.17 cm.sup.−3. To be more specific, the light emitting layer 220 may be an n-type impurity-doped light emitting layer, for example, Si-doped, but without being limited thereto, and the light emitting layer 220 is configured to emit light having wavelength fall into a range from UV, purple, blue to green. In details, the light emitting layer 220 includes a MQW structure, the MQW structure includes a plurality of well layers 224 and a plurality of barrier layers 222 stacked alternately, and a concentration of indium (In) in one of the Al.sub.xIn.sub.yGa.sub.l-x-yN layers 232A, 232B is smaller than a concentration of indium (In) in each of the well layers 224 of the MQW structure, without being limited thereto. Therefore, the forward voltage for the semiconductor structure 200 can be reduced.

[0053] The AlInGaN based stress control layer 238 is disposed between the light emitting layer 220 and the AlGaN based carrier blocking layer 231, and the AlInGaN based stress control layer 238 is doped with a second-type dopant at a concentration higher than 10.sup.19 cm.sup.−3. To be more specific, the AlInGaN base stress control layer 238 is doped with p-type dopant, and the p-type dopant is Mg, for example. Therefore, the stress control layer 238 located on the light emitting layer 220 can relieve the lattice mismatch between the well layers 224 and the barrier layers 222 of the light emitting layer 220.

[0054] The AlGaN based carrier blocking layer 231 is place between the light emitting layer 220 and the Al.sub.xIn.sub.yGa.sub.l-x-yN layer 232A, so as to relieve the lattice mismatch between the light emitting layer 220 and the rest of the second-type doped semiconductor layer 230.

[0055] The first AlInGaN based layer 232A of the embodiment is doped with carbon (C), and the AlInGaN based layer 232B of the embodiment is doped with hydrogen (H). To be specific, the Al.sub.xIn.sub.yGa.sub.l-x-yN layer 232A is an Al, In-containing GaN based layer doped with carbon (C) at a concentration higher than 5×10.sup.17 cm.sup.−3, and the Al.sub.xIn.sub.yGa.sub.l-x-yN layer 232B is an Al, In-containing GaN based layer doped with hydrogen (H) at a concentration higher than 10.sup.18 cm.sup.−3, but without being limited thereto. Therefore, the hole concentration can be increased.

[0056] In the second-type doped semiconductor layer 230 of this embodiment, the GaN based layer 234 includes a second-type dopant at a first concentration, and the Al.sub.xIn.sub.yGa.sub.l-x-yN layers 232A, 232B include the second-type dopant at a second concentration, and the first concentration is higher than the second concentration. In details, the GaN based layer 234 includes a p-type dopant at a higher concentration, and the Al.sub.xIn.sub.yGa.sub.l-x-yN layers 232A, 232B are AlInGaN based layers including the p-type dopant at a lower concentration, and the p-type dopant is Mg, for example.

[0057] Also, the ratio of the thickness of the GaN based layer 234 to the total thickness of the second-type doped semiconductor layer is lower than or equal to 0.5, but without being limited thereto. Therefore, the GaN based layer 234 not only can improve the electrical connection of the semiconductor structure 200, but the light absorption of the first-typed doped semiconductor layer 130 can be properly controlled.

[0058] In summary, the embodiments of the invention have at least one of the advantages below. In the embodiments of the invention, the second-type doped semiconductor layer of the semiconductor structure includes Al.sub.xIn.sub.yGa.sub.l-x-yN layers and GaN based layer, and the GaN based layers is interposed between the Al.sub.xIn.sub.yGa.sub.l-x-yN layers, and the GaN based layer and the Al.sub.xIn.sub.yGa.sub.l-x-yN are stacked on the light emitting layer of the semiconductor structure, and an ohmic contact layer is disposed on the Al.sub.xIn.sub.yGa.sub.l-x-yN layers and GaN based layer. Therefore, when the light emitting layer emits blue light or near-UV light, the Al.sub.xIn.sub.yGa.sub.l-x-yN layers can improve the transmittance and provide a carrier blocking function in the second-type doped semiconductor layer, and the electrical conductivity of the second-type doped semiconductor layer is increased by the GaN based layer, so as to improve the light emitting efficiency of the semiconductor structure.

[0059] It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the present invention cover modifications and variations of this invention provided they fall within the scope of the following claims and their equivalents.